The MC74LVX4066 utilizes silicon–gate CMOS technology to
achieve fast propagation delays, low ON resistances, and low
OFF–channel leakage current. This bilateral
switch/multiplexer/demultiplexer controls analog and digital voltages
that may vary across the full power–supply range (from VCC to GND).
The LVX4066 is identical in pinout to the metal–gate CMOS
MC14066 and the high–speed CMOS HC4066A. Each device has four
independent switches. The device has been designed so that the ON
resistances (RON) are much more linear over input voltage than R
of metal–gate CMOS analog switches.
The ON/OFF control inputs are compatible with standard CMOS
outputs; with pull–up resistors, they are compatible with LSTTL
outputs.
• Fast Switching and Propagation Speeds
• High ON/OFF Output Voltage Ratio
• Low Crosstalk Between Switches
• Diode Protection on All Inputs/Outputs
• Wide Power–Supply Voltage Range (V
• Analog Input Voltage Range (V
CC
– GND) = 2.0 to 6.0 Volts
CC
– GND) = 2.0 to 6.0 Volts
• Improved Linearity and Lower ON Resistance over Input Voltage
than the MC14016 or MC14066
• Low Noise
• Chip Complexity: 44 FET s or 11 Equivalent Gates
LOGIC DIAGRAM
ON
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14–LEAD SOIC
D SUFFIX
CASE 751A
14–LEAD TSSOP
DT SUFFIX
CASE 948G
PIN CONNECTION AND
MARKING DIAGRAM (Top View)
X
Y
Y
X
B ON/OFF
CONTROL
C ON/OFF
CONTROL
GND
For detailed package marking information, see the Marking
Diagram section on page 10 of this data sheet.
1
A
2
A
3
B
4
B
6
7
V
14
13
12
11
105
9
8
CC
A ON/OFF
CONTROL
D ON/OFF
CONTROL
X
D
Y
D
Y
C
X
C
12
X
A
A ON/OFF CONTROL
B ON/OFF CONTROL
C ON/OFF CONTROL
D ON/OFF CONTROL
Semiconductor Components Industries, LLC, 1999
March, 2000 – Rev . 2
13
43
X
B
5
89
X
C
6
1110
X
D
12
Y
A
Y
B
ANALOG
OUTPUTS/INPUTS
Y
C
Y
D
ANALOG INPUTS/OUTPUTS = XA, XB, XC, X
PIN 14 = V
PIN 7 = GND
*Maximum Ratings are those values beyond which damage to the device may occur.
Functional operation should be restricted to the Recommended Operating Conditions.
†Derating — SOIC Package: – 7 mW/_C from 65_ to 125_C
TSSOP Package: – 6.1 mW/_C from 65_ to 125_C
RECOMMENDED OPERATING CONDITIONS
Symbol
V
V
V
VIO*
T
tr, t
ÎÎ
*For voltage drops across the switch greater than 1.2 V (switch on), excessive VCC current may
be drawn; i.e., the current out of the switch may contain both VCC and switch input
components. The reliability of the device will be unaffected unless the Maximum Ratings are
exceeded.
Positive DC Supply Voltage (Referenced to GND)
CC
Analog Input Voltage (Referenced to GND)
IS
Digital Input Voltage (Referenced to GND)
in
Static or Dynamic Voltage Across Switch
Operating Temperature, All Package Types
A
Input Rise and Fall Time, ON/OFF Control
f
Inputs (Figure 10)VCC = 3.3 V ± 0.3 V
ООООООООООООО
Parameter
Parameter
TSSOP Package†
VCC = 5.0 V ± 0.5 V
Value
– 0.5 to + 7.0
– 0.5 to VCC + 0.5
– 0.5 to VCC + 0.5
± 20
± 20
500
450
– 65 to + 150
260
Min
Max
2.0
6.0
GND
V
CC
GND
V
CC
—
1.2
– 55
+ 85
0
100
Î
0
20
Unit
mA
mA
mW
_
_
Unit
_
ns/V
Î
This device contains protection
V
V
V
circuitry to guard against damage
due to high static voltages or electric
fields. However, precautions must
be taken to avoid applications of any
voltage higher than maximum rated
voltages to this high–impedance circuit. For proper operation, Vin and
V
should be constrained to the
out
range GND v (Vin or V
Unused inputs must always be
C
C
tied to an appropriate logic voltage
level (e.g., either GND or VCC).
Unused outputs must be left open.
) v VCC.
out
I/O pins must be connected to a
properly terminated line or bus.
V
V
V
V
C
DC ELECTRICAL CHARACTERISTIC Digital Section(Voltages Referenced to GND)
V
ÎÎ
Symbol
V
ÎÎ
ÎÎ
V
ÎÎ
ÎÎ
I
ÎÎ
ОООООООО
Minimum High–Level Voltage
IH
ON/OFF Control Inputs
ОООООООО
(Note 1)
ОООООООО
Maximum Low–Level Voltage
IL
ON/OFF Control Inputs
ОООООООО
(Note 1)
ОООООООО
I
CC
Maximum Input Leakage Current
in
ON/OFF Control Inputs
Maximum Quiescent Supply
Current (per Package)
ОООООООО
Parameter
ООООО
Test Conditions
Ron = Per Spec
ООООО
ООООО
Ron = Per Spec
ООООО
ООООО
Vin = VCC or GND
Vin = VCC or GND
VIO = 0 V
ООООО
1. Specifications are for design target only. Not final specification limits.
CC
ÎÎÎ
V
2.0
3.0
ÎÎÎ
4.5
5.5
ÎÎÎ
2.0
3.0
ÎÎÎ
4.5
5.5
ÎÎÎ
5.5V
5.5
ÎÎÎ
Guaranteed Limit
– 55 to
ÎÎ
25_C
1.5
2.1
ÎÎ
3.15
3.85
ÎÎ
0.5
0.9
ÎÎ
1.35
1.65
ÎÎ
± 0.1
4.0
ÎÎ
v
Î
85_C
1.5
2.1
Î
3.15
3.85
Î
0.5
0.9
Î
1.35
1.65
Î
± 1.0
40
Î
ÎÎ
v
125_C
1.5
2.1
ÎÎ
3.15
3.85
ÎÎ
0.5
0.9
ÎÎ
1.35
1.65
ÎÎ
± 1.0
160
ÎÎ
Î
Unit
Î
Î
Î
Î
µA
µA
Î
V
V
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2
Page 3
MC74LVX4066
ÎÎÎ
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
ÎÎÎ
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
ÎÎÎ
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
ÎÎÎ
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
ÎÎÎ
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
ÎÎÎ
Î
Î
Î
Î
Î
Î
Î
Î
ÎÎÎ
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
ÎÎÎ
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
ÎÎÎ
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
ÎÎÎ
Î
Î
Î
Î
Î
Î
Î
Î
ÎÎÎ
Î
Î
Î
ÎÎÎ
Î
Î
Î
Î
DC ELECTRICAL CHARACTERISTICS Analog Section(Voltages Referenced to GND)
Guaranteed Limit
V
Symbol
R
on
ÎÎ
ÎÎ
ÎÎ
ÎÎ
∆R
on
ÎÎ
I
off
ÎÎ
ÎÎ
I
on
ÎÎ
Maximum “ON” Resistance
ОООООООО
ОООООООО
ОООООООО
ОООООООО
Maximum Difference in “ON”
Resistance Between Any Two
ОООООООО
Channels in the Same Package
Maximum Off–Channel Leakage
ОООООООО
Current, Any One Channel
ОООООООО
Maximum On–Channel Leakage
Current, Any One Channel
ОООООООО
Parameter
Test Conditions
Vin = V
IH
ОООООО
VIS = VCC to GND
|IS| v 10 mA (Figures 1, 2)
ОООООО
Vin = V
IH
VIS = VCC or GND (Endpoints)
ОООООО
|IS| v 10 mA (Figures 1, 2)
ОООООО
Vin = V
IH
VIS = 1/2 (VCC – GND)
ОООООО
IS v 2.0 mA
Vin = V
IL
ОООООО
VIO = VCC or GND
Switch Off (Figure 3)
ОООООО
Vin = V
IH
VIS = VCC or GND
(Figure 4)
ОООООО
2.0†
ÎÎ
3.0
4.5
ÎÎ
5.5
2.0
3.0
ÎÎ
4.5
ÎÎ
5.5
3.0
4.5
ÎÎ
5.5
5.5
ÎÎ
ÎÎ
5.5
ÎÎ
†At supply voltage (VCC) approaching 2 V the analog switch–on resistance becomes extremely non–linear. Therefore, for low–voltage
operation, it is recommended that these devices only be used to control digital signals (See Figure 1a).
CC
V
– 55 to
25_C
—
ÎÎ
40
25
ÎÎ
20
—
30
ÎÎ
25
ÎÎ
20
15
10
ÎÎ
10
0.1
ÎÎ
ÎÎ
0.1
ÎÎ
v
85_C
—
Î
45
30
Î
25
—
35
Î
30
Î
25
20
12
Î
12
0.5
Î
Î
0.5
Î
v
125_C
—
ÎÎ
50
35
ÎÎ
30
—
40
ÎÎ
35
ÎÎ
30
25
15
ÎÎ
15
1.0
ÎÎ
ÎÎ
1.0
ÎÎ
Unit
Ω
Î
Î
Î
Î
Ω
Î
µA
Î
Î
µA
Î
AC ELECTRICAL CHARACTERISTICS (C
ÎÎÎ
Symbol
t
,
PLH
t
PHL
ÎÎÎ
ÎÎÎ
t
,
PLZ
t
PHZ
ÎÎÎ
ÎÎÎ
t
,
PZL
t
PZH
ÎÎÎ
ÎÎÎ
C
ОООООООООООООО
Maximum Propagation Delay , Analog Input to Analog Output
(Figures 8 and 9)
ОООООООООООООО
ОООООООООООООО
Maximum Propagation Delay, ON/OFF Control to Analog Output
(Figures 10 and 11)
ОООООООООООООО
ОООООООООООООО
Maximum Propagation Delay, ON/OFF Control to Analog Output
(Figures 10 and 1 1)
ОООООООООООООО
ОООООООООООООО
Maximum CapacitanceON/OFF Control Input
= 50 pF, ON/OFF Control Inputs: tr = tf = 6 ns)
L
Parameter
Control Input = GND
Analog I/O
ÎÎÎÎОООООООООООООО
C
PD
Power Dissipation Capacitance (Per Switch) (Figure 13)*
Feedthrough
*Used to determine the no–load dynamic power consumption: PD = CPD V
ÎÎ
ÎÎ
ÎÎ
ÎÎ
ÎÎ
ÎÎ
ÎÎ
ÎÎ
2
f + ICC VCC.
CC
Guaranteed Limit
V
2.0
3.0
4.5
5.5
2.0
3.0
4.5
5.5
2.0
3.0
4.5
5.5
—
—
—
CC
V
– 55 to
ÎÎ
25_C
4.0
3.0
ÎÎ
1.0
ÎÎ
1.0
30
20
ÎÎ
15
15
ÎÎ
20
12
ÎÎ
8.0
8.0
ÎÎ
10
35
1.0
ÎÎ
v
Î
85_C
6.0
5.0
Î
2.0
Î
2.0
35
25
Î
18
18
Î
25
14
Î
10
10
Î
10
35
1.0
Î
ÎÎ
v
125_C
8.0
6.0
ÎÎ
2.0
ÎÎ
2.0
40
30
ÎÎ
22
20
ÎÎ
30
15
ÎÎ
12
12
ÎÎ
10
35
1.0
ÎÎ
Î
Unit
Î
Î
Î
Î
Î
Î
pF
Î
ns
ns
ns
Typical @ 25°C, VCC = 5.0 V
15
pF
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3
Page 4
MC74LVX4066
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
ADDITIONAL APPLICATION CHARACTERISTICS (Voltages Referenced to GND Unless Noted)
Symbol
ÎÎ
BW
ОООООООО
Maximum On–Channel Bandwidth
or
ÎÎ
Minimum Frequency Response
ОООООООО
(Figure 5)
—
ÎÎ
ÎÎ
—
ÎÎ
ÎÎ
—
ÎÎ
ÎÎ
THD
ÎÎ
ÎÎ
Off–Channel Feedthrough Isolation
ОООООООО
(Figure 6)
ОООООООО
Feedthrough Noise, Control to
ОООООООО
Switch
(Figure 7)
ОООООООО
Crosstalk Between Any Two
ОООООООО
Switches
(Figure 12)
ОООООООО
Total Harmonic Distortion
ОООООООО
(Figure 14)
ОООООООО
*Guaranteed limits not tested. Determined by design and verified by qualification.
Parameter
ОООООООООООО
Test Conditions
fin = 1 MHz Sine Wave
Adjust fin Voltage to Obtain 0 dBm at V
Increase fin Frequency Until dB Meter Reads – 3 dB
ОООООООООООО
OS
RL = 50 Ω, CL = 10 pF
fin Sine Wave
ОООООООООООО
Adjust fin Voltage to Obtain 0 dBm at V
ОООООООООООО
fin = 10 kHz, RL = 600 Ω, CL = 50 pF
IS
fin = 1.0 MHz, RL = 50 Ω, CL = 10 pF
Vin v 1 MHz Square Wave (tr = tf = 6 ns)
ОООООООООООО
Adjust RL at Setup so that IS = 0 A
ОООООООООООО
RL = 600 Ω, CL = 50 pF
RL = 10 kΩ, CL = 10 pF
fin Sine Wave
ОООООООООООО
Adjust fin Voltage to Obtain 0 dBm at V
ОООООООООООО
fin = 10 kHz, RL = 600 Ω, CL = 50 pF
IS
fin = 1.0 MHz, RL = 50 Ω, CL = 10 pF
fin = 1 kHz, RL = 10 kΩ, CL = 50 pF
ОООООООООООО
THD = THD
ОООООООООООО
Measured
– THD
Source
VIS = 4.0 VPP sine wave
VIS = 5.0 VPP sine wave
V
CC
Î
4.5
5.5
Î
4.5
Î
5.5
Î
4.5
5.5
4.5
Î
5.5
Î
4.5
5.5
4.5
Î
5.5
Î
4.5
5.5
Î
4.5
Î
5.5
V
25_C
ÎÎ
150
Unit
Î
MHz
160
Limit*
ÎÎ
– 50
ÎÎ
– 50
ÎÎ
Î
dB
Î
Î
– 37
– 37
100
ÎÎ
200
ÎÎ
mV
Î
Î
PP
50
100
– 70
ÎÎ
– 70
ÎÎ
dB
Î
Î
– 80
– 80
ÎÎ
0.10
ÎÎ
Î
Î
%
0.06
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4
Page 5
MC74LVX4066
400
250
350
300
250
200
Ron (Ohms)
150
100
50
0
0.51
–55°C
25°C
85°C
125°C
1.522.50
Vin (Volts)
200
150
Ron (Ohms)
100
50
0
Is = 9mA
0.51
Is = 1mA
Is = 5mA
Is = 15mA
1.522.50
Vin (Volts)
Figure 1a. T ypical On Resistance, VCC = 2.0 V, T = 25°CFigure 1b. T ypical On Resistance, VCC = 2.0 V
35
30
25
20
15
Ron (Ohms)
10
5
0
125°C
85°C
25°C
–55°C
1
20
Vin (Volts)
3
4
20
18
16
14
12
10
Ron (Ohms)
8
6
4
2
0
12
Vin (Volts)
125°C
–55°C
3450
85°C
25°C
Figure 1c. T ypical On Resistance, VCC = 3.0 V
18
16
14
12
10
8
Ron (Ohms)
6
4
2
0
12
Vin (Volts)
3450
Figure 1e. T ypical On Resistance, VCC = 5.5 V
125°C
85°C
PROGRAMMABLE
25°C
–55°C
6
POWER
SUPPLY
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5
Figure 1d. T ypical On Resistance, VCC = 4.5 V
PLOTTER
MINI COMPUTER
+–
DEVICE
UNDER TEST
ANALOG INCOMMON OUT
GND
DC ANALYZER
V
CC
Figure 2. On Resistance T est Set–Up
Page 6
MC74LVX4066
V
CC
V
CC
OFF
SELECTED
CONTROL
INPUT
14
V
IL
GND
V
CC
A
7
Figure 3. Maximum Off Channel Leakage Current,
Any One Channel, Test Set–Up
V
V
14
f
in
0.1µF
7
ON
SELECTED
CONTROL
INPUT
CC
OS
CL*
V
CC
METER
dB
V
V
CC
GND
A
7
ON
SELECTED
CONTROL
INPUT
CC
14
V
IH
Figure 4. Maximum On Channel Leakage Current,
T est Set–Up
V
V
IS
f
in
0.1µF
R
L
SELECTED
CONTROL
INPUT
7
V
14
OFF
CC
OS
CL*
N/C
dB
METER
*Includes all probe and jig capacitance.
Figure 5. Maximum On–Channel Bandwidth
T est Set–Up
INPUT
V
CC
14
V
CC/2
R
L
OFF/ON
SELECTED
CONTROL
Vin ≤ 1 MHz
tr = tf = 3 ns
V
CC
GND
*Includes all probe and jig capacitance.
CONTROL
7
Figure 7. Feedthrough Noise, ON/OFF Control to
Analog Out, Test Set–Up
*Includes all probe and jig capacitance.
Figure 6. Off–Channel Feedthrough Isolation,
T est Set–Up
V
CC/2
R
L
V
CL*
OS
ANALOG IN
t
PLH
ANALOG OUT
50%
50%
t
PHL
V
CC
GND
I
S
Figure 8. Propagation Delays, Analog In to
Analog Out
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6
Page 7
V
t
t
14
ON
SELECTED
CONTROL
7
*Includes all probe and jig capacitance.
ANALOG OUTANALOG IN
V
INPUT
Figure 9. Propagation Delay T est Set–Up
CC
CC
CL*
MC74LVX4066
TEST
POINT
CONTROL
ANALOG
OUT
50%
10%
90%
r
50%
50%
t
PZL
t
PZH
t
PLZ
t
PHZ
f
10%
90%
Figure 10. Propagation Delay , ON/OFF Control
to Analog Out
V
CC
GND
HIGH
IMPEDANCE
V
OL
V
OH
HIGH
IMPEDANCE
POSITIONWHEN TESTING t
1
2
V
CC
1
2
*Includes all probe and jig capacitance.
POSITIONWHEN TESTING t
1
2
V
14
ON/OFF
SELECTED
CONTROL
INPUT
7
Figure 11. Propagation Delay Test Set–Up
14
N/C
OFF/ON
CC
PHZ
PLZ
AND t
AND t
1 kΩ
CL*
PZH
PZL
TEST
POINT
f
in
0.1 µF
VCC OR GND
*Includes all probe and jig capacitance.
V
IS
R
L
V
CC/2
R
L
ON
OFF
SELECTED
CONTROL
INPUT
7
V
CC
14
R
CL*
L
V
CC/2
V
CC/2
V
OS
R
CL*
L
Figure 12. Crosstalk Between Any Two Switches,
T est Set–Up
V
CC
A
N/C
f
in
0.1 µF
V
IS
ON
V
CC
V
OS
TO
DISTORTION
CL*
R
L
METER
SELECTED
CONTROL
7
ON/OFF CONTROL
INPUT
Figure 13. Power Dissipation Capacitance
Test Set–Up
*Includes all probe and jig capacitance.
Figure 14. Total Harmonic Distortion, T est Set–Up
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7
7
SELECTED
CONTROL
INPUT
V
CC/2
V
CC
Page 8
dBm
–10
–20
–30
–40
–50
–60
–70
–80
–90
MC74LVX4066
0
FUNDAMENTAL FREQUENCY
DEVICE
SOURCE
1.02.0
Figure 15. Plot, Harmonic Distortion
APPLICATION INFORMATION
The ON/OFF Control pins should be at VCC or GND logic
levels, VCC being recognized as logic high and GND being
recognized as a logic low. Unused analog inputs/outputs
may be left floating (not connected). However, it is
advisable to tie unused analog inputs and outputs to VCC or
GND through a low value resistor. This minimizes crosstalk
and feedthrough noise that may be picked–up by the unused
I/O pins.
The maximum analog voltage swings are determined by
the supply voltages VCC and GND. The positive peak analog
voltage should not exceed VCC. Similarly, the negative peak
analog voltage should not go below GND. In the example
below, the difference between VCC and GND is six volts.
VCC = 6.0 V
ON
14
ANALOG O/I
+ 6.0 V
0 V
ANALOG I/O
3.0
FREQUENCY (kHz)
Therefore, using the configuration in Figure 16, a maximum
analog signal of six volts peak–to–peak can be controlled.
When voltage transients above VCC and/or below GND
are anticipated on the analog channels, external diodes (Dx)
are recommended as shown in Figure 17. These diodes
should be small signal, fast turn–on types able to absorb the
maximum anticipated current surges during clipping. An
alternate method would be to replace the Dx diodes with
Mosorbs (Mosorb is an acronym for high current surge
protectors). Mosorbs are fast turn–on devices ideally suited
for precise DC protection with no inherent wear out
mechanism.
+ 6.0 V
0 V
V
CC
D
x
ON
D
x
V
CC
16
D
x
D
x
SELECTED
CONTROL
INPUT
7
OTHER CONTROL
INPUTS
(VCC OR GND)
V
CC
SELECTED
CONTROL
INPUT
7
OTHER CONTROL
INPUTS
(VCC OR GND)
Figure 16. 6.0 V ApplicationFigure 17. Transient Suppressor Application
*See Applications Note #AND8004/D for date code and traceability information.
P ACKAGE DIMENSIONS
D SUFFIX
PLASTIC SOIC PACKAGE
CASE 751A–03
ISSUE F
–A–
814
P 7 PL
–B–
MM
1
G
D14 PL
0.25 (0.010)T BA
7
R
C
X 45°
K
M
SS
B0.25 (0.010)
M
J
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
F
MILLIMETERSINCHES
MINMINMAXMAX
DIM
A
8.55
B
C
D
F
G
J
K
M
P
R
8.75
3.80
4.00
1.35
1.75
0.35
0.49
0.40
1.25
1.27 BSC0.050 BSC
0.19
0.25
0.10
0.25
0°
7°
5.80
6.20
0.25
0.50
0.337
0.150
0.054
0.014
0.016
0.008
0.004
0.228
0.010
0.344
0.157
0.068
0.019
0.049
0.009
0.009
0°
7°
0.244
0.019
http://onsemi.com
10
Page 11
MC74LVX4066
P ACKAGE DIMENSIONS
DT SUFFIX
PLASTIC TSSOP PACKAGE
CASE 948G–01
ISSUE O
0.10 (0.004)
–T–
SEATING
PLANE
14X REFK
S
U
T
S
N
0.25 (0.010)
U0.15 (0.006) T
S
2X L/2
0.10 (0.004)V
14
M
8
M
L
PIN 1
IDENT.
1
S
U0.15 (0.006) T
A
–V–
B
–U–
N
F
7
DETAIL E
K
K1
J
J1
SECTION N–N
C
D
G
H
DETAIL E
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD FLASH,
PROTRUSIONS OR GATE BURRS. MOLD FLASH
OR GATE BURRS SHALL NOT EXCEED 0.15
(0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE INTERLEAD
FLASH OR PROTRUSION. INTERLEAD FLASH OR
PROTRUSION SHALL NOT EXCEED
0.25 (0.010) PER SIDE.
5. DIMENSION K DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN
EXCESS OF THE K DIMENSION AT MAXIMUM
MATERIAL CONDITION.
6. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
7. DIMENSION A AND B ARE TO BE DETERMINED
AT DATUM PLANE –W–.
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12
MC74L VX4066/D
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