Page 1
MC74VHC1GT50
Noninverting Buffer /
CMOS Logic Level Shifter
TTL−Compatible Inputs
The MC74VHC1GT50 is a single gate noninverting buffer
fabricated with silicon gate CMOS technology. It achieves high speed
operation similar to equivalent Bipolar Schottky TTL while
maintaining CMOS low power dissipation.
The internal circuit is composed of three stages, including a buffer
output which provides high noise immunity and stable output.
The device input is compatible with TTL−type input thresholds and
the output has a f ull 5 V C MOS l evel o utput s wing. T he input p rotection
circuitry on this device allows overvoltage tolerance on the input,
allowing the device to be used as a logic−level translator from 3 V
CMOS logic to 5 V CMOS Logic or from 1.8 V CMOS logic to 3 V
CMOS Logic while operating at the high−voltage power supply.
The MC74VHC1GT50 input structure provides protection when
voltages up to 7 V are applied, regardless of the supply voltage. This
allows the MC74VHC1GT50 to be used to interface high voltage to
low voltage circuits. The output structures also provide protection
when V
device destruction caused by supply voltage − input/output voltage
mismatch, battery backup, hot insertion, etc.
= 0 V. These input and output structures help prevent
CC
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5
1
SC−88A/SOT−353/SC−70
DF SUFFIX
CASE 419A
5
1
TSOP−5/SOT−23/SC−59
DT SUFFIX
CASE 483
MARKING
DIAGRAMS
5
M
VL M G
G
1
5
VL M G
G
1
Features
• Designed for 1.65 V to 5.5 V
• High Speed: t
= 3.5 ns (Typ) at VCC = 5 V
PD
• Low Power Dissipation: I
• TTL−Compatible Inputs: V
• CMOS−Compatible Outputs: V
Operation
CC
= 1 mA (Max) at TA = 25°C
CC
= 0.8 V; VIH = 2.0 V, VCC = 5 V
IL
> 0.8 VCC; VOL < 0.1 VCC @Load
OH
• Power Down Protection Provided on Inputs and Outputs
• Balanced Propagation Delays
• Pin and Function Compatible with Other Standard Logic Families
• Chip Complexity: FETs = 104; Equivalent Gates = 26
• Pb−Free Packages are Available
5
NC
1
2
IN A
34
Figure 1. Pinout (Top View)
V
CC
OUT YGND
VL = Device Code
M = Date Code*
G = Pb−Free Package
(Note: Microdot may be in either location)
*Date Code orientation and/or position may vary
depending upon manufacturing location.
PIN ASSIGNMENT
1
2
3 GND
4
5V
FUNCTION TABLE
A Input Y Output
L
H
NC
IN A
OUT Y
CC
L
H
IN A
Figure 2. Logic Symbol
© Semiconductor Components Industries, LLC, 2007
February, 2007 − Rev. 13
1
OUT Y
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 4 of this data sheet.
1 Publication Order Number:
MC74VHC1GT50/D
Page 2
MC74VHC1GT50
MAXIMUM RATINGS
Symbol Characteristics Value Unit
V
V
V
I
I
OUT
I
q
T
V
I
Latchup
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Opera t i n g Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. Tested to EIA/JESD22−A114−A
2. Tested to EIA/JESD22−A115−A
3. Tested to JESD22−C101−A
4. Tested to EIA/JESD78
DC Supply Voltage −0.5 to +7.0 V
CC
DC Input Voltage −0.5 to +7.0 V
IN
DC Output Voltage VCC = 0
OUT
I
Input Diode Current −20 mA
IK
Output Diode Current V
OK
High or Low State
< GND; V
OUT
OUT
> V
CC
−0.5 to 7.0
−0.5 to V
CC
+20 mA
DC Output Current, per Pin +25 mA
DC Supply Current, VCC and GND +50 mA
CC
P
Power dissipation in still air SC−88A, TSOP−5 200 mW
D
Thermal resistance SC−88A, TSOP−5 333 °C/W
JA
T
Lead temperature, 1 mm from case for 10 secs 260 °C
L
T
Junction temperature under bias +150 °C
J
Storage temperature −65 to +150 °C
stg
ESD Withstand Voltage Human Body Model (Note 1)
ESD
Machine Model (Note 2)
Charged Device Model (Note 3)
> 2000
> 200
N/A
Latchup Performance Above VCC and Below GND at 125°C (Note 4) ±500 mA
+ 0.5
V
V
RECOMMENDED OPERATING CONDITIONS
Symbol Characteristics Min Max Unit
V
V
V
t
DC Supply Voltage 1.65 5.5 V
CC
DC Input Voltage 0.0 5.5 V
IN
DC Output Voltage VCC = 0
OUT
T
Operating Temperature Range −55 +125 °C
A
, tfInput Rise and Fall Time VCC = 3.3 V ± 0.3 V
r
High or Low State
V
= 5.0 V ± 0.5 V
CC
0.0
0.0
0
0
5.5
V
100
20
CC
ns/V
Device Junction Temperature versus
Time to 0.1% Bond Failures
Junction
Temperature °C
Time, Hours Time, Years
80 1,032,200 117.8
90 419,300 47.9
100 178,700 20.4
110 79,600 9.4
120 37,000 4.2
130 17,800 2.0
140 8,900 1.0
Figure 3. Failure Rate vs. Time Junction Temperature
FAILURE RATE OF PLASTIC = CERAMIC
UNTIL INTERMETALLICS OCCUR
= 130 C°
J
T
J
J
T
T
= 110 C°
= 120 C°
1
NORMALIZED FAILURE RATE
1 10 100
TIME, YEARS
C°
C°
= 80
= 90
= 100 C°
J
T
J
J
T
T
1000
V
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2
Page 3
MC74VHC1GT50
Î
l
Î
Î
DC ELECTRICAL CHARACTERISTICS
V
CC
Symbol Parameter Test Conditions (V) Min Typ Max Min Max Min Max Unit
V
IH
Minimum
High−Level
Input Voltage
1.65 to 2.29
2.3 to 2.99
3.0
4.5
5.5
V
IL
Maximum
Low−Level
Input Voltage
1.65 to 2.29
2.3 to 2.99
3.0
4.5
5.5
OH
OL
I
IN
Minimum
High−Level
Output
Voltage
Maximum
Low−Level
Output
Voltage
Maximum
Input
Leakage
V
= V
IN
IH
IOH = −50 mA
1.65 to 2.99
3.0
4.5
V
= VIH
IN
I
= −4 mA
OH
= −8 mA
I
OH
VIN = V
IL
IOL = 50 mA
3.0
4.5
1.65 to 2.99
3.0
4.5
V
= V
IN
IL
IOL = 4 mA
= 8 mA
I
OL
3.0
4.5
VIN = 5.5 V or GND 0 to
5.5
V
V
Current
Maximum
I
CC
Quiescent
VIN = VCC or GND 5.5 1.0 20 40
Supply
Current
I
CCT
Quiescent
Supply
Input: VIN = 3.4 V 5.5 1.35 1.50 1.65 mA
Current
I
OPD
Output
Leakage
V
= 5.5 V 0.0 0.5 5.0 10
OUT
Current
TA = 25°C TA ≤ 85°C −55 ≤ TA ≤ 125°C
0.50 V
CC
0.45 V
CC
1.4
2.0
2.0
VCC − 0.1
2.9
4.4
2.58
3.94
3.0
4.5
0.0
0.0
0.10 V
0.15 V
0.53
0.8
0.8
0.1
0.1
0.1
0.36
0.36
CC
CC
0.50 V
CC
0.45 V
CC
1.4
2.0
2.0
VCC − 0.1
2.9
4.4
2.48
3.80
0.10 V
0.15 V
0.53
0.8
0.8
0.1
0.1
0.1
0.44
0.44
CC
CC
VCC − 0.1
$0.1 $1.0 $1.0
0.50 V
0.45 V
1.4
2.0
2.0
2.9
4.4
2.34
3.66
CC
CC
0.10 V
0.15 V
0.53
0.8
0.8
0.1
0.1
0.1
0.52
0.52
CC
CC
V
V
V
V
V
V
mA
mA
mA
= 50 pF
= 50 pF
= 50 pF
= 3.0 ns
f
Min
TA = 25°C
Typ
4.5
6.3
3.5
4.3
Max
13.3
19.5
10.0
13.5
6.7
7.7
TA ≤ 85°C
Min
−55 ≤ TA ≤ 125°C
Max
14.5
22.0
11.0
15.0
7.5
8.5
Min
Max
17.5
25.5
13.0
17.5
8.5
9.5
5 10 10 10 pF
Unit
ns
ns
AC ELECTRICAL CHARACTERISTICS C
ÎÎ
Symbo
t
PLH
t
PHL
C
ÎÎÎÎ
,
Maximum
Propagation
Delay, Input A to Y
Maximum Input
IN
Capacitance
Parameter
ОООООООО
Test Conditions
VCC = 1.8 ± 0.15 V CL = 15 pF 16.6 18.0 22.0 ns
VCC = 2.5 ± 0.2 V CL = 15 pF
VCC = 3.3 ± 0.3 V CL = 15 pF
VCC = 5.0 ± 0.5 V CL = 15 pF
= 50 pF, Input tr = t
load
C
C
C
L
L
L
Typical @ 25°C, VCC = 5.0 V
C
Power Dissipation Capacitance (Note 5)
PD
12
pF
5. CPD is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load.
Average operating current can be obtained by the equation: I
power consumption; P
= CPD V
D
2
fin + ICC VCC.
CC
= CPD VCC fin + ICC. CPD is used to determine the no−load dynamic
)
CC(OPR
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3
Page 4
MC74VHC1GT50
A
50%
t
PLH
Y
Figure 4. Switching Waveforms
DEVICE
UNDER
TEST
50% V
CC
TEST POINT
OUTPUT
t
PHL
CL*
V
CC
GND
V
OH
V
OL
*Includes all probe and jig capacitance
Figure 5. Test Circuit
ORDERING INFORMATION
Device Package Shipping
MC74VHC1GT50DFT1 SC−88A / SOT−353 / SC−70
M74VHC1GT50DFT1G SC−88A / SOT−353 / SC−70
(Pb−Free)
MC74VHC1GT50DFT2 SC−88A / SOT−353 / SC−70
M74VHC1GT50DFT2G SC−88A / SOT−353 / SC−70
3000 / Tape & Reel
(Pb−Free)
MC74VHC1GT50DTT1 TSOP−5 / SOT−23 / SC−59
M74VHC1GT50DTT1G TSOP−5 / SOT−23 / SC−59
(Pb−Free)
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
†
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Page 5
MC74VHC1GT50
PACKAGE DIMENSIONS
SC−88A, SOT−353, SC−70
CASE 419A−02
ISSUE J
A
G
45
D
5 PL
−B−
MM
B0.2 (0.008)
S
12 3
N
NOTES:
1. DIMENSIONING AND TOLERANCING
PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. 419A−01 OBSOLETE. NEW STANDARD
419A−02.
4. DIMENSIONS A AND B DO NOT INCLUDE
MOLD FLASH, PROTRUSIONS, OR GATE
BURRS.
INCHES
DIMAMIN MAX MIN MAX
B 1.15 1.350.045 0.053
C 0.80 1.100.031 0.043
D 0.10 0.300.004 0.012
G 0.65 BSC0.026 BSC
H −−− 0.10−−−0.004
J 0.10 0.250.004 0.010
K 0.10 0.300.004 0.012
N 0.20 REF0.008 REF
S 2.00 2.200.079 0.087
MILLIMETERS
1.80 2.200.071 0.087
J
C
H
K
SOLDERING FOOTPRINT*
0.50
0.0197
0.65
0.025
0.65
0.025
0.40
0.0157
1.9
SCALE 20:1
0.0748
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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5
ǒ
inches
mm
Ǔ
Page 6
MC74VHC1GT50
PACKAGE DIMENSIONS
TSOP−5
CASE 483−02
ISSUE G
NOTES:
1. DIMENSIONING AND TOLERANCING PER
NOTE 5
2X
2X
T0.10
T0.20
54
123
L
G
D
0.205XC AB
M
S
B
K
DETAIL Z
A
J
DETAIL Z
C
0.05
H
SEATING
PLANE
T
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES
LEAD FINISH THICKNESS. MINIMUM LEAD
THICKNESS IS THE MINIMUM THICKNESS
OF BASE MATERIAL.
4. DIMENSIONS A AND B DO NOT INCLUDE
MOLD FLASH, PROTRUSIONS, OR GATE
BURRS.
5. OPTIONAL CONSTRUCTION: AN
ADDITIONAL TRIMMED LEAD IS ALLOWED
IN THIS LOCATION. TRIMMED LEAD NOT TO
EXTEND MORE THAN 0.2 FROM BODY.
MILLIMETERS
DIM MIN MAX
A 3.00 BSC
B 1.50 BSC
C 0.90 1.10
D 0.25 0.50
G 0.95 BSC
H 0.01 0.10
J 0.10 0.26
K 0.20 0.60
L 1.25 1.55
M 0 10
__
S 2.50 3.00
SOLDERING FOOTPRINT*
1.9
0.95
0.037
1.0
0.039
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
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associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
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0.074
0.028
0.7
2.4
0.094
SCALE 10:1
mm
ǒ
inches
Ǔ
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
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