Datasheet MC74VHC126D, MC74VHC126MEL, MC74VHC126ML1, MC74VHC126ML2, MC74VHC126DTR2 Datasheet (MOTOROLA)

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Page 1
Semiconductor Components Industries, LLC, 2000
April, 2000 – Rev. 1
1 Publication Order Number:
MC74VHC126/D
MC74VHC126
Quad Bus Buffer
with 3–State Control Inputs
The MC74VHC126 is a high speed CMOS quad bus buffer fabricated with silicon gate CMOS technology. It achieves noninverting high speed operation similar to equivalent Bipolar Schottky TTL while maintaining CMOS low power dissipation.
The MC74VHC126 requires the 3–state control input (OE) to be set Low to place the output into high impedance.
The internal circuit is composed of three stages, including a buffer output which provides high noise immunity and stable output. The inputs tolerate voltages up to 7V, allowing the interface of 5V systems to 3V systems.
High Speed: t
PD
= 3.8ns (Typ) at VCC = 5V
Low Power Dissipation: I
CC
= 4µA (Max) at TA = 25°C
High Noise Immunity: V
NIH
= V
NIL
= 28% V
CC
Power Down Protection Provided on Inputs
Balanced Propagation Delays
Designed for 2V to 5.5V Operating Range
Low Noise: V
OLP
= 0.8V (Max)
Pin and Function Compatible with Other Standard Logic Families
Latchup Performance Exceeds 300mA
ESD Performance: HBM > 2000V ; Machine Model > 200V
Chip Complexity: 72 FETs or 18 Equivalent Gates
LOGIC DIAGRAM
Active–High Output Enables
FUNCTION TABLE
VHC126
Inputs Output
AOE Y
HH H LH L XL Z
Y1
Y2
Y4
3
6
8
11
13
12
10
9
4
5
1
2
A1
OE1
A2
OE2
A3
OE3
A4
OE4
Y3
14–LEAD SOIC
D SUFFIX
CASE 751A
http://onsemi.com
14–LEAD TSSOP
DT SUFFIX
CASE 948G
PIN CONNECTION AND
MARKING DIAGRAM (Top View)
Device Package Shipping
ORDERING INFORMATION
MC74VHC126D SOIC 55 Units/Rail MC74VHC126DT TSSOP
96 Units/Rail
14–LEAD SOIC EIAJ
M SUFFIX CASE 965
MC74VHC126M SOIC EIAJ
50 Units/Rail
For detailed package marking information, see the Marking Diagram section on page 5 of this data sheet.
11
12
13
14
8
9
105
4
3
2
1
7
6
OE3
Y4
A4
OE4
V
CC
Y3
A3
OE2
Y1
A1
OE1
GND
Y2
A2
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MAXIMUM RATINGS*
Symbol
Parameter
Value
Unit
V
CC
DC Supply Voltage
– 0.5 to + 7.0
V
V
in
DC Input Voltage
– 0.5 to + 7.0
V
V
out
DC Output Voltage
– 0.5 to VCC + 0.5
V
I
IK
Input Diode Current
– 20
mA
I
OK
Output Diode Current
± 20
mA
I
out
DC Output Current, per Pin
± 25
mA
I
CC
DC Supply Current, VCC and GND Pins
± 50
mA
ÎÎ
Î
P
D
ОООООООООООО
Î
Power Dissipation in Still Air, SOIC Packages†
TSSOP Package†
ÎÎÎ
Î
500 450
Î
Î
mW
T
stg
Storage Temperature
– 65 to + 150
_
C
* Absolute maximum continuous ratings are those values beyond which damage to the device
may occur. Exposure to these conditions or conditions beyond those indicated may
adversely affect device reliability. Functional operation under absolute–maximum–rated
conditions is not implied. †Derating — SOIC Packages: – 7 mW/_C from 65_ to 125_C
TSSOP Package: – 6.1 mW/_C from 65_ to 125_C
RECOMMENDED OPERATING CONDITIONS
Symbol
Parameter
Min
ÎÎ
Max
Unit
V
CC
DC Supply Voltage
2.0
ÎÎ
5.5
V
V
in
DC Input Voltage
0
ÎÎ
5.5
V
V
out
DC Output Voltage
0
ÎÎ
V
CC
V
T
A
Operating Temperature, All Package Types
– 40
ÎÎ
+ 85
_
C
tr, t
f
Input Rise and Fall Time VCC = 3.3V ±0.3V
VCC =5.0V ±0.5V00
ÎÎ
10020ns/V
DC ELECTRICAL CHARACTERISTICS
V
CC
TA = 25°C TA 85°C TA 125°C
Symbol Parameter Test Conditions (V) Min Typ Max Min Max Min Max Unit
V
IH
Minimum High–Level Input Voltage
2.0
3.0
4.5
5.5
1.5
2.1
3.15
3.85
1.5
2.1
3.15
3.85
1.5
2.1
3.15
3.85
V
V
IL
Maximum Low–Level Input Voltage
2.0
3.0
4.5
5.5
0.5
0.9
1.35
1.65
0.5
0.9
1.35
1.65
0.5
0.9
1.35
1.65
V
V
OH
Minimum High–Level Output Voltage VIN = VIH or V
IL
VIN = VIH or V
IL
IOH = –50µA
2.0
3.0
4.5
1.9
2.9
4.4
2.0
3.0
4.5
1.9
2.9
4.4
1.9
2.9
4.4
V
VIN = VIH or V
IL
IOH = –4mA IOH = –8mA
3.0
4.5
2.58
3.94
2.48
3.80
2.34
3.66
V
V
OL
Maximum Low–Level Output Voltage VIN = VIH or V
IL
VIN = VIH or V
IL
IOL = 50µA
2.0
3.0
4.5
0.0
0.0
0.0
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
V
VIN = VIH or V
IL
IOL = 4mA IOL = 8mA
3.0
4.5
0.36
0.36
0.44
0.44
0.52
0.52
V
I
OZ
Maximum 3–State Leakage Current
VIN = VIH or V
IL
V
OUT
= VCC or GND
5.5 ±0.25 ±2.5 ±2.5 µA
This device contains protection circuitry to guard against damage due to high static voltages or electric fields. However, precautions must be taken to avoid applications of any voltage higher than maximum rated voltages to this high–impedance cir­cuit. For proper operation, Vin and V
out
should be constrained to the
range GND v (Vin or V
out
) v VCC.
Unused inputs must always be tied to an appropriate logic voltage level (e.g., either GND or VCC). Unused outputs must be left open.
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3
I
IN
Maximum Input Leakage Current
VIN = 5.5V or GND 0 to
5.5
±0.1 ±1.0 ±1.0 µA
I
CC
Maximum Quiescent Supply Current
VIN = VCC or GND 5.5 4.0 40 40 µA
AC ELECTRICAL CHARACTERISTICS (Input t
r
= tf = 3.0ns)
TA = 25°C
TA = ≤ 85°C
TA = ≤ 125°C
Symbol
Parameter
Test Conditions
Min
Typ
Max
Min
Max
Min
Max
Unit
ÎÎ
Î
t
PLH
,
t
PHL
ООООО
Î
Maximum Propagation Delay,
ООООООО
Î
VCC = 3.3 ± 0.3V CL = 15pF
CL = 50pF
ÎÎÎ
Î
5.6
8.1
Î
Î
8.0
11.5
Î
Î
1.0
1.0
Î
Î
9.5
13.0
Î
Î
1.0
1.0
Î
Î
12.0
15.0
ns
A to Y
VCC = 5.0 ± 0.5V CL = 15pF
CL = 50pF
3.8
5.3
5.5
7.5
1.0
1.0
6.5
8.5
1.0
1.0
8.5
10.5
ÎÎ
Î
t
PZL
,
t
PZH
ООООО
Î
Maximum Output Enable TIme,
ООООООО
Î
VCC = 3.3 ± 0.3V CL = 15pF RL = 1k CL = 50pF
ÎÎÎ
Î
5.4
7.9
Î
Î
8.0
11.5
Î
Î
1.0
1.0
Î
Î
9.5
13.0
Î
Î
1.0
1.0
Î
Î
11.5
15.0
ns
ÎÎÎООООО
Î
OE to Y
ООООООО
Î
VCC = 5.0 ± 0.5V CL = 15pF RL = 1k CL = 50pF
ÎÎÎ
Î
3.6
5.1
Î
Î
5.1
7.1
Î
Î
1.0
1.0
Î
Î
6.0
8.0
Î
Î
1.0
1.0
Î
Î
7.5
9.5
t
PLZ
,
t
PHZ
Maximum Output Disable Time,
VCC = 3.3 ± 0.3V CL = 50pF RL = 1k
9.5
13.2
1.0
15.0
1.0
18.0
ns
ÎÎÎООООО
Î
OE to Y
ООООООО
Î
VCC = 5.0 ± 0.5V CL = 50pF RL = 1k
ÎÎÎ
Î
6.1
Î
Î
8.8
Î
Î
1.0
Î
Î
10.0
Î
Î
1.0
Î
Î
12.0
ÎÎ
Î
t
OSLH
,
t
OSHL
ООООО
Î
Output–to–Output Skew
ООООООО
Î
VCC = 3.3 ± 0.3V CL = 50pF (Note 1.)
ÎÎÎÎÎ
Î
1.5
ÎÎÎ
Î
1.5
ÎÎÎ
Î
1.5
ns
VCC = 5.0 ± 0.5V CL = 50pF (Note 1.)
1.0
1.0
1.0
ÎÎ
Î
C
in
ООООО
Î
Maximum Input Capacitance
ОООООООÎÎÎÎ
Î
4
Î
Î
10
ÎÎÎ
Î
10
ÎÎÎ
Î
10
pF
ÎÎ
Î
ÎÎ
Î
C
out
ООООО
Î
ООООО
Î
Maximum Three–State Output Capacitance (Output in High Impedance State)
ООООООО
Î
ООООООО
Î
Î
Î
Î
Î
Î
Î
Î
Î
6
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
pF
Typical @ 25°C, VCC = 5.0V
C
PD
Power Dissipation Capacitance (Note 2.)
15
pF
1. Parameter guaranteed by design. t
OSLH
= |t
PLHm
– t
PLHn
|, t
OSHL
= |t
PHLm
– t
PHLn
|.
2. CPD is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load. Average operating current can be obtained by the equation: I
CC(OPR
)
= CPD VCC fin + ICC/4 (per buf fer). CPD is used to determine the
no–load dynamic power consumption; PD = CPD V
CC
2
fin + ICC VCC.
NOISE CHARACTERISTICS (Input t
r
= tf = 3.0ns, CL = 50pF, VCC = 5.0V)
TA = 25°C
Symbol Characteristic
Typ Max
Unit
V
OLP
Quiet Output Maximum Dynamic V
OL
0.3 0.8 V
V
OLV
Quiet Output Minimum Dynamic V
OL
– 0.3 – 0.8 V
V
IHD
Minimum High Level Dynamic Input Voltage 3.5 V
V
ILD
Maximum Low Level Dynamic Input Voltage 1.5 V
Page 4
MC74VHC126
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4
SWITCHING W AVEFORMS
Figure 1. Figure 2.
Y
50%
50% V
CC
50% V
CC
V
CC
GND HIGH
IMPEDANCE
VOL + 0.3V VOH – 0.3V
Y
Y
OE
t
PZLtPLZ
t
PZHtPHZ
*Includes all probe and jig capacitance
CL*
TEST POINT
DEVICE UNDER
TEST
OUTPUT
Figure 3. Test Circuit
*Includes all probe and jig capacitance
Figure 4. Test Circuit
OUTPUT
TEST POINT
CL *
1 k
CONNECT TO VCC WHEN TESTING t
PLZ
AND t
PZL.
CONNECT TO GND WHEN TESTING t
PHZ
AND t
PZH.
DEVICE
UNDER
TEST
HIGH IMPEDANCE
50%
50% V
CC
V
CC
GND
t
PLH
t
PHL
A
Figure 5. Input Equivalent Circuit
INPUT
Page 5
MC74VHC126
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MARKING DIAGRAMS
(Top View)
14–LEAD SOIC
D SUFFIX
CASE 751A
14–LEAD TSSOP
DT SUFFIX
CASE 948G
1314 12 11 10 9 8
21 34567
1314 12 11 10 9 8
21 34567
14–LEAD SOIC EIAJ
M SUFFIX CASE 965
1314 12 11 10 9 8
21 34567
VHC126
VHC
AWLYWW*
126
ALYW*
*See Applications Note #AND8004/D for date code and traceability information.
VHC126
AWLYWW*
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MC74VHC126
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6
P ACKAGE DIMENSIONS
D SUFFIX
PLASTIC SOIC PACKAGE
CASE 751A–03
ISSUE F
MIN MINMAX MAX
MILLIMETERS INCHES
DIM
A B C D F G J K M P R
8.55
3.80
1.35
0.35
0.40
0.19
0.10 0°
5.80
0.25
8.75
4.00
1.75
0.49
1.25
0.25
0.25 7°
6.20
0.50
0.337
0.150
0.054
0.014
0.016
0.008
0.004 0°
0.228
0.010
0.344
0.157
0.068
0.019
0.049
0.009
0.009 7°
0.244
0.019
1.27 BSC 0.050 BSC
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION.
–A–
–B–
P 7 PL
G
C
K
SEATING PLANE
D 14 PL
M
J
R
X 45°
1
7
814
0.25 (0.010) T B A
M
S S
B0.25 (0.010)
M M
F
DT SUFFIX
PLASTIC TSSOP PACKAGE
CASE 948G–01
ISSUE O
DIM MIN MAX MIN MAX
INCHESMILLIMETERS
A 4.90 5.10 0.193 0.200 B 4.30 4.50 0.169 0.177 C ––– 1.20 ––– 0.047 D 0.05 0.15 0.002 0.006 F 0.50 0.75 0.020 0.030 G 0.65 BSC 0.026 BSC H 0.50 0.60 0.020 0.024 J 0.09 0.20 0.004 0.008
J1 0.09 0.16 0.004 0.006
K 0.19 0.30 0.007 0.012
K1 0.19 0.25 0.007 0.010
L 6.40 BSC 0.252 BSC
M 0 8 0 8
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. MOLD FLASH OR GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED
0.25 (0.010) PER SIDE.
5. DIMENSION K DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE K DIMENSION AT MAXIMUM MATERIAL CONDITION.
6. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY.
7. DIMENSION A AND B ARE TO BE DETERMINED AT DATUM PLANE –W–.
____
S
U0.15 (0.006) T
2X L/2
S
U
M
0.10 (0.004) V
S
T
L
–U–
SEATING PLANE
0.10 (0.004)
–T–
SECTION N–N
DETAIL E
J
J1
K
K1
ÉÉ
DETAIL E
F
M
–W–
0.25 (0.010)
8
14
7
1
PIN 1 IDENT.
H
G
A
D
C
B
S
U0.15 (0.006) T
–V–
14X REFK
N
N
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MC74VHC126
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7
P ACKAGE DIMENSIONS
M SUFFIX
PLASTIC SOIC EIAJ PACKAGE
CASE 965–01
ISSUE O
H
E
A
1
DIM MIN MAX MIN MAX
INCHES
––– 2.05 ––– 0.081
MILLIMETERS
0.05 0.20 0.002 0.008
0.35 0.50 0.014 0.020
0.18 0.27 0.007 0.011
9.90 10.50 0.390 0.413
5.10 5.45 0.201 0.215
1.27 BSC 0.050 BSC
7.40 8.20 0.291 0.323
0.50 0.85 0.020 0.033
1.10 1.50 0.043 0.059 0
0.70 0.90 0.028 0.035
––– 1.42 ––– 0.056
A
1
H
E
Q
1
L
E
_
10
_
0
_
10
_
L
E
Q
1
_
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS AND ARE MEASURED AT THE PARTING LINE. MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.15 (0.006) PER SIDE.
4. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY.
5. THE LEAD WIDTH DIMENSION (b) DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE LEAD WIDTH DIMENSION AT MAXIMUM MATERIAL CONDITION. DAMBAR CANNOT BE LOCATED ON THE LOWER RADIUS OR THE FOOT. MINIMUM SPACE BETWEEN PROTRUSIONS AND ADJACENT LEAD TO BE 0.46 ( 0.018).
0.13 (0.005)
M
0.10 (0.004)
D
Z
E
1
14 8
7
e
A
b
VIEW P
c
L DETAIL P
M
A
b c D E e
0.50
M
Z
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8
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without further notice to any products herein. SCILLC makes no warranty , representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability , including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly , any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer .
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