Datasheet MCC170-12IO1, MCC170-14IO1, MCC170-16IO1, MCC170-18IO1 Datasheet (IXYS)

Page 1
MCC 170
Thyristor Modules Thyristor/Diode Modules
V
RSM
V
DSM
V
RRM
V
DRM
Type
VV
1300 1200 MCC 170-12io1 1500 1400 MCC 170-14io1 1700 1600 MCC 170-16io1 1900 1800 MCC 170-18io1
TRMS
I
TAVM
, I
I
TSM
FSM
2
òi
dt TVJ = 45°C t = 10 ms (50 Hz) 146 000 A2s
TVJ = T
VJM
TC = 85°C; 180° sine 203 A TVJ = 45°C; t = 10 ms (50 Hz) 5400 A
VR = 0 t = 8.3 ms (60 Hz) 5800 A
= T
T
VJ
VJM
VR = 0 t = 8.3 ms (60 Hz) 5500 A
t = 10 ms (50 Hz) 5000 A
VR = 0 t = 8.3 ms (60 Hz) 140 000 A2s
(di/dt)
= T
T
VJ
VJM
VR = 0 t = 8.3 ms (60 Hz) 126 000 A2s
cr
TVJ = T
VJM
f =50 Hz, tP =200 ms VD = 2/3 V IG = 1 A, non repetitive, IT = I
DRM
t = 10 ms (50 Hz) 125 000 A2s
repetitive, IT = 660 A 100 A/ms
diG/dt = 1 A/ms
(dv/dt)
P
GM
P
GAV
V
RGM
T
VJ
T
VJM
T
stg
V
ISOL
M
d
TVJ = T
cr
RGK = ¥; method 1 (linear voltage rise) TVJ = T
= I
I
T
50/60 Hz, RMS t = 1 min 3000 V~ I
ISOL
Mounting torque (M6) 4.5-7/40-62 Nm/lb.in. Terminal connection torque (M8) 11-13/97-115 Nm/lb.in.
; VDR = 2/3 V
VJM
VJM
TAVM
DRM
tP = 30 ms 120 W tP = 500 ms60W
£ 1 mA t = 1 s 3600 V~
Weight Typical including screws 750 g
3671542
350 A
TAVM
500 A/ms
1000 V/ms
-40...+130 °C 130 °C
-40...+125 °C
20 W 10 V
I
TRMS
I
TAVM
V
= 2x 350 A = 2x 203 A = 1200-1800 V
RRM
2
1
3
7
6
5
Features
International standard package
Direct copper bonded Al2O3-ceramic with copper base plate
Planar passivated chips
Isolation voltage 3600 V~
UL registered E 72873
Keyed gate/cathode twin pins
Applications
Motor control, softstarter
Power converter
Heat and temperature control for industrial furnaces and chemical processes
Lighting control
Solid state switches
Advantages
Simple mounting
Improved temperature and power cycling
Reduced protection circuits
4
Data according to IEC 60747 and refer to a single thyristor/diode unless otherwise stated. IXYS reserves the right to change limits, test conditions and dimensions
© 2000 IXYS All rights reserved
1 - 4
Page 2
Symbol Test Conditions Characteristic Values
, I
I
RRM
DRM
, V
V
T
F
V
T0
r
T
V
GT
I
GT
V
GD
I
GD
I
L
I
H
t
gd
t
q
Q
S
I
RM
R
thJC
R
thJK
d
S
d
A
a Maximum allowable acceleration 50 m/s
TVJ= T
; VR = V
VJM
RRM
; VD = V
DRM
40 mA IT, IF = 600 A; TVJ = 25°C 1.65 V For power-loss calculations only (TVJ = 130°C) 0.8 V
1mW
VD = 6 V; TVJ = 25°C2V
TVJ = -40°C3V
VD = 6 V; TVJ = 25°C 150 mA
TVJ = -40°C 220 mA
TVJ = T TVJ = T
;V
VJM
;V
VJM
D D
= 2/3 V = 2/3 V
DRM DRM
0.25 V 10 mA
TVJ = 25°C; tP = 30 ms; VD = 6 V 200 mA IG = 0.45 A; diG/dt = 0.45 A/ms
TVJ = 25°C; VD = 6 V; RGK = ¥ 150 mA TVJ = 25°C; VD = 1/2 V
IG = 1 A; diG/dt = 1 A/ms TVJ = T
VR = 100 V; dv/dt = 50 V/ms; VD = 2/3 V
; IT = 300 A, tP = 200 ms; -di/dt = 10 A/ms typ. 200 ms
VJM
DRM
DRM
2 ms
TVJ = 125°C; IT, IF = 300 A; -di/dt = 50 A/ms 550 mC
235 A
per thyristor (diode); DC current 0.164 K/W per module other values 0.082 K/W per thyristor (diode); DC current see Fig. 8/9 0.204 K/W per module 0.102 K/W
Creeping distance on surface 12.7 mm Creepage distance in air 9.6 mm
MCC 170
10
10
1: IGT, T
1: IGT, T 2: I
2: I
V
V
3: I
3: I
V
V
G
G
1
1
0.1
0.1
-3
-3
10
10
Fig. 1 Gate trigger characteristics
100
100
µs
µs
t
t
gd
gd
10
10
2
GT
GT GT
GT
IGD, T
IGD, T
, T
, T , T
, T
VJ
VJ
10
10
= 140°C
= 130°C
VJ
VJ
= 25°C
= 25°C
VJ
VJ
= -40°C
= -40°C
VJ
VJ
1
1
= 140°C
= 130°C
-2
-2
typ.
typ.
2
2
-1
-1
10
10
Limit
Limit
3
3
6
6
5
5
4
4
4: P
= 20 W
4: P
= 20 W
GM
GM
5: P
5: P
= 60 W
= 60 W
GM
GM
6: P
6: P
= 120 W
= 120 W
GM
GM
0
1
0
10
10
10
10
I
I
G
G
T
= 25°C
T
= 25°C
VJ
VJ
2
1
2
10
10
A
A
Optional accessories for modules Keyed Gate/Cathode twin plugs with wire length = 350 mm, gate = yellow, cathode = red Type ZY 180 L (L = Left for pin pair 4/5) UL 758, style 1385, Type ZY 180 R (R = Right for pin pair 6/7) CSA class 5851, guide 460-1-1
Dimensions in mm (1 mm = 0.0394")
M8x20
1
1
0.01 0.1 1 10
0.01 0.1 1 10 I
I
G
G
Fig. 2 Gate trigger delay time
A
A
© 2000 IXYS All rights reserved
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Page 3
MCC 170
6000
I
TSM
A
5000
4000
3000
2000
1000
0
0.001 0.01 0.1 1
50 Hz 80 % V
TVJ = 45°C T
Fig. 3 Surge overload current
I
, I
: Crest value, t: duration
TSM
FSM
400
P
tot
W
300
200
100
= 130°C
VJ
DC 180° sin 120° 60° 30°
RRM
I2dt
10
A2s
6
I I
TAVM FAVM
400
300
A
DC 180° sin 120° 60° 30°
TVJ = 45°C
5
10
TVJ = 130°C
4
s
t
10
110
ms
t
200
100
0
0 25 50 75 100 125 150
T
C
°C
Fig. 4 òi2dt versus time (1-10 ms) Fig. 4a Maximum forward current
at case temperature
R
0.1
0.2
0.3
0.4
0.6
0.8
1.0
thKA
K/W
Fig. 5 Power dissipation versus on-
state current and ambient temperature (per thyristor or diode)
0
2000
P
tot
W
1500
1000
Circuit B6
500
0
3xMCC170
I
TAVM/IFAVM
A
I
dAVM
0 2550751001251500 100 200 300
A
0 25 50 75 100 125 1500 200 400 600
R
thKA
0.04
0.06
0.08
0.1
0.15
0.2
0.3
T
A
K/W
T
A
°C
Fig. 6 Three phase rectifier bridge:
Power dissipation versus direct output current and ambient temperature
°C
© 2000 IXYS All rights reserved
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Page 4
MCC 170
2000
P
tot
W
1500
1000
500
0
0 100 200 300 400
0.25
K/W
Z
thJC
0.20
0.15
Circuit W3 3xMCC170
I
0 25 50 75 100 125 150
A
RMS
R
0.04
0.06
0.08
0.1
0.15
0.2
0.3
thKA
K/W
°C
T
A
Fig. 7 Three phase AC-controller:
Power dissipation versus RMS output current and ambient temperature
Fig. 8 Transient thermal impedance
junction to case (per thyristor or diode)
for various conduction angles d:
R
thJC
d R
thJC
(K/W)
DC 0.160
180° 0.171 120° 0.180
60° 0.203 30° 0.247
Constants for Z
iR
calculation:
thJC
(K/W) ti (s)
thi
1 0.0077 0.00054 2 0.0413 0.098 3 0.096 0.54
0.10
0.05
0.00
30° 60° 120° 180° DC
-3
10
-2
10
-1
10
0
10
1
10
s t
2
10
4 0.0149 12
0.30
K/W
0.25
Z
thJK
0.20
0.15
30°
0.10
0.05
0.00
-3
10
-2
10
-1
10
0
10
60° 120° 180° DC
10
1
t
10
s
Fig. 9 Transient thermal impedance
junction to heatsink (per thyristor or diode)
for various conduction angles d:
R
thJK
d R
thJK
(K/W)
DC 0.200
180° 0.211 120° 0.220
60° 0.243 30° 0.287
Constants for Z
2
iR
1 0.0077 0.00054
calculation:
thJK
(K/W) ti (s)
thi
2 0.0413 0.098 3 0.096 0.54 4 0.0149 12 5 0.04 12
© 2000 IXYS All rights reserved
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