Datasheet MC74VHCT14ADT, MC74VHCT14ADTR2, MC74VHCT14AD, MC74VHCT14ADR2 Datasheet (MOTOROLA)

Page 1

SEMICONDUCTOR TECHNICAL DATA
  
The MC74VHCT14A is an advanced high speed CMOS Schmitt inverter fabricated with silicon gate CMOS technology. It achieves high speed operation similar to equivalent Bipolar Schottky TTL while maintaining CMOS low power dissipation.
Pin configuration and function are the same as the MC74VHCT04A, but the inputs have hysteresis and, with its Schmitt trigger function, the VHCT14A can be used as a line receiver which will receive slow input signals.
The VHCT inputs are compatible with TTL levels. This device can be used as a level converter for interfacing 3.3V to 5.0V , because it has full 5V CMOS level output swings.
The VHCT14A input structures provide protection when voltages between 0V and 5.5V are applied, regardless of the supply voltage. The output structures also provide protection when VCC = 0V. These input and output structures help prevent device destruction caused by supply voltage – input/output voltage mismatch, battery backup, hot insertion, etc.
The internal circuit is composed of three stages, including a buffer output which provides high noise immunity and stable output. The inputs tolerate voltages up to 7V, allowing the interface of 5V systems to 3V systems.
High Speed: tPD = 5.5ns (Typ) at VCC = 5V
Low Power Dissipation: ICC = 2µA (Max) at TA = 25°C
TTL–Compatible Inputs: VIL = 0.8V; VIH = 2.0V
Power Down Protection Provided on Inputs
Balanced Propagation Delays
Designed for 2V to 5.5V Operating Range
Low Noise: V
Pin and Function Compatible with Other Standard Logic Families
Latchup Performance Exceeds 300mA
ESD Performance: HBM > 2000V; Machine Model > 200V
Chip Complexity: 60 FETs or 15 Equivalent Gates
LOGIC DIAGRAM
1
= 0.8V (Max)
OLP
2
Y1A1

D SUFFIX
14–LEAD SOIC PACKAGE
CASE 751A–03
14–LEAD TSSOP PACKAGE
14–LEAD SOIC EIAJ PACKAGE
MC74VHCTXXAD MC74VHCTXXADT MC74VHCTXXAM
DT SUFFIX
CASE 948G–01
M SUFFIX
CASE 965–01
ORDERING INFORMATION
SOIC TSSOP SOIC EIAJ
FUNCTION TABLE
Inputs Outputs
A
L
H
Y
H
L
3
A2
5
A3
9
A4
11
A5
13
A6
4/99
Motorola, Inc. 1999
10
12
4
Y2
Pinout: 14–Lead Packages (Top View)
6
Y3
Y = A
8
Y4
Y5
Y6
1
VCCA6 Y6
1314 12 11 10 9 8
21 34567
A1 Y1 A2 Y2 A3 Y3 GND
A5 Y5 A4 Y4
REV 0
Page 2
MC74VHCT14A
Î
Î
Î
Î
V
CC
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
OH
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
MAXIMUM RATINGS*
Symbol
V
V
I I I
Î
T
DC Supply Voltage
CC
V
DC Input Voltage
in
DC Output Voltage
out
I
Input Diode Current
IK
Output Diode Current
OK
DC Output Current, per Pin
out
DC Supply Current, VCC and GND Pins
CC
P
Power Dissipation in Still Air, SOIC Packages†
D
ОООООООООООО
Storage Temperature
stg
* Absolute maximum continuous ratings are those values beyond which damage to the device may occur. Exposure to these conditions or conditions
beyond those indicated may adversely affect device reliability. Functional operation under absolute–maximum–rated conditions is not implied. †Derating — SOIC Packages: – 7 mW/_C from 65_ to 125_C
TSSOP Package: – 6.1 mW/_C from 65_ to 125_C
RECOMMENDED OPERATING CONDITIONS
Symbol
V
V
V
T
DC Supply Voltage
CC
DC Input Voltage
in
DC Output Voltage
out
Operating Temperature, All Package Types
A
DC ELECTRICAL CHARACTERISTICS
Symbol
V
T+
Î
V
T–
Î
V
H
Î
V
OH
Î
Positive Threshold Voltage
ОООООО
Negative Threshold Voltage
ОООООО
Hysteresis Voltage
ОООООО
Minimum High–Level Output Voltage
ОООООО
IOH = –50µA
Parameter
Parameter
Parameter
– 0.5 to + 7.0 – 0.5 to + 7.0
– 0.5 to VCC + 0.5
TSSOP Package†
ÎÎÎÎ
– 65 to + 150
V
Test Conditions
V
3.0
ОООООÎÎ
4.5
5.5
3.0
ОООООÎÎ
4.5
6.0
3.0
ОООООÎÎ
VIN = VIH or V IOH = – 50µA
ООООО
IL
4.5
5.5
2.0
3.0
Î
4.5
Value
– 20
± 20 ± 25 ± 50
500 450
Min
Max
4.5
5.5
0
5.5
0
V
CC
– 40
+ 85
TA = 25°C
Min
Typ
ÎÎÎÎÎ
0.35
0.5
Î
ÎÎÎÎÎ
0.6
0.30
0.40
Î
Î
0.50
1.9
2.9
4.4
ÎÎÎ
2.0
3.0
Î
4.5
Unit
V V
V mA mA mA mA
mW
Î
_
C
Unit
V
V
V
_
C
circuitry to guard against damage due to high static voltages or electric fields. However, precautions must be taken to avoid applications of any voltage higher than maximum rated voltages to this high–impedance cir­cuit. For proper operation, Vin and V range GND v (Vin or V
tied to an appropriate logic voltage level (e.g., either GND or VCC). Unused outputs must be left open.
TA 85°C
Max
Min
1.7
2.0
ÎÎÎ
2.0
0.35
0.5
0.6
1.20
0.30
1.40
0.40
1.60
Î
0.50
1.9
ÎÎÎ
2.9
4.4
This device contains protection
should be constrained to the
out
Unused inputs must always be
) v VCC.
out
TA 125°C
Max
1.6
2.0
2.0
Min
Max
1.6
ÎÎÎ
2.0
2.0
0.35
ÎÎÎ
1.20
1.40
Î
1.60
0.5
0.6
0.30
0.40
Î
0.50
ÎÎÎ
1.20
1.40
Î
1.60
1.9
ÎÎÎ
2.9
ÎÎÎ
4.4
Unit
V
Î
V
V
Î
V
Î
Î
V
Î
Î
ÎÎООООООÎООООО
I
Î
I
CCT
I
OPD
MOTOROLA VHC Data – Advanced CMOS Logic
ОООООО
ОООООО
Maximum Low–Level
OL
ОООООО
Output Voltage
ОООООО
I
Maximum Input Leakage
IN
Current Maximum Quiescent Supply
CC
ОООООО
Current Quiescent Supply Current Output Leakage Current
ООООО
IOH = – 4mA IOH = – 8mA
ООООО
VIN = VIH or V
ООООО
IOL = 50µA
ООООО
IOL = 4mA IOL = 8mA
VIN = 5.5V or GND
VIN = VCC or GND
ООООО
Input: VIN = 3.4V V
= 5.5V
OUT
Î
Î
IL
Î
Î
Î
0 to 5.5
Î
Î
4.5
5.5
2.0
3.0
4.5
2.58
3.94
Î
Î
Î
4.5
5.5
ÎÎÎÎÎ
5.5
ÎÎÎÎÎ
5.5
0.0
Î
Î
0.0
Î
0.0
0.0
Î
Î
Î
0.1
Î
0.1
0.1
Î
0.36
0.36
± 0.1
2.0
1.35
0.5
Î
2.48
3.80
Î
Î
Î
Î
Î
0.1
Î
0.1
0.1
Î
0.44
0.44
ÎÎÎ
± 1.0
20
ÎÎÎ
1.50
5.0
Î
2.34
3.66
Î
Î
Î
Î
Î
0.1
Î
0.1
0.1
Î
0.52
0.52
ÎÎÎ
± 1.0
40εA
ÎÎÎ
1.65 10
V
µA
mA
µA
Î
Î
Î
Î
Î
2
DL203 — Rev 1
Page 3
MC74VHCT14A
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
AC ELECTRICAL CHARACTERISTICS (Input t
Symbol
t
,
PLH
t
Î
ÎÎООООООÎООООООО
C
Î
Maximum Propagation Delay, A to Y
ОООООО
PHL
Maximum Input
IN
ОООООО
Capacitance
Parameter
VCC = 3.3 ± 0.3 V CL = 15pF
ООООООО
VCC = 5.0 ± 0.5 V CL = 15pF
ОООООООÎÎÎÎ
= tf = 3.0ns)
r
Test Conditions
CL = 50pF
CL = 50pF
TA = 25°C
Min
Typ
8.3
ÎÎÎ
10.8
5.5
ÎÎÎ
7.0 4
Max
12.8
16.3
Î
8.6
10.6
Î
10
Î
TA 85°C
Min
Max
1.0
15.0
1.0
18.5
Î
Î
ÎÎÎ
1.0
1.0
Î
10.0
12.0
Î
10
TA 125°C
Min
Max
1.0
17.0
1.0
20.5
Î
1.0
1.0
Î
ÎÎÎ
Î
11.5
13.5
Î
10ÎpF
Unit
ns
Î
Î
Typical @ 25°C, VCC = 5.0 V
C
Power Dissipation Capacitance (Note 1.)
PD
21
pF
1. CPD is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load. Average operating current can be obtained by the equation: I dynamic power consumption; PD = CPD V
NOISE CHARACTERISTICS (Input t
= tf = 3.0ns, CL = 50pF, VCC = 5.0 V)
r
CC
2
CC(OPR
fin + ICC VCC.
= CPD VCC fin + ICC/6 (per buffer). CPD is used to determine the no–load
)
TA = 25°C
Symbol Characteristic
V V
V
V
OLP OLV
IHD
ILD
Quiet Output Maximum Dynamic V Quiet Output Minimum Dynamic V
OL
OL
Minimum High Level Dynamic Input Voltage 3.5 V Maximum Low Level Dynamic Input Voltage 1.5 V
3.0V
1.5V
A
GND
t
PLH
Y
1.5V
t
PHL
V
OH
V
OL
DEVICE UNDER
TEST
Typ Max
0.4 0.8 V
– 0.4 – 0.8 V
TEST POINT
OUTPUT
CL*
Unit
Figure 1. Switching Waveforms
(a) A Schmitt–Trigger Squares Up Inputs With Slow Rise and Fall Times (b) A Schmitt–Trigger Offers Maximum Noise Immunity
V
H
V
in
V
out
VHC Data – Advanced CMOS Logic DL203 — Rev 1
*Includes all probe and jig capacitance
V
CC
V
T+
V
T–
V
H
V
in
GND
V
OH
V
out
V
OL
Figure 3. T ypical Schmitt–Trigger Applications
3 MOTOROLA
Figure 2. T est Circuit
V
CC
V
T+
V
T–
GND
V
OH
V
OL
Page 4
MC74VHCT14A
1
SEATING PLANE
–A–
G
D 14 PL
0.25 (0.010) T B A
OUTLINE DIMENSIONS
D SUFFIX
PLASTIC SOIC PACKAGE
CASE 751A–03
ISSUE F
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
814
P 7 PL
–B–
M M
7
X 45°
C
R
K
M
S S
B0.25 (0.010)
M
J
3. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION.
F
MILLIMETERS INCHES
MIN MINMAX MAX
DIM
A B C D F G J K M P R
8.75
8.55
4.00
3.80
1.75
1.35
0.49
0.35
1.25
0.40
1.27 BSC 0.050 BSC
0.25
0.19
0.25
0.10 7
0
°
°
5.80
6.20
0.25
0.50
0.337
0.150
0.054
0.014
0.016
0.008
0.004
0.228
0.010
0.344
0.157
0.068
0.019
0.049
0.009
0.009 7
0
°
°
0.244
0.019
MOTOROLA VHC Data – Advanced CMOS Logic
4
DL203 — Rev 1
Page 5
OUTLINE DIMENSIONS
DT SUFFIX
PLASTIC TSSOP PACKAGE
CASE 948G–01
ISSUE O
MC74VHCT14A
0.10 (0.004)
SEATING
–T–
PLANE
14X REFK
S
U
T
S
N
0.25 (0.010)
U0.15 (0.006) T
S
2X L/2
0.10 (0.004) V
14
M
8
M
L
PIN 1 IDENT.
1
S
U0.15 (0.006) T
A
–V–
B
–U–
N
F
7
DETAIL E
K
K1
J
J1
SECTION N–N
C
D
G
H
DETAIL E
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. MOLD FLASH OR GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED
0.25 (0.010) PER SIDE.
5. DIMENSION K DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE K DIMENSION AT MAXIMUM MATERIAL CONDITION.
6. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY.
7. DIMENSION A AND B ARE TO BE DETERMINED AT DATUM PLANE –W–.
INCHESMILLIMETERS
–W–
DIM MIN MAX MIN MAX
A 4.90 5.10 0.193 0.200 B 4.30 4.50 0.169 0.177 C ––– 1.20 ––– 0.047 D 0.05 0.15 0.002 0.006 F 0.50 0.75 0.020 0.030 G 0.65 BSC 0.026 BSC H 0.50 0.60 0.020 0.024 J 0.09 0.20 0.004 0.008
J1 0.09 0.16 0.004 0.006
K 0.19 0.30 0.007 0.012
K1 0.19 0.25 0.007 0.010
L 6.40 BSC 0.252 BSC M 0 8 0 8
____
VHC Data – Advanced CMOS Logic DL203 — Rev 1
5 MOTOROLA
Page 6
MC74VHCT14A
14 8
1
Z
e
b
0.13 (0.005)
M
OUTLINE DIMENSIONS
M SUFFIX
PLASTIC SOIC EIAJ PACKAGE
CASE 965–01
ISSUE O
L
E
Q
1
H
E
E
7
D
VIEW P
A
A
1
0.10 (0.004)
_
M
L DETAIL P
c
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS AND ARE MEASURED AT THE PARTING LINE. MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.15 (0.006) PER SIDE.
4. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY.
5. THE LEAD WIDTH DIMENSION (b) DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE LEAD WIDTH DIMENSION AT MAXIMUM MATERIAL CONDITION. DAMBAR CANNOT BE LOCATED ON THE LOWER RADIUS OR THE FOOT. MINIMUM SPACE BETWEEN PROTRUSIONS AND ADJACENT LEAD TO BE 0.46 ( 0.018).
MILLIMETERS
DIM MIN MAX MIN MAX
––– 2.05 ––– 0.081
A
A
0.05 0.20 0.002 0.008
1
0.35 0.50 0.014 0.020
b
0.18 0.27 0.007 0.011
c
9.90 10.50 0.390 0.413
D
5.10 5.45 0.201 0.215
E
1.27 BSC 0.050 BSC
e
H
7.40 8.20 0.291 0.323
E
0.50 0.85 0.020 0.033
0.50 L
1.10 1.50 0.043 0.059
E
0
M
_
Q
0.70 0.90 0.028 0.035
1
––– 1.42 ––– 0.056
Z
10
INCHES
10
0
_
_
_
MOTOROLA VHC Data – Advanced CMOS Logic
6
DL203 — Rev 1
Page 7
NOTES
MC74VHCT14A
VHC Data – Advanced CMOS Logic DL203 — Rev 1
7 MOTOROLA
Page 8
MC74VHCT14A
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MOTOROLA VHC Data – Advanced CMOS Logic
8
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MC74VHCT14A/D
DL203 — Rev 1
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