Motorola reserves the right to make changes without further notice to any products herein to improve reliability, function or
design. Motorola does not assume any liability arising out of the application or use of any product or circuit described herein;
neither does it convey any license under its patent rights nor the rights of others. Motorola products are not designed, intended,
or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to
support or sustain life, or for any other application in which the failure of the Motorola product could create a situation where
personal injury or death may occur. Should Buyer purchase or use Motorola products for any such unintended or unauthorized
application,Buyershallindemnify andhold Motorolaand itsofficers, employees,subsidiaries, affiliates,and distributorsharmless
against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly orindirectly, any claim of
personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that Motorola was
negligent regarding the design or manufacture of the part.
1
Page 2
Revision History
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DOCUMENT NUMBER
9S12DP512DGV1/D
Version
Number
V01.00
V01.01
V01.02
V01.03
V01.04
V01.05
Revision
Date
27 Nov
2001
13 Mar
2002
02 Apr
2002
15 Apr
2002
06 Jun
2002
05 Jul
2002
Effective
Date
11 Feb
2002
13 Mar
2002
02 Apr
2002
15 Apr
2002
06 Jun
2002
05 Jul
2002
AuthorDescription of Changes
- Initial version based on DP256 V2.09.
- Updated document formats.
- Removed reference to SIM in overview.
- Changed XCLKS to PE7 in signal description.
- Removed"Oscillator start-up time fromPOR or STOP"from Oscillator
Characterisitcs.
- Added to Sections ATD, ECT and PWM: freeze mode = active BDM
mode.
.
INS
OL/IOH
values.
Motorola reserves the right to make changes without further notice to any products herein to improve reliability, function or
design. Motorola does not assume any liability arising out of the application or use of any product or circuit described herein;
neither does it convey any license under its patent rights nor the rights of others. Motorola products are not designed, intended,
or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to
support or sustain life, or for any other application in which the failure of the Motorola product could create a situation where
personal injury or death may occur. Should Buyer purchase or use Motorola products for any such unintended or unauthorized
application,Buyer shallindemnify andhold Motorolaand itsofficers, employees,subsidiaries, affiliates,and distributorsharmless
against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly orindirectly, any claim of
personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that Motorola was
negligent regarding the design or manufacture of the part.
2
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Version
Number
V01.06
V01.07
Revision
Date
24 Jul
2002
29 Jul
2002
Effective
Date
24 Jul
2002
05 Aug
2002
AuthorDescription of Changes
- Updated SPI electrical characteristics.
- Updated Derivative Differences table.
- Added ordering number example.
- Added Detailed Register Map.
- Changed Internal Pull Resistor column of signal table.
- Added pull device description for MODC pin.
- Corrected XCLKS figure titles. Moved table to section Modes of
Operation.
- Removed ’1/2’ from BDM in Figure Clock Connections.
- Completely reworked section Modes of Operation. Added Chip
Configuration Summary and Low Power Mode description.
- Changed classification to C for internal pull currents inTable 5V I/O
Characteristics.
- Changed input leakage to 1uA for all pins.
- Updated VREG section and layout recommendation.
- Moved Power and Gound Connection Summary table to start of
Power Supply Pins section.
✓: Available for this device, —: Not available for this device
PVPVPVPV
An errata exists
contact Sales
Office
An errata exists
contact Sales
Office
An errata exists
contact Sales
The following figure provides an ordering number example for the MC9S12D-Family devices.
contact Sales
Office
MC9S12 DP512C PV
Figure 0-1 Order Part Number Example
Package Option
Temperature Option
Device Title
Controller Family
Temperature Options
C = -40˚C to85˚C
V = -40˚C to 105˚C
M = -40˚C to 125˚C
Package Options
FU = 80 QFP
PV = 112 LQFP
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The following items should be considered when using a derivative (Table 0-1):
•Registers
–Do not write or read CAN0 registers (after reset: address range $0140 - $017F), if using a
derivative without CAN0.
–Do not write or read CAN1registers (after reset: address range $0180 - $01BF), if using a
derivative without CAN1.
–Do not write or read CAN2 registers (after reset: address range $01C0 - $01FF), if using a
derivative without CAN2.
–Do not write or read CAN3 registers (after reset: address range $0200 - $023F), if using a
derivative without CAN3.
–Do not write or read CAN4 registers (after reset: address range $0280 - $02BF), if using a
derivative without CAN4.
–Do not write or read BDLC registers (after reset: address range $00E8 - $00EF), if using a
derivative without BDLC.
•Interrupts
–Fill the four CAN0 interrupt vectors ($FFB0 - $FFB7) according to your coding policies for
unused interrupts, if using a derivative without CAN0.
–Fill the four CAN1 interrupt vectors ($FFA8 - $FFAF) according to your coding policies for
unused interrupts, if using a derivative without CAN1.
–Fill the four CAN2 interrupt vectors ($FFA0 - $FFA7) according to your coding policies for
unused interrupts, if using a derivative without CAN2.
–Fill the four CAN3 interrupt vectors ($FF98 - $FF9F) according to your coding policies for
unused interrupts, if using a derivative without CAN3.
–Fill the four CAN4 interrupt vectors ($FF90 - $FF97) according to your coding policies for
unused interrupts, if using a derivative without CAN4.
–Fill the BDLC interrupt vector ($FFC2, $FFC3) according to your coding policies for unused
interrupts, if using a derivative without BDLC.
•Ports
–The CAN0 pin functionality (TXCAN0, RXCAN0) is not available on port PJ7, PJ6, PM5,
PM4, PM3, PM2, PM1 and PM0, if using a derivative without CAN0.
–The CAN1 pin functionality (TXCAN1, RXCAN1) is not available on port PM3 and PM2, if
using a derivative without CAN1.
–The CAN2 pin functionality (TXCAN2, RXCAN2) is not available on port PM5 and PM4, if
using a derivative without CAN2.
–The CAN3 pin functionality (TXCAN3, RXCAN3) is not available on port PM7 and PM6, if
using a derivative without CAN3.
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–The CAN4 pin functionality (TXCAN4, RXCAN4) is not available on port PJ7, PJ6, PM7,
PM6, PM5 and PM4, if using a derivative without CAN0.
–The BDLC pin functionality (TXB, RXB) is not available on port PM1 and PM0, if using a
derivative without BDLC.
–Do not write MODRR1 and MODRR0 bits of Module Routing Register (PIM_9DP256 Block
Guide), if using a derivative without CAN0.
–Do not write MODRR3 and MODRR2 bits of Module Routing Register (PIM_9DP256 Block
Guide), if using a derivative without CAN4.
Document References
The Device Guide provides information about the MC9S12DP512 device made up of standard HCS12
blocks and the HCS12 processor core.
This document is part of the customer documentation. A complete set of device manuals also includes the
individual Block Guides of the implemented modules. In an effort to reduce redundancy, all module
specific information is located only in the respective Block Guide. If applicable, special implementation
details of the module are given in the block description sections of this document.
See Table 0-2 for names and versions of the referenced documents throughout the Device Guide.
Table 0-2 Document References
Block GuideVersionDocument Order Number
HCS12 CPU Reference ManualV02S12CPUV2/D
HCS12 Module Mapping Control (MMC) Block GuideV04S12MMCV4/D
HCS12 Multiplexed External Bus Interface (MEBI) Block GuideV03S12MEBIV3/D
Byte Level Data Link Controller -J1850 (BDLC) Block GuideV01S12BDLCV1/D
Motorola Scalable CAN (MSCAN) Block GuideV02S12MSCANV2/D
Voltage Regulator (VREG) Block GuideV01S12VREGV1/D
Port Integration Module (PIM_9DP256) Block Guide
Oscillator (OSC) Block GuideV02S12OSCV2/D
1
V03S12DP256PIMV3/D
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NOTES:
1. Reused due to functional equivalence.
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Section 1 Introduction
1.1 Overview
The MC9S12DP512 microcontroller unit (MCU) is a 16-bit device composed of standard on-chip
peripherals including a 16-bit central processing unit (HCS12 CPU), 512K bytes of Flash EEPROM, 14K
bytes of RAM, 4K bytes of EEPROM, two asynchronous serial communications interfaces (SCI), three
serial peripheral interfaces (SPI), an 8-channel IC/OC enhanced capture timer, two 8-channel, 10-bit
analog-to-digital converters(ADC),an 8-channel pulse-width modulator(PWM),a digital Byte Data Link
Controller (BDLC), 29 discrete digital I/O channels (Port A, Port B, Port K and Port E), 20 discrete digital
I/O lines with interrupt and wake up capability, five CAN 2.0 A, B software compatible modules
(MSCAN12), and an Inter-IC Bus. The MC9S12DP512 has full 16-bit data paths throughout. However,
the external bus can operate in an 8-bit narrow mode so single 8-bit wide memory can be interfaced for
lower cost systems. The inclusion of a PLL circuit allows power consumption and performance to be
adjusted to suit operational requirements.
1.2 Features
•HCS12 Core
–16-bit HCS12 CPU
i. Upward compatible with M68HC11 instruction set
ii. Interrupt stacking and programmer’s model identical to M68HC11
iii.Instruction queue
•Five 1M bit per second, CAN 2.0 A, B software compatible modules
–Five receive and three transmit buffers
–Flexible identifier filter programmable as 2 x 32 bit, 4 x 16 bit or 8x8bit
–Four separate interrupt channels for Rx, Tx, error and wake-up
–Low-pass filter wake-up function
–Loop-back for self test operation
•Enhanced Capture Timer
–16-bit main counter with 7-bit prescaler
–8 programmable input capture or output compare channels
–Four 8-bit or two 16-bit pulse accumulators
•8 PWM channels
–Programmable period and duty cycle
–8-bit 8-channel or 16-bit 4-channel
–Separate control for each pulse width and duty cycle
–Center-aligned or left-aligned outputs
–Programmable clock select logic with a wide range of frequencies
–Fast emergency shutdown input
–Usable as interrupt inputs
•Serial interfaces
–Two asynchronous Serial Communications Interfaces (SCI)
–Three Synchronous Serial Peripheral Interface (SPI)
•Byte Data Link Controller (BDLC)
–SAE J1850 Class B Data Communications Network Interface Compatible and ISO Compatible
for Low-Speed (<125 Kbps) Serial Data Communications in Automotive Applications
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•Inter-IC Bus (IIC)
–Compatible with I
–Multi-master operation
–Software programmable for one of 256 different serial clock frequencies
•112-Pin LQFP package
–I/O lines with 5V input and drive capability
–5V A/D converter inputs
2
C Bus standard
–Operation at 50MHz equivalent to 25MHz Bus Speed over -40˚C <= T
–Development support
–Single-wire background debug™ mode (BDM)
–On-chip hardware breakpoints
•Special Operating Modes
–Special Single-Chip Mode with active Background Debug Mode
–Special Test Mode (Motorola use only)
–Special Peripheral Mode (Motorola use only)
Low power modes
•Stop Mode
•Pseudo Stop Mode
<= 125˚C
A
•Wait Mode
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1.4 Block Diagram
Figure 1-1 shows a block diagram of the MC9S12DP512 device.
The part ID is located in two 8-bit registers PARTIDH and PARTIDL (addresses $001A and $001B after
reset). The read-only value is a uniquepartIDforeachrevisionof the chip. Table 1-3showstheassigned
part ID number.
1. The coding is as follows:
Bit 15 - 12: Major family identifier
Bit 11 - 8: Minor family identifier
Bit 7 - 4: Major mask set revision number including FAB transfers
Bit 3 - 0: Minor - non full - mask set revision
1.7 Memory Size Assignments
Part ID
1
$0402
$0403
$0404
The device memory sizes are located in two 8-bit registers MEMSIZ0 and MEMSIZ1 (addresses $001C
and $001D after reset). Table 1-4 shows the read-only values of these registers. Refer to HCS12 Module
Mapping Control (MMC) Block Guide for further details.
Table 1-4 Memory size registers
Register nameValue
MEMSIZ0$26
MEMSIZ1$82
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Section 2 Signal Description
This section describes signals that connect off-chip. It includes a pinout diagram, a table of signal
properties, and detailed discussion of signals. It is built from the signal description sections of the Block
Guides of the individual IP blocks on the device.
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2.1 Device Pinout
The MC9S12DP512 is available in a 112-pin low profile quad flat pack (LQFP). Most pins perform two
or more functions, as described in the Signal Descriptions. Figure 2-1 shows the pin assignments.
ATD1, External Trigger Input of ATD1
Port AD Inputs, Analog Inputs
AN[6:0] of ATD1
Port AD Input, Analog Input AN7 of
ATD0, External Trigger Input of ATD0
Port AD Inputs, Analog Inputs
AN[6:0] of ATD0
Port A I/O, Multiplexed Address/Data
Port B I/O, Multiplexed Address/Data
UpPort E I/O, Access, Clock Select
Port E I/O, Pipe Status, Mode Input
Port E I/O, Pipe Status, Mode Input
Port E I/O, Bus Clock Output
Up
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Pin Name
Funct. 1
PH7KWH7SS2——
PH6KWH6SCK2——Port H I/O, Interrupt, SCK of SPI2
PH5KWH5MOSI2——Port H I/O, Interrupt, MOSI of SPI2
PH4KWH4MISO2——Port H I/O, Interrupt, MISO of SPI2
PH3KWH3
PH2KWH2SCK1——Port H I/O, Interrupt, SCK of SPI1
PH1KWH1MOSI1——Port H I/O, Interrupt, MOSI of SPI1
PH0KWH0MISO1——Port H I/O, Interrupt, MISO of SPI1
PJ7KWJ7TXCAN4SCLTXCAN0
PJ6KWJ6RXCAN4SDARXCAN0
PJ[1:0]KWJ[1:0]———Port J I/O, Interrupts
PK7
PK[5:0]
PM7TXCAN3TXCAN4——
PM6RXCAN3RXCAN4——Port M I/O, RX of CAN3, RX of CAN4
PM5TXCAN2TXCAN0TXCAN4SCK0
PM4RXCAN2RXCAN0RXCAN4MOSI0
PM3TXCAN1TXCAN0—
PM2RXCAN1RXCAN0—MISO0
PM1TXCAN0TXB——Port M I/O,TX of CAN0, RX of BDLC
PM0RXCAN0RXB——Port M I/O, RX of CAN0,RX of BDLC
PP7KWP7PWM7SCK2—
PP6KWP6PWM6
PP5KWP5PWM5MOSI2—
Pin Name
Funct. 2
ECSROMCTL——
XADDR
[19:14]
Pin Name
Funct. 3
SS1——Port H I/O, Interrupt, SS of SPI1
———Port K I/O, Extended Addresses
Pin Name
Funct. 4
PP4KWP4PWM4MISO2—
PP3KWP3PWM3
PP2KWP2PWM2SCK1—
PP1KWP1PWM1MOSI1—
PP0KWP0PWM0MISO1—
Pin Name
Funct. 5
SS0
SS2—
SS1—
Power
Supply
VDDR
VDDX
VDDX
VDDX
VDDX
Internal Pull
Resistor
CTRL
PERH/
PPSH
PERJ/
PPSJ
PUCR/
PUPKE
PERM/
PPSM
PERP/
PPSP
Disabled
Disabled
Disabled
Reset
State
Up
Up
Description
Port H I/O, Interrupt, SS of SPI2
Port J I/O, Interrupt, TX of CAN4,
SCL of IIC, TX of CAN0
Port J I/O, Interrupt, RX of CAN4,
SDA of IIC, RX of CAN0
Port K I/O, Emulation Chip Select,
ROM Control
Port M I/O, TX of CAN3, TX of CAN4
Port M I/O, TX of CAN2, CAN0,
CAN4, SCK of SPI0
Port M I/O, RX of CAN2, CAN0,
CAN4, MOSI of SPI0
Port M I/O, TX of CAN1, CAN0,
of SPI0
Port M I/O, RX of CAN1, CAN0,
MISO of SPI0
Port P I/O, Interrupt, Channel 7 of
PWM, SCK of SPI2
Port P I/O, Interrupt, Channel 6 of
PWM,
SS of SPI2
Port P I/O, Interrupt, Channel 5 of
PWM, MOSI of SPI2
Port P I/O, Interrupt, Channel 4 of
PWM, MISO2 of SPI2
Port P I/O, Interrupt, Channel 3 of
PWM,
SS of SPI1
Port P I/O, Interrupt, Channel 2 of
PWM, SCK of SPI1
Port P I/O, Interrupt, Channel 1 of
PWM, MOSI of SPI1
Port P I/O, Interrupt, Channel 0 of
PWM, MISO2 of SPI1
SS
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Pin Name
Funct. 1
PS7SS0———
PS6SCK0———Port S I/O, SCK of SPI0
PS5MOSI0———Port S I/O, MOSI of SPI0
PS4MISO0———Port S I/O, MISO of SPI0
PS3TXD1———Port S I/O, TXD of SCI1
PS2RXD1———Port S I/O, RXD of SCI1
PS1TXD0———Port S I/O, TXD of SCI0
PS0RXD0———Port S I/O, RXD of SCI0
PT[7:0]IOC[7:0]———VDDX
Pin Name
Funct. 2
Pin Name
Funct. 3
Pin Name
Funct. 4
Pin Name
Funct. 5
Power
Supply
VDDX
Internal Pull
Resistor
CTRL
PERS/
PPSS
PERT/
PPST
Reset
State
Disabled Port T I/O, Timer channels
Port S I/O, SS of SPI0
Up
2.3 Detailed Signal Descriptions
2.3.1 EXTAL, XTAL — Oscillator Pins
Description
EXTAL andXTALare the crystal driver and externalclockpins.On reset all the deviceclocksarederived
from the EXTAL input frequency. XTAL is the crystal output.
2.3.2 RESET — External Reset Pin
An active low bidirectional control signal, it acts as an input to initialize the MCU to a known start-up
state, and an output when an internal MCU function causes a reset.
2.3.3 TEST — Test Pin
This input only pin is reserved for test.
NOTE:
2.3.4 VREGEN — Voltage Regulator Enable Pin
This input only pin enables or disables the on-chip voltage regulator.
The TEST pin must be tied to VSS in all applications.
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2.3.5 XFC — PLL Loop Filter Pin
PLL loop filter. Please ask your Motorola representative for the interactive application note to compute
PLL loop filter elements. Any current leakage on this pin must be avoided.
2.3.6 BKGD / TAGHI / MODC — Background Debug, Tag High, and Mode Pin
Figure 2-2 PLL Loop Filter Connections
MCU
XFC
R
0
C
S
C
P
VDDPLLVDDPLL
The BKGD/TAGHI/MODC pin is used as a pseudo-open-drain pin for the background debug
communication. In MCU expanded modes of operation when instruction tagging is on, an input low on
this pin during the falling edge of E-clock tags the high half of the instruction word being read into the
instruction queue. It is used as a MCU operating mode select pin during reset. The state of this pin is
latched to the MODC bit at the rising edge of
RESET. This pin has a permanently enabled pull-up device.
2.3.7 PAD15 / AN15 / ETRIG1 — Port AD Input Pin of ATD1
PAD15 is a general purpose input pin and analog input AN7 of the analog to digital converter ATD1. It
can act as an external trigger input for the ATD1.
2.3.8 PAD[14:08] / AN[14:08] — Port AD Input Pins of ATD1
PAD14 - PAD08 are general purpose input pins and analog inputs AN[6:0] of the analog to digital
converter ATD1.
2.3.9 PAD7 / AN07 / ETRIG0 — Port AD Input Pin of ATD0
PAD7 is a general purpose input pin and analog input AN7 of the analogtodigital converter ATD0. It can
act as an external trigger input for the ATD0.
2.3.10 PAD[06:00] / AN[06:00] — Port AD Input Pins of ATD0
PAD06 - PAD00 are general purpose input pins and analog inputs AN[6:0] of the analog to digital
converter ATD0.
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2.3.11 PA[7:0] / ADDR[15:8] / DATA[15:8] — Port A I/O Pins
PA7-PA0 are general purpose input or output pins. In MCU expanded modes of operation, these pins are
used for the multiplexed external address and data bus.
2.3.12 PB[7:0] / ADDR[7:0] / DATA[7:0] — Port B I/O Pins
PB7-PB0 are general purpose input or output pins. In MCU expanded modes of operation, these pins are
used for the multiplexed external address and data bus.
2.3.13 PE7 / NOACC / XCLKS — Port E I/O Pin 7
PE7 is a general purpose input or output pin. During MCU expanded modes of operation, the NOACC
signal, when enabled, is used to indicate that the current bus cycle is an unused or “free” cycle. This signal
will assert when the CPU is not using the bus.
XCLKS is an input signal which controls whether a crystal in combination with the internal Colpitts
The
(low power) oscillator isusedorwhether Pierce oscillator/external clock circuitry is used. The state of this
pin is latched at the rising edge of
external clock drive or a Pierce Oscillator.If input is a logic high a Colpitts oscillator circuit is configured
on EXTAL and XTAL. Since this pin is an input with a pull-up device during reset, if the pin is left
floating, the default configuration is a Colpitts oscillator circuit on EXTAL and XTAL.
RESET. If the input is a logic low the EXTAL pin is configured for an
EXTAL
CDC*
MCU
XTAL
* Due to the nature of a translated ground Colpitts oscillator a
DC voltage bias is applied to the crystal
Please contact the crystal manufacturer for crystal DC
* Rs can be zero (shorted) when used with higher frequency crystals.
Refer to manufacturer’s data.
Figure 2-4 Pierce Oscillator Connections (PE7=0)
XTAL
C
1
R
B
*
R
S
Crystal or
ceramic resonator
C
2
VSSPLL
EXTAL
MCU
CMOS-COMPATIBLE
EXTERNAL OSCILLATO
(VDDPLL-Level)
R
Figure 2-5 External Clock Connections (PE7=0)
2.3.14 PE6 / MODB / IPIPE1 — Port E I/O Pin 6
PE6 is a general purpose input or output pin. It is used as a MCU operating mode select pin during reset.
The state of this pin is latched to the MODB bit at the rising edge of
instruction queue tracking signalIPIPE1.Thispinis an input with a pull-down device which is only active
RESET is low.
when
2.3.15 PE5 / MODA / IPIPE0 — Port E I/O Pin 5
PE5 is a general purpose input or output pin. It is used as a MCU operating mode select pin during reset.
The state of this pin is latched to the MODA bit at the rising edge of
instruction queue tracking signalIPIPE0.Thispinis an input with a pull-down device which is only active
RESET is low.
when
XTAL
not connected
RESET. This pin is shared with the
RESET. This pin is shared with the
2.3.16 PE4 / ECLK — Port E I/O Pin 4
PE4 is a general purpose input or output pin. It can be configured to drive the internal bus clock ECLK.
ECLK can be used as a timing reference.
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2.3.17 PE3 / LSTRB / TAGLO — Port E I/O Pin 3
PE3 is a general purpose input or output pin. In MCU expanded modes of operation, LSTRB can be used
for the low-byte strobe function to indicate the type of bus access and when instruction tagging is on,
TAGLO is used to tag the low half of the instruction word being read into the instruction queue.
2.3.18 PE2 / R/W—Port E I/O Pin 2
PE2 is a general purpose input or output pin. In MCU expanded modes of operations, this pin drives the
read/write output signal for the external bus. It indicates the direction of data on the external bus.
2.3.19 PE1 / IRQ — Port E Input Pin 1
PE1 is a general purpose input pin and the maskable interrupt request input that provides a means of
applying asynchronous interrupt requests. This will wake up the MCU from STOP or WAIT mode.
2.3.20 PE0 / XIRQ — Port E Input Pin 0
PE0 is a general purpose input pin and the non-maskable interrupt request input that provides a means of
applying asynchronous interrupt requests. This will wake up the MCU from STOP or WAIT mode.
2.3.21 PH7 / KWH7 / SS2 — Port H I/O Pin 7
PH7isa general purpose inputor output pin. Itcan be configured togeneratean interrupt causingtheMCU
to exit STOP or WAIT mode. It can be configured as slave select pin
2 (SPI2).
SS of the Serial Peripheral Interface
2.3.22 PH6 / KWH6 / SCK2 — Port H I/O Pin 6
PH6isa general purpose inputor output pin. Itcan be configured togeneratean interrupt causingtheMCU
to exitSTOP or WAIT mode.It can be configuredasserial clock pinSCKof the SerialPeripheralInterface
2 (SPI2).
2.3.23 PH5 / KWH5 / MOSI2 — Port H I/O Pin 5
PH5isa general purpose inputor output pin. Itcan be configured togeneratean interrupt causingtheMCU
to exit STOP or WAIT mode. It can be configured as master output (during master mode) or slave input
pin (during slave mode) MOSI of the Serial Peripheral Interface 2 (SPI2).
2.3.24 PH4 / KWH4 / MISO2 — Port H I/O Pin 2
PH4isa general purpose inputor output pin. Itcan be configured togeneratean interrupt causingtheMCU
to exit STOP or WAIT mode. It can be configured as master input (during master mode) or slave output
(during slave mode) pin MISO of the Serial Peripheral Interface 2 (SPI2).
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2.3.25 PH3 / KWH3 / SS1 — Port H I/O Pin 3
PH3isa general purpose inputor output pin. Itcan be configured togeneratean interrupt causingtheMCU
to exit STOP or WAIT mode. It can be configured as slave select pin
1 (SPI1).
SS of the Serial Peripheral Interface
2.3.26 PH2 / KWH2 / SCK1 — Port H I/O Pin 2
PH2isa general purpose inputor output pin. Itcan be configured togeneratean interrupt causingtheMCU
toexitSTOP or WAITmode.It can beconfigured as serial clockpin SCK
1 (SPI1).
oftheSerial Peripheral Interface
2.3.27 PH1 / KWH1 / MOSI1 — Port H I/O Pin 1
PH1isa general purpose inputor output pin. Itcan be configured togeneratean interrupt causingtheMCU
to exit STOP or WAIT mode. It can be configured as master output (during master mode) or slave input
pin (during slave mode) MOSI of the Serial Peripheral Interface 1 (SPI1).
2.3.28 PH0 / KWH0 / MISO1 — Port H I/O Pin 0
PH0isa general purpose inputor output pin. Itcan be configured togeneratean interrupt causingtheMCU
to exit STOP or WAIT mode. It can be configured as master input (during master mode) or slave output
(during slave mode) pin MISO of the Serial Peripheral Interface 1 (SPI1).
PJ7 is a generalpurposeinputoroutput pin. It can be configured to generate an interrupt causingtheMCU
to exit STOP or WAIT mode. It can be configured as the transmit pin TXCAN for the Motorola Scalable
Controller Area Network controller 0 or 4 (CAN0 or CAN4) or theserialclockpinSCLoftheIICmodule.
PJ6 is a generalpurposeinputoroutput pin. It can be configured to generate an interrupt causingtheMCU
to exit STOP or WAIT mode. It can be configured as the receive pin RXCAN for the Motorola Scalable
Controller Area Network controller 0 or 4 (CAN 0 or CAN4) or the serialdatapin SDA of the IIC module.
2.3.31 PJ[1:0] / KWJ[1:0] — Port J I/O Pins [1:0]
PJ1 and PJ0 are general purpose input or output pins. They can be configured to generate an interrupt
causing the MCU to exit STOP or WAIT mode.
2.3.32 PK7 / ECS / ROMCTL — Port K I/O Pin 7
PK7 is a general purpose input or output pin. During MCU expanded modes of operation, this pin is used
as the emulation chip select output (
60
ECS). During MCU normal expanded modes of operation, this pin is
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used toenable the Flash EEPROMmemoryin the memory map(ROMCTL).At the rising edgeofRESET,
the state of this pin is latched to the ROMON bit.
2.3.33 PK[5:0] / XADDR[19:14] — Port K I/O Pins [5:0]
PK5-PK0 are general purpose input or output pins. In MCU expanded modes of operation, these pins
provide the expanded address XADDR[19:14] for the external bus.
2.3.34 PM7 / TXCAN3 / TXCAN4 — Port M I/O Pin 7
PM7 is a general purpose input or output pin. It can be configured as the transmit pin TXCAN of the
Motorola Scalable Controller Area Network controllers 3 or 4 (CAN3 or CAN4).
2.3.35 PM6 / RXCAN3 / RXCAN4 — Port M I/O Pin 6
PM6 is a general purpose input or output pin. It can be configured as the receive pin RXCAN of the
Motorola Scalable Controller Area Network controllers 3 or 4 (CAN3 or CAN4).
2.3.36 PM5 / TXCAN2 / TXCAN0 / TXCAN4 / SCK0 — Port M I/O Pin 5
PM5 is a general purpose input or output pin. It can be configured as the transmit pin TXCAN of the
Motorola Scalable Controller Area Network controllers 2, 0 or 4 (CAN2, CAN0 or CAN4). It can be
configured as the serial clock pin SCK of the Serial Peripheral Interface 0 (SPI0).
2.3.37 PM4 / RXCAN2 / RXCAN0 / RXCAN4/ MOSI0 — Port M I/O Pin 4
PM4 is a general purpose input or output pin. It can be configured as the receive pin RXCAN of the
Motorola Scalable Controller Area Network controllers 2, 0 or 4 (CAN2, CAN0 or CAN4). It can be
configured as the master output (during master mode) or slave input pin (during slave mode) MOSI
the Serial Peripheral Interface 0 (SPI0).
2.3.38 PM3 / TXCAN1 / TXCAN0 / SS0 — Port M I/O Pin 3
PM3 is a general purpose input or output pin. It can be configured as the transmit pin TXCAN of the
Motorola Scalable Controller Area Network controllers 1 or 0 (CAN1 or CAN0). It can be configured as
the slave select pin
SS of the Serial Peripheral Interface 0 (SPI0).
2.3.39 PM2 / RXCAN1 / RXCAN0 / MISO0 — Port M I/O Pin 2
PM2 is a general purpose input or output pin. It can be configured as the receive pin RXCAN of the
Motorola Scalable Controller Area Network controllers 1 or 0 (CAN1 or CAN0). It can be configured as
the master input (during master mode) or slave output pin (during slave mode) MISO
Peripheral Interface 0 (SPI0).
for the Serial
for
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2.3.40 PM1 / TXCAN0 / TXB — Port M I/O Pin 1
PM1 is a general purpose input or output pin. It can be configured as the transmit pin TXCAN of the
Motorola Scalable Controller Area Network controller 0 (CAN0). It can be configured as the transmit pin
TXB of the BDLC.
2.3.41 PM0 / RXCAN0 / RXB — Port M I/O Pin 0
PM0 is a general purpose input or output pin. It can be configured as the receive pin RXCAN of the
Motorola Scalable Controller Area Network controller 0 (CAN0). It can be configured as the receive pin
RXB of the BDLC.
2.3.42 PP7 / KWP7 / PWM7 / SCK2 — Port P I/O Pin 7
PP7 isageneral purpose input or outputpin.Itcan be configured to generateaninterrupt causing the MCU
to exit STOP or WAIT mode. It can be configured as Pulse Width Modulator (PWM) channel 7 output or
an input for the PWM emergency shutdown. It can be configured as serial clock pin SCK of the Serial
Peripheral Interface 2 (SPI2).
2.3.43 PP6 / KWP6 / PWM6 / SS2 — Port P I/O Pin 6
PP6 isageneral purpose input or outputpin.Itcan be configured to generateaninterrupt causing the MCU
to exit STOP or WAIT mode. It can be configured as Pulse Width Modulator (PWM) channel 6 output. It
can be configured as slave select pin
2.3.44 PP5 / KWP5 / PWM5 / MOSI2 — Port P I/O Pin 5
PP5 isageneral purpose input or outputpin.Itcan be configured to generateaninterrupt causing the MCU
to exit STOP or WAIT mode. It can be configured as Pulse Width Modulator (PWM) channel 5 output. It
can be configured as master output (during master mode) or slave input pin (during slave mode) MOSI of
the Serial Peripheral Interface 2 (SPI2).
2.3.45 PP4 / KWP4 / PWM4 / MISO2 — Port P I/O Pin 4
PP4 isageneral purpose input or outputpin.Itcan be configured to generateaninterrupt causing the MCU
to exit STOP or WAIT mode. It can be configured as Pulse Width Modulator (PWM) channel 4 output. It
can be configured as master input (during master mode) or slave output (during slave mode) pin MISO of
the Serial Peripheral Interface 2 (SPI2).
SS of the Serial Peripheral Interface 2 (SPI2).
2.3.46 PP3 / KWP3 / PWM3 / SS1 — Port P I/O Pin 3
PP3 isageneral purpose input or outputpin.Itcan be configured to generateaninterrupt causing the MCU
to exit STOP or WAIT mode. It can be configured as Pulse Width Modulator (PWM) channel 3 output. It
can be configured as slave select pin
62
SS of the Serial Peripheral Interface 1 (SPI1).
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2.3.47 PP2 / KWP2 / PWM2 / SCK1 — Port P I/O Pin 2
PP2 isageneral purpose input or outputpin.Itcan be configured to generateaninterrupt causing the MCU
to exit STOP or WAIT mode. It can be configured as Pulse Width Modulator (PWM) channel 2 output. It
can be configured as serial clock pin SCK of the Serial Peripheral Interface 1 (SPI1).
2.3.48 PP1 / KWP1 / PWM1 / MOSI1 — Port P I/O Pin 1
PP1 isageneral purpose input or outputpin.Itcan be configured to generateaninterrupt causing the MCU
to exit STOP or WAIT mode. It can be configured as Pulse Width Modulator (PWM) channel 1 output. It
can be configured as master output (during master mode) or slave input pin (during slave mode) MOSI of
the Serial Peripheral Interface 1 (SPI1).
2.3.49 PP0 / KWP0 / PWM0 / MISO1 — Port P I/O Pin 0
PP0 isageneral purpose input or outputpin.Itcan be configured to generateaninterrupt causing the MCU
to exit STOP or WAIT mode. It can be configured as Pulse Width Modulator (PWM) channel 0 output. It
can be configured as master input (during master mode) or slave output (during slave mode) pin MISO of
the Serial Peripheral Interface 1 (SPI1).
2.3.50 PS7 / SS0 — Port S I/O Pin 7
PS6 is a general purpose input or output pin. It can be configured as the slave select pin SS of the Serial
Peripheral Interface 0 (SPI0).
2.3.51 PS6 / SCK0 — Port S I/O Pin 6
PS6 is a general purpose input or output pin. It can be configured as the serial clock pin SCK of the Serial
Peripheral Interface 0 (SPI0).
2.3.52 PS5 / MOSI0 — Port S I/O Pin 5
PS5 is a general purpose input or output pin. It can be configured as master output (during master mode)
or slave input pin (during slave mode) MOSI of the Serial Peripheral Interface 0 (SPI0).
2.3.53 PS4 / MISO0 — Port S I/O Pin 4
PS4 is a general purpose input or output pin. It can be configured as master input (during master mode) or
slave output pin (during slave mode) MOSI of the Serial Peripheral Interface 0 (SPI0).
2.3.54 PS3 / TXD1 — Port S I/O Pin 3
PS3 is a general purpose input or output pin. It can be configured as the transmit pin TXD of Serial
Communication Interface 1 (SCI1).
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2.3.55 PS2 / RXD1 — Port S I/O Pin 2
PS2 is a general purpose input or output pin. It can be configured as the receive pin RXD of Serial
Communication Interface 1 (SCI1).
2.3.56 PS1 / TXD0 — Port S I/O Pin 1
PS1 is a general purpose input or output pin. It can be configured as the transmit pin TXD of Serial
Communication Interface 0 (SCI0).
2.3.57 PS0 / RXD0 — Port S I/O Pin 0
PS0 is a general purpose input or output pin. It can be configured as the receive pin RXD of Serial
Communication Interface 0 (SCI0).
2.3.58 PT[7:0] / IOC[7:0] — Port T I/O Pins [7:0]
PT7-PT0 are general purpose input or output pins. They can be configured as input capture or output
compare pins IOC7-IOC0 of the Enhanced Capture Timer (ECT).
2.4 Power Supply Pins
MC9S12DP512 power and ground pins are described below.
Table 2-2 MC9S12DP512 Power and Ground Connection Summary
Mnemonic
V
DD1, 2
V
SS1, 2
V
DDR
V
SSR
V
DDX
V
SSX
V
DDA
V
SSA
V
RL
V
RH
V
DDPLL
V
SSPLL
VREGEN975VInternal Voltage Regulator enable/disable
Pin Number
112-pin QFP
13, 652.5 V
14, 660V
415.0 V
400 V
1075.0 V
1060 V
835.0 V
860 V
850 V
845.0 V
432.5 V
450 V
Nominal
Voltage
Internal power and ground generated by internal regulator
External power and ground, supply to pin drivers and internal voltage
regulator.
External power and ground, supply to pin drivers.
Operating voltage and ground for the analog-to-digital converters and
the reference for the internal voltage regulator, allows the supply
voltage to the A/D to be bypassed independently.
Reference voltages for the analog-to-digital converter.
Provides operating voltage and ground for the Phased-Locked Loop.
This allows the supply voltage to the PLL to be bypassed
independently. Internal power and ground generated by internal
regulator.
Description
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NOTE:
All VSS pins must be connected together in the application.
2.4.1 VDDX,VSSX — Power & Ground Pins for I/O Drivers
External power and ground for I/O drivers. Because fast signal transitions place high, short-duration
current demandsonthepower supply, use bypass capacitors withhigh-frequencycharacteristics and place
them as close to the MCU as possible. Bypass requirements depend on how heavily the MCU pins are
loaded.
2.4.2 VDDR, VSSR —Power & Ground Pins for I/O Drivers & Internal Voltage
Regulator
External power and ground for I/O drivers and input to the internal voltage regulator. Because fast signal
transitions place high, short-duration current demands on the power supply, use bypass capacitors with
high-frequency characteristics and place them as close to the MCU as possible. Bypass requirements
depend on how heavily the MCU pins are loaded.
Power is supplied to the MCU through VDD and VSS. Because fast signal transitions place high,
short-duration current demands on the power supply, use bypass capacitors with high-frequency
characteristics and place them as close to the MCU as possible. This 2.5V supply is derived from the
internal voltage regulator. There is no static load on those pins allowed. The internal voltage regulator is
turned off, if VREGEN is tied to ground.
NOTE:
No load allowed except for bypass capacitors.
2.4.4 VDDA, VSSA — Power Supply Pins for ATD and VREG
VDDA, VSSA are the power supply and ground input pins for the voltage regulator and the analog to
digital converter. It also provides the reference for the internal voltage regulator. This allows the supply
voltage to the ATD and the reference voltage to be bypassed independently.
2.4.5 VRH, VRL — ATD Reference Voltage Input Pins
VRH and VRL are the reference voltage input pins for the analog to digital converter.
2.4.6 VDDPLL, VSSPLL — Power Supply Pins for PLL
Provides operating voltage and ground for the Oscillator and the Phased-Locked Loop. This allows the
supply voltage to the Oscillator and PLL to be bypassed independently. This 2.5V voltage is generated by
the internal voltage regulator.
NOTE:
No load allowed except for bypass capacitors.
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2.4.7 VREGEN — On Chip Voltage Regulator Enable
Enables the internal 5V to 2.5V voltage regulator. If this pin is tied low, VDD1,2 and VDDPLL must be
supplied externally.
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Section 3 System Clock Description
3.1 Overview
The Clock and Reset Generator provides the internal clock signals for the core and all peripheral modules.
Figure 3-1 shows the clock connections from the CRG to all modules.
Consult the CRG Block Guide and OSC Block Guide for details on clock generation.
EXTAL
XTAL
OSC
CRG
Bus Clock
Oscillator Clock
Core Clock
HCS12 CORE
CPUMEBI
MMCINT
BDM
SCI0, SCI1
CAN0, 1, 2, 3, 4
BKP
Flash
RAM
EEPROM
ECT
ATD0, 1
PWM
SPI0, 1, 2
IIC
BDLC
PIM
Figure 3-1 Clock Connections
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Section 4 Modes of Operation
4.1 Overview
Eight possible modes determine the operating configuration of the MC9S12DP512. Each mode has an
associated default memory map and external bus configuration controlled by a further pin.
Three low power modes exist for the device (Section 4.4 Low Power Modes).
4.2 Chip Configuration Summary
The operatingmode out of resetisdetermined by the statesof the MODC, MODB,andMODA pins during
reset (Table4-1).TheMODC,MODB, and MODA bits intheMODE register show the currentoperating
modeandprovide limited modeswitchingduring operation. Thestates of theMODC,MODB, and MODA
pinsarelatched into thesebitson the risingedge of theresetsignal. The ROMCTLsignalallows the setting
of the ROMON bit in the MISC register thus controlling whether the internal Flash is visible in the
memory map. ROMON = 1 means the Flash is visible in the memory map. The state of the ROMCTL pin
is latched into the ROMON bit in the MISC register on the rising edge of the reset signal.
BKGD =
MODC
000X1
001
010X0Special Test (Expanded Wide), BDM allowed
011
100X1Normal Single Chip, BDM allowed
101
110X1
111
PE6 =
MODB
PE5 =
MODA
Table 4-1 Mode Selection
PK7 =
ROMCTL
01
10
01
10
00
11
00
11
ROMON
Bit
Special Single Chip, BDM allowed and ACTIVE. BDM is
allowed in all other modes but a serial command is
required to make BDM active.
Emulation Expanded Narrow, BDM allowed
Emulation Expanded Wide, BDM allowed
Normal Expanded Narrow, BDM allowed
Peripheral; BDM allowed but bus operations would cause
bus conflicts (must not be used)
Normal Expanded Wide, BDM allowed
Mode Description
For further explanation on the modes refer to the HCS12 Multiplexed External Bus Interface (MEBI)
Block Guide.
Internal Voltage Regulator disabled, VDD1,2 and
VDDPLL must be supplied externally with 2.5V
4.3 Security
The device will make available a security feature preventing the unauthorized read and write of the
memory contents. This feature allows:
•Protection of the contents of FLASH,
•Protection of the contents of EEPROM,
•Operation in single-chip mode,
•Operation from external memory with internal FLASH and EEPROM disabled.
The user must be reminded that part of the security must lie with the user’s code. An extreme example
would be user’s code that dumps the contents of theinternal program. This code would defeat the purpose
of security. At the same time the user may also wish to put a back door inthe user’s program. An example
of this is the user downloads a key through the SCI which allows access to a programming routine that
updates parameters stored in EEPROM.
4.3.1 Securing the Microcontroller
Once the user has programmed the FLASH and EEPROM (if desired), the part can be secured by
programming the security bits located in the FLASH module. These non-volatile bits will keep the part
secured through resetting the part and through powering down the part.
The security byte resides in a portion of the Flash array.
Check the Flash Block Guide for more details on the security configuration.
4.3.2 Operation of the Secured Microcontroller
4.3.2.1 Normal Single Chip Mode
This will bethemostcommon usage of the secured part. Everything will appear thesameasif the part was
not secured with the exception of BDM operation. The BDM operation will be blocked.
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4.3.2.2 Executing from External Memory
The user may wish to execute from external space with a secured microcontroller. This is accomplished
by resetting directly into expanded mode. The internal FLASH and EEPROM will be disabled. BDM
operations will be blocked.
4.3.3 Unsecuring the Microcontroller
In order to unsecure the microcontroller, the internal FLASH and EEPROM must be erased. This can be
done through an external program in expanded mode or via a sequence of BDM commands. Unsecuring
is also possible via the Backdoor Key Access. Refer to Flash Block Guide for details..
Once the user has erased the FLASH and EEPROM, the part can be reset into special single chip mode.
This invokes a program that verifies the erasure of the internal FLASH and EEPROM. Once this program
completes,theuser can eraseandprogram the FLASHsecurity bits totheunsecured state. Thisisgenerally
done through the BDM, but the user could also change to expanded mode (by writing the mode bits
through the BDM) and jumping to an external program (again through BDM commands). Note that if the
part goes through a reset before the security bits are reprogrammed to the unsecure state, the part will be
secured again.
4.4 Low Power Modes
The microcontroller features three main low power modes. Consult the respective Block Guide for
information on the module behavior in Stop, Pseudo Stop, and Wait Mode. An important source of
information about the clock system is the Clock and Reset Generator Block Guide (CRG).
4.4.1 Stop
Executing the CPU STOP instruction stops all clocks andthe oscillator thus putting the chip in fully static
mode. Wake up from this mode can be done via reset or external interrupts.
4.4.2 Pseudo Stop
This mode is entered by executing the CPU STOP instruction. In this mode the oscillator is still running
and the Real Time Interrupt (RTI) or Watchdog (COP) sub module can stay active. Other peripherals are
turned off. This mode consumes more current than the full STOP mode, but the wake up time from this
mode is significantly shorter.
4.4.3 Wait
This mode is entered by executing the CPU WAI instruction. In this mode the CPU will not execute
instructions.Theinternal CPU signals(addressand databus) willbe fully static.Allperipherals stay active.
For further power consumption the peripherals can individually turn off their local clocks.
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4.4.4 Run
Although this is not a low power mode, unused peripheral modules should not be enabled in order to save
power.
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Section 5 Resets and Interrupts
5.1 Overview
Consult the Exception Processing section of the CPU12 Reference Manual for information on resets and
interrupts.
5.2 Vectors
5.2.1 Vector Table
Table 5-1 lists interrupt sources and vectors in default order of priority.
When a reset occurs, MCU registers and control bits are changed to known start-up states. Refer to the
respective module Block Guides for register reset states.
5.3.1 I/O pins
Refer to the HCS12 Multiplexed External Bus Interface (MEBI) Block Guide for mode dependent pin
configuration of port A, B, E and K out of reset.
Refer to the PIM Block Guide for reset configurations of all peripheral module ports.
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5.3.2 Memory
Refer to Table 1-1 for locations of the memories depending on the operating mode after reset.
The RAM array is not automatically initialized out of reset.
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Section 6 HCS12 Core Block Description
6.1 CPU12 Block Description
Consult the HCS12 CPU Reference Manual for information on the CPU.
6.1.1 Device-specific information
When the HCS12 CPU Reference Manual refers to cycles this is equivalent to Bus Clock periods.
So 1 cycle is equivalent to 1 Bus Clock period.
6.2 HCS12 Module Mapping Control (MMC) Block Description
Consult the MMC Block Guide for information on the HCS12 Module Mapping Control module.
6.2.1 Device-specific information
•INITEE
–Reset state: $01
–Bits EE11-EE15 are "Write once in Normal and Emulation modes and write anytime in Special
modes".
•PPAGE
–Reset state: $00
–Register is "Write anytime in all modes"
6.3 HCS12 Multiplexed External Bus Interface (MEBI) Block
Description
Consult the MEBI Block Guide for information on HCS12 Multiplexed External Bus Interface module.
6.3.1 Device-specific information
•PUCR
–Reset state: $90
6.4 HCS12 Interrupt (INT) Block Description
Consult the INT Block Guide for information on the HCS12 Interrupt module.
Consult the ECT_16B8C Block Guide for information about the Enhanced Capture Timer module.
When the ECT_16B8C Block Guide refers to freeze mode this is equivalent to active BDM mode.
Section 10 Analog to Digital Converter (ATD) Block
Description
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There are two Analog to Digital Converters (ATD1 and ATD0) implemented on the MC9S12DP512.
Consult the ATD_10B8C Block Guide for information about each Analog to Digital Converter module.
When the ATD_10B8C Block Guide refers to freeze mode this is equivalent to active BDM mode.
Section 11 Inter-IC Bus (IIC) Block Description
Consult the IIC Block Guide for information about the Inter-IC Bus module.
Section 12 Serial Communications Interface (SCI) Block
Description
There are two Serial Communications Interfaces (SCI1 and SCI0) implemented on the MC9S12DP512
device.
Consult the SCI Block Guide for information about each Serial Communications Interface module.
Section 13 Serial Peripheral Interface (SPI) Block
Description
There are three Serial Peripheral Interfaces (SPI2, SPI1 and SPI0) implemented on MC9S12DP512.
Consult the SPI Block Guide for information about each Serial Peripheral Interface module.
Section 14 J1850 (BDLC) Block Description
Consult the BDLC Block Guide for information about the J1850 module.
Consult the PWM_8B6C Block Guide for information about the Pulse Width Modulator module.
When the PWM_8B8C Block Guide refers to freeze mode this is equivalent to active BDM mode.
Section 16 Flash EEPROM 512K Block Description
Consult the FTS512K4 Block Guide for information about the flash module.
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The "S12 LRAE" is a generic Load RAM and Execute (LRAE) program which will be programmed into
the flash memory of this device during manufacture. This LRAE program will provide greater
programming flexibility to the end users by allowing the device to be programmed directly using CAN or
SCI after it is assembled on the PCB. Use of the LRAE program is at the discretion of the end user and, if
not required, it must simply be erased prior to flash programming. For more details of the S12 LRAE and
its implementation, please see the S12 LREA Application Note (AN2546/D).
It isplanned that most HC9S12devicesmanufactured after Q1 of2004 will be shippedwiththe S12 LRAE
programmed in theFlash.Exact details of the changeover (i.e. blank toprogrammed)for each product will
be communicated in advance via GPCN and will be traceable by the customer via datecode marking on
the device.
Please contact Motorola SPS Sales if you have any additional questions.
Section 17 EEPROM 4K Block Description
Consult the EETS4K Block Guide for information about the EEPROM module.
Section 18 RAM Block Description
This module supports single-cycle misaligned word accesses.
Section 19 MSCAN Block Description
There are five MSCAN modules (CAN4, CAN3, CAN2, CAN1 and CAN0) implemented on the
MC9S12DP512.
Consult the MSCAN Block Guide for information about the Motorola Scalable CAN Module.
Section 20 Port Integration Module (PIM) Block Description
Consult the functionally equivalent PIM_9DP256 Block Guide for information about the Port Integration
Module.
Section 21 Voltage Regulator (VREG) Block Description
Consult the VREG Block Guide for information about the dual output linear voltage regulator.
The PCB must be carefully laid out to ensure proper operation of the voltage regulator as well as of the
MCU itself. The following rules must be observed:
•Every supply pair must be decoupled by a ceramic capacitor connected as near as possible to the
corresponding pins (C1 – C6).
•Central point of the ground star should be the VSSR pin.
•Use low ohmic low inductance connections between VSS1, VSS2 and VSSR.
•VSSPLL must be directly connected to VSSR.
•Keep traces of VSSPLL, EXTAL and XTAL as short as possible and occupied board area for C7,
C8, C11 and Q1 as small as possible.
Pierce mode only
•Do not place other signals or supplies underneath area occupied by C7, C8, C10 and Q1 and the
connection area to the MCU.
•Central power input should be fed in at the VDDA/VSSA pins.
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Figure 22-1 Recommended PCB Layout for 112LQFP Colpitts Oscillator
C1
VDD1
VSS1
VDDX
C6
VSSX
VSSR
VDDR
C4
VREGEN
C5
C11
C8
C7
VSSA
C3
VDDA
VSS2
VDD2
C2
82
C10
C9
R1
Q1
VSSPLL
VDDPLL
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Figure 22-2 Recommended PCB Layout for 112LQFP Pierce Oscillator
C1
VDD1
VSS1
VDDX
C6
VSSX
VSSR
VDDR
VDDPLL
C4
C9
R1
VREGEN
C5
C10
C8
R2
Q1
R3
C7
VSSA
VSSPLL
C3
VDDA
VSS2
VDD2
C2
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Appendix A Electrical Characteristics
A.1 General
MC9S12DP512 Device Guide V01.23
NOTE:
This supplement contains themostaccurateelectricalinformation for the MC9S12DP512 microcontroller
availableatthe time ofpublication. The informationshould be consideredPRELIMINARYand issubject
to change.
This introduction is intended to give an overview on several common topics like power supply, current
injection etc.
The electrical characteristics given in this section are preliminary and should be
used as a guide only. Values cannot be guaranteed by Motorola and are subject to
change without notice.
A.1.1 Parameter Classification
The electrical parameters shown in this supplement are guaranteed by various methods. To give the
customer a better understanding the following classification is used and the parameters are tagged
accordingly in the tables where appropriate.
NOTE:
P:
Those parameters are guaranteed during production testing on each individual device.
This classification is shown in the column labeled “C” in the parameter tables
where appropriate.
C:
Those parameters are achieved by the design characterization by measuring a statistically relevant
sample size across process variations.
T:
Those parameters are achieved by design characterization on a small sample size from typical devices
under typical conditions unless otherwise noted. All values shown in the typical column are within
this category.
D:
Those parameters are derived mainly from simulations.
A.1.2 Power Supply
The MC9S12DP512 utilizes several pins to supply power to the I/O ports, A/D converter, oscillator, PLL
and internal logic.
The VDDA, VSSA pairsuppliestheA/D converter and the resistor ladder of the internal voltage regulator.
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The VDDX, VSSX, VDDR and VSSR pairs supply the I/O pins, VDDR supplies also the internal voltage
regulator.
VDD1, VSS1, VDD2 and VSS2 are the supply pins for the digital logic, VDDPLL, VSSPLL supply the
oscillator and the PLL.
VSS1 and VSS2 are internally connected by metal.
VDDA, VDDX, VDDR as well as VSSA, VSSX, VSSR are connected by anti-parallel diodes for ESD
protection.
NOTE:
A.1.3 Pins
There are four groups of functional pins.
In the following context VDD5 is used for either VDDA, VDDR and VDDX; VSS5
is used for either VSSA, VSSR and VSSX unless otherwise noted.
IDD5 denotes the sum of the currents flowing into the VDDA, VDDX and VDDR
pins.
VDD is used for VDD1, VDD2 and VDDPLL, VSS is used for VSS1, VSS2 and
VSSPLL.
IDD is used for the sum of the currents flowing into VDD1 and VDD2.
A.1.3.1 5V I/O pins
Those I/O pins have a nominal level of 5V. This class of pins is comprised of all port I/O pins, the analog
inputs, BKGD and the RESET pins.The internal structure of all those pins is identical, however some of
the functionality may be disabled. E.g. for the analog inputs the output drivers, pull-up and pull-down
resistors are disabled permanently.
A.1.3.2 Analog Reference
This group is made up by the VRH and VRL pins.
A.1.3.3 Oscillator
The pins XFC, EXTAL, XTAL dedicated to the oscillator have a nominal 2.5V level. They are supplied
by VDDPLL.
A.1.3.4 TEST
This pin is used for production testing only.
A.1.3.5 VREGEN
This pin is used to enable the on chip voltage regulator.
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A.1.4 Current Injection
MC9S12DP512 Device Guide V01.23
Power supply must maintain regulation within operating V
operating maximum current conditions. If positive injection current (V
or VDD range during instantaneous and
DD5
in
>V
) is greater than I
DD5
injection current may flowoutofVDD5and could result in external power supply going out of regulation.
Ensure external VDD5 load will shunt current greater than maximum injection current. This will be the
greatest risk when the MCU is not consuming power; e.g. if no system clock is present, or if clock rate is
very low which would reduce overall power consumption.
A.1.5 Absolute Maximum Ratings
Absolute maximum ratings are stress ratings only. A functional operation under or outside those maxima
is not guaranteed. Stress beyond those limits may affect the reliability or cause permanent damage of the
device.
This device contains circuitry protecting against damage due to high static voltage or electrical fields;
however, it is advised that normal precautions be taken to avoid application of any voltages higher than
maximum-rated voltages to this high-impedance circuit. Reliability of operation is enhanced if unused
inputs are tied to an appropriate logic voltage level (e.g., either V
SS5
or V
DD5
).
Table A-1 Absolute Maximum Ratings
NumRatingSymbolMinMaxUnit
1
DD5
, the
1I/O, Regulator and Analog Supply Voltage
2
Digital Logic Supply Voltage
3
PLL Supply Voltage
4Voltage difference VDDX to VDDR and VDDA
5Voltage difference VSSX to VSSR and VSSA
6Digital I/O Input Voltage
7Analog Reference
8XFC, EXTAL, XTAL inputs
9TEST input
Instantaneous Maximum Current
10
Single pin limit for all digital I/O pins
Instantaneous Maximum Current
11
Single pin limit for XFC, EXTAL, XTAL
Instantaneous Maximum Current
12
Single pin limit for TEST
13Storage Temperature Range
NOTES:
1. Beyond absolute maximum ratings device might be damaged.
(2)
2
3
4
5
V
DD5
V
DD
V
DDPLL
∆
VDDX
∆
VSSX
V
V
RH,VRL
V
ILV
V
TEST
I
D
I
DL
I
DT
T
stg
-0.36.0V
-0.33.0V
-0.33.0V
-0.30.3V
-0.30.3V
IN
-0.36.0V
-0.36.0V
-0.33.0V
-0.310.0V
-25+25mA
-25+25mA
-0.250mA
– 65155°C
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2. The device contains an internal voltage regulator to generatethe logic and PLL supply out of the I/O supply.
The absolute maximum ratings apply when the device is powered from an external source.
3. All digital I/O pins are internally clamped to V
4. Those pins are internally clamped to V
5. This pin is clamped low to V
SSX
and V
SSX
and V
SSPLL
, but not clamped high. This pin must be tied low in applications.
DDPLL
DDX
.
, V
SSR
and V
DDR
or V
SSA
and V
DDA
.
A.1.6 ESD Protection and Latch-up Immunity
All ESD testing is in conformity with CDF-AEC-Q100 Stress test qualification for Automotive Grade
Integrated Circuits. During the device qualification ESD stresses were performed for the Human Body
Model (HBM), the Machine Model (MM) and the Charge Device Model.
A device will be defined as a failure if after exposure to ESD pulses the device no longer meets the device
specification. Complete DC parametric and functional testing is performed per the applicable device
specification at room temperature followed by hot temperature, unless specified otherwise in the device
specification.
Table A-2 ESD and Latch-up Test Conditions
ModelDescriptionSymbolValueUnit
Series ResistanceR11500Ohm
Storage CapacitanceC100pF
Human Body
Machine
Latch-up
Number of Pulse per pin
positive
negative
Series ResistanceR10Ohm
Storage CapacitanceC200pF
Number of Pulse per pin
positive
negative
Minimum input voltage limit-2.5V
Maximum input voltage limit7.5V
-
-
3
3
3
3
Table A-3 ESD and Latch-up Protection Characteristics
Num CRatingSymbolMinMaxUnit
1C Human Body Model (HBM)
2C Machine Model (MM)
3C Charge Device Model (CDM)
Latch-up Current at TA = 125°C
4C
5C
positive
negative
Latch-up Current at T
positive
negative
= 27°C
A
V
V
HBM
V
CDM
I
LAT
I
LAT
MM
2000-V
200-V
500-V
+100
-100
+200
-200
-mA
-mA
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A.1.7 Operating Conditions
This chapter describes the operating conditions of the device. Unless otherwise noted those conditions
apply to all the following data.
NOTE:
Please refer to the temperature rating of the device (C, V, M) with regards to the
ambient temperature T
and the junction temperature TJ. For power dissipation
A
calculations refer to Section A.1.8 Power Dissipation and ThermalCharacteristics.
Table A-4 Operating Conditions
RatingSymbolMinTypMaxUnit
(3)
(3)
V
DD5
V
DD
V
DDPLL
∆
VDDX
∆
VSSX
f
bus
T
J
3
T
A
T
J
T
A
T
J
T
A
4.555.25V
2.352.52.75V
2.352.52.75V
-0.100.1V
-0.100.1V
2
0.25
-40-100°C
-402785°C
-40-120°C
-4027105°C
-40-140°C
-4027125°C
-25MHz
I/O, Regulator and Analog Supply Voltage
Digital Logic Supply Voltage
PLL Supply Voltage
Voltage Difference VDDX to VDDR and VDDA
Voltage Difference VSSX to VSSR and VSSA
Bus Frequency (MC9S12DP512C, V, M)
MC9S12DP512C
Operating Ambient Temperature Range
MC9S12DP512V
Operating Ambient Temperature Range
MC9S12DP512M
Operating Ambient Temperature Range
NOTES:
1. The device contains an internal voltage regulator to generate the logic and PLL supply out of the I/O supply. The
given operating rangeapplies when this regulator isdisabled and the device ispowered from an external source.
2. Some blocks e.g. ATD (conversion) and NVMs (program/erase) require higher bus frequencies for proper operation.
3. Please refer to Section A.1.8 Power Dissipation and Thermal Characteristics for more details about the relation between ambient temperature T
(1)
Operating Junction Temperature Range
Operating Junction Temperature Range
Operating Junction Temperature Range
1
and device junction temperature TJ.
A
A.1.8 Power Dissipation and Thermal Characteristics
Power dissipation and thermal characteristics are closely related. The user must assure that the maximum
operating junction temperature is not exceeded. The average chip-junction temperature (T
obtained from:
)in°C can be
J
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T
T
J
A
P
D
ΘJA•()+=
T
T
P
Θ
The total power dissipation can be calculated from:
P
Two cases with internal voltage regulator enabled and disabled must be considered:
Junction Temperature, [°C]=
J
Ambient Temperature, [°C]=
A
Total Chip Power Dissipation, [W]=
D
JA
INT
1.Internal Voltage Regulator disabled
Package Thermal Resistance, [°C/W]=
Chip Internal Power Dissipation, [W]=
P
D
P
INT
PIO+=
P
INT
I
⋅I
DDVDD
P
DDPLLVDDPLL
R
IO
∑
i
DSON
⋅I
⋅=
+V
2
I
IO
i
DDA
⋅+=
DDA
P
is the sum of all output currents on I/O ports associated with VDDX and VDDR.
IO
For R
respectively
2.Internal voltage regulator enabled
is the current shown in Table A-7 and not the overall current flowing into VDDR, which
I
DDR
additionally contains the current flowing into the external loads with output high.
PIO is the sum of all output currents on I/O ports associated with VDDX and VDDR.
DSON
is valid:
R
DSON
R
DSON
P
INT
V
OL
------------ for outputs driven low;=
I
OL
V
DD5
------------------------------------ for outputs driven high;=
I
OH
I
DDRVDDR
P
IO
⋅I
∑
i
VOH–
R
DSON
⋅+=
DDAVDDA
2
I
⋅=
IO
i
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Table A-5 Thermal Package Characteristics
Num CRatingSymbolMinTypMaxUnit
1T
2T
NOTES:
1. The values for thermal resistance are achieved by package simulations
This section describes the characteristics of all 5V I/O pins. All parameters are not alwaysapplicable, e.g.
not all pins feature pull up/down resistances.
o
C/W
o
C/W
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Table A-6 5V I/O Characteristics
Conditions are shown in Table A-4 unless otherwise noted
Num CRatingSymbolMinTypMaxUnit
1P Input High Voltage
T Input High Voltage
2P Input Low Voltage
T Input Low Voltage
3C Input Hysteresis
Input Leakage Current (pins in high impedance input
4P
5P
6P
7P
8C
9P
10C
11D Input Capacitance
12T
13P
14P
NOTES:
1. Refer to Section A.1.4 Current Injection, for more details
2. Parameter only applies in STOP or Pseudo STOP mode.
mode)
V
= V
in
Output High Voltage (pins in output mode)
Partial Drive IOH= –2mA
Full Drive IOH= –10mA
Output Low Voltage (pins in output mode)
Partial Drive IOL= +2mA
Full Drive IOL= +10mA
Internal Pull Up Device Current,
tested at V
Internal Pull Up Device Current,
tested at V
Internal Pull Down Device Current,
tested at V
Internal Pull Down Device Current,
tested at V
Injection current
Single Pin limit
Total Device Limit. Sum of all injected currents
Port H, J, P Interrupt Input Pulse filtered
Port H, J, P Interrupt Input Pulse passed
DD5
or V
Max.
IL
Min.
IH
Min.
IH
Max.
IL
SS5
1
2
(2)
V
V
V
V
V
HYS
I
V
V
I
PUL
I
PUH
I
PDH
I
PDL
C
I
ICS
I
ICP
t
PIGN
t
PVAL
IH
IH
IL
IL
in
OH
OL
in
0.65*V
DD5
--VDD5 + 0.3V
--
VSS5 - 0.3--V
-250-mV
–1-1µA
V
– 0.8
DD5
--0.8V
---130µA
-10--µA
--130µA
10--µA
-6-pF
-2.5
-25
--3µs
10--µs
--V
0.35*V
DD5
--V
-2.5
25
V
mA
A.1.10 Supply Currents
This section describes the current consumption characteristics of the device as well as the conditions for
the measurements.
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A.1.10.1 Measurement Conditions
All measurements are without output loads. Unless otherwise noted the currents are measured in single
chip mode, internal voltage regulator enabled and at 25MHz bus frequency using a 4MHz oscillator in
Colpitts mode. Production testing is performed using a square wave signal at the EXTAL input.
A.1.10.2 Additional Remarks
In expanded modesthecurrents flowing in the system are highly dependentonthe load at the address, data
and control signals as well as on the duty cycle of those signals. No generally applicable numbers can be
given. A very good estimate is to take the single chip currents and add the currents due to the external
loads.
Table A-7 Supply Current Characteristics
Conditions are shown in Table A-4 unless otherwise noted
Num CRatingSymbolMinTypMaxUnit
1P
2P
3
4
5
Run supply currents
Wait Supply current
P
Pseudo Stop Current (RTI and COP disabled)
C
P
C
C
P
C
P
C
P
Pseudo Stop Current (RTI and COP enabled)
C
C
C
C
C
C
C
Stop Current
C
P
C
C
P
C
P
C
P
Single Chip, Internal regulator enabled
All modules enabled, PLL on
only RTI enabled
1, 2
-40°C
27°C
70°C
85°C
"C" Temp Option 100°C
105°C
"V" Temp Option 120°C
125°C
"M" Temp Option 140°C
(1), (2)
-40°C
27°C
70°C
85°C
105°C
125°C
140°C
(2)
-40°C
27°C
70°C
85°C
"C" Temp Option 100°C
105°C
"V" Temp Option 120°C
125°C
"M" Temp Option 140°C
(1)
I
DD5
I
DDW
I
DDPS
I
DDPS
I
DDS
--
--405mA
370
400
450
-
-
-
550
600
650
800
850
1200
570
600
650
750
850
1200
1500
12
25
100
130
160
200
350
400
600
65
500
1600
2100
5000
-µA
100
1200
1700
5000
mA
µA
µA
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NOTES:
1. PLL off
2. At those low power dissipation levels T
= TA can be assumed
J
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A.2 ATD Characteristics
This section describes the characteristics of the analog to digital converter.
A.2.1 ATD Operating Characteristics
The Table A-8 shows conditions under which the ATD operates.
The following constraints exist to obtain full-scale, full range results:
V
≤ VRL≤ VIN≤ VRH≤ V
SSA
beyond the power supply levels that it ties to. If the input level goes outside of this range it will effectively
be clipped.
Table A-8 ATD Operating Characteristics
Conditions are shown in Table A-4 unless otherwise noted
Num CRatingSymbolMinTypMaxUnit
. This constraint exists since the sample buffer amplifier can not drive
DDA
Reference Potential
1D
2C
3D ATD Clock Frequency
4D
5D
6D
7P Reference Supply current 2 ATD blocks on
8P Reference Supply current 1 ATD block on
NOTES:
1. Full accuracy is not guaranteed when differential voltage is less than 4.50V
2. The minimumtime assumes a final sample periodof 2 ATD clocks cycles whilethe maximum time assumes a finalsample
Differential Reference Voltage
ATD 10-Bit Conversion Period
Conv, Time at 2.0MHz ATD Clock f
ATD 8-Bit Conversion Period
Conv, Time at 2.0MHz ATD Clock f
Recovery Time (V
period of 16 ATD clocks.
=5.0 Volts)t
DDA
1
A.2.2 Factors influencing accuracy
Low
High
Clock Cycles
ATDCLK
Clock Cycles
ATDCLK
(2)
V
RL
V
RH
V
RH-VRL
f
ATDCLK
2
N
CONV10
T
CONV10
V
SSA
V
/2
DDA
4.505.005.25V
0.5-2.0MHz
14
7
-
-28
V
DDA
V
/2
DDA
14
V
V
Cycles
µs
N
CONV8
T
CONV8
REC
I
REF
I
REF
12
6
--20µs
--0.750mA
--0.375mA
-26
13
Cycles
µs
Three factors - source resistance, source capacitance and current injection - have an influence on the
accuracy of the ATD.
A.2.2.1 Source Resistance
Due to the input pin leakage current as specified in Table A-6 in conjunction with the source resistance
there will be a voltage drop from the signal source to the ATD input. The maximum source resistance R
S
95
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specifies results in an error of less than 1/2 LSB (2.5mV) at the maximum leakage current. If device or
operatingconditionsare less thanworstcase or leakage-inducederror is acceptable,largervalues of source
resistance is allowed.
A.2.2.2 Source Capacitance
When sampling an additional internal capacitor is switched to the input. This can cause a voltage drop due
to charge sharing with the external and the pin capacitance. For a maximum sampling error of the input
voltage ≤ 1LSB, then the external filter capacitor, C
≥ 1024 * (C
f
INS
- C
INN
).
A.2.2.3 Current Injection
There are two cases to consider.
1.A current is injected into the channel being converted. The channel being stressed has conversion
values of$3FF($FF in 8-bit mode) for analoginputsgreater than V
unless the current is higher than specified as disruptive condition.
V
RL
and $000forvalues less than
RH
2.Current is injected into pins in the neighborhood of the channel being converted. A portion of this
current is picked up by the channel (coupling ratio K), This additional current impacts the accuracy
of the conversion depending on the source resistance.
The additional input voltage error on the converted channel can be calculated as V
I
INJ
, with I
being the sum of the currents injected into the two pins adjacent to the converted
INJ
ERR
channel.
=K*RS*
Table A-9 ATD Electrical Characteristics
Conditions are shown in Table A-4 unless otherwise noted
Num CRatingSymbolMinTypMaxUnit
1C Max input Source Resistance
Total Input Capacitance
2T
3C Disruptive Analog Input Current
4C Coupling Ratio positive current injection
5C Coupling Ratio negative current injection
Non Sampling
Sampling
R
S
C
INN
C
INS
I
NA
K
p
K
n
--1KΩ
--1022pF
-2.5-2.5mA
--
--
10
10
-4
-2
A/A
A/A
96
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A.2.3 ATD accuracy
Table A-10 specifies the ATD conversion performance excluding any errors due to current injection,
input capacitance and source resistance.
Table A-10 ATD Conversion Performance
Conditions are shown in Table A-4 unless otherwise noted
V
= VRH - VRL = 5.12V. Resulting to one 8 bit count = 20mV and one 10 bit count = 5mV
shows only definitions, for specification values refer to
Table A-10
.
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A.3 NVM, Flash and EEPROM
MC9S12DP512 Device Guide V01.23
NOTE:
Unless otherwise noted the abbreviation NVM (Non Volatile Memory) is used for
both Flash and EEPROM.
A.3.1 NVM timing
The time base for all NVM program or erase operations is derived from the oscillator. A minimum
oscillator frequency f
do not have any means to monitor the frequency and will not prevent program or erase operation at
frequencies above or below the specified minimum. Attempting to program or erase the NVM modules at
a lower frequency a full program or erase transition is not assured.
The Flash and EEPROM program and erase operations are timed using a clock derived fromtheoscillator
using the FCLKDIV and ECLKDIV registers respectively. Thefrequency of this clock must be set within
the limits specified as f
The minimum program and erase times shown in Table A-11 are calculated for maximum f
maximum f
. The maximum times are calculated for minimum f
bus
NVMOSC
NVMOP
is required for performing program or erase operations. The NVM modules
.
NVMOP
and a f
of 2MHz.
bus
A.3.1.1 Single Word Programming
The programming time for single word programming is dependant on the bus frequency as a well as on
the frequency f
A.3.1.2 Row Programming
NVMOP
and can be calculated according to the following formula.
t
swpgm
9
1
⋅25
--------------------f
NVMOP
⋅+=
1
---------f
bus
This applies onlytothe Flash where up to 64 wordsinarow can be programmed consecutively by keeping
the command pipeline filled. The time to program a consecutive word can be calculated as:
t
bwpgm
4
1
⋅9
--------------------f
NVMOP
⋅+=
1
---------f
bus
NVMOP
and
The time to program a whole row is:
Row programming is more than 2 times faster than single word programming.
A.3.1.3 Sector Erase
Erasing a 1024 byte Flash sector or a 4 byte EEPROM sector takes:
t
brpgm
t
swpgm
63t
⋅+=
bwpgm
1
t
era
4000
⋅≈
--------------------f
NVMOP
99
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The setup time can be ignored for this operation.
A.3.1.4 Mass Erase
Erasing a NVM block takes:
1
t
mass
The setup time can be ignored for this operation.
A.3.1.5 Blank Check
The time it takes to perform a blank check on the Flash or EEPROM is dependant on the location of the
first non-blank word starting at relative address zero. Ittakes one bus cycle per word to verify plus a setup
of the command.
20000
⋅≈
--------------------f
NVMOP
t
check
location t
cyc
10t
⋅+⋅≈
cyc
Table A-11 NVM Timing Characteristics
Conditions are shown in Table A-4 unless otherwise noted
Num CRatingSymbolMinTypMaxUnit
1D External Oscillator Clock
2D Bus frequency for Programming or Erase Operations
3D Operating Frequency
4P Single Word Programming Time
5D
6D
7P Sector Erase Time
8P Mass Erase Time
9D Blank Check Time Flash per block
10D Blank Check Time EEPROM per block
NOTES:
1. Restrictions for oscillator in crystal mode apply!