Datasheet MC74VHC138MEL, MC74VHC138ML1, MC74VHC138ML2, MC74VHC138N, MC74VHC138DTEL Datasheet (MOTOROLA)
...Page 1
SEMICONDUCTOR TECHNICAL DATA
1
REV 1
Motorola, Inc. 1997
6/97
The MC74VHC138 is an advanced high speed CMOS 3–to–8 decoder
fabricated with silicon gate CMOS technology. It achieves high speed
operation similar to equivalent Bipolar Schottky TTL while maintaining
CMOS low power dissipation.
When the device is enabled, three Binary Select inputs (A0 – A2)
determine which one of the outputs (Y0
– Y7) will go Low. When enable input
E3 is held Low or either E2
or E1 is held High, decoding function is inhibited
and all outputs go high. E3, E2
, and E1 inputs are provided to ease cascade
connection and for use as an address decoder for memory systems.
The internal circuit is composed of three stages, including a buffer output
which provides high noise immunity and stable output. The inputs tolerate
voltages up to 7V, allowing the interface of 5V systems to 3V systems.
• High Speed: tPD = 5.7ns (Typ) at VCC = 5V
• Low Power Dissipation: ICC = 4µA (Max) at TA = 25°C
• High Noise Immunity: V
NIH
= V
NIL
= 28% V
CC
• Power Down Protection Provided on Inputs
• Balanced Propagation Delays
• Designed for 2V to 5.5V Operating Range
• Low Noise: V
OLP
= 0.8 V (Max)
• Pin and Function Compatible with Other Standard Logic Families
• Latchup Performance Exceeds 300mA
• ESD Performance: HBM > 2000V; Machine Model > 200V
• Chip Complexity: 122 FETs or 30.5 Equivalent Gates
7
Y6
Y5
Y4
Y3
Y2
Y1
Y0
Y7
9
10
11
12
13
14
15
3
2
1
E3
E2
A0
A1
A2
ACTIVE–LOW
OUTPUTS
SELECT
INPUTS
E1
ENABLE
INPUTS
4
5
6
Inputs Outputs
E3 E2
E1 A2 A1 A0 Y0 Y1 Y2 Y3 Y4 Y5 Y6 Y7
X X H XXXHHHHHHHH
X H X XXXHHHHHHHH
L X X XXXHHHHHHHH
H L L LLLLHHHHHHH
H L L LLHHLHHHHHH
H L L LHLHHLHHHHH
H L L LHHHHHLHHHH
H L L HLLHHHHLHHH
H L L HLHHHHHHLHH
H L L HHLHHHHHHLH
H L L HHHHHHHHHHL
FUNCTION TABLE
H = high level (steady state); L = low level (steady state);
X = don’t care
LOGIC DIAGRAM
PIN ASSIGNMENT
13
14
15
16
9
10
11
12
5
4
3
2
1
8
7
6
A0
E1
A2
A1
Y7
E3
E2
GND
Y3
Y2
Y1
Y0
V
CC
Y5
Y4
Y6
D SUFFIX
16–LEAD SOIC PACKAGE
CASE 751B–05
DT SUFFIX
16–LEAD TSSOP PACKAGE
CASE 948F–01
ORDERING INFORMATION
MC74VHCXXXD
MC74VHCXXXDT
MC74VHCXXXM
SOIC
TSSOP
SOIC EIAJ
M SUFFIX
16–LEAD SOIC EIAJ PACKAGE
CASE 966–01
Page 2
MC74VHC138
MOTOROLA VHC Data – Advanced CMOS Logic
DL203 — Rev 1
2
A0
A1
A2
E2
E1
E3
1
2
3
4
5
6
15
14
13
12
11
10
9
7
Y1
Y2
Y3
Y4
Y5
Y6
Y7
Y0
EXPANDED LOGIC DIAGRAM
Page 3
MC74VHC138
VHC Data – Advanced CMOS Logic
DL203 — Rev 1
3 MOTOROLA
MAXIMUM RATINGS*
Symbol
Parameter
Value
Unit
V
CC
DC Supply Voltage
– 0.5 to + 7.0
V
V
in
DC Input Voltage
– 0.5 to + 7.0
V
V
out
DC Output Voltage
– 0.5 to VCC + 0.5
V
I
IK
Input Diode Current
– 20
mA
I
OK
Output Diode Current
± 20
mA
I
out
DC Output Current, per Pin
± 25
mA
I
CC
DC Supply Current, VCC and GND Pins
± 75
mA
Î
Î
P
D
ОООООООООООО
Î
Power Dissipation in Still Air, SOIC Packages†
TSSOP Package†
ÎÎÎÎ
Î
500
450
Î
Î
mW
T
stg
Storage Temperature
– 65 to + 150
_
C
* Absolute maximum continuous ratings are those values beyond which damage to the device
may occur. Exposure to these conditions or conditions beyond those indicated may adversely
affect device reliability . Functional operation under absolute–maximum–rated conditions is not
implied.
†Derating — SOIC Packages: – 7 mW/_C from 65_ to 125_C
TSSOP Package: – 6.1 mW/_C from 65_ to 125_C
RECOMMENDED OPERATING CONDITIONS
Symbol
Parameter
Min
Max
Unit
V
CC
DC Supply Voltage
2.0
5.5
V
V
in
DC Input Voltage
0
5.5
V
V
out
DC Output Voltage
0
V
CC
V
T
A
Operating Temperature
– 40
+ 85
_
C
tr, t
f
Input Rise and Fall Time VCC = 3.3V ±0.3V
VCC =5.0V ±0.5V00
10020ns/V
DC ELECTRICAL CHARACTERISTICS
ÎÎÎ
V
TA = 25°C
TA = – 40 to 85°C
Symbol
Parameter
Test Conditions
ÎÎÎ
V
CC
V
Min
Typ
Max
Min
Max
Unit
ÎÎ
Î
V
IH
ÎÎÎÎ
Î
Minimum High–Level
Input Voltage
ОООООО
Î
ÎÎÎ
ÎÎ
Î
2.0
3.0 to
5.5
ÎÎ
Î
1.50
VCC x 0.7
ÎÎÎÎÎÎÎ
Î
1.50
VCC x 0.7
ÎÎ
Î
V
ÎÎ
Î
ÎÎ
Î
V
IL
ÎÎÎÎ
Î
ÎÎÎÎ
Î
Maximum Low–Level
Input Voltage
ОООООО
Î
ОООООО
Î
ÎÎÎ
ÎÎ
Î
ÎÎ
Î
2.0
3.0 to
5.5
ÎÎ
Î
ÎÎ
Î
Î
Î
Î
Î
ÎÎ
Î
ÎÎ
Î
0.50
VCC x 0.3
ÎÎ
Î
ÎÎ
Î
ÎÎ
Î
ÎÎ
Î
0.50
VCC x 0.3
V
ÎÎ
Î
ÎÎ
Î
V
OH
ÎÎÎÎ
Î
ÎÎÎÎ
Î
Minimum High–Level
Output Voltage
ОООООО
Î
ОООООО
Î
Vin = VIH or V
IL
IOH = – 50µ
A
ÎÎÎ
ÎÎ
Î
ÎÎ
Î
2.0
3.0
4.5
ÎÎ
Î
ÎÎ
Î
1.9
2.9
4.4
Î
Î
Î
Î
2.0
3.0
4.5
ÎÎ
Î
ÎÎ
Î
ÎÎ
Î
ÎÎ
Î
1.9
2.9
4.4
ÎÎ
Î
ÎÎ
Î
V
ÎÎÎÎÎÎÎÎОООООО
Î
Vin = VIH or V
IL
IOH = – 4mA
IOH = – 8mA
ÎÎÎ
ÎÎ
Î
3.0
4.5
ÎÎ
Î
2.58
3.94
ÎÎÎÎÎÎÎ
Î
2.48
3.80
ÎÎ
Î
ÎÎ
Î
ÎÎ
V
OL
ÎÎÎÎ
Î
ÎÎÎÎ
Maximum Low–Level
Output Voltage
ОООООО
Î
ОООООО
Vin = VIH or V
IL
IOL = 50µA
ÎÎÎ
ÎÎ
Î
ÎÎ
2.0
3.0
4.5
ÎÎ
Î
ÎÎ
Î
Î
Î
0.0
0.0
0.0
ÎÎ
Î
ÎÎ
0.1
0.1
0.1
ÎÎ
Î
ÎÎ
ÎÎ
Î
ÎÎ
0.1
0.1
0.1
V
ÎÎ
Î
ÎÎ
Î
ÎÎÎÎ
Î
ÎÎÎÎ
Î
ОООООО
Î
ОООООО
Î
Vin = VIH or V
IL
IOL = 4mA
IOL = 8mA
ÎÎÎ
ÎÎ
Î
ÎÎ
Î
3.0
4.5
ÎÎ
Î
ÎÎ
Î
Î
Î
Î
Î
ÎÎ
Î
ÎÎ
Î
0.36
0.36
ÎÎ
Î
ÎÎ
Î
ÎÎ
Î
ÎÎ
Î
0.44
0.44
This device contains protection
circuitry to guard against damage
due to high static voltages or electric
fields. However, precautions must
be taken to avoid applications of any
voltage higher than maximum rated
voltages to this high–impedance circuit. For proper operation, Vin and
V
out
should be constrained to the
range GND v (Vin or V
out
) v VCC.
Unused inputs must always be
tied to an appropriate logic voltage
level (e.g., either GND or VCC).
Unused outputs must be left open.
Page 4
MC74VHC138
MOTOROLA VHC Data – Advanced CMOS Logic
DL203 — Rev 1
4
DC ELECTRICAL CHARACTERISTICS
Unit
TA = – 40 to 85°C
TA = 25°C
ÎÎÎ
V
CC
V
Test Conditions
Parameter
Symbol
Unit
Max
Min
Max
Typ
Min
ÎÎÎ
V
CC
V
Test Conditions
Parameter
Symbol
ÎÎ
Î
I
in
ÎÎÎÎ
Î
Maximum Input
Leakage Current
ОООООО
Î
Vin = 5.5 V or GND
ÎÎÎ
ÎÎ
Î
0 to 5.5
ÎÎÎÎÎÎÎ
Î
± 0.1
ÎÎÎÎÎ
Î
± 1.0
µA
ÎÎ
Î
I
CC
ÎÎÎÎ
Î
Maximum Quiescent
Supply Current
ОООООО
Î
Vin = VCC or GND
ÎÎÎ
ÎÎ
Î
5.5
ÎÎÎÎÎÎÎ
Î
4.0
ÎÎÎÎÎ
Î
40.0
µA
AC ELECTRICAL CHARACTERISTICS (Input t
r
= tf = 3.0ns)
TA = 25°C
TA = – 40 to 85°C
Symbol
Parameter
Test Conditions
Min
Typ
Max
Min
Max
Unit
ÎÎ
Î
t
PLH
,
t
PHL
ОООООО
Î
Maximum Propagation Delay,
A to Y
ООООООО
Î
VCC = 3.3 ± 0.3V CL = 15pF
CL = 50pF
ÎÎÎÎ
Î
8.2
10.0
ÎÎ
Î
11.4
15.8
Î
Î
1.0
1.0
ÎÎ
Î
13.5
18.0
ns
ÎÎÎООООООÎООООООО
Î
VCC = 5.0 ± 0.5V CL = 15pF
CL = 50pF
ÎÎÎÎ
Î
5.7
7.2
ÎÎ
Î
8.1
10.1
Î
Î
1.0
1.0
ÎÎ
Î
9.5
11.5
t
PLH
,
t
PHL
Maximum Propagation Delay,
E3 to Y
VCC = 3.3 ± 0.3V CL = 15pF
CL = 50pF
8.1
10.6
12.8
16.3
1.0
1.0
15.0
18.5
ns
ÎÎÎООООООÎООООООО
Î
VCC = 5.0 ± 0.5V CL = 15pF
CL = 50pF
ÎÎÎÎ
Î
5.6
7.1
ÎÎ
Î
8.1
10.1
Î
Î
1.0
1.0
ÎÎ
Î
9.5
11.5
ÎÎ
Î
t
PLH
,
t
PHL
ОООООО
Î
Maximum Propagation Delay,
E2
or E1 to Y
ООООООО
Î
VCC = 3.3 ± 0.3V CL = 15pF
CL = 50pF
ÎÎÎÎ
Î
8.2
10.7
ÎÎ
Î
11.4
14.9
Î
Î
1.0
1.0
ÎÎ
Î
13.5
17.0
ns
VCC = 5.0 ± 0.5V CL = 15pF
CL = 50pF
5.8
7.3
8.1
10.1
1.0
1.0
9.5
11.5
C
in
Maximum Input Capacitance
4
10
10
pF
Typical @ 25°C, VCC = 5.0V
C
PD
Power Dissipation Capacitance (Note 1.)
34
pF
1. CPD is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load.
Average operating current can be obtained by the equation: I
CC(OPR
)
= CPD VCC fin + ICC. CPD is used to determine the no–load dynamic
power consumption; PD = CPD V
CC
2
fin + ICC VCC.
Page 5
MC74VHC138
VHC Data – Advanced CMOS Logic
DL203 — Rev 1
5 MOTOROLA
Figure 1.
50%
t
PHL
t
PLH
V
CC
GND
Figure 2.
VALID VALID
Y 50% V
CC
V
CC
GND
t
PLH
50% V
CC
Y
E3
t
PHL
50%
A
SWITCHING W AVEFORMS
V
CC
GND
t
PHL
t
PLH
Y
E2
or E1
50% V
CC
50%
Figure 3.
*Includes all probe and jig capacitance
Figure 4. Test Circuit
CL*
TEST POINT
DEVICE
UNDER
TEST
OUTPUT
INPUT
Figure 5. Input Equivalent Circuit
Page 6
MC74VHC138
MOTOROLA VHC Data – Advanced CMOS Logic
DL203 — Rev 1
6
OUTLINE DIMENSIONS
0.25 (0.010) T B A
M
S S
MIN MINMAX MAX
MILLIMETERS INCHES
DIM
A
B
C
D
F
G
J
K
M
P
R
9.80
3.80
1.35
0.35
0.40
0.19
0.10
0
°
5.80
0.25
10.00
4.00
1.75
0.49
1.25
0.25
0.25
7
°
6.20
0.50
0.386
0.150
0.054
0.014
0.016
0.008
0.004
0
°
0.229
0.010
0.393
0.157
0.068
0.019
0.049
0.009
0.009
7
°
0.244
0.019
1.27 BSC 0.050 BSC
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
1
8
916
–A
–
–B
–
D 16 PL
K
C
G
–T
–
SEATING
PLANE
R X 45°
M
J
F
P 8 PL
0.25 (0.010) B
M M
D SUFFIX
PLASTIC SOIC PACKAGE
CASE 751B–05
ISSUE J
DT SUFFIX
PLASTIC TSSOP PACKAGE
CASE 948F–01
ISSUE O
ÇÇ
DIM MIN MAX MIN MAX
INCHESMILLIMETERS
A 4.90 5.10 0.193 0.200
B 4.30 4.50 0.169 0.177
C ––– 1.20 ––– 0.047
D 0.05 0.15 0.002 0.006
F 0.50 0.75 0.020 0.030
G 0.65 BSC 0.026 BSC
H 0.18 0.28 0.007 0.011
J 0.09 0.20 0.004 0.008
J1 0.09 0.16 0.004 0.006
K 0.19 0.30 0.007 0.012
K1 0.19 0.25 0.007 0.010
L 6.40 BSC 0.252 BSC
M 0 8 0 8
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD FLASH.
PROTRUSIONS OR GATE BURRS. MOLD FLASH OR
GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER
SIDE.
4. DIMENSION B DOES NOT INCLUDE INTERLEAD
FLASH OR PROTRUSION. INTERLEAD FLASH OR
PROTRUSION SHALL NOT EXCEED
0.25 (0.010) PER SIDE.
5. DIMENSION K DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR PROTRUSION
SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE K
DIMENSION AT MAXIMUM MA TERIAL CONDITION.
6. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
7. DIMENSION A AND B ARE TO BE DETERMINED AT
DATUM PLANE –W–.
____
SECTION N–N
SEATING
PLANE
IDENT.
PIN 1
1
8
16
9
DETAIL E
J
J1
B
C
D
A
K
K1
H
G
DETAIL E
F
M
L
2X L/2
–U–
S
U0.15 (0.006) T
S
U0.15 (0.006) T
S
U
M
0.10 (0.004) V
S
T
0.10 (0.004)
–T–
–V–
–W–
0.25 (0.010)
16X REFK
N
N
Page 7
MC74VHC138
VHC Data – Advanced CMOS Logic
DL203 — Rev 1
7 MOTOROLA
OUTLINE DIMENSIONS
M SUFFIX
PLASTIC SOIC EIAJ PACKAGE
CASE 966–01
ISSUE O
H
E
A
1
DIM MIN MAX MIN MAX
INCHES
––– 2.05 ––– 0.081
MILLIMETERS
0.05 0.20 0.002 0.008
0.35 0.50 0.014 0.020
0.18 0.27 0.007 0.011
9.90 10.50 0.390 0.413
5.10 5.45 0.201 0.215
1.27 BSC 0.050 BSC
7.40 8.20 0.291 0.323
0.50 0.85 0.020 0.033
1.10 1.50 0.043 0.059
0
0.70 0.90 0.028 0.035
––– 0.78 ––– 0.031
A
1
H
E
Q
1
L
E
_
10
_
0
_
10
_
L
E
Q
1
_
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS D AND E DO NOT INCLUDE MOLD
FLASH OR PROTRUSIONS AND ARE MEASURED
AT THE PARTING LINE. MOLD FLASH OR
PROTRUSIONS SHALL NOT EXCEED 0.15 (0.006)
PER SIDE.
4. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
5. THE LEAD WIDTH DIMENSION (b) DOES NOT
INCLUDE DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08 (0.003)
TOTAL IN EXCESS OF THE LEAD WIDTH
DIMENSION AT MAXIMUM MA TERIAL CONDITION.
DAMBAR CANNOT BE LOCATED ON THE LOWER
RADIUS OR THE FOOT. MINIMUM SPACE
BETWEEN PROTRUSIONS AND ADJACENT LEAD
TO BE 0.46 ( 0.018).
M
L
DETAIL P
VIEW P
c
A
b
e
M
0.13 (0.005)
0.10 (0.004)
1
16 9
8
D
Z
E
A
b
c
D
E
e
L
M
Z
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