Datasheet MC9S12DP512 Datasheet (Freescale)

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查询MC9S12A512供应商
MC9S12DP512
Device Guide
Covers also
DOCUMENT NUMBER
9S12DP512DGV1/D
MC9S12DT512, MC9S12DJ512,
MC9S12A512
Original Release Date: 27 Nov 2001
Revised: 09 Feb 2005
Motorola, Inc
Motorola reserves the right to make changes without further notice to any products herein to improve reliability, function or design. Motorola does not assume any liability arising out of the application or use of any product or circuit described herein; neither does it convey any license under its patent rights nor the rights of others. Motorola products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the Motorola product could create a situation where personal injury or death may occur. Should Buyer purchase or use Motorola products for any such unintended or unauthorized application,Buyershallindemnify andhold Motorolaand itsofficers, employees,subsidiaries, affiliates,and distributorsharmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly orindirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that Motorola was negligent regarding the design or manufacture of the part.
1
Page 2
Revision History
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DOCUMENT NUMBER
9S12DP512DGV1/D
Version Number
V01.00
V01.01
V01.02
V01.03
V01.04
V01.05
Revision
Date
27 Nov
2001
13 Mar
2002
02 Apr
2002
15 Apr
2002
06 Jun
2002
05 Jul
2002
Effective
Date
11 Feb
2002
13 Mar
2002
02 Apr
2002
15 Apr
2002
06 Jun
2002
05 Jul
2002
Author Description of Changes
- Initial version based on DP256 V2.09.
- Updated document formats.
- Removed reference to SIM in overview.
- Changed XCLKS to PE7 in signal description.
- Removed"Oscillator start-up time fromPOR or STOP"from Oscillator Characterisitcs.
- Changed VDD and VDDPLL to 2.35V.
- Updated C
- Updated I
- Updated input capacitance.
- Updated NVM timing characteristics.
- Updated document reference (SPI, SCI).
- Corrected values in device memory map (RAM start, flash protected sector sizes).
- Updated document reference (SCI).
- Changed all operating frequency references to 50MHz EXTAL and removed references to 80 pin LQFP.
- Preface Table "Document References": Changed to full naming for each block.
- Table "Interrupt Vector Locations", Column "Local Enable": Corrected several register and bit names.
- Table "Signal Properties": Added column "Internal Pull Resistor".
- Table "PLL Characteristics": Updated parameters K1 and f1
- Figure "Basic Pll functional diagram": Inserted XFC pin in diagram
- Enhanced section "XFC Component Selection"
- Added to Sections ATD, ECT and PWM: freeze mode = active BDM mode.
.
INS
OL/IOH
values.
Motorola reserves the right to make changes without further notice to any products herein to improve reliability, function or design. Motorola does not assume any liability arising out of the application or use of any product or circuit described herein; neither does it convey any license under its patent rights nor the rights of others. Motorola products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the Motorola product could create a situation where personal injury or death may occur. Should Buyer purchase or use Motorola products for any such unintended or unauthorized application,Buyer shallindemnify andhold Motorolaand itsofficers, employees,subsidiaries, affiliates,and distributorsharmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly orindirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that Motorola was negligent regarding the design or manufacture of the part.
2
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MC9S12DP512 Device Guide V01.23
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Version Number
V01.06
V01.07
Revision
Date
24 Jul
2002
29 Jul
2002
Effective
Date
24 Jul
2002
05 Aug
2002
Author Description of Changes
- Updated SPI electrical characteristics.
- Updated Derivative Differences table.
- Added ordering number example.
- Added Detailed Register Map.
- Changed Internal Pull Resistor column of signal table.
- Added pull device description for MODC pin.
- Corrected XCLKS figure titles. Moved table to section Modes of Operation.
- Removed ’1/2’ from BDM in Figure Clock Connections.
- Completely reworked section Modes of Operation. Added Chip Configuration Summary and Low Power Mode description.
- Changed classification to C for internal pull currents inTable 5V I/O Characteristics.
- Changed input leakage to 1uA for all pins.
- Updated VREG section and layout recommendation.
- Moved Power and Gound Connection Summary table to start of Power Supply Pins section.
- Added ROMONE to pinout
- Corrected mem map: ’MEBI map x of 3’
- Corrected mem map: KEYEN bits in FSEC.
- Added section Printed Circuit Board Layout Proposal.
- Corrected addresses in Reserved, CAN and EEP buffer map.
- Updated NVM electricals.
V01.08
V01.09
V01.10
V01.11
V01.12
V01.13
V01.14
V01.15
21 Aug
2002
24 Sep
2002
18 Oct
2002
29 Oct
2002
03 Dec
2002
08 Jan
2003
23 Jan
2003
28 Feb
2003
21 Aug
2002
24 Sep
2002
18 Oct
2002
29 Oct
2002
03 Dec
2002
08 Jan
2003
23 Jan
2003
28 Feb
2003
- Updated table ’Document References’
- Added section ’Oscillator (OSC) Block Description’
- Section HCS12 Core Block Desciption: mentioned alternalte clock of BDM to be equivalent to oscillator clock
- Corrected tables 0-1 and 0-2
- Added derivatives to cover sheet.
- Added part ID for 1L00M maskset.
- Corrected in footnote of Table "PLL Characteristics": f
- Renamed Preface section to Derivative Differences and Document references.
- Added A512 derivative.
- Updated module set of DJ512 in Table 0-1.
- Added details for derivatives without CAN and/or BDLC modules.
- Corrected several entries in ’Detailed Memory Map’.
- Removed footnote on input leakage current from table ’5V I/O Characteristics’.
- Updated section ’Unsecuring the Microcontroller’.
- Updated footnote 1 in table ’Operating Conditions’.
- Renamed ROMONE pin to ROMCTL.
- Corrected PE[1,0] pull specification in Signal Properties Summary Table.
OSC
= 4MHz.
3
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MC9S12DP512 Device Guide V01.23
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Version Number
V01.16
V01.17
V01.18
V01.19
V01.20
V01.21
V01.22
V01.23
Revision
Date
31 Mar
2003
30 May
2003
23 Jul
2003
24 Jul
2003
01 Sep
2003
08 Mar
2004
23 Aug
2004
09 Feb
2005
Effective
Date
31 Mar
2003
30 May
2003
23 Jul
2003
24 Jul
2003
01 Sep
2003
08 Mar
2004
23 Aug
2004
09 Feb
2005
Author Description of Changes
- Corrections in App. A ’NVM, Flash and EEPROM’:
- Number of words per flash row = 64
- Replaced ’burst programming’ with ’row programming’
- Sector erase size = 1024 bytes
- Corrected feature description ECT
- Corrected min. bus freq. in table ’Operating Conditions’
- Replacedreferences to HCS12Core Guide with theindividual HCS12 Block guides throughout document
- Table ’Absolute Maximum Ratings’ corrected footnote on clamp of TEST pin
- Mentioned ’S12 LRAE’ bootloader in Flash section
- Document References: corrected S12 CPU document reference
- Added part ID for 2L00M maskset.
- Added part ID for 3L00M maskset.
- Added cycle definition to ’CPU 12 Block Description’.
- Diagram ’Clock Connections’: Connected Bus Clock to HCS12 Core.
- Corrected ’Background Debug Module’ to ’HCS12 Breakpoint’ at address $0028 - $002F in table 1-1.
- Corrected ’Blank Check Time Flash’ value in table ’NVM Timing Characteristics’
- Added EXTAL pin VIH, VIL and EXTAL pin hysteresis value to ’Oscillator Characteristics’. Updated oscillator description and table note.
- Added part ID for 4L00M maskset.
- Corrected pin name KWP5 in device pinout.
- Updated V
- Removed item ’Oscillator’ from table ’Operating Conditions’ as already covered in table ’Oscillator Characteristics’
- Corrected Flash Row Programming Time in NVM Timing Characteristics
IH,EXTAL
and V
in table ’Oscillator Characteristics’
IL,EXTAL
4
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MC9S12DP512 Device Guide V01.23
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Table of Contents
Section 1 Introduction
1.1 Overview. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .19
1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .19
1.3 Modes of Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .21
1.4 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .22
1.5 Device Memory Map. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .24
1.5.1 Detailed Register Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .27
1.6 Part ID Assignments. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .49
1.7 Memory Size Assignments. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .49
Section 2 Signal Description
2.1 Device Pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .52
2.2 Signal Properties Summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .53
2.3 Detailed Signal Descriptions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .55
2.3.1 EXTAL, XTAL — Oscillator Pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .55
2.3.2 RESET — External Reset Pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .55
2.3.3 TEST — Test Pin. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .55
2.3.4 VREGEN — Voltage Regulator Enable Pin. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .55
2.3.5 XFC — PLL Loop Filter Pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .56
2.3.6 BKGD / TAGHI / MODC — Background Debug, Tag High, and Mode Pin . . . . . . . .56
2.3.7 PAD15 / AN15 / ETRIG1 — Port AD Input Pin of ATD1 . . . . . . . . . . . . . . . . . . . . . .56
2.3.8 PAD[14:08] / AN[14:08] — Port AD Input Pins of ATD1 . . . . . . . . . . . . . . . . . . . . . .56
2.3.9 PAD7 / AN07 / ETRIG0 — Port AD Input Pin of ATD0 . . . . . . . . . . . . . . . . . . . . . . .56
2.3.10 PAD[06:00] / AN[06:00] — Port AD Input Pins of ATD0 . . . . . . . . . . . . . . . . . . . . . .56
2.3.11 PA[7:0] / ADDR[15:8] / DATA[15:8] — Port A I/O Pins . . . . . . . . . . . . . . . . . . . . . . .57
2.3.12 PB[7:0] / ADDR[7:0] / DATA[7:0] — Port B I/O Pins . . . . . . . . . . . . . . . . . . . . . . . . .57
2.3.13 PE7 / NOACC / XCLKS — Port E I/O Pin 7. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .57
2.3.14 PE6 / MODB / IPIPE1 — Port E I/O Pin 6 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .58
2.3.15 PE5 / MODA / IPIPE0 — Port E I/O Pin 5 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .58
2.3.16 PE4 / ECLK — Port E I/O Pin 4 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .58
2.3.17 PE3 / LSTRB / TAGLO — Port E I/O Pin 3 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .59
2.3.18 PE2 / R/W — Port E I/O Pin 2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .59
2.3.19 PE1 / IRQ — Port E Input Pin 1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .59
5
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2.3.20 PE0 / XIRQ — Port E Input Pin 0. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .59
2.3.21 PH7 / KWH7 / SS2 — Port H I/O Pin 7 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .59
2.3.22 PH6 / KWH6 / SCK2 — Port H I/O Pin 6 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .59
2.3.23 PH5 / KWH5 / MOSI2 — Port H I/O Pin 5 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .59
2.3.24 PH4 / KWH4 / MISO2 — Port H I/O Pin 2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .59
2.3.25 PH3 / KWH3 / SS1 — Port H I/O Pin 3 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .60
2.3.26 PH2 / KWH2 / SCK1 — Port H I/O Pin 2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .60
2.3.27 PH1 / KWH1 / MOSI1 — Port H I/O Pin 1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .60
2.3.28 PH0 / KWH0 / MISO1 — Port H I/O Pin 0 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .60
2.3.29 PJ7 / KWJ7 / TXCAN4 / SCL / TXCAN0 — PORT J I/O Pin 7. . . . . . . . . . . . . . . . . .60
2.3.30 PJ6 / KWJ6 / RXCAN4 / SDA / RXCAN0 — PORT J I/O Pin 6 . . . . . . . . . . . . . . . . .60
2.3.31 PJ[1:0] / KWJ[1:0] — Port J I/O Pins [1:0] . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .60
2.3.32 PK7 / ECS / ROMCTL — Port K I/O Pin 7. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .60
2.3.33 PK[5:0] / XADDR[19:14] — Port K I/O Pins [5:0] . . . . . . . . . . . . . . . . . . . . . . . . . . . .61
2.3.34 PM7 / TXCAN3 / TXCAN4 — Port M I/O Pin 7 . . . . . . . . . . . . . . . . . . . . . . . . . . . . .61
2.3.35 PM6 / RXCAN3 / RXCAN4 — Port M I/O Pin 6 . . . . . . . . . . . . . . . . . . . . . . . . . . . . .61
2.3.36 PM5 / TXCAN2 / TXCAN0 / TXCAN4 / SCK0 — Port M I/O Pin 5. . . . . . . . . . . . . . .61
2.3.37 PM4 / RXCAN2 / RXCAN0 / RXCAN4/ MOSI0 — Port M I/O Pin 4. . . . . . . . . . . . . .61
2.3.38 PM3 / TXCAN1 / TXCAN0 / SS0 — Port M I/O Pin 3 . . . . . . . . . . . . . . . . . . . . . . . .61
2.3.39 PM2 / RXCAN1 / RXCAN0 / MISO0 — Port M I/O Pin 2. . . . . . . . . . . . . . . . . . . . . .61
2.3.40 PM1 / TXCAN0 / TXB — Port M I/O Pin 1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .62
2.3.41 PM0 / RXCAN0 / RXB — Port M I/O Pin 0. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .62
2.3.42 PP7 / KWP7 / PWM7 / SCK2 — Port P I/O Pin 7 . . . . . . . . . . . . . . . . . . . . . . . . . . .62
2.3.43 PP6 / KWP6 / PWM6 / SS2 — Port P I/O Pin 6. . . . . . . . . . . . . . . . . . . . . . . . . . . . .62
2.3.44 PP5 / KWP5 / PWM5 / MOSI2 — Port P I/O Pin 5. . . . . . . . . . . . . . . . . . . . . . . . . . .62
2.3.45 PP4 / KWP4 / PWM4 / MISO2 — Port P I/O Pin 4. . . . . . . . . . . . . . . . . . . . . . . . . . .62
2.3.46 PP3 / KWP3 / PWM3 / SS1 — Port P I/O Pin 3. . . . . . . . . . . . . . . . . . . . . . . . . . . . .62
2.3.47 PP2 / KWP2 / PWM2 / SCK1 — Port P I/O Pin 2 . . . . . . . . . . . . . . . . . . . . . . . . . . .63
2.3.48 PP1 / KWP1 / PWM1 / MOSI1 — Port P I/O Pin 1. . . . . . . . . . . . . . . . . . . . . . . . . . .63
2.3.49 PP0 / KWP0 / PWM0 / MISO1 — Port P I/O Pin 0. . . . . . . . . . . . . . . . . . . . . . . . . . .63
2.3.50 PS7 / SS0 — Port S I/O Pin 7 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .63
2.3.51 PS6 / SCK0 — Port S I/O Pin 6 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .63
2.3.52 PS5 / MOSI0 — Port S I/O Pin 5 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .63
2.3.53 PS4 / MISO0 — Port S I/O Pin 4 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .63
2.3.54 PS3 / TXD1 — Port S I/O Pin 3 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .63
2.3.55 PS2 / RXD1 — Port S I/O Pin 2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .64
6
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2.3.56 PS1 / TXD0 — Port S I/O Pin 1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .64
2.3.57 PS0 / RXD0 — Port S I/O Pin 0. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .64
2.3.58 PT[7:0] / IOC[7:0] — Port T I/O Pins [7:0] . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .64
2.4 Power Supply Pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .64
2.4.1 VDDX,VSSX — Power & Ground Pins for I/O Drivers. . . . . . . . . . . . . . . . . . . . . . . .65
2.4.2 VDDR, VSSR — Power & Ground Pins for I/O Drivers & Internal Voltage Regulator65
2.4.3 VDD1, VDD2, VSS1, VSS2 — Internal Logic Power Supply Pins. . . . . . . . . . . . . . .65
2.4.4 VDDA, VSSA — Power Supply Pins for ATD and VREG . . . . . . . . . . . . . . . . . . . . .65
2.4.5 VRH, VRL — ATD Reference Voltage Input Pins . . . . . . . . . . . . . . . . . . . . . . . . . . .65
2.4.6 VDDPLL, VSSPLL — Power Supply Pins for PLL. . . . . . . . . . . . . . . . . . . . . . . . . . .65
2.4.7 VREGEN — On Chip Voltage Regulator Enable. . . . . . . . . . . . . . . . . . . . . . . . . . . .66
Section 3 System Clock Description
3.1 Overview. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .67
Section 4 Modes of Operation
4.1 Overview. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .69
4.2 Chip Configuration Summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .69
4.3 Security. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .70
4.3.1 Securing the Microcontroller . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .70
4.3.2 Operation of the Secured Microcontroller . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .70
4.3.3 Unsecuring the Microcontroller . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .71
4.4 Low Power Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .71
4.4.1 Stop . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .71
4.4.2 Pseudo Stop. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .71
4.4.3 Wait . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .71
4.4.4 Run. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .72
Section 5 Resets and Interrupts
5.1 Overview. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .73
5.2 Vectors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .73
5.2.1 Vector Table. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .73
5.3 Effects of Reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .74
5.3.1 I/O pins. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .74
5.3.2 Memory . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .75
Section 6 HCS12 Core Block Description
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6.1 CPU12 Block Description. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .77
6.1.1 Device-specific information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .77
6.2 HCS12 Module Mapping Control (MMC) Block Description. . . . . . . . . . . . . . . . . . . . . .77
6.2.1 Device-specific information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .77
6.3 HCS12 Multiplexed External Bus Interface (MEBI) Block Description . . . . . . . . . . . . . .77
6.3.1 Device-specific information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .77
6.4 HCS12 Interrupt (INT) Block Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .77
6.5 HCS12 Background Debug (BDM) Block Description . . . . . . . . . . . . . . . . . . . . . . . . . .78
6.5.1 Device-specific information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .78
6.6 HCS12 Breakpoint (BKP) Block Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .78
Section 7 Clock and Reset Generator (CRG) Block Description
7.1 Device-specific information. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .78
Section 8 Oscillator (OSC) Block Description
8.1 Device-specific information. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .78
Section 9 Enhanced Capture Timer (ECT) Block Description
Section 10 Analog to Digital Converter (ATD) Block Description
Section 11 Inter-IC Bus (IIC) Block Description
Section 12 Serial Communications Interface (SCI) Block Description
Section 13 Serial Peripheral Interface (SPI) Block Description
Section 14 J1850 (BDLC) Block Description
Section 15 Pulse Width Modulator (PWM) Block Description
Section 16 Flash EEPROM 512K Block Description
Section 17 EEPROM 4K Block Description
Section 18 RAM Block Description
Section 19 MSCAN Block Description
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Section 20 Port Integration Module (PIM) Block Description
Section 21 Voltage Regulator (VREG) Block Description
Section 22 Printed Circuit Board Layout Proposal
Appendix A Electrical Characteristics
A.1 General. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .85
A.1.1 Parameter Classification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .85
A.1.2 Power Supply. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .85
A.1.3 Pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .86
A.1.4 Current Injection. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .87
A.1.5 Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .87
A.1.6 ESD Protection and Latch-up Immunity. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .88
A.1.7 Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .89
A.1.8 Power Dissipation and Thermal Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . .89
A.1.9 I/O Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .91
A.1.10 Supply Currents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .92
A.2 ATD Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .95
A.2.1 ATD Operating Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .95
A.2.2 Factors influencing accuracy . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .95
A.2.3 ATD accuracy. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .97
A.3 NVM, Flash and EEPROM. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .99
A.3.1 NVM timing. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .99
A.3.2 NVM Reliability. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .101
A.4 Voltage Regulator. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .103
A.5 Reset, Oscillator and PLL. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .105
A.5.1 Startup . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .105
A.5.2 Oscillator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .106
A.5.3 Phase Locked Loop . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .107
A.6 MSCAN. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .111
A.7 SPI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .113
A.7.1 Master Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .113
A.7.2 Slave Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .115
A.8 External Bus Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .117
A.8.1 General Muxed Bus Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .117
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Appendix B Package Information
B.1 General. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .121
B.2 112-pin LQFP package. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .122
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List of Figures
Figure 0-1 Order Part Number Example. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .15
Figure 1-1 MC9S12DP512 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .23
Figure 1-2 MC9S12DP512 Memory Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .26
Figure 2-1 Pin Assignments in 112-pin LQFP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .52
Figure 2-2 PLL Loop Filter Connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .56
Figure 2-3 Colpitts Oscillator Connections (PE7=1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .57
Figure 2-4 Pierce Oscillator Connections (PE7=0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .58
Figure 2-5 External Clock Connections (PE7=0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .58
Figure 3-1 Clock Connections. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .67
Figure 22-1 Recommended PCB Layout for 112LQFP Colpitts Oscillator . . . . . . . . . . . . . . .82
Figure 22-2 Recommended PCB Layout for 112LQFP Pierce Oscillator . . . . . . . . . . . . . . . .83
Figure A-1 ATD Accuracy Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 98
Figure A-2 Basic PLL functional diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 107
Figure A-3 Jitter Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 109
Figure A-4 Maximum bus clock jitter approximation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 109
Figure A-5 SPI Master Timing (CPHA=0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 113
Figure A-6 SPI Master Timing (CPHA=1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 114
Figure A-7 SPI Slave Timing (CPHA=0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 115
Figure A-8 SPI Slave Timing (CPHA=1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 116
Figure A-9 General External Bus Timing. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 118
Figure B-1 112-pin LQFP mechanical dimensions (case no. 987) . . . . . . . . . . . . . . . . . . 122
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List of Tables
Table 0-1 Derivative Differences . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .15
Table 0-2 Document References. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .17
Table 1-1 Device Memory Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .24
$0000 - $000F MEBI map 1 of 3 (HCS12 Multiplexed External Bus Interface) . . . . . . . . . .27
$0010 - $0014 MMC map 1 of 4 (HCS12 Module Mapping Control). . . . . . . . . . . . . . . . . .27
$0015 - $0016 INT map 1 of 2 (HCS12 Interrupt) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .28
$0017 - $0019 Reserved . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .28
$001A - $001B Device ID Register (Table 1-3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .28
$001C - $001D MMC map 3 of 4 (HCS12 Module Mapping Control, Table 1-4) . . . . . . . . .28
$001E - $001E MEBI map 2 of 3 (HCS12 Multiplexed External Bus Interface). . . . . . . . . .28
$001F - $001F INT map 2 of 2 (HCS12 Interrupt). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .28
$0020 - $0027 Reserved . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .28
$0028 - $002F BKP (HCS12 Breakpoint) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .29
$0030 - $0031 MMC map 4 of 4 (HCS12 Module Mapping Control). . . . . . . . . . . . . . . . . .29
$0032 - $0033 MEBI map 3 of 3 (HCS12 Multiplexed External Bus Interface) . . . . . . . . . .29
$0034 - $003F CRG (Clock and Reset Generator) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .29
$0040 - $007F ECT (Enhanced Capture Timer 16 Bit 8 Channels) . . . . . . . . . . . . . . . . . .30
$0080 - $009F ATD0 (Analog to Digital Converter 10 Bit 8 Channel) . . . . . . . . . . . . . . . . .33
$00A0 - $00C7 PWM (Pulse Width Modulator 8 Bit 8 Channel). . . . . . . . . . . . . . . . . . . . . .34
$00C8 - $00CF SCI0 (Asynchronous Serial Interface). . . . . . . . . . . . . . . . . . . . . . . . . . . . .36
$00D0 - $00D7 SCI1 (Asynchronous Serial Interface) . . . . . . . . . . . . . . . . . . . . . . . . . . . . .36
$00D8 - $00DF SPI0 (Serial Peripheral Interface) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .36
$00E0 - $00E7 IIC (Inter IC Bus) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .37
$00E8 - $00EF BDLC (Bytelevel Data Link Controller J1850) . . . . . . . . . . . . . . . . . . . . . . .37
$00F0 - $00F7 SPI1 (Serial Peripheral Interface) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .38
$00F8 - $00FF SPI2 (Serial Peripheral Interface) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .38
$0100 - $010F Flash Control Register (fts512k4) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .38
$0110 - $011B EEPROM Control Register (eets4k) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .39
$011C - $011F Reserved for RAM Control Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .39
$0120 - $013F ATD1 (Analog to Digital Converter 10 Bit 8 Channel) . . . . . . . . . . . . . . . . .40
$0140 - $017F CAN0 (Motorola Scalable CAN - MSCAN) . . . . . . . . . . . . . . . . . . . . . . . . .41
Table 1-2 Detailed MSCAN Foreground Receive and Transmit Buffer Layout. . . . . . . . . . .42
$0180 - $01BF CAN1 (Motorola Scalable CAN - MSCAN) . . . . . . . . . . . . . . . . . . . . . . . . .43
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$01C0 - $01FF CAN2 (Motorola Scalable CAN - MSCAN) . . . . . . . . . . . . . . . . . . . . . . . . .44
$0200 - $023F CAN3 (Motorola Scalable CAN - MSCAN) . . . . . . . . . . . . . . . . . . . . . . . . .45
$0240 - $027F PIM (Port Integration Module PIM_9DP256). . . . . . . . . . . . . . . . . . . . . . . .46
$0280 - $02BF CAN4 (Motorola Scalable CAN - MSCAN) . . . . . . . . . . . . . . . . . . . . . . . . .48
$02C0 - $03FF Reserved . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .49
Table 1-3 Assigned Part ID Numbers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .49
Table 1-4 Memory size registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .49
Table 2-1 Signal Properties . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .53
Table 2-2 MC9S12DP512 Power and Ground Connection Summary. . . . . . . . . . . . . . . . . .64
Table 4-1 Mode Selection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .69
Table 4-2 Clock Selection Based on PE7 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .70
Table 4-3 Voltage Regulator VREGEN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .70
Table 5-1 Interrupt Vector Locations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .73
Table 22-1 Suggested External Component Values . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .81
Table A-1 Absolute Maximum Ratings. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .87
Table A-2 ESD and Latch-up Test Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .88
Table A-3 ESD and Latch-up Protection Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . .88
Table A-4 Operating Conditions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .89
Table A-5 Thermal Package Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .91
Table A-6 5V I/O Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .92
Table A-7 Supply Current Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .93
Table A-8 ATD Operating Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .95
Table A-9 ATD Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .96
Table A-10 ATD Conversion Performance. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .97
Table A-11 NVM Timing Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .100
Table A-12 NVM Reliability Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .101
Table A-13 Voltage Regulator Recommended Load Capacitances. . . . . . . . . . . . . . . . . . . .103
Table A-14 Startup Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .105
Table A-15 Oscillator Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .106
Table A-16 PLL Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .110
Table A-17 MSCAN Wake-up Pulse Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .111
Table A-18 Measurement Conditions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .113
Table A-19 SPI Master Mode Timing Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .114
Table A-20 SPI Slave Mode Timing Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .116
Table A-21 Expanded Bus Timing Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .119
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Derivative Differences and Document References
Derivative Differences
Table 0-1 shows the availability of peripheral modules on the various derivatives. For details about the
compatibility within the MC9S12D-Family refer also to engineering bulletin EB386.
1
An errata exists
Office
Table 0-1 Derivative Differences
Modules MC9S12DP512 MC9S12DT512 MC9S12DJ512 MC9S12A512
# of CANs 5 3 2 0
CAN0 ✓✓ ✓ — CAN1 ✓✓ —— CAN2 ——— CAN3 ——— CAN4 ✓✓ ✓
J1850/BDLC
Package 112 LQFP 112 LQFP 112 LQFP 112 LQFP Package
Code
Mask set L00M L00M L00M L00M
Temp Options M, V, C M, V, C M, V, C C
Notes
NOTES:
1.
: Available for this device, —: Not available for this device
PV PV PV PV
An errata exists
contact Sales
Office
An errata exists
contact Sales
Office
An errata exists
contact Sales
The following figure provides an ordering number example for the MC9S12D-Family devices.
contact Sales
Office
MC9S12 DP512 C PV
Figure 0-1 Order Part Number Example
Package Option
Temperature Option Device Title Controller Family
Temperature Options
C = -40˚C to 85˚C V = -40˚C to 105˚C M = -40˚C to 125˚C
Package Options
FU = 80 QFP PV = 112 LQFP
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The following items should be considered when using a derivative (Table 0-1):
Registers
Do not write or read CAN0 registers (after reset: address range $0140 - $017F), if using a
derivative without CAN0.
Do not write or read CAN1registers (after reset: address range $0180 - $01BF), if using a
derivative without CAN1.
Do not write or read CAN2 registers (after reset: address range $01C0 - $01FF), if using a
derivative without CAN2.
Do not write or read CAN3 registers (after reset: address range $0200 - $023F), if using a
derivative without CAN3.
Do not write or read CAN4 registers (after reset: address range $0280 - $02BF), if using a
derivative without CAN4.
Do not write or read BDLC registers (after reset: address range $00E8 - $00EF), if using a
derivative without BDLC.
Interrupts
Fill the four CAN0 interrupt vectors ($FFB0 - $FFB7) according to your coding policies for
unused interrupts, if using a derivative without CAN0.
Fill the four CAN1 interrupt vectors ($FFA8 - $FFAF) according to your coding policies for
unused interrupts, if using a derivative without CAN1.
Fill the four CAN2 interrupt vectors ($FFA0 - $FFA7) according to your coding policies for
unused interrupts, if using a derivative without CAN2.
Fill the four CAN3 interrupt vectors ($FF98 - $FF9F) according to your coding policies for
unused interrupts, if using a derivative without CAN3.
Fill the four CAN4 interrupt vectors ($FF90 - $FF97) according to your coding policies for
unused interrupts, if using a derivative without CAN4.
Fill the BDLC interrupt vector ($FFC2, $FFC3) according to your coding policies for unused
interrupts, if using a derivative without BDLC.
Ports
The CAN0 pin functionality (TXCAN0, RXCAN0) is not available on port PJ7, PJ6, PM5,
PM4, PM3, PM2, PM1 and PM0, if using a derivative without CAN0.
The CAN1 pin functionality (TXCAN1, RXCAN1) is not available on port PM3 and PM2, if
using a derivative without CAN1.
The CAN2 pin functionality (TXCAN2, RXCAN2) is not available on port PM5 and PM4, if
using a derivative without CAN2.
The CAN3 pin functionality (TXCAN3, RXCAN3) is not available on port PM7 and PM6, if
using a derivative without CAN3.
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The CAN4 pin functionality (TXCAN4, RXCAN4) is not available on port PJ7, PJ6, PM7,
PM6, PM5 and PM4, if using a derivative without CAN0.
The BDLC pin functionality (TXB, RXB) is not available on port PM1 and PM0, if using a
derivative without BDLC.
Do not write MODRR1 and MODRR0 bits of Module Routing Register (PIM_9DP256 Block
Guide), if using a derivative without CAN0.
Do not write MODRR3 and MODRR2 bits of Module Routing Register (PIM_9DP256 Block
Guide), if using a derivative without CAN4.
Document References
The Device Guide provides information about the MC9S12DP512 device made up of standard HCS12 blocks and the HCS12 processor core.
This document is part of the customer documentation. A complete set of device manuals also includes the individual Block Guides of the implemented modules. In an effort to reduce redundancy, all module specific information is located only in the respective Block Guide. If applicable, special implementation details of the module are given in the block description sections of this document.
See Table 0-2 for names and versions of the referenced documents throughout the Device Guide.
Table 0-2 Document References
Block Guide Version Document Order Number
HCS12 CPU Reference Manual V02 S12CPUV2/D
HCS12 Module Mapping Control (MMC) Block Guide V04 S12MMCV4/D
HCS12 Multiplexed External Bus Interface (MEBI) Block Guide V03 S12MEBIV3/D
HCS12 Interrupt (INT) Block Guide V01 S12INTV1/D
HCS12 Background Debug (BDM) Block Guide V04 S12BDMV4/D
HCS12 Breakpoint (BKP) Block Guide V01 S12BKPV1/D
Clock and Reset Generator (CRG) Block Guide V04 S12CRGV4/D
Enhanced Capture Timer 16 Bit 8 Channel (ECT_16B8C) Block Guide V01 S12ECT16B8V1/D
Analog to Digital Converter 10 Bit 8 Channel (ATD_10B8C) Block Guide V02 S12ATD10B8CV2/D
Inter IC Bus (IIC) Block Guide V02 S12IICV2/D
Asynchronous Serial Interface (SCI) Block Guide V02 S12SCIV2/D
Serial Peripheral Interface (SPI) Block Guide V03 S12SPIV3/D
Pulse Width Modulator 8 Bit 8 Channel (PWM_8B8C) Block Guide V01 S12PWM8B8CV1/D
512K Byte Flash (FTS512K4) Block Guide V01 S12FTS512K4V1/D
4K Byte EEPROM (EETS4K) Block Guide V02 S12EETS4KV2/D
Byte Level Data Link Controller -J1850 (BDLC) Block Guide V01 S12BDLCV1/D
Motorola Scalable CAN (MSCAN) Block Guide V02 S12MSCANV2/D
Voltage Regulator (VREG) Block Guide V01 S12VREGV1/D
Port Integration Module (PIM_9DP256) Block Guide
Oscillator (OSC) Block Guide V02 S12OSCV2/D
1
V03 S12DP256PIMV3/D
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NOTES:
1. Reused due to functional equivalence.
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Section 1 Introduction
1.1 Overview
The MC9S12DP512 microcontroller unit (MCU) is a 16-bit device composed of standard on-chip peripherals including a 16-bit central processing unit (HCS12 CPU), 512K bytes of Flash EEPROM, 14K bytes of RAM, 4K bytes of EEPROM, two asynchronous serial communications interfaces (SCI), three serial peripheral interfaces (SPI), an 8-channel IC/OC enhanced capture timer, two 8-channel, 10-bit analog-to-digital converters(ADC),an 8-channel pulse-width modulator(PWM),a digital Byte Data Link Controller (BDLC), 29 discrete digital I/O channels (Port A, Port B, Port K and Port E), 20 discrete digital I/O lines with interrupt and wake up capability, five CAN 2.0 A, B software compatible modules (MSCAN12), and an Inter-IC Bus. The MC9S12DP512 has full 16-bit data paths throughout. However, the external bus can operate in an 8-bit narrow mode so single 8-bit wide memory can be interfaced for lower cost systems. The inclusion of a PLL circuit allows power consumption and performance to be adjusted to suit operational requirements.
1.2 Features
HCS12 Core – 16-bit HCS12 CPU
i. Upward compatible with M68HC11 instruction set ii. Interrupt stacking and programmer’s model identical to M68HC11 iii.Instruction queue
iv.Enhanced indexed addressing – MEBI (Multiplexed External Bus Interface) – MMC (Module Mapping Control) – INT (Interrupt control) – BKP (Breakpoints) – BDM (Background Debug Mode)
CRG (Clock and Reset Generation) – Low current Colpitts oscillator or – Pierce oscillator – PLL – COP watchdog – Real Time Interrupt – Clock Monitor
8-bit and 4-bit ports with interrupt functionality
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Digital filtering – Programmable rising or falling edge trigger
Memory – 512K Flash EEPROM – 4K byte EEPROM – 14K byte RAM
Two 8-channel Analog-to-Digital Converters – 10-bit resolution – External conversion trigger capability
Five 1M bit per second, CAN 2.0 A, B software compatible modules – Five receive and three transmit buffers – Flexible identifier filter programmable as 2 x 32 bit, 4 x 16 bit or 8x8bit – Four separate interrupt channels for Rx, Tx, error and wake-up – Low-pass filter wake-up function – Loop-back for self test operation
Enhanced Capture Timer – 16-bit main counter with 7-bit prescaler – 8 programmable input capture or output compare channels – Four 8-bit or two 16-bit pulse accumulators
8 PWM channels – Programmable period and duty cycle – 8-bit 8-channel or 16-bit 4-channel – Separate control for each pulse width and duty cycle – Center-aligned or left-aligned outputs – Programmable clock select logic with a wide range of frequencies – Fast emergency shutdown input – Usable as interrupt inputs
Serial interfaces – Two asynchronous Serial Communications Interfaces (SCI) – Three Synchronous Serial Peripheral Interface (SPI)
Byte Data Link Controller (BDLC) – SAE J1850 Class B Data Communications Network Interface Compatible and ISO Compatible
for Low-Speed (<125 Kbps) Serial Data Communications in Automotive Applications
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Inter-IC Bus (IIC) – Compatible with I – Multi-master operation – Software programmable for one of 256 different serial clock frequencies
112-Pin LQFP package – I/O lines with 5V input and drive capability – 5V A/D converter inputs
2
C Bus standard
Operation at 50MHz equivalent to 25MHz Bus Speed over -40˚C <= T – Development support – Single-wire background debug™ mode (BDM) – On-chip hardware breakpoints
1.3 Modes of Operation
User modes
Normal and Emulation Operating Modes – Normal Single-Chip Mode – Normal Expanded Wide Mode – Normal Expanded Narrow Mode – Emulation Expanded Wide Mode – Emulation Expanded Narrow Mode
Special Operating Modes – Special Single-Chip Mode with active Background Debug Mode – Special Test Mode (Motorola use only) – Special Peripheral Mode (Motorola use only)
Low power modes
Stop Mode
Pseudo Stop Mode
<= 125˚C
A
Wait Mode
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1.4 Block Diagram
Figure 1-1 shows a block diagram of the MC9S12DP512 device.
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Figure 1-1 MC9S12DP512 Block Diagram
VDDR VSSR
VREGEN
VDD1,2
VSS1,2
BKGD
XFC
VDDPLL
VSSPLL
EXTAL
XTAL
RESET
PE0
PE1 PE2 PE3 PE4 PE5 PE6 PE7
TEST
Multiplexed Wide Bus
Multiplexed Narrow Bus
Internal Logic 2.5V
VDD1,2 VSS1,2
PLL 2.5V
VDDPLL
VSSPLL
512K Byte Flash EEPROM
14K Byte RAM
4K Byte EEPROM
Voltage Regulator
Single-wire Background
Debug Module
Clock and Reset
PLL
Generation Module
XIRQ IRQ
W
R/ LSTRB
DDRE
ECLK MODA MODB NOACC/
XCLKS
PTE
Multiplexed Address/Data Bus
DDRA DDRB
PTA PTB
PA4
PA3
PA2
PA1
ADDR11
ADDR10
ADDR9
DATA11
DATA10
DATA9
DATA3
DATA2
DATA1
PA0
ADDR8
DATA8
DATA0
PA7
PA6
PA5
ADDR15
ADDR14
ADDR13
DATA15
DATA14
DATA13
DATA7
DATA6
DATA5
ADDR12
DATA12
DATA4
I/O Driver 5V
VDDX
VSSX
A/D Converter 5V &
Voltage Regulator Reference
VDDA
VSSA
Voltage Regulator 5V & I/O
VDDR
VSSR
CPU12
Periodic Interrupt
COP Watchdog
Clock Monitor
Breakpoints
System
Integration
Module
(SIM)
PB4
PB6
PB5
ADDR6
ADDR5
DATA6
DATA5
PB3
ADDR4
ADDR3
DATA4
DATA3
PB7
ADDR7
DATA7
PB2
PB1
ADDR2
ADDR1
DATA2
DATA1
ATD0
AN00 AN01 AN02 AN03 AN04 AN05 AN06 AN07
Enhanced Capture Timer
SCI0
SCI1
SPI0
BDLC (J1850)
CAN0
PB0
CAN1 CAN2
ADDR0
CAN3 CAN4
DATA0
IIC
PWM
SPI1
SPI2
VRH
VRL
VDDA
VSSA
PPAGE
MISO MOSI
SCK
RXB
TXB RXCAN TXCAN RXCAN TXCAN RXCAN TXCAN RXCAN TXCAN RXCAN TXCAN
SDA
SCL
PWM0 PWM1 PWM2 PWM3 PWM4 PWM5 PWM6 PWM7
MISO MOSI
SCK
MISO MOSI
SCK
SS
SS
SS
AD0
ATD1
PAD00 PAD01 PAD02
PAD03 PAD04 PAD05 PAD06 PAD07
AN08 AN09 AN10 AN11 AN12 AN13 AN14 AN15
PIX0 PIX1 PIX2 PIX3 PIX4
PIX5
ECS
IOC0 IOC1 IOC2 IOC3 IOC4 IOC5 IOC6 IOC7
RXD
TXD
RXD
TXD
Module to Port Routing
KWJ0 KWJ1 KWJ6 KWJ7
KWP0 KWP1 KWP2 KWP3 KWP4 KWP5 KWP6 KWP7
KWH0 KWH1 KWH2
KWH3 KWH4 KWH5 KWH6 KWH7
VRH
VRL
VDDA
VSSA
DDRK
DDRT
DDRS
DDRM
DDRJ
DDRP
DDRH
AD1
PTK
PTT
PTS
PTM
PTJ
PTP
PTH
VRH VRL VDDA VSSA
PAD08 PAD09 PAD10
PAD11 PAD12 PAD13 PAD14 PAD15
PK0 PK1 PK2 PK3 PK4 PK5 PK7
PT0 PT1 PT2 PT3 PT4 PT5 PT6 PT7
PS0 PS1 PS2 PS3 PS4 PS5 PS6 PS7
PM0 PM1 PM2 PM3 PM4 PM5 PM6 PM7
PJ0 PJ1 PJ6 PJ7
PP0 PP1 PP2 PP3 PP4 PP5 PP6 PP7
PH0 PH1
PH2
PH3 PH4 PH5 PH6 PH7
XADDR14 XADDR15 XADDR16 XADDR17 XADDR18 XADDR19
ECS
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1.5 Device Memory Map
Table 1-1andFigure 1-2 show thedevicememory map oftheMC9S12DP512 after reset.Notethat after
reset the bottom 1k of the EEPROM ($0000 - $03FF) are hidden by the register space
Table 1-1 Device Memory Map
Address Module
$0000 - $000F HCS12 Multiplexed External Bus Interface 16 $0010 - $0014 HCS12 Module Mapping Control 5 $0015 - $0016 HCS12 Interrupt 2
$0017 - $0019 Reserved 3 $001A - $001B Device ID register (PARTID) 2 $001C - $001D HCS12 Module Mapping Control 2
$001E HCS12 Multiplexed External Bus Interface 1
$001F HCS12 Interrupt 1 $0020 - $0027 Reserved 8 $0028 - $002F HCS12 Breakpoint 8 $0030 - $0031 HCS12 Module Mapping Control 2 $0032 - $0033 HCS12 Multiplexed External Bus Interface 2 $0034 - $003F Clock and Reset Generator (PLL, RTI, COP) 12 $0040 - $007F Enhanced Capture Timer 16-bit 8 channels 64 $0080 - $009F Analog to Digital Converter 10-bit 8 channels (ATD0) 32
$00A0 - $00C7 Pulse Width Modulator 8-bit 8 channels (PWM) 40 $00C8 - $00CF Serial Communications Interface 0 (SCI0) 8 $00D0 - $00D7 Serial Communications Interface 0 (SCI1) 8 $00D8 - $00DF Serial Peripheral Interface (SPI0) 8
$00E0 - $00E7 Inter IC Bus 8 $00E8 - $00EF Byte Data Link Controller (BDLC) 8
$00F0 - $00F7 Serial Peripheral Interface (SPI1) 8
$00F8 - $00FF Serial Peripheral Interface (SPI2) 8
$0100- $010F Flash Control Register 16 $0110 - $011B EEPROM Control Register 12 $011C - $011F Reserved 4
$0120 - $013F Analog to Digital Converter 10-bit 8 channels (ATD1) 32 $0140 - $017F Motorola Scalable Can (CAN0) 64
$0180 - $01BF Motorola Scalable Can (CAN1) 64
$01C0 - $01FF Motorola Scalable Can (CAN2) 64
$0200 - $023F Motorola Scalable Can (CAN3) 64 $0240 - $027F Port Integration Module (PIM) 64
$0280 - $02BF Motorola Scalable Can (CAN4) 64
$02C0 - $03FF Reserved 320
$0000 - $0FFF EEPROM array 4096 $0800 - $3FFF RAM array 14336
$4000 - $7FFF
Fixed Flash EEPROM array incl. 1K, 2K, 4K or 8K Protected Sector at start
Size
(Bytes)
16384
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Table 1-1 Device Memory Map
Address Module
$8000 - $BFFF Flash EEPROM Page Window 16384
Fixed Flash EEPROM array
$C000 - $FFFF
incl. 2K, 4K, 8K or 16K Protected Sector at end and 256 bytes of Vector Space at $FF80 - $FFFF
Size
(Bytes)
16384
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Figure 1-2 MC9S12DP512 Memory Map
$0000 $0400
$0800
$4000
$8000
EXTERN
$0000
$03FF $0000
$0FFF
$0800
$3FFF
$4000
$7FFF
$8000
REGISTERS
(Mappable to any 2k Block within the first 32K)
4K Bytes EEPROM
(Mappable to any 4K Block)
14K Bytes RAM
(Mappable to any 16K and alignable to top or bottom)
16K Fixed Flash Page $3E = 62
(This is dependant on the state of the ROMHM bit)
16K Page Window 32 x 16K Flash EEPROM pages
$C000
$FF00 $FFFF
$BFFF
$C000
$FFFF
$FF00
VECTORS
EXPANDED*
* Assuming that a ‘0’ was driven onto port K bit 7 during MCU is reset into normal expanded wide or narrow mode.
VECTORS
NORMAL
SINGLE CHIP
VECTORS
SPECIAL
SINGLE CHIP
$FFFF
16K Fixed Flash Page $3F = 63
BDM (if active)
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1.5.1 Detailed Register Map
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$0000 - $000F MEBI map 1 of 3 (HCS12 Multiplexed External Bus Interface)
Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 $0000 PORTA
$0001 PORTB
$0002 DDRA
$0003 DDRB $0004 -
$0007 $0008 PORTE
$0009 DDRE
$000A PEAR
$000B MODE
Reserved
$000C PUCR
$000D RDRIV
$000E EBICTL
$000F Reserved
$0010 - $0014 MMC map 1 of 4 (HCS12 Module Mapping Control)
Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 $0010 INITRM
$0011 INITRG
$0012 INITEE
$0013 MISC
$0014 Reserved
MC9S12DP512 Device Guide V01.23
Read:
Write:
Read:
Write:
Read:
Write:
Read:
Write:
Read: 00000000
Write:
Read:
Write:
Read:
Write:
Read:
Write:
Read:
Write:
Read:
Write:
Read:
Write:
Read: 0000000
Write:
Read: 00000000
Write:
Read:
Write:
Read: 0
Write: Read: Write: Read: 0000 Write: Read: 00000000
Write:
Bit 7 654321Bit 0
Bit 7 654321Bit 0
Bit 7 654321Bit 0
Bit 7 654321Bit 0
Bit 7 65432
Bit 7 6543Bit 2
NOACCE
MODC MODB MODA
PUPKE
RDPK
RAM15 RAM14 RAM13 RAM12 RAM11
EE15 EE14 EE13 EE12 EE11
0
00
00
REG14 REG13 REG12 REG11
PIPOE NECLK LSTRE RDWE
0
PUPEE
RDPE
IVIS
00
00
EXSTR1 EXSTR0 ROMHM ROMON
0
00
000
00
Bit 1 Bit 0
00
00
EMK EME
PUPBE PUPAE
RDPB RDPA
ESTR
RAMHAL
EEON
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$0015 - $0016 INT map 1 of 2 (HCS12 Interrupt)
Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 $0015 ITCR
$0016 ITEST
$0017 - $0019 Reserved
Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 $0017-
$0019
Reserved
$001A - $001B Device ID Register (Table 1-3)
Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 $001A PARTIDH
$001B PARTIDL
Read: 0 0 0
Write: Read:
Write:
Read: 00000000
Write:
Read: ID15 ID14 ID13 ID12 ID11 ID10 ID9 ID8
Write: Read: ID7 ID6 ID5 ID4 ID3 ID2 ID1 ID0
Write:
WRINT ADR3 ADR2 ADR1 ADR0
INTE INTC INTA INT8 INT6 INT4 INT2 INT0
$001C - $001D MMC map 3 of 4 (HCS12 Module Mapping Control, Table 1-4)
Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 $001C MEMSIZ0
$001D MEMSIZ1
Read: reg_sw0 0 eep_sw1 eep_sw0 0 ram_sw2 ram_sw1 ram_sw0
Write: Read: rom_sw1 rom_sw0 0000pag_sw1 pag_sw0
Write:
$001E - $001E MEBI map 2 of 3 (HCS12 Multiplexed External Bus Interface)
Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 $001E INTCR
Read:
Write:
IRQE IRQEN
000000
$001F - $001F INT map 2 of 2 (HCS12 Interrupt)
Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 $001F HPRIO
Read:
Write:
PSEL7 PSEL6 PSEL5 PSEL4 PSEL3 PSEL2 PSEL1
0
$0020 - $0027 Reserved
Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
Read: 00000000
Write:
28
$0020 ­$0027
Reserved
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$0028 - $002F BKP (HCS12 Breakpoint)
Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 $0028 BKPCT0
$0029 BKPCT1
$002A BKP0X
$002B BKP0H
$002C BKP0L
$002D BKP1X
$002E BKP1H
$002F BKP1L
Read:
Write: Read:
Write: Read: 0 0
Write: Read:
Write: Read:
Write: Read: 0 0
Write: Read:
Write: Read:
Write:
BKEN BKFULL BKBDM BKTAG
BK0MBH BK0MBL BK1MBH BK1MBL BK0RWE BK0RW BK1RWE BK1RW
BK0V5 BK0V4 BK0V3 BK0V2 BK0V1 BK0V0
Bit 15 14 13 12 11 10 9 Bit 8
Bit 7 654321Bit 0
BK1V5 BK1V4 BK1V3 BK1V2 BK1V1 BK1V0
Bit 15 14 13 12 11 10 9 Bit 8
Bit 7 654321Bit 0
0000
$0030 - $0031 MMC map 4 of 4 (HCS12 Module Mapping Control)
Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 $0030 PPAGE
$0031 Reserved
Read: 0 0
Write: Read: 00000000
Write:
PIX5 PIX4 PIX3 PIX2 PIX1 PIX0
$0032 - $0033 MEBI map 3 of 3 (HCS12 Multiplexed External Bus Interface)
Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 $0032 PORTK
$0033 DDRK
Read: Write: Read: Write:
Bit 7 654321Bit 0
Bit 7 654321Bit 0
$0034 - $003F CRG (Clock and Reset Generator)
Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 $0034 SYNR
$0035 REFDV
$0036
$0037 CRGFLG
$0038 CRGINT
CTFLG
Test Only
Read: 0 0
Write: Read: 0000
Write: Read: TOUT7 TOUT6 TOUT5 TOUT4 TOUT3 TOUT2 TOUT1 TOUT0
Write: Read:
Write: Read:
Write:
RTIF PROF
RTIE
00
SYN5 SYN4 SYN3 SYN2 SYN1 SYN0
REFDV3 REFDV2 REFDV1 REFDV0
0
LOCKIF
LOCKIE
LOCK TRACK
00
SCMIF
SCMIE
SCM
0
29
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MC9S12DP512 Device Guide V01.23
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$0034 - $003F CRG (Clock and Reset Generator)
Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 $0039 CLKSEL
$003A PLLCTL
$003B RTICTL
$003C COPCTL
$003D
$003E
$003F ARMCOP
FORBYP Test Only
CTCTL
Test Only
Read:
Write: Read:
Write: Read: 0
Write: Read:
Write: Read:
Write: Read: TCTL7 TCTL6 TCTL5 TCTL4 TCLT3 TCTL2 TCTL1 TCTL0
Write: Read: 00000000
Write: Bit 7 654321Bit 0
PLLSEL PSTP SYSWAI ROAWAI PLLWAI CWAI RTIWAI COPWAI
CME PLLON AUTO ACQ
RTR6 RTR5 RTR4 RTR3 RTR2 RTR1 RTR0
WCOP RSBCK
RTIBYP COPBYP
000
0
PLLBYP
0
00
PRE PCE SCME
CR2 CR1 CR0
$0040 - $007F ECT (Enhanced Capture Timer 16 Bit 8 Channels)
FCM
0
Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 $0040 TIOS
$0041 CFORC
$0042 OC7M
$0043 OC7D
$0044 TCNT (hi)
$0045 TCNT (lo)
$0046 TSCR1
$0047 TTOV
$0048 TCTL1
$0049 TCTL2
$004A TCTL3
$004B TCTL4
$004C TIE
$004D TSCR2
$004E TFLG1
Read:
Write: Read: 00000000
Write: FOC7 FOC6 FOC5 FOC4 FOC3 FOC2 FOC1 FOC0 Read:
Write: Read:
Write: Read: Bit 15 14 13 12 11 10 9 Bit 8
Write: Read: Bit 7 654321Bit 0
Write: Read:
Write: Read:
Write: Read:
Write: Read:
Write: Read:
Write: Read:
Write: Read:
Write: Read:
Write: Read:
Write:
IOS7 IOS6 IOS5 IOS4 IOS3 IOS2 IOS1 IOS0
OC7M7 OC7M6 OC7M5 OC7M4 OC7M3 OC7M2 OC7M1 OC7M0
OC7D7 OC7D6 OC7D5 OC7D4 OC7D3 OC7D2 OC7D1 OC7D0
TEN TSWAI TSFRZ TFFCA
TOV7 TOV6 TOV5 TOV4 TOV3 TOV2 TOV1 TOV0
OM7 OL7 OM6 OL6 OM5 OL5 OM4 OL4
OM3 OL3 OM2 OL2 OM1 OL1 OM0 OL0
EDG7B EDG7A EDG6B EDG6A EDG5B EDG5A EDG4B EDG4A
EDG3B EDG3A EDG2B EDG2A EDG1B EDG1A EDG0B EDG0A
C7I C6I C5I C4I C3I C2I C1I C0I
TOI
C7F C6F C5F C4F C3F C2F C1F C0F
000
0000
TCRE PR2 PR1 PR0
30
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MC9S12DP512 Device Guide V01.23
$0040 - $007F ECT (Enhanced Capture Timer 16 Bit 8 Channels)
Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 $004F TFLG2
$0050 TC0 (hi)
$0051 TC0 (lo)
$0052 TC1 (hi)
$0053 TC1 (lo)
$0054 TC2 (hi)
$0055 TC2 (lo)
$0056 TC3 (hi)
$0057 TC3 (lo)
$0058 TC4 (hi)
$0059 TC4 (lo)
$005A TC5 (hi)
$005B TC5 (lo)
$005C TC6 (hi)
$005D TC6 (lo)
$005E TC7 (hi)
$005F TC7 (lo)
$0060 PACTL
$0061 PAFLG
$0062 PACN3 (hi)
$0063 PACN2 (lo)
$0064 PACN1 (hi)
$0065 PACN0 (lo)
$0066 MCCTL
$0067 MCFLG
Read:
Write: Read:
Write: Read:
Write: Read:
Write: Read:
Write: Read:
Write: Read:
Write: Read:
Write: Read:
Write: Read:
Write: Read:
Write: Read:
Write: Read:
Write: Read:
Write: Read:
Write: Read:
Write: Read:
Write: Read: 0
Write: Read: 000000
Write: Read:
Write: Read:
Write: Read:
Write: Read:
Write: Read:
Write: ICLAT FLMC Read:
Write:
TOF
Bit 15 14 13 12 11 10 9 Bit 8
Bit 7 654321Bit 0
Bit 15 14 13 12 11 10 9 Bit 8
Bit 7 654321Bit 0
Bit 15 14 13 12 11 10 9 Bit 8
Bit 7 654321Bit 0
Bit 15 14 13 12 11 10 9 Bit 8
Bit 7 654321Bit 0
Bit 15 14 13 12 11 10 9 Bit 8
Bit 7 654321Bit 0
Bit 15 14 13 12 11 10 9 Bit 8
Bit 7 654321Bit 0
Bit 15 14 13 12 11 10 9 Bit 8
Bit 7 654321Bit 0
Bit 15 14 13 12 11 10 9 Bit 8
Bit 7 654321Bit 0
Bit 7 654321Bit 0
Bit 7 654321Bit 0
Bit 7 654321Bit 0
Bit 7 654321Bit 0
MCZI MODMC RDMCL
MCZF
0000000
PAEN PAMOD PEDGE CLK1 CLK0 PAOVI PAI
PAOVF PAIF
00
0 0 0 POLF3 POLF2 POLF1 POLF0
MCEN MCPR1 MCPR0
31
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MC9S12DP512 Device Guide V01.23
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$0040 - $007F ECT (Enhanced Capture Timer 16 Bit 8 Channels)
Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 $0068 ICPAR
$0069 DLYCT
$006A ICOVW
$006B ICSYS
$006C Reserved
$006D $006E -
$006F $0070 PBCTL
$0071 PBFLG
TIMTST
Test Only
Reserved
$0072 PA3H
$0073 PA2H
$0074 PA1H
$0075 PA0H
$0076 MCCNT (hi)
$0077 MCCNT (lo)
$0078 TC0H (hi)
$0079 TC0H (lo)
$007A TC1H (hi)
$007B TC1H (lo)
$007C TC2H (hi)
$007D TC2H (lo)
$007E TC3H (hi)
$007F TC3H (lo)
Read: 0000
Write: Read: 000000
Write: Read:
Write: Read:
Write: Read:
Write: Read: 000000
Write: Read:
Write: Read: 0
Write: Read: 000000
Write: Read: Bit 7 654321Bit 0
Write: Read: Bit 7 654321Bit 0
Write: Read: Bit 7 654321Bit 0
Write: Read: Bit 7 654321Bit 0
Write: Read:
Write: Read:
Write: Read: Bit 15 14 13 12 11 10 9 Bit 8
Write: Read: Bit 7 654321Bit 0
Write: Read: Bit 15 14 13 12 11 10 9 Bit 8
Write: Read: Bit 7 654321Bit 0
Write: Read: Bit 15 14 13 12 11 10 9 Bit 8
Write: Read: Bit 7 654321Bit 0
Write: Read: Bit 15 14 13 12 11 10 9 Bit 8
Write: Read: Bit 7 654321Bit 0
Write:
PA3EN PA2EN PA1EN PA0EN
DLY1 DLY0
NOVW7 NOVW6 NOVW5 NOVW4 NOVW3 NOVW2 NOVW1 NOVW0
SH37 SH26 SH15 SH04 TFMOD PACMX BUFEN LATQ
TCBYP
PBEN
Bit 15 14 13 12 11 10 9 Bit 8
Bit 7 654321Bit 0
0000
PBOVI
PBOVF
0
0
0
32
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MC9S12DP512 Device Guide V01.23
$0080 - $009F ATD0 (Analog to Digital Converter 10 Bit 8 Channel)
Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 $0080 ATD0CTL0
$0081 ATD0CTL1
$0082 ATD0CTL2
$0083 ATD0CTL3
$0084 ATD0CTL4
$0085 ATD0CTL5
$0086 ATD0STAT0
$0087 Reserved
$0088 ATD0TEST0
$0089 ATD0TEST1
$008A Reserved
$008B ATD0STAT1
$008C Reserved
$008D ATD0DIEN
$008E Reserved
$008F PORTAD0
$0090 ATD0DR0H
$0091 ATD0DR0L
$0092 ATD0DR1H
$0093 ATD0DR1L
$0094 ATD0DR2H
$0095 ATD0DR2L
$0096 ATD0DR3H
$0097 ATD0DR3L
$0098 ATD0DR4H
Read: 00000000
Write: Read: 00000000
Write: Read:
Write: Read: 0
Write: Read:
Write: Read:
Write: Read:
Write: Read: 00000000
Write: Read: 00000000
Write: Read: 0000000
Write: Read: 00000000
Write: Read: CCF7 CCF6 CCF5 CCF4 CCF3 CCF2 CCF1 CCF0
Write: Read: 00000000
Write: Read:
Write: Read: 00000000
Write: Read: Bit 7 654321Bit 0
Write: Read: Bit 15 14 13 12 11 10 9 Bit 8
Write: Read: Bit 7 654321Bit 0
Write: Read: Bit 15 14 13 12 11 10 9 Bit 8
Write: Read: Bit 7 654321Bit 0
Write: Read: Bit 15 14 13 12 11 10 9 Bit 8
Write: Read: Bit 7 654321Bit 0
Write: Read: Bit 15 14 13 12 11 10 9 Bit 8
Write: Read: Bit 7 654321Bit 0
Write: Read: Bit 15 14 13 12 11 10 9 Bit 8
Write:
ADPU AFFC AWAI ETRIGLE ETRIGP ETRIG ASCIE
S8C S4C S2C S1C FIFO FRZ1 FRZ0
SRES8 SMP1 SMP0 PRS4 PRS3 PRS2 PRS1 PRS0
DJM DSGN SCAN MULT
SCF
Bit 7 654321Bit 0
0
ETORF FIFOR
0
0 CC2 CC1 CC0
CC CB CA
ASCIF
SC
33
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MC9S12DP512 Device Guide V01.23
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$0080 - $009F ATD0 (Analog to Digital Converter 10 Bit 8 Channel)
Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 $0099 ATD0DR4L
$009A ATD0DR5H
$009B ATD0DR5L
$009C ATD0DR6H
$009D ATD0DR6L
$009E ATD0DR7H
$009F ATD0DR7L
Read: Bit 7 654321Bit 0
Write: Read: Bit 15 14 13 12 11 10 9 Bit 8
Write: Read: Bit 7 654321Bit 0
Write: Read: Bit 15 14 13 12 11 10 9 Bit 8
Write: Read: Bit 7 654321Bit 0
Write: Read: Bit 15 14 13 12 11 10 9 Bit 8
Write: Read: Bit 7 654321Bit 0
Write:
$00A0 - $00C7 PWM (Pulse Width Modulator 8 Bit 8 Channel)
Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 $00A0 PWME
$00A1 PWMPOL
$00A2 PWMCLK
$00A3 PWMPRCLK
$00A4 PWMCAE
$00A5 PWMCTL
$00A6
$00A7 PWMPRSC
$00A8 PWMSCLA
$00A9 PWMSCLB
$00AA PWMSCNTA
$00AB PWMSCNTB
$00AC PWMCNT0
$00AD PWMCNT1
$00AE PWMCNT2
PWMTST
Test Only
Read:
Write: Read:
Write: Read:
Write: Read: 0
Write: Read:
Write: Read:
Write: Read: 00000000
Write: Read: 00000000
Write: Read:
Write: Read:
Write: Read: 00000000
Write: Read: 00000000
Write: Read: Bit 7 6 5 4 3 2 1 Bit 0
Write: 00000000 Read: Bit 7 6 5 4 3 2 1 Bit 0
Write: 00000000 Read: Bit 7 6 5 4 3 2 1 Bit 0
Write: 00000000
PWME7 PWME6 PWME5 PWME4 PWME3 PWME2 PWME1 PWME0
PPOL7 PPOL6 PPOL5 PPOL4 PPOL3 PPOL2 PPOL1 PPOL0
PCLK7 PCLK6 PCLK5 PCLK4 PCLK3 PCLK2 PCLK1 PCLK0
PCKB2 PCKB1 PCKB0
CAE7 CAE6 CAE5 CAE4 CAE3 CAE2 CAE1 CAE0
CON67 CON45 CON23 CON01 PSWAI PFRZ
Bit 7 6 5 4 3 2 1 Bit 0
Bit 7 6 5 4 3 2 1 Bit 0
0
PCKA2 PCKA1 PCKA0
00
34
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MC9S12DP512 Device Guide V01.23
$00A0 - $00C7 PWM (Pulse Width Modulator 8 Bit 8 Channel)
Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 $00AF PWMCNT3
$00B0 PWMCNT4
$00B1 PWMCNT5
$00B2 PWMCNT6
$00B3 PWMCNT7
$00B4 PWMPER0
$00B5 PWMPER1
$00B6 PWMPER2
$00B7 PWMPER3
$00B8 PWMPER4
$00B9 PWMPER5
$00BA PWMPER6
$00BB PWMPER7
$00BC PWMDTY0
$00BD PWMDTY1
$00BE PWMDTY2
$00BF PWMDTY3
$00C0 PWMDTY4
$00C1 PWMDTY5
$00C2 PWMDTY6
$00C3 PWMDTY7
$00C4 PWMSDN $00C5 -
$00C7
Reserved
Read: Bit 7 6 5 4 3 2 1 Bit 0
Write: 00000000 Read: Bit 7 6 5 4 3 2 1 Bit 0
Write: 00000000 Read: Bit 7 6 5 4 3 2 1 Bit 0
Write: 00000000 Read: Bit 7 6 5 4 3 2 1 Bit 0
Write: 00000000 Read: Bit 7 6 5 4 3 2 1 Bit 0
Write: 00000000 Read:
Write: Read:
Write: Read:
Write: Read:
Write: Read:
Write: Read:
Write: Read:
Write: Read:
Write: Read:
Write: Read:
Write: Read:
Write: Read:
Write: Read:
Write: Read:
Write: Read:
Write: Read:
Write: Read:
Write: Read: 00000000
Write:
Bit 7 6 5 4 3 2 1 Bit 0
Bit 7 6 5 4 3 2 1 Bit 0
Bit 7 6 5 4 3 2 1 Bit 0
Bit 7 6 5 4 3 2 1 Bit 0
Bit 7 6 5 4 3 2 1 Bit 0
Bit 7 6 5 4 3 2 1 Bit 0
Bit 7 6 5 4 3 2 1 Bit 0
Bit 7 6 5 4 3 2 1 Bit 0
Bit 7 6 5 4 3 2 1 Bit 0
Bit 7 6 5 4 3 2 1 Bit 0
Bit 7 6 5 4 3 2 1 Bit 0
Bit 7 6 5 4 3 2 1 Bit 0
Bit 7 6 5 4 3 2 1 Bit 0
Bit 7 6 5 4 3 2 1 Bit 0
Bit 7 6 5 4 3 2 1 Bit 0
Bit 7 6 5 4 3 2 1 Bit 0
PWMIF PWMIE
PWM
RSTRT
PWMLVL
0
PWM7IN
PWM7
INL
PWM7
ENA
35
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MC9S12DP512 Device Guide V01.23
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$00C8 - $00CF SCI0 (Asynchronous Serial Interface)
Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 $00C8 SCI0BDH
$00C9 SCI0BDL
$00CA SC0CR1
$00CB SCI0CR2
$00CC SCI0SR1
$00CD SC0SR2
$00CE SCI0DRH
$00CF SCI0DRL
Read: 0 0 0
Write: Read:
Write: Read:
Write: Read:
Write: Read: TDRE TC RDRF IDLE OR NF FE PF
Write: Read: 00000
Write: Read: R8
Write: Read: R7 R6 R5 R4 R3 R2 R1 R0
Write: T7 T6 T5 T4 T3 T2 T1 T0
SBR7 SBR6 SBR5 SBR4 SBR3 SBR2 SBR1 SBR0
LOOPS SCISWAI RSRC M WAKE ILT PE PT
TIE TCIE RIE ILIE TE RE RWU SBK
T8
000000
SBR12 SBR11 SBR10 SBR9 SBR8
BRK13 TXDIR
RAF
$00D0 - $00D7 SCI1 (Asynchronous Serial Interface)
Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 $00D0 SCI1BDH
$00D1 SCI1BDL
$00D2 SC1CR1
$00D3 SCI1CR2
$00D4 SCI1SR1
$00D5 SC1SR2
$00D6 SCI1DRH
$00D7 SCI1DRL
Read: 0 0 0
Write: Read:
Write: Read:
Write: Read:
Write: Read: TDRE TC RDRF IDLE OR NF FE PF
Write: Read: 00000
Write: Read: R8
Write: Read: R7 R6 R5 R4 R3 R2 R1 R0
Write: T7 T6 T5 T4 T3 T2 T1 T0
SBR7 SBR6 SBR5 SBR4 SBR3 SBR2 SBR1 SBR0
LOOPS SCISWAI RSRC M WAKE ILT PE PT
TIE TCIE RIE ILIE TE RE RWU SBK
T8
000000
SBR12 SBR11 SBR10 SBR9 SBR8
BRK13 TXDIR
RAF
$00D8 - $00DF SPI0 (Serial Peripheral Interface)
Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 $00D8 SPI0CR1
$00D9 SPI0CR2
$00DA SPI0BR
$00DB SPI0SR
Read:
Write: Read: 0 0 0
Write: Read: 0
Write: Read: SPIF 0 SPTEF MODF 0000
Write:
SPIE SPE SPTIE MSTR CPOL CPHA SSOE LSBFE
MODFEN BIDIROE
SPPR2 SPPR1 SPPR0
0
0
SPISWAI SPC0
SPR2 SPR1 SPR0
36
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MC9S12DP512 Device Guide V01.23
$00D8 - $00DF SPI0 (Serial Peripheral Interface)
Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 $00DC Reserved
$00DD SPI0DR $00DE-
$00DF
Reserved
Read: 00000000
Write: Read:
Write: Read: 00000000
Write:
Bit 7 654321Bit 0
$00E0 - $00E7 IIC (Inter IC Bus)
Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 $00E0 IBAD
$00E1 IBFD
$00E2 IBCR
$00E3 IBSR
$00E4 IBDR $00E5 -
$00E7
Reserved
Read:
Write: Read:
Write: Read:
Write: RSTA Read: TCF IAAS IBB
Write: Read:
Write: Read: 0 0 0 0 0 0 0 0
Write:
ADR7 ADR6 ADR5 ADR4 ADR3 ADR2 ADR1 0
IBC7 IBC6 IBC5 IBC4 IBC3 IBC2 IBC1 IBC0
IBEN IBIE MS/
D7 D6 D5 D4 D3 D2 D1 D 0
SL TX/RX TXAK
IBAL
0SRW
00
IBIF
IBSWAI
RXAK
$00E8 - $00EF BDLC (Bytelevel Data Link Controller J1850)
Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 $00E8 DLCBCR1
$00E9 DLCBSVR
$00EA DLCBCR2
$00EB DLCBDR
$00EC DLCBARD
$00ED DLCBRSR
$00EE DLCSCR
$00EF DLCBSTAT
Read:
Write: Read: 0 0 I3 I2 I1 I0 0 0
Write: Read:
Write: Read:
Write: Read: 0
Write: Read:
Write: Read:
Write: Read:
Write:
IMSG CLKS
SMRST DLOOP RX4XE NBFS TEOD TSIFR TMIFR1 TMIFR0
D7 D6 D5 D4 D3 D2 D1 D0
RXPOL
0 0
0 0 0
0 0 0 0 0 0 0 IDLE
0000
00
R5 R4 R3 R2 R1 R0
BDLCE
BO3 BO2 BO1 BO0
0 0 0 0
IE WCM
37
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$00F0 - $00F7 SPI1 (Serial Peripheral Interface)
Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 $00F0 SPI1CR1
$00F1 SPI1CR2
$00F2 SPI1BR
$00F3 SPI1SR
$00F4 Reserved
$00F5 SPI1DR $00F6 -
$00F7
Reserved
Read:
Write: Read: 0 0 0
Write: Read: 0
Write: Read: SPIF 0 SPTEF MODF 0000
Write: Read: 00000000
Write: Read:
Write: Read: 00000000
Write:
SPIE SPE SPTIE MSTR CPOL CPHA SSOE LSBFE
MODFEN BIDIROE
SPPR2 SPPR1 SPPR0
Bit 7 654321Bit 0
0
0
SPISWAI SPC0
SPR2 SPR1 SPR0
$00F8 - $00FF SPI2 (Serial Peripheral Interface)
Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 $00F8 SPI2CR1
$00F9 SPI2CR2
$00FA SPI2BR
$00FB SPI2SR
$00FC Reserved
$00FD SPI2DR $00FE -
$00FF
Reserved
Read:
Write: Read: 0 0 0
Write: Read: 0
Write: Read: SPIF 0 SPTEF MODF 0000
Write: Read: 00000000
Write: Read:
Write: Read: 00000000
Write:
SPIE SPE SPTIE MSTR CPOL CPHA SSOE LSBFE
MODFEN BIDIROE
SPPR2 SPPR1 SPPR0
Bit 7 654321Bit 0
0
0
SPISWAI SPC0
SPR2 SPR1 SPR0
$0100 - $010F Flash Control Register (fts512k4)
Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 $0100 FCLKDIV
$0101 FSEC
$0102 FTSTMOD
$0103 FCNFG
$0104 FPROT
$0105 FSTAT
Read: FDIVLD
Write: Read: KEYEN1 KEYEN0 NV5 NV4 NV3 NV2 SEC1 SEC0
Write: Read:
Write: Read:
Write: Read:
Write: Read:
Write:
CBEIE CCIE KEYACC
FPOPEN NV6 FPHDIS FPHS1 FPHS0 FPLDIS FPLS1 FPLS0
CBEIF
PRDIV8 FDIV5 FDIV4 FDIV3 FDIV2 FDIV1 FDIV0
0 0 0 WRALL
000
CCIF
PVIOL ACCERR
000
BKSEL1 BKSEL0
0
BLANK
00
0
38
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$0100 - $010F Flash Control Register (fts512k4)
Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 $0106 FCMD
$0107 Reserved
$0108 FADDRHI
$0109 FADDRLO
$010A FDATAHI
$010B FDATALO $010C -
$010F
Reserved
Read: 0
Write: Read: 00000000
Write: Read:
Write: Read:
Write: Read:
Write: Read:
Write: Read: 00000000
Write:
CMDB6 CMDB5
Bit 15 14 13 12 11 10 9 Bit 8
Bit 7 654321Bit 0
Bit 15 14 13 12 11 10 9 Bit 8
Bit 7 654321Bit 0
00
CMDB2
0
CMDB0
$0110 - $011B EEPROM Control Register (eets4k)
Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 $0110 ECLKDIV $0111 -
$0112 $0113 ECNFG
$0114 EPROT
$0115 ESTAT
$0116 ECMD
$0117 Reserved
$0118 EADDRHI
$0119 EADDRLO
$011A EDATAHI
$011B EDATALO
Reserved
Read: EDIVLD
Write: Read: 00000000
Write: Read:
Write: Read:
Write: Read:
Write: Read: 0
Write: Read: 00000000
Write: Read: 00000
Write: Read:
Write: Read:
Write: Read:
Write:
CBEIE CCIE
EPOPEN
CBEIF
Bit 7 654321Bit 0
Bit 15 14 13 12 11 10 9 Bit 8
Bit 7 654321Bit 0
PRDIV8 EDIV5 EDIV4 EDIV3 EDIV2 EDIV1 EDIV0
000000
NV6 NV5 NV4
CCIF
CMDB6 CMDB5
PVIOL ACCERR
00
EPDIS EP2 EP1 EP0
0
BLANK
CMDB2
10 9 Bit 8
00
0
CMDB0
$011C - $011F Reserved for RAM Control Register
Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 $011C -
$011F
Reserved
Read: 00000000
Write:
39
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$0120 - $013F ATD1 (Analog to Digital Converter 10 Bit 8 Channel)
Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 $0120 ATD1CTL0
$0121 ATD1CTL1
$0122 ATD1CTL2
$0123 ATD1CTL3
$0124 ATD1CTL4
$0125 ATD1CTL5
$0126 ATD1STAT0
$0127 Reserved
$0128 ATD1TEST0
$0129 ATD1TEST1
$012A Reserved
$012B ATD1STAT1
$012C Reserved
$012D ATD1DIEN
$012E Reserved
$012F PORTAD1
$0130 ATD1DR0H
$0131 ATD1DR0L
$0132 ATD1DR1H
$0133 ATD1DR1L
$0134 ATD1DR2H
$0135 ATD1DR2L
$0136 ATD1DR3H
$0137 ATD1DR3L
$0138 ATD1DR4H
Read: 00000000
Write: Read: 00000000
Write: Read:
Write: Read: 0
Write: Read:
Write: Read:
Write: Read: SCF 0 ETORF FIFOR 0 CC2 CC1 CC0
Write: Read: 00000000
Write: Read: 00000000
Write: Read: 00000
Write: Read: 00000000
Write: Read: CCF7 CCF6 CCF5 CCF4 CCF3 CCF2 CCF1 CCF0
Write: Read: 00000000
Write: Read:
Write: Read: 00000000
Write: Read: Bit 7 654321Bit 0
Write: Read: Bit 15 14 13 12 11 10 9 Bit 8
Write: Read: Bit 7 654321Bit 0
Write: Read: Bit 15 14 13 12 11 10 9 Bit 8
Write: Read: Bit 7 654321Bit 0
Write: Read: Bit 15 14 13 12 11 10 9 Bit 8
Write: Read: Bit 7 654321Bit 0
Write: Read: Bit 15 14 13 12 11 10 9 Bit 8
Write: Read: Bit 7 654321Bit 0
Write: Read: Bit 15 14 13 12 11 10 9 Bit 8
Write:
ADPU AFFC AWAI ETRIGLE ETRIGP ETRIG ASCIE
S8C S4C S2C S1C FIFO FRZ1 FRZ0
SRES8 SMP1 SMP0 PRS4 PRS3 PRS2 PRS1 PRS0
DJM DSGN SCAN MULT
Bit 7 654321Bit 0
0
CC CB CA
0
0
ASCIF
SC
40
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MC9S12DP512 Device Guide V01.23
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$0120 - $013F ATD1 (Analog to Digital Converter 10 Bit 8 Channel)
Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 $0139 ATD1DR4L
$013A ATD1DR5H
$013B ATD1DR5L
$013C ATD1DR6H
$013D ATD1DR6L
$013E ATD1DR7H
$013F ATD1DR7L
Read: Bit 7 654321Bit 0
Write: Read: Bit 15 14 13 12 11 10 9 Bit 8
Write: Read: Bit 7 654321Bit 0
Write: Read: Bit 15 14 13 12 11 10 9 Bit 8
Write: Read: Bit 7 654321Bit 0
Write: Read: Bit 15 14 13 12 11 10 9 Bit 8
Write: Read: Bit 7 654321Bit 0
Write:
$0140 - $017F CAN0 (Motorola Scalable CAN - MSCAN)
Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 $0140 CAN0CTL0
$0141 CAN0CTL1
$0142 CAN0BTR0
$0143 CAN0BTR1
$0144 CAN0RFLG
$0145 CAN0RIER
$0146 CAN0TFLG
$0147 CAN0TIER
$0148 CAN0TARQ
$0149 CAN0TAAK
$014A CAN0TBSEL
$014B CAN0IDAC $014C -
$014D $014E CAN0RXERR
$014F CAN0TXERR $0150 -
$0153
Reserved
CAN0IDAR0 ­CAN0IDAR3
Read:
Write: Read:
Write: Read:
Write: Read:
Write: Read:
Write: Read:
Write: Read: 00000
Write: Read: 00000
Write: Read: 00000
Write: Read: 00000ABTAK2ABTAK1ABTAK0
Write: Read: 00000
Write: Read: 0 0
Write: Read: 00000000
Write: Read: RXERR7 RXERR6 RXERR5 RXERR4 RXERR3 RXERR2 RXERR1 RXERR0
Write: Read: TXERR7 TXERR6 TXERR5 TXERR4 TXERR3 TXERR2 TXERR1 TXERR0
Write: Read:
Write:
RXFRM
CANE CLKSRC LOOPB LISTEN
SJW1 SJW0 BRP5 BRP4 BRP3 BRP2 BRP1 BRP0
SAMP TSEG22 TSEG21 TSEG20 TSEG13 TSEG12 TSEG11 TSEG10
WUPIF CSCIF
WUPIE CSCIE RSTATE1 RSTATE0 TSTATE1 TSTATE0 OVRIE RXFIE
AC7 AC6 AC5 AC4 AC3 AC2 AC1 AC0
RXACT
CSWAI
RSTAT1 RSTAT0 TSTAT1 TSTAT0
IDAM1 IDAM0
SYNCH
TIME WUPE SLPRQ INITRQ
0
0 IDHIT2 IDHIT1 IDHIT0
WUPM
TXE2 TXE1 TXE0
TXEIE2 TXEIE1 TXEIE0
ABTRQ2 ABTRQ1 ABTRQ0
TX2 TX1 TX0
SLPAK INITAK
OVRIF RXF
41
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MC9S12DP512 Device Guide V01.23
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$0140 - $017F CAN0 (Motorola Scalable CAN - MSCAN)
Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 $0154 -
$0157 $0158 -
$015B $015C -
$015F $0160 -
$016F $0170 -
$017F
CAN0IDMR0 ­CAN0IDMR3
CAN0IDAR4 ­CAN0IDAR7
CAN0IDMR4 ­CAN0IDMR7
CAN0RXFG
CAN0TXFG
Table 1-2 Detailed MSCAN Foreground Receive and Transmit Buffer Layout
Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
Extended ID Read: ID28 ID27 ID26 ID25 ID24 ID23 ID22 ID21
$xxx0
$xxx1
$xxx2
$xxx3
$xxx4 ­$xxxB
$xxxC CANRxDLR
Standard ID Read: ID10 ID9 ID8 ID7 ID6 ID5 ID4 ID3 CANxRIDR0 Write: Extended ID Read: ID20 ID19 ID18 SRR=1 IDE=1 ID17 ID16 ID15
Standard ID Read: ID2 ID1 ID0 RTR IDE=0 CANxRIDR1 Write: Extended ID Read: ID14 ID13 ID12 ID11 ID10 ID9 ID8 ID7
Standard ID Read: CANxRIDR2 Write: Extended ID Read: ID6 ID5 ID4 ID3 ID2 ID1 ID0 RTR
Standard ID Read: CANxRIDR3 Write:
CANxRDSR0 ­CANxRDSR7
$xxxD Reserved
$xxxE CANxRTSRH
$xxxF CANxRTSRL
Extended ID Read:
$xx10
$xx11
$xx12
CANxTIDR0 Write:
Standard ID Read:
Extended ID Read: CANxTIDR1 Write:
Standard ID Read:
Extended ID Read: CANxTIDR2 Write:
Standard ID Read:
Read:
Write:
Read:
Write:
Read:
Write:
Read: FOREGROUND RECEIVE BUFFER see Table 1-2
Write:
Read:
Write:
Read: DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0
Write:
Read:
Write:
Read:
Write:
Read: TSR15 TSR14 TSR13 TSR12 TSR11 TSR10 TSR9 TSR8
Write:
Read: TSR7 TSR6 TSR5 TSR4 TSR3 TSR2 TSR1 TSR0
Write:
Write:
Write:
Write:
AM7 AM6 AM5 AM4 AM3 AM2 AM1 AM0
AC7 AC6 AC5 AC4 AC3 AC2 AC1 AC0
AM7 AM6 AM5 AM4 AM3 AM2 AM1 AM0
FOREGROUND TRANSMIT BUFFER see Table 1-2
DLC3 DLC2 DLC1 DLC0
ID28 ID27 ID26 ID25 ID24 ID23 ID22 ID21
ID10 ID9 ID8 ID7 ID6 ID5 ID4 ID3
ID20 ID19 ID18 SRR=1 IDE=1 ID17 ID16 ID15
ID2 ID1 ID0 RTR IDE=0
ID14 ID13 ID12 ID11 ID10 ID9 ID8 ID7
42
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MC9S12DP512 Device Guide V01.23
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Table 1-2 Detailed MSCAN Foreground Receive and Transmit Buffer Layout
Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
Extended ID Read:
$xx13
$xx14 ­$xx1B
$xx1C CANxTDLR
$xx1D CANxTTBPR
$xx1E CANxTTSRH
$xx1F CANxTTSRL
CANxTIDR3 Write:
Standard ID Read:
CANxTDSR0 -
CANxTDSR7
Write:
Read:
Write:
Read:
Write:
Read:
Write:
Read: TSR15 TSR14 TSR13 TSR12 TSR11 TSR10 TSR9 TSR8
Write:
Read: TSR7 TSR6 TSR5 TSR4 TSR3 TSR2 TSR1 TSR0
Write:
ID6 ID5 ID4 ID3 ID2 ID1 ID0 RTR
DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0
DLC3 DLC2 DLC1 DLC0
PRIO7 PRIO6 PRIO5 PRIO4 PRIO3 PRIO2 PRIO1 PRIO0
$0180 - $01BF CAN1 (Motorola Scalable CAN - MSCAN)
Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 $0180 CAN1CTL0
$0181 CAN1CTL1
$0182 CAN1BTR0
$0183 CAN1BTR1
$0184 CAN1RFLG
$0185 CAN1RIER
$0186 CAN1TFLG
$0187 CAN1TIER
$0188 CAN1TARQ
$0189 CAN1TAAK
$018A CAN1TBSEL
$018B CAN1IDAC $018C -
$018D $018E CAN1RXERR
$018F CAN1TXERR $0190 -
$0193
Reserved
CAN1IDAR0 ­CAN1IDAR3
Read:
Write:
Read:
Write:
Read:
Write:
Read:
Write:
Read:
Write:
Read:
Write:
Read: 00000
Write:
Read: 00000
Write:
Read: 00000
Write:
Read: 00000ABTAK2ABTAK1ABTAK0
Write:
Read: 00000
Write:
Read: 0 0
Write:
Read: 00000000
Write:
Read: RXERR7 RXERR6 RXERR5 RXERR4 RXERR3 RXERR2 RXERR1 RXERR0
Write:
Read: TXERR7 TXERR6 TXERR5 TXERR4 TXERR3 TXERR2 TXERR1 TXERR0
Write:
Read:
Write:
RXFRM
CANE CLKSRC LOOPB LISTEN
SJW1 SJW0 BRP5 BRP4 BRP3 BRP2 BRP1 BRP0
SAMP TSEG22 TSEG21 TSEG20 TSEG13 TSEG12 TSEG11 TSEG10
WUPIF CSCIF
WUPIE CSCIE RSTATE1 RSTATE0 TSTATE1 TSTATE0 OVRIE RXFIE
AC7 AC6 AC5 AC4 AC3 AC2 AC1 AC0
RXACT
CSWAI
RSTAT1 RSTAT0 TSTAT1 TSTAT0
IDAM1 IDAM0
SYNCH
TIME WUPE SLPRQ INITRQ
0
0 IDHIT2 IDHIT1 IDHIT0
WUPM
TXE2 TXE1 TXE0
TXEIE2 TXEIE1 TXEIE0
ABTRQ2 ABTRQ1 ABTRQ0
TX2 TX1 TX0
SLPAK INITAK
OVRIF RXF
43
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MC9S12DP512 Device Guide V01.23
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$0180 - $01BF CAN1 (Motorola Scalable CAN - MSCAN)
Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 $0194 -
$0197 $0198 -
$019B $019C -
$019F $01A0 -
$01AF $01B0 -
$01BF
CAN1IDMR0 ­CAN1IDMR3
CAN1IDAR4 ­CAN1IDAR7
CAN1IDMR4 ­CAN1IDMR7
CAN1RXFG
CAN1TXFG
$01C0 - $01FF CAN2 (Motorola Scalable CAN - MSCAN)
Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 $01C0 CAN2CTL0
$01C1 CAN2CTL1
$01C2 CAN2BTR0
$01C3 CAN2BTR1
$01C4 CAN2RFLG
$01C5 CAN2RIER
$01C6 CAN2TFLG
$01C7 CAN2TIER
$01C8 CAN2TARQ
$01C9 CAN2TAAK
$01CA CAN2TBSEL
$01CB CAN2IDAC $01CC-
$01CD $01CE CAN2RXERR
$01CF CAN2TXERR $01D0 -
$01D3 $01D4 -
$01D7
Reserved
CAN2IDAR0 ­CAN2IDAR3
CAN2IDMR0 ­CAN2IDMR3
Read:
Write:
Read:
Write:
Read:
Write:
Read: FOREGROUND RECEIVE BUFFER see Table 1-2
Write:
Read:
Write:
Read:
Write:
Read:
Write:
Read:
Write:
Read:
Write:
Read:
Write:
Read:
Write:
Read: 00000
Write:
Read: 00000
Write:
Read: 00000
Write:
Read: 00000ABTAK2ABTAK1ABTAK0
Write:
Read: 00000
Write:
Read: 0 0
Write:
Read: 00000000
Write:
Read: RXERR7 RXERR6 RXERR5 RXERR4 RXERR3 RXERR2 RXERR1 RXERR0
Write:
Read: TXERR7 TXERR6 TXERR5 TXERR4 TXERR3 TXERR2 TXERR1 TXERR0
Write:
Read:
Write:
Read:
Write:
AM7 AM6 AM5 AM4 AM3 AM2 AM1 AM0
AC7 AC6 AC5 AC4 AC3 AC2 AC1 AC0
AM7 AM6 AM5 AM4 AM3 AM2 AM1 AM0
FOREGROUND TRANSMIT BUFFER see Table 1-2
RXFRM
CANE CLKSRC LOOPB LISTEN
SJW1 SJW0 BRP5 BRP4 BRP3 BRP2 BRP1 BRP0
SAMP TSEG22 TSEG21 TSEG20 TSEG13 TSEG12 TSEG11 TSEG10
WUPIF CSCIF
WUPIE CSCIE RSTATE1 RSTATE0 TSTATE1 TSTATE0 OVRIE RXFIE
AC7 AC6 AC5 AC4 AC3 AC2 AC1 AC0
AM7 AM6 AM5 AM4 AM3 AM2 AM1 AM0
RXACT
CSWAI
RSTAT1 RSTAT0 TSTAT1 TSTAT0
IDAM1 IDAM0
SYNCH
TIME WUPE SLPRQ INITRQ
0
0 IDHIT2 IDHIT1 IDHIT0
WUPM
TXE2 TXE1 TXE0
TXEIE2 TXEIE1 TXEIE0
ABTRQ2 ABTRQ1 ABTRQ0
TX2 TX1 TX0
SLPAK INITAK
OVRIF RXF
44
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MC9S12DP512 Device Guide V01.23
$01C0 - $01FF CAN2 (Motorola Scalable CAN - MSCAN)
Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 $01D8 -
$01DB $01DC-
$01DF $01E0 -
$01EF $01F0 -
$01FF
CAN2IDAR4 ­CAN2IDAR7
CAN2IDMR4 ­CAN2IDMR7
CAN2RXFG
CAN2TXFG
Read:
Write:
Read:
Write:
Read: FOREGROUND RECEIVE BUFFER see Table 1-2
Write:
Read:
Write:
AC7 AC6 AC5 AC4 AC3 AC2 AC1 AC0
AM7 AM6 AM5 AM4 AM3 AM2 AM1 AM0
FOREGROUND TRANSMIT BUFFER see Table 1-2
$0200 - $023F CAN3 (Motorola Scalable CAN - MSCAN)
Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 $0200 CAN3CTL0
$0201 CAN3CTL1
$0202 CAN3BTR0
$0203 CAN3BTR1
$0204 CAN3RFLG
$0205 CAN3RIER
$0206 CAN3TFLG
$0207 CAN3TIER
$0208 CAN3TARQ
$0209 CAN3TAAK
$020A CAN3TBSEL
$020B CAN3IDAC $020C -
$020D $020E CAN3RXERR
$020F CAN3TXERR $0210 -
$0213 $0214 -
$0217 $0218 -
$021B
Reserved
CAN3IDAR0 ­CAN3IDAR3
CAN3IDMR0 ­CAN3IDMR3
CAN3IDAR4 ­CAN3IDAR7
Read:
Write:
Read:
Write:
Read:
Write:
Read:
Write:
Read:
Write:
Read:
Write:
Read: 00000
Write:
Read: 00000
Write:
Read: 00000
Write:
Read: 00000ABTAK2ABTAK1ABTAK0
Write:
Read: 00000
Write:
Read: 0 0
Write:
Read: 00000000
Write:
Read: RXERR7 RXERR6 RXERR5 RXERR4 RXERR3 RXERR2 RXERR1 RXERR0
Write:
Read: TXERR7 TXERR6 TXERR5 TXERR4 TXERR3 TXERR2 TXERR1 TXERR0
Write:
Read:
Write:
Read:
Write:
Read:
Write:
RXFRM
CANE CLKSRC LOOPB LISTEN
SJW1 SJW0 BRP5 BRP4 BRP3 BRP2 BRP1 BRP0
SAMP TSEG22 TSEG21 TSEG20 TSEG13 TSEG12 TSEG11 TSEG10
WUPIF CSCIF
WUPIE CSCIE RSTATE1 RSTATE0 TSTATE1 TSTATE0 OVRIE RXFIE
AC7 AC6 AC5 AC4 AC3 AC2 AC1 AC0
AM7 AM6 AM5 AM4 AM3 AM2 AM1 AM0
AC7 AC6 AC5 AC4 AC3 AC2 AC1 AC0
RXACT
CSWAI
RSTAT1 RSTAT0 TSTAT1 TSTAT0
IDAM1 IDAM0
SYNCH
TIME WUPE SLPRQ INITRQ
0
0 IDHIT2 IDHIT1 IDHIT0
WUPM
TXE2 TXE1 TXE0
TXEIE2 TXEIE1 TXEIE0
ABTRQ2 ABTRQ1 ABTRQ0
TX2 TX1 TX0
SLPAK INITAK
OVRIF RXF
45
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MC9S12DP512 Device Guide V01.23
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$0200 - $023F CAN3 (Motorola Scalable CAN - MSCAN)
Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 $021C -
$021F $0220 -
$022F $0230 -
$023F
CAN3IDMR4 ­CAN3IDMR7
CAN3RXFG
CAN3TXFG
$0240 - $027F PIM (Port Integration Module PIM_9DP256)
Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 $0240 PTT
$0241 PTIT
$0242 DDRT
$0243 RDRT
$0244 PERT
$0245 PPST $0246 -
$0247 $0248 PTS
$0249 PTIS
$024A DDRS
Reserved
$024B RDRS
$024C PERS
$024D PPSS
$024E WOMS
$024F Reserved
$0250 PTM
$0251 PTIM
$0252 DDRM
$0253 RDRM
Read:
Write:
Read: FOREGROUND RECEIVE BUFFER see Table 1-2
Write:
Read:
Write:
Read:
Write:
Read: PTIT7 PTIT6 PTIT5 PTIT4 PTIT3 PTIT2 PTIT1 PTIT0
Write:
Read:
Write:
Read:
Write:
Read:
Write:
Read:
Write:
Read: 00000000
Write:
Read:
Write:
Read: PTIS7 PTIS6 PTIS5 PTIS4 PTIS3 PTIS2 PTIS1 PTIS0
Write:
Read:
Write:
Read:
Write:
Read:
Write:
Read:
Write:
Read:
Write:
Read: 00000000
Write:
Read:
Write:
Read: PTIM7 PTIM6 PTIM5 PTIM4 PTIM3 PTIM2 PTIM1 PTIM0
Write:
Read:
Write:
Read:
Write:
AM7 AM6 AM5 AM4 AM3 AM2 AM1 AM0
FOREGROUND TRANSMIT BUFFER see Table 1-2
PTT7 PTT6 PTT5 PTT4 PTT3 PTT2 PTT1 PTT0
DDRT7 DDRT7 DDRT5 DDRT4 DDRT3 DDRT2 DDRT1 DDRT0
RDRT7 RDRT6 RDRT5 RDRT4 RDRT3 RDRT2 RDRT1 RDRT0
PERT7 PERT6 PERT5 PERT4 PERT3 PERT2 PERT1 PERT0
PPST7 PPST6 PPST5 PPST4 PPST3 PPST2 PPST1 PPST0
PTS7 PTS6 PTS5 PTS4 PTS3 PTS2 PTS1 PTS0
DDRS7 DDRS7 DDRS5 DDRS4 DDRS3 DDRS2 DDRS1 DDRS0
RDRS7 RDRS6 RDRS5 RDRS4 RDRS3 RDRS2 RDRS1 RDRS0
PERS7 PERS6 PERS5 PERS4 PERS3 PERS2 PERS1 PERS0
PPSS7 PPSS6 PPSS5 PPSS4 PPSS3 PPSS2 PPSS1 PPSS0
WOMS7 WOMS6 WOMS5 WOMS4 WOMS3 WOMS2 WOMS1 WOMS0
PTM7 PTM6 PTM5 PTM4 PTM3 PTM2 PTM1 PTM0
DDRM7 DDRM7 DDRM5 DDRM4 DDRM3 DDRM2 DDRM1 DDRM0
RDRM7 RDRM6 RDRM5 RDRM4 RDRM3 RDRM2 RDRM1 RDRM0
46
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MC9S12DP512 Device Guide V01.23
$0240 - $027F PIM (Port Integration Module PIM_9DP256)
Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 $0254 PERM
$0255 PPSM
$0256 WOMM
$0257 MODRR
$0258 PTP
$0259 PTIP
$025A DDRP
$025B RDRP
$025C PERP
$025D PPSP
$025E PIEP
$025F PIFP
$0260 PTH
$0261 PTIH
$0262 DDRH
$0263 RDRH
$0264 PERH
$0265 PPSH
$0266 PIEH
$0267 PIFH
$0268 PTJ
$0269 PTIJ
$026A DDRJ
$026B RDRJ
$026C PERJ
Read:
Write:
Read:
Write:
Read:
Write:
Read: 0
Write:
Read:
Write:
Read: PTIP7 PTIP6 PTIP5 PTIP4 PTIP3 PTIP2 PTIP1 PTIP0
Write:
Read:
Write:
Read:
Write:
Read:
Write:
Read:
Write:
Read:
Write:
Read:
Write:
Read:
Write:
Read: PTIH7 PTIH6 PTIH5 PTIH4 PTIH3 PTIH2 PTIH1 PTIH0
Write:
Read:
Write:
Read:
Write:
Read:
Write:
Read:
Write:
Read:
Write:
Read:
Write:
Read:
Write:
Read: PTIJ7 PTIJ6 0000PTIJ1 PTIJ0
Write:
Read:
Write:
Read:
Write:
Read:
Write:
PERM7 PERM6 PERM5 PERM4 PERM3 PERM2 PERM1 PERM0
PPSM7 PPSM6 PPSM5 PPSM4 PPSM3 PPSM2 PPSM1 PPSM0
WOMM7 WOMM6 WOMM5 WOMM4 WOMM3 WOMM2 WOMM1 WOMM0
MODRR6 MODRR5 MODRR4 MODRR3 MODRR2 MODRR1 MODRR0
PTP7 PTP6 PTP5 PTP4 PTP3 PTP2 PTP1 PTP0
DDRP7 DDRP7 DDRP5 DDRP4 DDRP3 DDRP2 DDRP1 DDRP0
RDRP7 RDRP6 RDRP5 RDRP4 RDRP3 RDRP2 RDRP1 RDRP0
PERP7 PERP6 PERP5 PERP4 PERP3 PERP2 PERP1 PERP0
PPSP7 PPSP6 PPSP5 PPSP4 PPSP3 PPSP2 PPSP1 PPSS0
PIEP7 PIEP6 PIEP5 PIEP4 PIEP3 PIEP2 PIEP1 PIEP0
PIFP7 PIFP6 PIFP5 PIFP4 PIFP3 PIFP2 PIFP1 PIFP0
PTH7 PTH6 PTH5 PTH4 PTH3 PTH2 PTH1 PTH0
DDRH7 DDRH7 DDRH5 DDRH4 DDRH3 DDRH2 DDRH1 DDRH0
RDRH7 RDRH6 RDRH5 RDRH4 RDRH3 RDRH2 RDRH1 RDRH0
PERH7 PERH6 PERH5 PERH4 PERH3 PERH2 PERH1 PERH0
PPSH7 PPSH6 PPSH5 PPSH4 PPSH3 PPSH2 PPSH1 PPSH0
PIEH7 PIEH6 PIEH5 PIEH4 PIEH3 PIEH2 PIEH1 PIEH0
PIFH7 PIFH6 PIFH5 PIFH4 PIFH3 PIFH2 PIFH1 PIFH0
PTJ7 PTJ6
DDRJ7 DDRJ7
RDRJ7 RDRJ6
PERJ7 PERJ6
0000
0000
0000
0000
PTJ1 PTJ0
DDRJ1 DDRJ0
RDRJ1 RDRJ0
PERJ1 PERJ0
47
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MC9S12DP512 Device Guide V01.23
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$0240 - $027F PIM (Port Integration Module PIM_9DP256)
Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 $026D PPSJ
$026E PIEJ
$026F PIFJ $0270 -
$027F
Reserved Read:
$0280 - $02BF CAN4 (Motorola Scalable CAN - MSCAN)
Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 $0280 CAN4CTL0
$0281 CAN4CTL1
$0282 CAN4BTR0
$0283 CAN4BTR1
$0284 CAN4RFLG
$0285 CAN4RIER
$0286 CAN4TFLG
$0287 CAN4TIER
$0288 CAN4TARQ
$0289 CAN4TAAK
$028A CAN4TBSEL
$028B CAN4IDAC $028C -
$028D
Reserved
$028E CAN4RXERR
$028F CAN4TXERR $0290 -
$0293 $0294 -
$0297 $0298 -
$029B
CAN4IDAR0 ­CAN4IDAR3
CAN4IDMR0 ­CAN4IDMR3
CAN4IDAR4 ­CAN4IDAR7
Read:
Write:
Read:
Write:
Read:
Write:
Read:
Write:
Read:
Write:
Read:
Write:
Read:
Write:
Read:
Write:
Read:
Write:
Read: 00000
Write:
Read: 00000
Write:
Read: 00000
Write:
Read: 00000ABTAK2ABTAK1ABTAK0
Write:
Read: 00000
Write:
Read: 0 0
Write:
Read: 00000000
Write:
Read: RXERR7 RXERR6 RXERR5 RXERR4 RXERR3 RXERR2 RXERR1 RXERR0
Write:
Read: TXERR7 TXERR6 TXERR5 TXERR4 TXERR3 TXERR2 TXERR1 TXERR0
Write:
Read:
Write:
Read:
Write:
Read:
Write:
PPSJ7 PPSJ6
PIEJ7 PIEJ6
PIFJ7 PIFJ6
RXFRM
CANE CLKSRC LOOPB LISTEN
SJW1 SJW0 BRP5 BRP4 BRP3 BRP2 BRP1 BRP0
SAMP TSEG22 TSEG21 TSEG20 TSEG13 TSEG12 TSEG11 TSEG10
WUPIF CSCIF
WUPIE CSCIE RSTATE1 RSTATE0 TSTATE1 TSTATE0 OVRIE RXFIE
AC7 AC6 AC5 AC4 AC3 AC2 AC1 AC0
AM7 AM6 AM5 AM4 AM3 AM2 AM1 AM0
AC7 AC6 AC5 AC4 AC3 AC2 AC1 AC0
RXACT
0000
0000
0000
CSWAI
RSTAT1 RSTAT0 TSTAT1 TSTAT0
IDAM1 IDAM0
SYNCH
TIME WUPE SLPRQ INITRQ
0
0 IDHIT2 IDHIT1 IDHIT0
WUPM
TXE2 TXE1 TXE0
TXEIE2 TXEIE1 TXEIE0
ABTRQ2 ABTRQ1 ABTRQ0
TX2 TX1 TX0
PPSJ1 PPSJ0
PIEJ1 PIEJ0
PIFJ1 PIFJ0
SLPAK INITAK
OVRIF RXF
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$0280 - $02BF CAN4 (Motorola Scalable CAN - MSCAN)
Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 $029C -
$029F $02A0 -
$02AF $02B0 -
$02BF
CAN4IDMR4 ­CAN4IDMR7
CAN4RXFG
CAN4TXFG
Read:
Write:
Read: FOREGROUND RECEIVE BUFFER see Table 1-2
Write:
Read:
Write:
AM7 AM6 AM5 AM4 AM3 AM2 AM1 AM0
FOREGROUND TRANSMIT BUFFER see Table 1-2
$02C0 - $03FF Reserved
Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 $02C0 -
$03FF
Reserved
Read: 00000000
Write:
1.6 Part ID Assignments
The part ID is located in two 8-bit registers PARTIDH and PARTIDL (addresses $001A and $001B after reset). The read-only value is a uniquepartIDforeachrevisionof the chip. Table 1-3showstheassigned part ID number.
Table 1-3 Assigned Part ID Numbers
Device Mask Set Number
MC9S12DP512 0L00M $0400 MC9S12DP512 1L00M $0401
MC9S12DP512 2L00M MC9S12DP512 3L00M MC9S12DP512 4L00M
NOTES:
1. The coding is as follows: Bit 15 - 12: Major family identifier Bit 11 - 8: Minor family identifier Bit 7 - 4: Major mask set revision number including FAB transfers Bit 3 - 0: Minor - non full - mask set revision
1.7 Memory Size Assignments
Part ID
1
$0402 $0403 $0404
The device memory sizes are located in two 8-bit registers MEMSIZ0 and MEMSIZ1 (addresses $001C and $001D after reset). Table 1-4 shows the read-only values of these registers. Refer to HCS12 Module Mapping Control (MMC) Block Guide for further details.
Table 1-4 Memory size registers
Register name Value
MEMSIZ0 $26 MEMSIZ1 $82
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Section 2 Signal Description
This section describes signals that connect off-chip. It includes a pinout diagram, a table of signal properties, and detailed discussion of signals. It is built from the signal description sections of the Block Guides of the individual IP blocks on the device.
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2.1 Device Pinout
The MC9S12DP512 is available in a 112-pin low profile quad flat pack (LQFP). Most pins perform two or more functions, as described in the Signal Descriptions. Figure 2-1 shows the pin assignments.
PP7/KWP7/PWM7/SCK2
PP4/KWP4/PWM4/MISO2
PK7/ECS/ROMCTL
PP5/KWP5/PWM5/MOSI2
PP6/KWP6/PWM6/SS2
VDDX
VSSX
PM0/RXCAN0/RXB
PM1/TXCAN0/TXB
PM2/RXCAN1/RXCAN0/MISO0
PM4/RXCAN2/RXCAN0/RXCAN4/MOSI0
PM5/TXCAN2/TXCAN0/TXCAN4/SCK0
PJ6/KWJ6/RXCAN4/SDA/RXCAN0
PJ7/KWJ7/TXCAN4/SCL/TXCAN0
VREGEN
PM3/TXCAN1/TXCAN0/SS0
PS7/SS0
PS6/SCK0
PS5/MOSI0
PS4/MISO0
PS3/TXD1
PS2/RXD1
PS1/TXD0
PS0/RXD0
PM6/RXCAN3/RXCAN4
PM7/TXCAN3/TXCAN4
VSSA
VRL
SS1/PWM3/KWP3/PP3
SCK1/PWM2/KWP2/PP2 MOSI1/PWM1/KWP1/PP1 MISO1/PWM0/KWP0/PP0
XADDR17/PK3 XADDR16/PK2 XADDR15/PK1 XADDR14/PK0
IOC0/PT0 IOC1/PT1 IOC2/PT2 IOC3/PT3
VDD1
VSS1 IOC4/PT4 IOC5/PT5 IOC6/PT6 IOC7/PT7
XADDR19/PK5 XADDR18/PK4
KWJ1/PJ1 KWJ0/PJ0
MODC/TAGHI/BKGD
ADDR0/DATA0/PB0 ADDR1/DATA1/PB1 ADDR2/DATA2/PB2 ADDR3/DATA3/PB3 ADDR4/DATA4/PB4
112
111
110
109
108
107
106
105
104
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28
293031323334353637383940414243444546474849505152535455
103
999897969594939291908988878685
102
101
100
MC9S12DP512
112LQFP
84
VRH
83
VDDA
82
PAD15/AN15/ETRIG1
81
PAD07/AN07/ETRIG0
80
PAD14/AN14
79
PAD06/AN06
78
PAD13/AN13
77
PAD05/AN05
76
PAD12/AN12
75
PAD04/AN04
74
PAD11/AN11
73
PAD03/AN03
72
PAD10/AN10
71
PAD02/AN02
70
PAD09/AN09
69
PAD01/AN01
68
PAD08/AN08
67
PAD00/AN00
66
VSS2
65
VDD2
64
PA7/ADDR15/DATA15
63
PA6/ADDR14/DATA14
62
PA5/ADDR13/DATA13
61
PA4/ADDR12/DATA12
60
PA3/ADDR11/DATA11
59
PA2/ADDR10/DATA10
58
PA1/ADDR9/DATA9
57
PA0/ADDR8/DATA8
56
52
XFC
XTAL
EXTAL
VSSPLL
TEST
SS1/KWH3/PH3
SCK1/KWH2/PH2
MOSI1/KWH1/PH1
MISO1/KWH0/PH0
LSTRB/TAGLO/PE3
ADDR5/DATA5/PB5
ADDR6/DATA6/PB6
ADDR7/DATA7/PB7
SS2/KWH7/PH7
SCK2/KWH6/PH6
MOSI2/KWH5/PH5
MISO2/KWH4/PH4
MODB/IPIPE1/PE6
XCLKS/NOACC/PE7
VSSR
VDDR
RESET
ECLK/PE4
MODA/IPIPE0/PE5
VDDPLL
Figure 2-1 Pin Assignments in 112-pin LQFP
IRQ/PE1
R/W/PE2
XIRQ/PE0
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2.2 Signal Properties Summary
Table 2-1 summarizes the pin functionality.
Table 2-1 Signal Properties
Internal Pull
Pin Name
Funct. 1
EXTAL
XTAL
RESET VDDR External Reset
TEST NA Test Input
VREGEN VDDX Voltage Regulator Enable Input
XFC VDDPLL PLL Loop Filter
BKGD
PAD15 AN15 ETRIG1
PAD[14:8] AN[14:08]
PAD07 AN07 ETRIG0
PAD[06:00] AN[06:00]
PA[7:0]
PB[7:0]
PE7 NOACC
Pin Name
Funct. 2
TAGHI MODC VDDR
ADDR[15:8]/
DATA[15:8]
ADDR[7:0]/
DATA[7:0]
Pin Name
Funct. 3
———
———
XCLKS
Pin Name
Funct. 4
Pin Name
Funct. 5
Power
Supply
VDDPLL
VDDA None None
PE6 IPIPE1 MODB
VDDR
PE5 IPIPE0 MODA
PE4 ECLK — PE3 PE2 R/ PE1 PE0
LSTRB TAGLO Port E I/O, Byte Strobe, Tag Low
W Port E I/O, R/W in expanded modes
IRQ Port E Input, Maskable Interrupt
XIRQ Port E Input, Non Maskable Interrupt
Resistor
CTRL
None None
Always
Up
PUCR/
PUPAE
PUCR/
PUPBE
PUCR/
PUPEE
While
While RESET
PUCR/
PUPEE
Reset
State
Disabled
RESET
pin is low:
Down
pin is low:
Down
Description
Oscillator Pins
Background Debug, Tag High, Mode
Up
Input Port AD Input, Analog Input AN7 of
ATD1, External Trigger Input of ATD1 Port AD Inputs, Analog Inputs
AN[6:0] of ATD1 Port AD Input, Analog Input AN7 of
ATD0, External Trigger Input of ATD0 Port AD Inputs, Analog Inputs
AN[6:0] of ATD0 Port A I/O, Multiplexed Address/Data
Port B I/O, Multiplexed Address/Data
Up Port E I/O, Access, Clock Select
Port E I/O, Pipe Status, Mode Input
Port E I/O, Pipe Status, Mode Input
Port E I/O, Bus Clock Output
Up
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Pin Name
Funct. 1
PH7 KWH7 SS2 — PH6 KWH6 SCK2 Port H I/O, Interrupt, SCK of SPI2 PH5 KWH5 MOSI2 Port H I/O, Interrupt, MOSI of SPI2 PH4 KWH4 MISO2 Port H I/O, Interrupt, MISO of SPI2 PH3 KWH3 PH2 KWH2 SCK1 Port H I/O, Interrupt, SCK of SPI1 PH1 KWH1 MOSI1 Port H I/O, Interrupt, MOSI of SPI1 PH0 KWH0 MISO1 Port H I/O, Interrupt, MISO of SPI1
PJ7 KWJ7 TXCAN4 SCL TXCAN0
PJ6 KWJ6 RXCAN4 SDA RXCAN0
PJ[1:0] KWJ[1:0] Port J I/O, Interrupts
PK7
PK[5:0]
PM7 TXCAN3 TXCAN4 — PM6 RXCAN3 RXCAN4 Port M I/O, RX of CAN3, RX of CAN4
PM5 TXCAN2 TXCAN0 TXCAN4 SCK0
PM4 RXCAN2 RXCAN0 RXCAN4 MOSI0
PM3 TXCAN1 TXCAN0
PM2 RXCAN1 RXCAN0 MISO0 PM1 TXCAN0 TXB Port M I/O,TX of CAN0, RX of BDLC
PM0 RXCAN0 RXB Port M I/O, RX of CAN0,RX of BDLC PP7 KWP7 PWM7 SCK2
PP6 KWP6 PWM6
PP5 KWP5 PWM5 MOSI2
Pin Name
Funct. 2
ECS ROMCTL
XADDR
[19:14]
Pin Name
Funct. 3
SS1 Port H I/O, Interrupt, SS of SPI1
Port K I/O, Extended Addresses
Pin Name
Funct. 4
PP4 KWP4 PWM4 MISO2
PP3 KWP3 PWM3
PP2 KWP2 PWM2 SCK1
PP1 KWP1 PWM1 MOSI1
PP0 KWP0 PWM0 MISO1
Pin Name
Funct. 5
SS0
SS2
SS1
Power
Supply
VDDR
VDDX
VDDX
VDDX
VDDX
Internal Pull
Resistor
CTRL
PERH/
PPSH
PERJ/
PPSJ
PUCR/
PUPKE
PERM/
PPSM
PERP/
PPSP
Disabled
Disabled
Disabled
Reset
State
Up
Up
Description
Port H I/O, Interrupt, SS of SPI2
Port J I/O, Interrupt, TX of CAN4, SCL of IIC, TX of CAN0
Port J I/O, Interrupt, RX of CAN4, SDA of IIC, RX of CAN0
Port K I/O, Emulation Chip Select, ROM Control
Port M I/O, TX of CAN3, TX of CAN4
Port M I/O, TX of CAN2, CAN0, CAN4, SCK of SPI0
Port M I/O, RX of CAN2, CAN0, CAN4, MOSI of SPI0
Port M I/O, TX of CAN1, CAN0, of SPI0
Port M I/O, RX of CAN1, CAN0, MISO of SPI0
Port P I/O, Interrupt, Channel 7 of PWM, SCK of SPI2
Port P I/O, Interrupt, Channel 6 of PWM,
SS of SPI2
Port P I/O, Interrupt, Channel 5 of PWM, MOSI of SPI2
Port P I/O, Interrupt, Channel 4 of PWM, MISO2 of SPI2
Port P I/O, Interrupt, Channel 3 of PWM,
SS of SPI1
Port P I/O, Interrupt, Channel 2 of PWM, SCK of SPI1
Port P I/O, Interrupt, Channel 1 of PWM, MOSI of SPI1
Port P I/O, Interrupt, Channel 0 of PWM, MISO2 of SPI1
SS
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Pin Name
Funct. 1
PS7 SS0 — PS6 SCK0 Port S I/O, SCK of SPI0 PS5 MOSI0 Port S I/O, MOSI of SPI0 PS4 MISO0 Port S I/O, MISO of SPI0 PS3 TXD1 Port S I/O, TXD of SCI1 PS2 RXD1 Port S I/O, RXD of SCI1 PS1 TXD0 Port S I/O, TXD of SCI0 PS0 RXD0 Port S I/O, RXD of SCI0
PT[7:0] IOC[7:0] VDDX
Pin Name
Funct. 2
Pin Name
Funct. 3
Pin Name
Funct. 4
Pin Name
Funct. 5
Power
Supply
VDDX
Internal Pull
Resistor
CTRL
PERS/
PPSS
PERT/
PPST
Reset
State
Disabled Port T I/O, Timer channels
Port S I/O, SS of SPI0
Up
2.3 Detailed Signal Descriptions
2.3.1 EXTAL, XTAL — Oscillator Pins
Description
EXTAL andXTALare the crystal driver and externalclockpins.On reset all the deviceclocksarederived from the EXTAL input frequency. XTAL is the crystal output.
2.3.2 RESET — External Reset Pin
An active low bidirectional control signal, it acts as an input to initialize the MCU to a known start-up state, and an output when an internal MCU function causes a reset.
2.3.3 TEST — Test Pin
This input only pin is reserved for test.
NOTE:
2.3.4 VREGEN — Voltage Regulator Enable Pin
This input only pin enables or disables the on-chip voltage regulator.
The TEST pin must be tied to VSS in all applications.
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2.3.5 XFC — PLL Loop Filter Pin
PLL loop filter. Please ask your Motorola representative for the interactive application note to compute PLL loop filter elements. Any current leakage on this pin must be avoided.
2.3.6 BKGD / TAGHI / MODC — Background Debug, Tag High, and Mode Pin
Figure 2-2 PLL Loop Filter Connections
MCU
XFC
R
0
C
S
C
P
VDDPLLVDDPLL
The BKGD/TAGHI/MODC pin is used as a pseudo-open-drain pin for the background debug communication. In MCU expanded modes of operation when instruction tagging is on, an input low on this pin during the falling edge of E-clock tags the high half of the instruction word being read into the instruction queue. It is used as a MCU operating mode select pin during reset. The state of this pin is latched to the MODC bit at the rising edge of
RESET. This pin has a permanently enabled pull-up device.
2.3.7 PAD15 / AN15 / ETRIG1 — Port AD Input Pin of ATD1
PAD15 is a general purpose input pin and analog input AN7 of the analog to digital converter ATD1. It can act as an external trigger input for the ATD1.
2.3.8 PAD[14:08] / AN[14:08] — Port AD Input Pins of ATD1
PAD14 - PAD08 are general purpose input pins and analog inputs AN[6:0] of the analog to digital converter ATD1.
2.3.9 PAD7 / AN07 / ETRIG0 — Port AD Input Pin of ATD0
PAD7 is a general purpose input pin and analog input AN7 of the analogtodigital converter ATD0. It can act as an external trigger input for the ATD0.
2.3.10 PAD[06:00] / AN[06:00] — Port AD Input Pins of ATD0
PAD06 - PAD00 are general purpose input pins and analog inputs AN[6:0] of the analog to digital converter ATD0.
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2.3.11 PA[7:0] / ADDR[15:8] / DATA[15:8] — Port A I/O Pins
PA7-PA0 are general purpose input or output pins. In MCU expanded modes of operation, these pins are used for the multiplexed external address and data bus.
2.3.12 PB[7:0] / ADDR[7:0] / DATA[7:0] — Port B I/O Pins
PB7-PB0 are general purpose input or output pins. In MCU expanded modes of operation, these pins are used for the multiplexed external address and data bus.
2.3.13 PE7 / NOACC / XCLKS — Port E I/O Pin 7
PE7 is a general purpose input or output pin. During MCU expanded modes of operation, the NOACC signal, when enabled, is used to indicate that the current bus cycle is an unused or “free” cycle. This signal will assert when the CPU is not using the bus.
XCLKS is an input signal which controls whether a crystal in combination with the internal Colpitts
The (low power) oscillator isusedorwhether Pierce oscillator/external clock circuitry is used. The state of this pin is latched at the rising edge of external clock drive or a Pierce Oscillator.If input is a logic high a Colpitts oscillator circuit is configured on EXTAL and XTAL. Since this pin is an input with a pull-up device during reset, if the pin is left floating, the default configuration is a Colpitts oscillator circuit on EXTAL and XTAL.
RESET. If the input is a logic low the EXTAL pin is configured for an
EXTAL
CDC*
MCU
XTAL
* Due to the nature of a translated ground Colpitts oscillator a
DC voltage bias is applied to the crystal
Please contact the crystal manufacturer for crystal DC
bias conditions and recommended capacitor value C
C
1
C
2
VSSPLL
.
DC
Crystal or
ceramic resonator
Figure 2-3 Colpitts Oscillator Connections (PE7=1)
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EXTAL
MCU
* Rs can be zero (shorted) when used with higher frequency crystals.
Refer to manufacturer’s data.
Figure 2-4 Pierce Oscillator Connections (PE7=0)
XTAL
C
1
R
B
*
R
S
Crystal or
ceramic resonator
C
2
VSSPLL
EXTAL
MCU
CMOS-COMPATIBLE
EXTERNAL OSCILLATO
(VDDPLL-Level)
R
Figure 2-5 External Clock Connections (PE7=0)
2.3.14 PE6 / MODB / IPIPE1 — Port E I/O Pin 6
PE6 is a general purpose input or output pin. It is used as a MCU operating mode select pin during reset. The state of this pin is latched to the MODB bit at the rising edge of instruction queue tracking signalIPIPE1.Thispinis an input with a pull-down device which is only active
RESET is low.
when
2.3.15 PE5 / MODA / IPIPE0 — Port E I/O Pin 5
PE5 is a general purpose input or output pin. It is used as a MCU operating mode select pin during reset. The state of this pin is latched to the MODA bit at the rising edge of instruction queue tracking signalIPIPE0.Thispinis an input with a pull-down device which is only active
RESET is low.
when
XTAL
not connected
RESET. This pin is shared with the
RESET. This pin is shared with the
2.3.16 PE4 / ECLK — Port E I/O Pin 4
PE4 is a general purpose input or output pin. It can be configured to drive the internal bus clock ECLK. ECLK can be used as a timing reference.
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2.3.17 PE3 / LSTRB / TAGLO — Port E I/O Pin 3
PE3 is a general purpose input or output pin. In MCU expanded modes of operation, LSTRB can be used for the low-byte strobe function to indicate the type of bus access and when instruction tagging is on, TAGLO is used to tag the low half of the instruction word being read into the instruction queue.
2.3.18 PE2 / R/W—Port E I/O Pin 2
PE2 is a general purpose input or output pin. In MCU expanded modes of operations, this pin drives the read/write output signal for the external bus. It indicates the direction of data on the external bus.
2.3.19 PE1 / IRQ — Port E Input Pin 1
PE1 is a general purpose input pin and the maskable interrupt request input that provides a means of applying asynchronous interrupt requests. This will wake up the MCU from STOP or WAIT mode.
2.3.20 PE0 / XIRQ — Port E Input Pin 0
PE0 is a general purpose input pin and the non-maskable interrupt request input that provides a means of applying asynchronous interrupt requests. This will wake up the MCU from STOP or WAIT mode.
2.3.21 PH7 / KWH7 / SS2 — Port H I/O Pin 7
PH7isa general purpose inputor output pin. Itcan be configured togeneratean interrupt causingtheMCU to exit STOP or WAIT mode. It can be configured as slave select pin 2 (SPI2).
SS of the Serial Peripheral Interface
2.3.22 PH6 / KWH6 / SCK2 — Port H I/O Pin 6
PH6isa general purpose inputor output pin. Itcan be configured togeneratean interrupt causingtheMCU to exitSTOP or WAIT mode.It can be configuredasserial clock pinSCKof the SerialPeripheralInterface 2 (SPI2).
2.3.23 PH5 / KWH5 / MOSI2 — Port H I/O Pin 5
PH5isa general purpose inputor output pin. Itcan be configured togeneratean interrupt causingtheMCU to exit STOP or WAIT mode. It can be configured as master output (during master mode) or slave input pin (during slave mode) MOSI of the Serial Peripheral Interface 2 (SPI2).
2.3.24 PH4 / KWH4 / MISO2 — Port H I/O Pin 2
PH4isa general purpose inputor output pin. Itcan be configured togeneratean interrupt causingtheMCU to exit STOP or WAIT mode. It can be configured as master input (during master mode) or slave output (during slave mode) pin MISO of the Serial Peripheral Interface 2 (SPI2).
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2.3.25 PH3 / KWH3 / SS1 — Port H I/O Pin 3
PH3isa general purpose inputor output pin. Itcan be configured togeneratean interrupt causingtheMCU to exit STOP or WAIT mode. It can be configured as slave select pin 1 (SPI1).
SS of the Serial Peripheral Interface
2.3.26 PH2 / KWH2 / SCK1 — Port H I/O Pin 2
PH2isa general purpose inputor output pin. Itcan be configured togeneratean interrupt causingtheMCU toexitSTOP or WAITmode.It can beconfigured as serial clockpin SCK 1 (SPI1).
oftheSerial Peripheral Interface
2.3.27 PH1 / KWH1 / MOSI1 — Port H I/O Pin 1
PH1isa general purpose inputor output pin. Itcan be configured togeneratean interrupt causingtheMCU to exit STOP or WAIT mode. It can be configured as master output (during master mode) or slave input pin (during slave mode) MOSI of the Serial Peripheral Interface 1 (SPI1).
2.3.28 PH0 / KWH0 / MISO1 — Port H I/O Pin 0
PH0isa general purpose inputor output pin. Itcan be configured togeneratean interrupt causingtheMCU to exit STOP or WAIT mode. It can be configured as master input (during master mode) or slave output (during slave mode) pin MISO of the Serial Peripheral Interface 1 (SPI1).
2.3.29 PJ7 / KWJ7 / TXCAN4 / SCL / TXCAN0 — PORT J I/O Pin 7
PJ7 is a generalpurposeinputoroutput pin. It can be configured to generate an interrupt causingtheMCU to exit STOP or WAIT mode. It can be configured as the transmit pin TXCAN for the Motorola Scalable Controller Area Network controller 0 or 4 (CAN0 or CAN4) or theserialclockpinSCLoftheIICmodule.
2.3.30 PJ6 / KWJ6 / RXCAN4 / SDA / RXCAN0 — PORT J I/O Pin 6
PJ6 is a generalpurposeinputoroutput pin. It can be configured to generate an interrupt causingtheMCU to exit STOP or WAIT mode. It can be configured as the receive pin RXCAN for the Motorola Scalable Controller Area Network controller 0 or 4 (CAN 0 or CAN4) or the serialdatapin SDA of the IIC module.
2.3.31 PJ[1:0] / KWJ[1:0] — Port J I/O Pins [1:0]
PJ1 and PJ0 are general purpose input or output pins. They can be configured to generate an interrupt causing the MCU to exit STOP or WAIT mode.
2.3.32 PK7 / ECS / ROMCTL — Port K I/O Pin 7
PK7 is a general purpose input or output pin. During MCU expanded modes of operation, this pin is used as the emulation chip select output (
60
ECS). During MCU normal expanded modes of operation, this pin is
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used toenable the Flash EEPROMmemoryin the memory map(ROMCTL).At the rising edgeofRESET, the state of this pin is latched to the ROMON bit.
2.3.33 PK[5:0] / XADDR[19:14] — Port K I/O Pins [5:0]
PK5-PK0 are general purpose input or output pins. In MCU expanded modes of operation, these pins provide the expanded address XADDR[19:14] for the external bus.
2.3.34 PM7 / TXCAN3 / TXCAN4 — Port M I/O Pin 7
PM7 is a general purpose input or output pin. It can be configured as the transmit pin TXCAN of the Motorola Scalable Controller Area Network controllers 3 or 4 (CAN3 or CAN4).
2.3.35 PM6 / RXCAN3 / RXCAN4 — Port M I/O Pin 6
PM6 is a general purpose input or output pin. It can be configured as the receive pin RXCAN of the Motorola Scalable Controller Area Network controllers 3 or 4 (CAN3 or CAN4).
2.3.36 PM5 / TXCAN2 / TXCAN0 / TXCAN4 / SCK0 — Port M I/O Pin 5
PM5 is a general purpose input or output pin. It can be configured as the transmit pin TXCAN of the Motorola Scalable Controller Area Network controllers 2, 0 or 4 (CAN2, CAN0 or CAN4). It can be configured as the serial clock pin SCK of the Serial Peripheral Interface 0 (SPI0).
2.3.37 PM4 / RXCAN2 / RXCAN0 / RXCAN4/ MOSI0 — Port M I/O Pin 4
PM4 is a general purpose input or output pin. It can be configured as the receive pin RXCAN of the Motorola Scalable Controller Area Network controllers 2, 0 or 4 (CAN2, CAN0 or CAN4). It can be configured as the master output (during master mode) or slave input pin (during slave mode) MOSI the Serial Peripheral Interface 0 (SPI0).
2.3.38 PM3 / TXCAN1 / TXCAN0 / SS0 — Port M I/O Pin 3
PM3 is a general purpose input or output pin. It can be configured as the transmit pin TXCAN of the Motorola Scalable Controller Area Network controllers 1 or 0 (CAN1 or CAN0). It can be configured as the slave select pin
SS of the Serial Peripheral Interface 0 (SPI0).
2.3.39 PM2 / RXCAN1 / RXCAN0 / MISO0 — Port M I/O Pin 2
PM2 is a general purpose input or output pin. It can be configured as the receive pin RXCAN of the Motorola Scalable Controller Area Network controllers 1 or 0 (CAN1 or CAN0). It can be configured as the master input (during master mode) or slave output pin (during slave mode) MISO Peripheral Interface 0 (SPI0).
for the Serial
for
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2.3.40 PM1 / TXCAN0 / TXB — Port M I/O Pin 1
PM1 is a general purpose input or output pin. It can be configured as the transmit pin TXCAN of the Motorola Scalable Controller Area Network controller 0 (CAN0). It can be configured as the transmit pin TXB of the BDLC.
2.3.41 PM0 / RXCAN0 / RXB — Port M I/O Pin 0
PM0 is a general purpose input or output pin. It can be configured as the receive pin RXCAN of the Motorola Scalable Controller Area Network controller 0 (CAN0). It can be configured as the receive pin RXB of the BDLC.
2.3.42 PP7 / KWP7 / PWM7 / SCK2 — Port P I/O Pin 7
PP7 isageneral purpose input or outputpin.Itcan be configured to generateaninterrupt causing the MCU to exit STOP or WAIT mode. It can be configured as Pulse Width Modulator (PWM) channel 7 output or an input for the PWM emergency shutdown. It can be configured as serial clock pin SCK of the Serial Peripheral Interface 2 (SPI2).
2.3.43 PP6 / KWP6 / PWM6 / SS2 — Port P I/O Pin 6
PP6 isageneral purpose input or outputpin.Itcan be configured to generateaninterrupt causing the MCU to exit STOP or WAIT mode. It can be configured as Pulse Width Modulator (PWM) channel 6 output. It can be configured as slave select pin
2.3.44 PP5 / KWP5 / PWM5 / MOSI2 — Port P I/O Pin 5
PP5 isageneral purpose input or outputpin.Itcan be configured to generateaninterrupt causing the MCU to exit STOP or WAIT mode. It can be configured as Pulse Width Modulator (PWM) channel 5 output. It can be configured as master output (during master mode) or slave input pin (during slave mode) MOSI of the Serial Peripheral Interface 2 (SPI2).
2.3.45 PP4 / KWP4 / PWM4 / MISO2 — Port P I/O Pin 4
PP4 isageneral purpose input or outputpin.Itcan be configured to generateaninterrupt causing the MCU to exit STOP or WAIT mode. It can be configured as Pulse Width Modulator (PWM) channel 4 output. It can be configured as master input (during master mode) or slave output (during slave mode) pin MISO of the Serial Peripheral Interface 2 (SPI2).
SS of the Serial Peripheral Interface 2 (SPI2).
2.3.46 PP3 / KWP3 / PWM3 / SS1 — Port P I/O Pin 3
PP3 isageneral purpose input or outputpin.Itcan be configured to generateaninterrupt causing the MCU to exit STOP or WAIT mode. It can be configured as Pulse Width Modulator (PWM) channel 3 output. It can be configured as slave select pin
62
SS of the Serial Peripheral Interface 1 (SPI1).
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2.3.47 PP2 / KWP2 / PWM2 / SCK1 — Port P I/O Pin 2
PP2 isageneral purpose input or outputpin.Itcan be configured to generateaninterrupt causing the MCU to exit STOP or WAIT mode. It can be configured as Pulse Width Modulator (PWM) channel 2 output. It can be configured as serial clock pin SCK of the Serial Peripheral Interface 1 (SPI1).
2.3.48 PP1 / KWP1 / PWM1 / MOSI1 — Port P I/O Pin 1
PP1 isageneral purpose input or outputpin.Itcan be configured to generateaninterrupt causing the MCU to exit STOP or WAIT mode. It can be configured as Pulse Width Modulator (PWM) channel 1 output. It can be configured as master output (during master mode) or slave input pin (during slave mode) MOSI of the Serial Peripheral Interface 1 (SPI1).
2.3.49 PP0 / KWP0 / PWM0 / MISO1 — Port P I/O Pin 0
PP0 isageneral purpose input or outputpin.Itcan be configured to generateaninterrupt causing the MCU to exit STOP or WAIT mode. It can be configured as Pulse Width Modulator (PWM) channel 0 output. It can be configured as master input (during master mode) or slave output (during slave mode) pin MISO of the Serial Peripheral Interface 1 (SPI1).
2.3.50 PS7 / SS0 — Port S I/O Pin 7
PS6 is a general purpose input or output pin. It can be configured as the slave select pin SS of the Serial Peripheral Interface 0 (SPI0).
2.3.51 PS6 / SCK0 — Port S I/O Pin 6
PS6 is a general purpose input or output pin. It can be configured as the serial clock pin SCK of the Serial Peripheral Interface 0 (SPI0).
2.3.52 PS5 / MOSI0 — Port S I/O Pin 5
PS5 is a general purpose input or output pin. It can be configured as master output (during master mode) or slave input pin (during slave mode) MOSI of the Serial Peripheral Interface 0 (SPI0).
2.3.53 PS4 / MISO0 — Port S I/O Pin 4
PS4 is a general purpose input or output pin. It can be configured as master input (during master mode) or slave output pin (during slave mode) MOSI of the Serial Peripheral Interface 0 (SPI0).
2.3.54 PS3 / TXD1 — Port S I/O Pin 3
PS3 is a general purpose input or output pin. It can be configured as the transmit pin TXD of Serial Communication Interface 1 (SCI1).
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2.3.55 PS2 / RXD1 — Port S I/O Pin 2
PS2 is a general purpose input or output pin. It can be configured as the receive pin RXD of Serial Communication Interface 1 (SCI1).
2.3.56 PS1 / TXD0 — Port S I/O Pin 1
PS1 is a general purpose input or output pin. It can be configured as the transmit pin TXD of Serial Communication Interface 0 (SCI0).
2.3.57 PS0 / RXD0 — Port S I/O Pin 0
PS0 is a general purpose input or output pin. It can be configured as the receive pin RXD of Serial Communication Interface 0 (SCI0).
2.3.58 PT[7:0] / IOC[7:0] — Port T I/O Pins [7:0]
PT7-PT0 are general purpose input or output pins. They can be configured as input capture or output compare pins IOC7-IOC0 of the Enhanced Capture Timer (ECT).
2.4 Power Supply Pins
MC9S12DP512 power and ground pins are described below.
Table 2-2 MC9S12DP512 Power and Ground Connection Summary
Mnemonic
V
DD1, 2
V
SS1, 2
V
DDR
V
SSR
V
DDX
V
SSX
V
DDA
V
SSA
V
RL
V
RH
V
DDPLL
V
SSPLL
VREGEN 97 5V Internal Voltage Regulator enable/disable
Pin Number
112-pin QFP
13, 65 2.5 V 14, 66 0V
41 5.0 V
40 0 V 107 5.0 V 106 0 V
83 5.0 V
86 0 V
85 0 V
84 5.0 V
43 2.5 V
45 0 V
Nominal
Voltage
Internal power and ground generated by internal regulator
External power and ground, supply to pin drivers and internal voltage regulator.
External power and ground, supply to pin drivers.
Operating voltage and ground for the analog-to-digital converters and the reference for the internal voltage regulator, allows the supply voltage to the A/D to be bypassed independently.
Reference voltages for the analog-to-digital converter.
Provides operating voltage and ground for the Phased-Locked Loop. This allows the supply voltage to the PLL to be bypassed independently. Internal power and ground generated by internal regulator.
Description
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NOTE:
All VSS pins must be connected together in the application.
2.4.1 VDDX,VSSX — Power & Ground Pins for I/O Drivers
External power and ground for I/O drivers. Because fast signal transitions place high, short-duration current demandsonthepower supply, use bypass capacitors withhigh-frequencycharacteristics and place them as close to the MCU as possible. Bypass requirements depend on how heavily the MCU pins are loaded.
2.4.2 VDDR, VSSR —Power & Ground Pins for I/O Drivers & Internal Voltage Regulator
External power and ground for I/O drivers and input to the internal voltage regulator. Because fast signal transitions place high, short-duration current demands on the power supply, use bypass capacitors with high-frequency characteristics and place them as close to the MCU as possible. Bypass requirements depend on how heavily the MCU pins are loaded.
2.4.3 VDD1, VDD2, VSS1, VSS2 — Internal Logic Power Supply Pins
Power is supplied to the MCU through VDD and VSS. Because fast signal transitions place high, short-duration current demands on the power supply, use bypass capacitors with high-frequency characteristics and place them as close to the MCU as possible. This 2.5V supply is derived from the internal voltage regulator. There is no static load on those pins allowed. The internal voltage regulator is turned off, if VREGEN is tied to ground.
NOTE:
No load allowed except for bypass capacitors.
2.4.4 VDDA, VSSA — Power Supply Pins for ATD and VREG
VDDA, VSSA are the power supply and ground input pins for the voltage regulator and the analog to digital converter. It also provides the reference for the internal voltage regulator. This allows the supply voltage to the ATD and the reference voltage to be bypassed independently.
2.4.5 VRH, VRL — ATD Reference Voltage Input Pins
VRH and VRL are the reference voltage input pins for the analog to digital converter.
2.4.6 VDDPLL, VSSPLL — Power Supply Pins for PLL
Provides operating voltage and ground for the Oscillator and the Phased-Locked Loop. This allows the supply voltage to the Oscillator and PLL to be bypassed independently. This 2.5V voltage is generated by the internal voltage regulator.
NOTE:
No load allowed except for bypass capacitors.
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2.4.7 VREGEN — On Chip Voltage Regulator Enable
Enables the internal 5V to 2.5V voltage regulator. If this pin is tied low, VDD1,2 and VDDPLL must be supplied externally.
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Section 3 System Clock Description
3.1 Overview
The Clock and Reset Generator provides the internal clock signals for the core and all peripheral modules. Figure 3-1 shows the clock connections from the CRG to all modules.
Consult the CRG Block Guide and OSC Block Guide for details on clock generation.
EXTAL
XTAL
OSC
CRG
Bus Clock
Oscillator Clock
Core Clock
HCS12 CORE
CPUMEBI
MMCINT
BDM
SCI0, SCI1
CAN0, 1, 2, 3, 4
BKP
Flash
RAM
EEPROM
ECT
ATD0, 1
PWM
SPI0, 1, 2
IIC
BDLC
PIM
Figure 3-1 Clock Connections
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Section 4 Modes of Operation
4.1 Overview
Eight possible modes determine the operating configuration of the MC9S12DP512. Each mode has an associated default memory map and external bus configuration controlled by a further pin.
Three low power modes exist for the device (Section 4.4 Low Power Modes).
4.2 Chip Configuration Summary
The operatingmode out of resetisdetermined by the statesof the MODC, MODB,andMODA pins during reset (Table4-1).TheMODC,MODB, and MODA bits intheMODE register show the currentoperating modeandprovide limited modeswitchingduring operation. Thestates of theMODC,MODB, and MODA pinsarelatched into thesebitson the risingedge of theresetsignal. The ROMCTLsignalallows the setting of the ROMON bit in the MISC register thus controlling whether the internal Flash is visible in the memory map. ROMON = 1 means the Flash is visible in the memory map. The state of the ROMCTL pin is latched into the ROMON bit in the MISC register on the rising edge of the reset signal.
BKGD =
MODC
000X1
001 0 1 0 X 0 Special Test (Expanded Wide), BDM allowed 011 1 0 0 X 1 Normal Single Chip, BDM allowed 101
110X1
111
PE6 =
MODB
PE5 =
MODA
Table 4-1 Mode Selection
PK7 =
ROMCTL
01 10
01 10
00 11
00 11
ROMON
Bit
Special Single Chip, BDM allowed and ACTIVE. BDM is allowed in all other modes but a serial command is required to make BDM active.
Emulation Expanded Narrow, BDM allowed
Emulation Expanded Wide, BDM allowed
Normal Expanded Narrow, BDM allowed Peripheral; BDM allowed but bus operations would cause
bus conflicts (must not be used) Normal Expanded Wide, BDM allowed
Mode Description
For further explanation on the modes refer to the HCS12 Multiplexed External Bus Interface (MEBI) Block Guide.
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Table 4-2 Clock Selection Based on PE7
PE7 = XCLKS Description
1 Colpitts Oscillator selected 0 Pierce Oscillator/external clock selected
Table 4-3 Voltage Regulator VREGEN
VREGEN Description
1 Internal Voltage Regulator enabled 0
Internal Voltage Regulator disabled, VDD1,2 and VDDPLL must be supplied externally with 2.5V
4.3 Security
The device will make available a security feature preventing the unauthorized read and write of the memory contents. This feature allows:
Protection of the contents of FLASH,
Protection of the contents of EEPROM,
Operation in single-chip mode,
Operation from external memory with internal FLASH and EEPROM disabled.
The user must be reminded that part of the security must lie with the user’s code. An extreme example would be user’s code that dumps the contents of theinternal program. This code would defeat the purpose of security. At the same time the user may also wish to put a back door inthe user’s program. An example of this is the user downloads a key through the SCI which allows access to a programming routine that updates parameters stored in EEPROM.
4.3.1 Securing the Microcontroller
Once the user has programmed the FLASH and EEPROM (if desired), the part can be secured by programming the security bits located in the FLASH module. These non-volatile bits will keep the part secured through resetting the part and through powering down the part.
The security byte resides in a portion of the Flash array. Check the Flash Block Guide for more details on the security configuration.
4.3.2 Operation of the Secured Microcontroller
4.3.2.1 Normal Single Chip Mode
This will bethemostcommon usage of the secured part. Everything will appear thesameasif the part was not secured with the exception of BDM operation. The BDM operation will be blocked.
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4.3.2.2 Executing from External Memory
The user may wish to execute from external space with a secured microcontroller. This is accomplished by resetting directly into expanded mode. The internal FLASH and EEPROM will be disabled. BDM operations will be blocked.
4.3.3 Unsecuring the Microcontroller
In order to unsecure the microcontroller, the internal FLASH and EEPROM must be erased. This can be done through an external program in expanded mode or via a sequence of BDM commands. Unsecuring is also possible via the Backdoor Key Access. Refer to Flash Block Guide for details..
Once the user has erased the FLASH and EEPROM, the part can be reset into special single chip mode. This invokes a program that verifies the erasure of the internal FLASH and EEPROM. Once this program completes,theuser can eraseandprogram the FLASHsecurity bits totheunsecured state. Thisisgenerally done through the BDM, but the user could also change to expanded mode (by writing the mode bits through the BDM) and jumping to an external program (again through BDM commands). Note that if the part goes through a reset before the security bits are reprogrammed to the unsecure state, the part will be secured again.
4.4 Low Power Modes
The microcontroller features three main low power modes. Consult the respective Block Guide for information on the module behavior in Stop, Pseudo Stop, and Wait Mode. An important source of information about the clock system is the Clock and Reset Generator Block Guide (CRG).
4.4.1 Stop
Executing the CPU STOP instruction stops all clocks andthe oscillator thus putting the chip in fully static mode. Wake up from this mode can be done via reset or external interrupts.
4.4.2 Pseudo Stop
This mode is entered by executing the CPU STOP instruction. In this mode the oscillator is still running and the Real Time Interrupt (RTI) or Watchdog (COP) sub module can stay active. Other peripherals are turned off. This mode consumes more current than the full STOP mode, but the wake up time from this mode is significantly shorter.
4.4.3 Wait
This mode is entered by executing the CPU WAI instruction. In this mode the CPU will not execute instructions.Theinternal CPU signals(addressand databus) willbe fully static.Allperipherals stay active. For further power consumption the peripherals can individually turn off their local clocks.
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4.4.4 Run
Although this is not a low power mode, unused peripheral modules should not be enabled in order to save power.
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Section 5 Resets and Interrupts
5.1 Overview
Consult the Exception Processing section of the CPU12 Reference Manual for information on resets and interrupts.
5.2 Vectors
5.2.1 Vector Table
Table 5-1 lists interrupt sources and vectors in default order of priority.
Table 5-1 Interrupt Vector Locations
Vector Address Interrupt Source
$FFFE, $FFFF Reset None None – $FFFC, $FFFD Clock Monitor fail reset None PLLCTL (CME, SCME) – $FFFA, $FFFB COP failure reset None COP rate select – $FFF8, $FFF9 Unimplemented instruction trap None None – $FFF6, $FFF7 SWI None None – $FFF4, $FFF5 XIRQ X-Bit None – $FFF2, $FFF3 IRQ I-Bit IRQCR (IRQEN) $F2 $FFF0, $FFF1 Real Time Interrupt I-Bit CRGINT (RTIE) $F0 $FFEE, $FFEF Enhanced Capture Timer channel 0 I-Bit TIE (C0I) $EE $FFEC, $FFED Enhanced Capture Timer channel 1 I-Bit TIE (C1I) $EC $FFEA, $FFEB Enhanced Capture Timer channel 2 I-Bit TIE (C2I) $EA $FFE8, $FFE9 Enhanced Capture Timer channel 3 I-Bit TIE (C3I) $E8 $FFE6, $FFE7 Enhanced Capture Timer channel 4 I-Bit TIE (C4I) $E6 $FFE4, $FFE5 Enhanced Capture Timer channel 5 I-Bit TIE (C5I) $E4 $FFE2, $FFE3 Enhanced Capture Timer channel 6 I-Bit TIE (C6I) $E2 $FFE0, $FFE1 Enhanced Capture Timer channel 7 I-Bit TIE (C7I) $E0 $FFDE, $FFDF Enhanced Capture Timer overflow I-Bit TSRC2 (TOI) $DE $FFDC, $FFDD Pulse accumulator A overflow I-Bit PACTL (PAOVI) $DC $FFDA, $FFDB Pulse accumulator input edge I-Bit PACTL (PAI) $DA $FFD8, $FFD9 SPI0 I-Bit SPICR1 (SPIE, SPTIE) $D8
$FFD6, $FFD7 SCI0 I-Bit
$FFD4, $FFD5 SCI1 I-Bit $FFD2, $FFD3 ATD0 I-Bit ATDCTL2 (ASCIE) $D2
$FFD0, $FFD1 ATD1 I-Bit ATDCTL2 (ASCIE) $D0 $FFCE, $FFCF Port J I-Bit $FFCC, $FFCD Port H I-Bit PIEH (PIEH7-0) $CC
CCR
Mask
Local Enable
SCICR2
(TIE, TCIE, RIE, ILIE)
SCICR2
(TIE, TCIE, RIE, ILIE)
PIEJ
(PIEJ7, PIEJ6, PIEJ1, PIEJ0)
HPRIO Value
to Elevate
$D6
$D4
$CE
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$FFCA, $FFCB Modulus Down Counter underflow I-Bit MCCTL (MCZI) $CA $FFC8, $FFC9 Pulse Accumulator B Overflow I-Bit PBCTL (PBOVI) $C8 $FFC6, $FFC7 CRG PLL lock I-Bit CRGINT (LOCKIE) $C6 $FFC4, $FFC5 CRG Self Clock Mode I-Bit CRGINT (SCMIE) $C4 $FFC2, $FFC3 BDLC I-Bit DLCBCR1 (IE) $C2 $FFC0, $FFC1 IIC Bus I-Bit IBCR (IBIE) $C0 $FFBE, $FFBF SPI1 I-Bit SPICR1 (SPIE, SPTIE) $BE $FFBC, $FFBD SPI2 I-Bit SPICR1 (SPIE, SPTIE) $BC $FFBA, $FFBB EEPROM I-Bit ECNFG (CCIE, CBEIE) $BA $FFB8, $FFB9 FLASH I-Bit FCNFG (CCIE, CBEIE) $B8 $FFB6, $FFB7 CAN0 wake-up I-Bit CANRIER (WUPIE) $B6 $FFB4, $FFB5 CAN0 errors I-Bit CANRIER (CSCIE, OVRIE) $B4 $FFB2, $FFB3 CAN0 receive I-Bit CANRIER (RXFIE) $B2 $FFB0, $FFB1 CAN0 transmit I-Bit CANTIER (TXEIE2-TXEIE0) $B0 $FFAE, $FFAF CAN1 wake-up I-Bit CANRIER (WUPIE) $AE $FFAC, $FFAD CAN1 errors I-Bit CANRIER (CSCIE, OVRIE) $AC $FFAA, $FFAB CAN1 receive I-Bit CANRIER (RXFIE) $AA $FFA8, $FFA9 CAN1 transmit I-Bit CANTIER (TXEIE2-TXEIE0) $A8 $FFA6, $FFA7 CAN2 wake-up I-Bit CANRIER (WUPIE) $A6 $FFA4, $FFA5 CAN2 errors I-Bit CANRIER (CSCIE, OVRIE) $A4 $FFA2, $FFA3 CAN2 receive I-Bit CANRIER (RXFIE) $A2 $FFA0, $FFA1 CAN2 transmit I-Bit CANTIER (TXEIE2-TXEIE0) $A0 $FF9E, $FF9F CAN3 wake-up I-Bit CANRIER (WUPIE) $9E $FF9C, $FF9D CAN3 errors I-Bit CANRIER (CSCIE, OVRIE) $9C $FF9A, $FF9B CAN3 receive I-Bit CANRIER (RXFIE) $9A $FF98, $FF99 CAN3 transmit I-Bit CANTIER (TXEIE2-TXEIE0) $98 $FF96, $FF97 CAN4 wake-up I-Bit CANRIER (WUPIE) $96 $FF94, $FF95 CAN4 errors I-Bit CANRIER (CSCIE, OVRIE) $94 $FF92, $FF93 CAN4 receive I-Bit CANRIER (RXFIE) $92 $FF90, $FF91 CAN4 transmit I-Bit CANTIER (TXEIE2-TXEIE0) $90 $FF8E, $FF8F Port P Interrupt I-Bit PIEP (PIEP7-0) $8E $FF8C, $FF8D PWM Emergency Shutdown I-Bit PWMSDN (PWMIE) $8C $FF80 to
$FF8B
Reserved
5.3 Effects of Reset
When a reset occurs, MCU registers and control bits are changed to known start-up states. Refer to the respective module Block Guides for register reset states.
5.3.1 I/O pins
Refer to the HCS12 Multiplexed External Bus Interface (MEBI) Block Guide for mode dependent pin configuration of port A, B, E and K out of reset.
Refer to the PIM Block Guide for reset configurations of all peripheral module ports.
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5.3.2 Memory
Refer to Table 1-1 for locations of the memories depending on the operating mode after reset. The RAM array is not automatically initialized out of reset.
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Section 6 HCS12 Core Block Description
6.1 CPU12 Block Description
Consult the HCS12 CPU Reference Manual for information on the CPU.
6.1.1 Device-specific information
When the HCS12 CPU Reference Manual refers to cycles this is equivalent to Bus Clock periods. So 1 cycle is equivalent to 1 Bus Clock period.
6.2 HCS12 Module Mapping Control (MMC) Block Description
Consult the MMC Block Guide for information on the HCS12 Module Mapping Control module.
6.2.1 Device-specific information
INITEE – Reset state: $01 – Bits EE11-EE15 are "Write once in Normal and Emulation modes and write anytime in Special
modes".
PPAGE – Reset state: $00 – Register is "Write anytime in all modes"
6.3 HCS12 Multiplexed External Bus Interface (MEBI) Block Description
Consult the MEBI Block Guide for information on HCS12 Multiplexed External Bus Interface module.
6.3.1 Device-specific information
PUCR – Reset state: $90
6.4 HCS12 Interrupt (INT) Block Description
Consult the INT Block Guide for information on the HCS12 Interrupt module.
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6.5 HCS12 Background Debug (BDM) Block Description
Consult the BDM Block Guide for information on the HCS12 Background Debug module.
6.5.1 Device-specific information
When the BDM Block Guide refers to alternate clock this is equivalent to Oscillator Clock.
6.6 HCS12 Breakpoint (BKP) Block Description
Consult the BKP Block Guide for information on the HCS12 Breakpoint module.
Section 7 Clock and Reset Generator (CRG) Block Description
Consult the CRG Block Guide for information about the Clock and Reset Generator module.
7.1 Device-specific information
The Low Voltage Reset feature of the CRG is not available on this device.
Section 8 Oscillator (OSC) Block Description
8.1 Device-specific information
The XCLKS input signal is active low (see 2.3.13 PE7 / NOACC / XCLKS — Port E I/O Pin 7).
Section 9 Enhanced Capture Timer (ECT) Block Description
Consult the ECT_16B8C Block Guide for information about the Enhanced Capture Timer module. When the ECT_16B8C Block Guide refers to freeze mode this is equivalent to active BDM mode.
Section 10 Analog to Digital Converter (ATD) Block Description
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There are two Analog to Digital Converters (ATD1 and ATD0) implemented on the MC9S12DP512. Consult the ATD_10B8C Block Guide for information about each Analog to Digital Converter module.
When the ATD_10B8C Block Guide refers to freeze mode this is equivalent to active BDM mode.
Section 11 Inter-IC Bus (IIC) Block Description
Consult the IIC Block Guide for information about the Inter-IC Bus module.
Section 12 Serial Communications Interface (SCI) Block Description
There are two Serial Communications Interfaces (SCI1 and SCI0) implemented on the MC9S12DP512 device.
Consult the SCI Block Guide for information about each Serial Communications Interface module.
Section 13 Serial Peripheral Interface (SPI) Block Description
There are three Serial Peripheral Interfaces (SPI2, SPI1 and SPI0) implemented on MC9S12DP512. Consult the SPI Block Guide for information about each Serial Peripheral Interface module.
Section 14 J1850 (BDLC) Block Description
Consult the BDLC Block Guide for information about the J1850 module.
Section 15 Pulse Width Modulator (PWM) Block Description
Consult the PWM_8B6C Block Guide for information about the Pulse Width Modulator module. When the PWM_8B8C Block Guide refers to freeze mode this is equivalent to active BDM mode.
Section 16 Flash EEPROM 512K Block Description
Consult the FTS512K4 Block Guide for information about the flash module.
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The "S12 LRAE" is a generic Load RAM and Execute (LRAE) program which will be programmed into the flash memory of this device during manufacture. This LRAE program will provide greater programming flexibility to the end users by allowing the device to be programmed directly using CAN or SCI after it is assembled on the PCB. Use of the LRAE program is at the discretion of the end user and, if not required, it must simply be erased prior to flash programming. For more details of the S12 LRAE and its implementation, please see the S12 LREA Application Note (AN2546/D).
It isplanned that most HC9S12devicesmanufactured after Q1 of2004 will be shippedwiththe S12 LRAE programmed in theFlash.Exact details of the changeover (i.e. blank toprogrammed)for each product will be communicated in advance via GPCN and will be traceable by the customer via datecode marking on the device.
Please contact Motorola SPS Sales if you have any additional questions.
Section 17 EEPROM 4K Block Description
Consult the EETS4K Block Guide for information about the EEPROM module.
Section 18 RAM Block Description
This module supports single-cycle misaligned word accesses.
Section 19 MSCAN Block Description
There are five MSCAN modules (CAN4, CAN3, CAN2, CAN1 and CAN0) implemented on the MC9S12DP512.
Consult the MSCAN Block Guide for information about the Motorola Scalable CAN Module.
Section 20 Port Integration Module (PIM) Block Description
Consult the functionally equivalent PIM_9DP256 Block Guide for information about the Port Integration Module.
Section 21 Voltage Regulator (VREG) Block Description
Consult the VREG Block Guide for information about the dual output linear voltage regulator.
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Section 22 Printed Circuit Board Layout Proposal
Table 22-1 Suggested External Component Values
Component Purpose Type Value
C1 VDD1 filter cap ceramic X7R 100 … 220nF C2 VDD2 filter cap ceramic X7R 100 … 220nF C3 VDDA filter cap ceramic X7R 100nF C4 VDDR filter cap X7R/tantalum >= 100nF C5 VDDPLL filter cap ceramic X7R 100nF C6 VDDX filter cap X7R/tantalum >= 100nF C7 OSC load cap C8 OSC load cap
C9 / C
S
C10 / C
C11 / C
P
DC
PLL loop filter cap PLL loop filter cap
DC cutoff cap
See PLL specification chapter
Colpitts mode only, if recommended by
quartz manufacturer
R1 / R PLL loop filter res See PLL Specification chapter
R2 / R
B
R3 / R
S
Q1 Quartz
The PCB must be carefully laid out to ensure proper operation of the voltage regulator as well as of the MCU itself. The following rules must be observed:
Every supply pair must be decoupled by a ceramic capacitor connected as near as possible to the corresponding pins (C1 – C6).
Central point of the ground star should be the VSSR pin.
Use low ohmic low inductance connections between VSS1, VSS2 and VSSR.
VSSPLL must be directly connected to VSSR.
Keep traces of VSSPLL, EXTAL and XTAL as short as possible and occupied board area for C7, C8, C11 and Q1 as small as possible.
Pierce mode only
Do not place other signals or supplies underneath area occupied by C7, C8, C10 and Q1 and the connection area to the MCU.
Central power input should be fed in at the VDDA/VSSA pins.
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Figure 22-1 Recommended PCB Layout for 112LQFP Colpitts Oscillator
C1
VDD1
VSS1
VDDX
C6
VSSX
VSSR
VDDR
C4
VREGEN
C5
C11
C8
C7
VSSA
C3
VDDA
VSS2
VDD2
C2
82
C10
C9
R1
Q1
VSSPLL VDDPLL
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Figure 22-2 Recommended PCB Layout for 112LQFP Pierce Oscillator
C1
VDD1
VSS1
VDDX
C6
VSSX
VSSR
VDDR
VDDPLL
C4
C9
R1
VREGEN
C5
C10
C8
R2
Q1
R3
C7
VSSA
VSSPLL
C3
VDDA
VSS2
VDD2
C2
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Appendix A Electrical Characteristics
A.1 General
MC9S12DP512 Device Guide V01.23
NOTE:
This supplement contains themostaccurateelectricalinformation for the MC9S12DP512 microcontroller availableatthe time ofpublication. The informationshould be consideredPRELIMINARYand issubject to change.
This introduction is intended to give an overview on several common topics like power supply, current injection etc.
The electrical characteristics given in this section are preliminary and should be used as a guide only. Values cannot be guaranteed by Motorola and are subject to change without notice.
A.1.1 Parameter Classification
The electrical parameters shown in this supplement are guaranteed by various methods. To give the customer a better understanding the following classification is used and the parameters are tagged accordingly in the tables where appropriate.
NOTE:
P:
Those parameters are guaranteed during production testing on each individual device.
This classification is shown in the column labeled “C” in the parameter tables where appropriate.
C:
Those parameters are achieved by the design characterization by measuring a statistically relevant sample size across process variations.
T:
Those parameters are achieved by design characterization on a small sample size from typical devices under typical conditions unless otherwise noted. All values shown in the typical column are within this category.
D:
Those parameters are derived mainly from simulations.
A.1.2 Power Supply
The MC9S12DP512 utilizes several pins to supply power to the I/O ports, A/D converter, oscillator, PLL and internal logic.
The VDDA, VSSA pairsuppliestheA/D converter and the resistor ladder of the internal voltage regulator.
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The VDDX, VSSX, VDDR and VSSR pairs supply the I/O pins, VDDR supplies also the internal voltage regulator.
VDD1, VSS1, VDD2 and VSS2 are the supply pins for the digital logic, VDDPLL, VSSPLL supply the oscillator and the PLL.
VSS1 and VSS2 are internally connected by metal. VDDA, VDDX, VDDR as well as VSSA, VSSX, VSSR are connected by anti-parallel diodes for ESD
protection.
NOTE:
A.1.3 Pins
There are four groups of functional pins.
In the following context VDD5 is used for either VDDA, VDDR and VDDX; VSS5 is used for either VSSA, VSSR and VSSX unless otherwise noted. IDD5 denotes the sum of the currents flowing into the VDDA, VDDX and VDDR pins. VDD is used for VDD1, VDD2 and VDDPLL, VSS is used for VSS1, VSS2 and VSSPLL. IDD is used for the sum of the currents flowing into VDD1 and VDD2.
A.1.3.1 5V I/O pins
Those I/O pins have a nominal level of 5V. This class of pins is comprised of all port I/O pins, the analog inputs, BKGD and the RESET pins.The internal structure of all those pins is identical, however some of the functionality may be disabled. E.g. for the analog inputs the output drivers, pull-up and pull-down resistors are disabled permanently.
A.1.3.2 Analog Reference
This group is made up by the VRH and VRL pins.
A.1.3.3 Oscillator
The pins XFC, EXTAL, XTAL dedicated to the oscillator have a nominal 2.5V level. They are supplied by VDDPLL.
A.1.3.4 TEST
This pin is used for production testing only.
A.1.3.5 VREGEN
This pin is used to enable the on chip voltage regulator.
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A.1.4 Current Injection
MC9S12DP512 Device Guide V01.23
Power supply must maintain regulation within operating V operating maximum current conditions. If positive injection current (V
or VDD range during instantaneous and
DD5
in
>V
) is greater than I
DD5
injection current may flowoutofVDD5and could result in external power supply going out of regulation. Ensure external VDD5 load will shunt current greater than maximum injection current. This will be the greatest risk when the MCU is not consuming power; e.g. if no system clock is present, or if clock rate is very low which would reduce overall power consumption.
A.1.5 Absolute Maximum Ratings
Absolute maximum ratings are stress ratings only. A functional operation under or outside those maxima is not guaranteed. Stress beyond those limits may affect the reliability or cause permanent damage of the device.
This device contains circuitry protecting against damage due to high static voltage or electrical fields; however, it is advised that normal precautions be taken to avoid application of any voltages higher than maximum-rated voltages to this high-impedance circuit. Reliability of operation is enhanced if unused inputs are tied to an appropriate logic voltage level (e.g., either V
SS5
or V
DD5
).
Table A-1 Absolute Maximum Ratings
Num Rating Symbol Min Max Unit
1
DD5
, the
1 I/O, Regulator and Analog Supply Voltage 2
Digital Logic Supply Voltage
3
PLL Supply Voltage 4 Voltage difference VDDX to VDDR and VDDA 5 Voltage difference VSSX to VSSR and VSSA 6 Digital I/O Input Voltage 7 Analog Reference 8 XFC, EXTAL, XTAL inputs 9 TEST input
Instantaneous Maximum Current
10
Single pin limit for all digital I/O pins
Instantaneous Maximum Current
11
Single pin limit for XFC, EXTAL, XTAL
Instantaneous Maximum Current
12
Single pin limit for TEST
13 Storage Temperature Range
NOTES:
1. Beyond absolute maximum ratings device might be damaged.
(2)
2
3
4
5
V
DD5
V
DD
V
DDPLL
VDDX
VSSX
V
V
RH,VRL
V
ILV
V
TEST
I
D
I
DL
I
DT
T
stg
-0.3 6.0 V
-0.3 3.0 V
-0.3 3.0 V
-0.3 0.3 V
-0.3 0.3 V
IN
-0.3 6.0 V
-0.3 6.0 V
-0.3 3.0 V
-0.3 10.0 V
-25 +25 mA
-25 +25 mA
-0.25 0 mA
– 65 155 °C
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2. The device contains an internal voltage regulator to generatethe logic and PLL supply out of the I/O supply. The absolute maximum ratings apply when the device is powered from an external source.
3. All digital I/O pins are internally clamped to V
4. Those pins are internally clamped to V
5. This pin is clamped low to V
SSX
and V
SSX
and V
SSPLL
, but not clamped high. This pin must be tied low in applications.
DDPLL
DDX
.
, V
SSR
and V
DDR
or V
SSA
and V
DDA
.
A.1.6 ESD Protection and Latch-up Immunity
All ESD testing is in conformity with CDF-AEC-Q100 Stress test qualification for Automotive Grade Integrated Circuits. During the device qualification ESD stresses were performed for the Human Body Model (HBM), the Machine Model (MM) and the Charge Device Model.
A device will be defined as a failure if after exposure to ESD pulses the device no longer meets the device specification. Complete DC parametric and functional testing is performed per the applicable device specification at room temperature followed by hot temperature, unless specified otherwise in the device specification.
Table A-2 ESD and Latch-up Test Conditions
Model Description Symbol Value Unit
Series Resistance R1 1500 Ohm Storage Capacitance C 100 pF
Human Body
Machine
Latch-up
Number of Pulse per pin positive negative
Series Resistance R1 0 Ohm Storage Capacitance C 200 pF Number of Pulse per pin
positive negative
Minimum input voltage limit -2.5 V Maximum input voltage limit 7.5 V
-
-
­3 3
­3 3
Table A-3 ESD and Latch-up Protection Characteristics
Num C Rating Symbol Min Max Unit
1 C Human Body Model (HBM) 2 C Machine Model (MM) 3 C Charge Device Model (CDM)
Latch-up Current at TA = 125°C
4C
5C
positive negative
Latch-up Current at T positive
negative
= 27°C
A
V
V
HBM
V
CDM
I
LAT
I
LAT
MM
2000 - V
200 - V 500 - V
+100
-100
+200
-200
-mA
-mA
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A.1.7 Operating Conditions
This chapter describes the operating conditions of the device. Unless otherwise noted those conditions apply to all the following data.
NOTE:
Please refer to the temperature rating of the device (C, V, M) with regards to the ambient temperature T
and the junction temperature TJ. For power dissipation
A
calculations refer to Section A.1.8 Power Dissipation and Thermal Characteristics.
Table A-4 Operating Conditions
Rating Symbol Min Typ Max Unit
(3)
(3)
V
DD5
V
DD
V
DDPLL
VDDX
VSSX
f
bus
T
J
3
T
A
T
J
T
A
T
J
T
A
4.5 5 5.25 V
2.35 2.5 2.75 V
2.35 2.5 2.75 V
-0.1 0 0.1 V
-0.1 0 0.1 V
2
0.25
-40 - 100 °C
-40 27 85 °C
-40 - 120 °C
-40 27 105 °C
-40 - 140 °C
-40 27 125 °C
- 25 MHz
I/O, Regulator and Analog Supply Voltage Digital Logic Supply Voltage PLL Supply Voltage
Voltage Difference VDDX to VDDR and VDDA Voltage Difference VSSX to VSSR and VSSA Bus Frequency (MC9S12DP512C, V, M) MC9S12DP512C
Operating Ambient Temperature Range
MC9S12DP512V
Operating Ambient Temperature Range
MC9S12DP512M
Operating Ambient Temperature Range
NOTES:
1. The device contains an internal voltage regulator to generate the logic and PLL supply out of the I/O supply. The given operating rangeapplies when this regulator isdisabled and the device ispowered from an external source.
2. Some blocks e.g. ATD (conversion) and NVMs (program/erase) require higher bus frequencies for proper oper­ation.
3. Please refer to Section A.1.8 Power Dissipation and Thermal Characteristics for more details about the rela­tion between ambient temperature T
(1)
Operating Junction Temperature Range
Operating Junction Temperature Range
Operating Junction Temperature Range
1
and device junction temperature TJ.
A
A.1.8 Power Dissipation and Thermal Characteristics
Power dissipation and thermal characteristics are closely related. The user must assure that the maximum operating junction temperature is not exceeded. The average chip-junction temperature (T obtained from:
)in°C can be
J
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T
T
J
A
P
D
ΘJA•()+= T T P
Θ
The total power dissipation can be calculated from:
P
Two cases with internal voltage regulator enabled and disabled must be considered:
Junction Temperature, [°C]=
J
Ambient Temperature, [°C]=
A
Total Chip Power Dissipation, [W]=
D
JA
INT
1. Internal Voltage Regulator disabled
Package Thermal Resistance, [°C/W]=
Chip Internal Power Dissipation, [W]=
P
D
P
INT
PIO+=
P
INT
I
I
DDVDD
P
DDPLLVDDPLL
R
IO
i
DSON
I
=
+V
2
I
IO
i
DDA
+=
DDA
P
is the sum of all output currents on I/O ports associated with VDDX and VDDR.
IO
For R
respectively
2. Internal voltage regulator enabled
is the current shown in Table A-7 and not the overall current flowing into VDDR, which
I
DDR
additionally contains the current flowing into the external loads with output high.
PIO is the sum of all output currents on I/O ports associated with VDDX and VDDR.
DSON
is valid:
R
DSON
R
DSON
P
INT
V
OL
------------ for outputs driven low;= I
OL
V
DD5
------------------------------------ for outputs driven high;= I
OH
I
DDRVDDR
P
IO
I
i
VOH–
R
DSON
+=
DDAVDDA
2
I
=
IO
i
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Table A-5 Thermal Package Characteristics
Num C Rating Symbol Min Typ Max Unit
1T
2T
NOTES:
1. The values for thermal resistance are achieved by package simulations
2. PC Board according to EIA/JEDEC Standard 51-2
3. PC Board according to EIA/JEDEC Standard 51-7
Thermal Resistance LQFP112, single sided PCB Thermal Resistance LQFP112, double sided PCB
with 2 internal planes
3
2
θ
JA
θ
JA
--54
--41
1
A.1.9 I/O Characteristics
This section describes the characteristics of all 5V I/O pins. All parameters are not alwaysapplicable, e.g. not all pins feature pull up/down resistances.
o
C/W
o
C/W
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Table A-6 5V I/O Characteristics
Conditions are shown in Table A-4 unless otherwise noted
Num C Rating Symbol Min Typ Max Unit
1 P Input High Voltage
T Input High Voltage
2 P Input Low Voltage
T Input Low Voltage
3 C Input Hysteresis
Input Leakage Current (pins in high impedance input
4P
5P
6P
7P
8C
9P
10 C
11 D Input Capacitance
12 T
13 P 14 P
NOTES:
1. Refer to Section A.1.4 Current Injection, for more details
2. Parameter only applies in STOP or Pseudo STOP mode.
mode) V
= V
in
Output High Voltage (pins in output mode) Partial Drive IOH= –2mA
Full Drive IOH= –10mA Output Low Voltage (pins in output mode)
Partial Drive IOL= +2mA Full Drive IOL= +10mA
Internal Pull Up Device Current, tested at V
Internal Pull Up Device Current, tested at V
Internal Pull Down Device Current, tested at V
Internal Pull Down Device Current, tested at V
Injection current Single Pin limit Total Device Limit. Sum of all injected currents
Port H, J, P Interrupt Input Pulse filtered Port H, J, P Interrupt Input Pulse passed
DD5
or V
Max.
IL
Min.
IH
Min.
IH
Max.
IL
SS5
1
2
(2)
V V
V V
V
HYS
I
V
V
I
PUL
I
PUH
I
PDH
I
PDL
C
I
ICS
I
ICP
t
PIGN
t
PVAL
IH
IH
IL
IL
in
OH
OL
in
0.65*V
DD5
- - VDD5 + 0.3 V
--
VSS5 - 0.3 - - V
- 250 - mV
–1 - 1 µA
V
– 0.8
DD5
- - 0.8 V
- - -130 µA
-10 - - µA
- - 130 µA
10 - - µA
-6-pF
-2.5
-25
--3µs
10 - - µs
--V
0.35*V
DD5
--V
- 2.5 25
V
mA
A.1.10 Supply Currents
This section describes the current consumption characteristics of the device as well as the conditions for the measurements.
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A.1.10.1 Measurement Conditions
All measurements are without output loads. Unless otherwise noted the currents are measured in single chip mode, internal voltage regulator enabled and at 25MHz bus frequency using a 4MHz oscillator in Colpitts mode. Production testing is performed using a square wave signal at the EXTAL input.
A.1.10.2 Additional Remarks
In expanded modesthecurrents flowing in the system are highly dependentonthe load at the address, data and control signals as well as on the duty cycle of those signals. No generally applicable numbers can be given. A very good estimate is to take the single chip currents and add the currents due to the external loads.
Table A-7 Supply Current Characteristics
Conditions are shown in Table A-4 unless otherwise noted
Num C Rating Symbol Min Typ Max Unit
1P
2P
3
4
5
Run supply currents
Wait Supply current
P
Pseudo Stop Current (RTI and COP disabled)
C P C C P C P C P
Pseudo Stop Current (RTI and COP enabled)
C C C C C C C
Stop Current
C P C C P C P C P
Single Chip, Internal regulator enabled
All modules enabled, PLL on
only RTI enabled
1, 2
-40°C 27°C 70°C 85°C
"C" Temp Option 100°C
105°C
"V" Temp Option 120°C
125°C
"M" Temp Option 140°C
(1), (2)
-40°C 27°C 70°C 85°C
105°C 125°C 140°C
(2)
-40°C 27°C 70°C 85°C
"C" Temp Option 100°C
105°C
"V" Temp Option 120°C
125°C
"M" Temp Option 140°C
(1)
I
DD5
I
DDW
I
DDPS
I
DDPS
I
DDS
--
--405mA
370 400 450
-
-
-
550 600 650 800 850
1200
570 600 650 750
850 1200 1500
12
25 100 130 160 200 350 400 600
65
500
1600 2100 5000
- µA
100
1200 1700 5000
mA
µA
µA
93
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NOTES:
1. PLL off
2. At those low power dissipation levels T
= TA can be assumed
J
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A.2 ATD Characteristics
This section describes the characteristics of the analog to digital converter.
A.2.1 ATD Operating Characteristics
The Table A-8 shows conditions under which the ATD operates. The following constraints exist to obtain full-scale, full range results:
V
VRL≤ VIN≤ VRH≤ V
SSA
beyond the power supply levels that it ties to. If the input level goes outside of this range it will effectively be clipped.
Table A-8 ATD Operating Characteristics
Conditions are shown in Table A-4 unless otherwise noted
Num C Rating Symbol Min Typ Max Unit
. This constraint exists since the sample buffer amplifier can not drive
DDA
Reference Potential
1D
2C 3 D ATD Clock Frequency
4D
5D
6D 7 P Reference Supply current 2 ATD blocks on 8 P Reference Supply current 1 ATD block on
NOTES:
1. Full accuracy is not guaranteed when differential voltage is less than 4.50V
2. The minimumtime assumes a final sample periodof 2 ATD clocks cycles whilethe maximum time assumes a finalsample
Differential Reference Voltage
ATD 10-Bit Conversion Period
Conv, Time at 2.0MHz ATD Clock f
ATD 8-Bit Conversion Period
Conv, Time at 2.0MHz ATD Clock f
Recovery Time (V
period of 16 ATD clocks.
=5.0 Volts) t
DDA
1
A.2.2 Factors influencing accuracy
Low
High
Clock Cycles
ATDCLK
Clock Cycles
ATDCLK
(2)
V
RL
V
RH
V
RH-VRL
f
ATDCLK
2
N
CONV10
T
CONV10
V
SSA
V
/2
DDA
4.50 5.00 5.25 V
0.5 - 2.0 MHz
14
7
-
-28
V
DDA
V
/2
DDA
14
V V
Cycles
µs
N
CONV8
T
CONV8
REC
I
REF
I
REF
12
6
--20µs
- - 0.750 mA
- - 0.375 mA
-26 13
Cycles
µs
Three factors - source resistance, source capacitance and current injection - have an influence on the accuracy of the ATD.
A.2.2.1 Source Resistance
Due to the input pin leakage current as specified in Table A-6 in conjunction with the source resistance there will be a voltage drop from the signal source to the ATD input. The maximum source resistance R
S
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specifies results in an error of less than 1/2 LSB (2.5mV) at the maximum leakage current. If device or operatingconditionsare less thanworstcase or leakage-inducederror is acceptable,largervalues of source resistance is allowed.
A.2.2.2 Source Capacitance
When sampling an additional internal capacitor is switched to the input. This can cause a voltage drop due to charge sharing with the external and the pin capacitance. For a maximum sampling error of the input voltage 1LSB, then the external filter capacitor, C
1024 * (C
f
INS
- C
INN
).
A.2.2.3 Current Injection
There are two cases to consider.
1. A current is injected into the channel being converted. The channel being stressed has conversion values of$3FF($FF in 8-bit mode) for analoginputsgreater than V
unless the current is higher than specified as disruptive condition.
V
RL
and $000forvalues less than
RH
2. Current is injected into pins in the neighborhood of the channel being converted. A portion of this current is picked up by the channel (coupling ratio K), This additional current impacts the accuracy of the conversion depending on the source resistance. The additional input voltage error on the converted channel can be calculated as V I
INJ
, with I
being the sum of the currents injected into the two pins adjacent to the converted
INJ
ERR
channel.
=K*RS*
Table A-9 ATD Electrical Characteristics
Conditions are shown in Table A-4 unless otherwise noted
Num C Rating Symbol Min Typ Max Unit
1 C Max input Source Resistance
Total Input Capacitance
2T
3 C Disruptive Analog Input Current 4 C Coupling Ratio positive current injection 5 C Coupling Ratio negative current injection
Non Sampling Sampling
R
S
C
INN
C
INS
I
NA
K
p
K
n
--1K
--1022pF
-2.5 - 2.5 mA
--
--
10 10
-4
-2
A/A A/A
96
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A.2.3 ATD accuracy
Table A-10 specifies the ATD conversion performance excluding any errors due to current injection,
input capacitance and source resistance.
Table A-10 ATD Conversion Performance
Conditions are shown in Table A-4 unless otherwise noted V
= VRH - VRL = 5.12V. Resulting to one 8 bit count = 20mV and one 10 bit count = 5mV
REF
f
ATDCLK
Num C Rating Symbol Min Typ Max Unit
= 2.0MHz
1 P 10-Bit Resolution LSB - 5 - mV 2 P 10-Bit Differential Nonlinearity DNL –1 - 1 Counts 3 P 10-Bit Integral Nonlinearity INL –2.5 ±1.5 2.5 Counts
4P 5 P 8-Bit Resolution LSB - 20 - mV
6 P 8-Bit Differential Nonlinearity DNL –0.5 - 0.5 Counts
10-Bit Absolute Error
1
AE -3 ±2.0 3 Counts
7 P 8-Bit Integral Nonlinearity INL –1.0 ±0.5 1.0 Counts 8P
NOTES:
1. These values include the quantization error which is inherently 1/2 count for any A/D converter.
8-Bit Absolute Error
(1)
AE -1.5 ±1.0 1.5 Counts
For the following definitions see also Figure A-1. Differential Non-Linearity (DNL) is defined as the difference between two adjacent switching steps.
V
V
i
DNL i()
------------------------
i1
1=
1LSB
The Integral Non-Linearity (INL) is defined as the sum of all DNLs:
n
INL n() DNL i()
V
------------------- -
V
n
1LSB
0
n==
i1=
97
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DNL
$3FF
$3FE
$3FD
$3FC
$3FB
$3FA
$3F9
$3F8
$3F7
$3F6
$3F5
$3F4
$3F3
9
8
10-Bit Resolution
7
6
5
4
3
2
1
0
5
10 15 20 25 30 35 40 5085 5090 5095 5100 5105 5110 5115 51205065 5070 5075 50805060
V
i-1
LSB
10-Bit Absolute Error Boundary
V
i
8-Bit Absolute Error Boundary
Ideal Transfer Curve
10-Bit Transfer Curve
8-Bit Transfer Curve
45
5055
$FF
$FE
$FD
2
8-Bit Resolution
1
Vin mV
NOTE: Figure A-1
98
Figure A-1 ATD Accuracy Definitions
shows only definitions, for specification values refer to
Table A-10
.
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A.3 NVM, Flash and EEPROM
MC9S12DP512 Device Guide V01.23
NOTE:
Unless otherwise noted the abbreviation NVM (Non Volatile Memory) is used for both Flash and EEPROM.
A.3.1 NVM timing
The time base for all NVM program or erase operations is derived from the oscillator. A minimum oscillator frequency f do not have any means to monitor the frequency and will not prevent program or erase operation at frequencies above or below the specified minimum. Attempting to program or erase the NVM modules at a lower frequency a full program or erase transition is not assured.
The Flash and EEPROM program and erase operations are timed using a clock derived fromtheoscillator using the FCLKDIV and ECLKDIV registers respectively. Thefrequency of this clock must be set within the limits specified as f
The minimum program and erase times shown in Table A-11 are calculated for maximum f maximum f
. The maximum times are calculated for minimum f
bus
NVMOSC
NVMOP
is required for performing program or erase operations. The NVM modules
.
NVMOP
and a f
of 2MHz.
bus
A.3.1.1 Single Word Programming
The programming time for single word programming is dependant on the bus frequency as a well as on the frequency f
A.3.1.2 Row Programming
NVMOP
and can be calculated according to the following formula.
t
swpgm
9
1
25
--------------------­f
NVMOP
+=
1
---------­f
bus
This applies onlytothe Flash where up to 64 wordsinarow can be programmed consecutively by keeping the command pipeline filled. The time to program a consecutive word can be calculated as:
t
bwpgm
4
1
9
--------------------­f
NVMOP
+=
1
---------­f
bus
NVMOP
and
The time to program a whole row is:
Row programming is more than 2 times faster than single word programming.
A.3.1.3 Sector Erase
Erasing a 1024 byte Flash sector or a 4 byte EEPROM sector takes:
t
brpgm
t
swpgm
63 t
+=
bwpgm
1
t
era
4000
--------------------­f
NVMOP
99
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The setup time can be ignored for this operation.
A.3.1.4 Mass Erase
Erasing a NVM block takes:
1
t
mass
The setup time can be ignored for this operation.
A.3.1.5 Blank Check
The time it takes to perform a blank check on the Flash or EEPROM is dependant on the location of the first non-blank word starting at relative address zero. Ittakes one bus cycle per word to verify plus a setup of the command.
20000
--------------------­f
NVMOP
t
check
location t
cyc
10 t
+
cyc
Table A-11 NVM Timing Characteristics
Conditions are shown in Table A-4 unless otherwise noted
Num C Rating Symbol Min Typ Max Unit
1 D External Oscillator Clock 2 D Bus frequency for Programming or Erase Operations 3 D Operating Frequency 4 P Single Word Programming Time 5D 6D 7 P Sector Erase Time 8 P Mass Erase Time 9 D Blank Check Time Flash per block
10 D Blank Check Time EEPROM per block
NOTES:
1. Restrictions for oscillator in crystal mode apply!
2.Minimum Programmingtimes areachieved undermaximum NVMoperating frequencyf
3. Maximum Erase and Programming times are achieved under particular combinations of f
4. Row Programming operations are not applicable to EEPROM
5. Minimum Erase times are achieved under maximum NVM operating frequency f
6. Minimum time, if first word in the array is not blank
7. Maximum time to complete check on an erased block
Flash Row Programming consecutive word Flash Row Programming Time for 64 Words
f
.
bus
Refer to formulae in Sections Section A.3.1.1 Single Word Programming- Section A.3.1.4 Mass Erasefor guidance.
4
(4)
f
NVMOSC
f
NVMBUS
f
NVMOP
t
swpgm
t
bwpgm
t
brpgm
t
era
t
mass
t
check
t
check
0.5 ­1 - - MHz
150 - 200 kHz
46
20.4
1331.2 20
100
11
11
NVMOP
2
(2)
(2)
5
(5)
6
(6)
NVMOP
-
-
-
-
-
-
-
andmaximum busfrequency
and bus frequency f
NVMOP
.
50
74.5 31
2027.5
26.7 133
65546 2058
(3)
1
(3)
(3)
(7)
MHz
3
(3)
7
bus
µs µs µs
ms ms
t
cyc
t
cyc
.
100
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