Datasheet MC74LVX245DWR2, MC74LVX245DTR2, MC74LVX245DW Datasheet (MOTOROLA)



SEMICONDUCTOR TECHNICAL DATA

   

  

The MC74LVX245 is an advanced high speed CMOS octal bus

transceiver.

It is intended for two–way asynchronous communication between data buses. The direction of data transmission is determined by the level of the T/R

input. The output enable pin (OE) can be used to disable the device,

so that the buses are effectively isolated.

All inputs are equipped with protection circuits against static discharge.



LVX

LOW–VOLTAGE CMOS

• High Speed: t

• Low Power Dissipation: I

= 4.7ns (Typ) at VCC = 3.3V

PD

= 4µA (Max) at TA = 25°C

CC

• Power Down Protection Provided on Inputs

• Balanced Propagation Delays

• Low Noise: V

= 0.8V (Max)

OLP

• Pin and Function Compatible with Other Standard Logic Families

• Latchup Performance Exceeds 300mA

• ESD Performance: HBM > 2000V; Machine Model > 200V

APPLICATION NOTES

1. Do not force a signal on an I/O pin when it is an active output, damage may

occur.

2. All floating (high impedence) input or I/O pins must be fixed by means of

pull up or pull down resistors or bus terminator ICs.

3. A parasitic diode is formed between the bus and VCC terminals. Therefore,

the L VX245 cannot be used to interface 5V to 3V systems directly.

V

OE

CC

T/R

B0 B1 B2 B3 B4 B5 B6 B7

1920 18 17 16 15 14

21 34567

A0 A1 A2 A3 A4 A5 A6 A7 GND

Figure 1. 20–Lead Pinout (Top View)

13

12

11

9

8

10

20–LEAD TSSOP PACKAGE

20–LEAD SOIC EIAJ PACKAGE

PIN NAMES

Pins

OE T/R A0–A7

B0–B7

DW SUFFIX

20–LEAD SOIC PACKAGE

CASE 751D–04

DT SUFFIX

CASE 948E–02

M SUFFIX

CASE 967–01

Function

Output Enable Input Transmit/Receive Input Side A 3–State Inputs or 3–State Outputs Side B 3–State Inputs or 3–State Outputs

6/97

 Motorola, Inc. 1997

1

REV 0

MC74LVX245

OPERATING MODE

OE

T/R 1

19

A0

A1

A2

A3

A4

A5

A6

A7

2

18

B0

3

17

B1

4

16

B2

5

15

B3

6

14

B4

7

13

B5

8

12

B6

9

11

B7

Figure 2. Logic Diagram

INPUTS

OE T/R

L L B Data to A Bus L H A Data to B Bus

H X Z

H = High Voltage Level; L = Low V oltage Level; Z = High Impedance State; X = High or Low Voltage Level and Transitions are Acceptable; For ICC reasons, Do Not Float Inputs

MOTOROLA LCX DATA

2

Non–Inverting

BR1339 — REV 3

MC74LVX245

ОООООО

V

CC

Î

ОООООО

Î

ОООООО

Î

ОООООО

Î

ОООООО

Î

ОООООО

Î

ОООООО ОООООО

MAXIMUM RATINGS*

Symbol

V V V I I I I P T

CC in

I/O IK OK out CC

D

stg

DC Supply Voltage DC Input Voltage (T/R, OE) DC Output Voltage Input Diode Current Output Diode Current DC Output Current, per Pin DC Supply Current, VCC and GND Pins Power Dissipation Storage Temperature

* Absolute maximum continuous ratings are those values beyond which damage to the device may occur. Exposure to these conditions or

conditions beyond those indicated may adversely affect device reliability. Functional operation under absolute–maximum–rated conditions is

not implied.

RECOMMENDED OPERATING CONDITIONS

Symbol

V

CC

V

in

V

I/O

T

A

∆t/∆V

DC Supply Voltage DC Input Voltage (T/R, OE) DC Output Voltage Operating Temperature, All Package Types Input Rise and Fall Time

Parameter

Value

–0.5 to +7.0 –0.5 to +7.0

–0.5 to VCC +0.5

–20

±20 ±25 ±75

180

–65 to +150

Min

2.0 0 0

–40

0

Max

3.6

5.5

V

CC

+85 100

Unit

V V

V mA mA mA mA

mW

_

C

Unit

V

_

C

ns/V

DC ELECTRICAL CHARACTERISTICS

Symbol

V

IH

ÎÎ

V

IL

ÎÎ

V

OH

ÎÎ

V

OL

ÎÎ

I

in

ÎÎ

I

OZ

I

CC

Parameter

High–Level Input Voltage

ОООООО

Low–Level Input Voltage

ОООООО

High–Level Output Voltage

ОООООО

(Vin = VIH or VIL)

ОООООО

Low–Level Output Voltage (Vin = VIH or VIL)

ОООООО

Input Leakage Current

ОООООО

Maximum Three–State Leakage Current

Quiescent Supply Current

ОООООÎÎ

IOH = –50µA

ООООО

IOH = –50µA IOH = –4mA

ООООО

IOL = 50µA IOL = 50µA

ООООО

IOL = 4mA Vin = 5.5V or GND

(T/R

ООООО

Vin = VIL or V V

Vin = VCC or GND

Test Conditions

, OE)

= VCC or GND

out

IH

V

2.0

3.0

3.6

2.0

3.0

3.6

2.0

Î

3.0

Î

2.0

3.0

Î

3.0

3.6

Î

3.6

TA = 25°C

Min

Typ

Max

1.5

2.0

ÎÎ

2.4

ÎÎÎÎÎÎÎ

0.5

ÎÎÎÎÎÎÎ

1.9

ÎÎ

2.9

2.58

ÎÎ

2.0

Î

3.0

Î

0.0

ÎÎÎÎ

0.8

ÎÎ

0.1

ÎÎ

0.36 ±0.1

ÎÎÎÎÎÎÎ

±0.25

4.0

TA = – 40 to 85°C

Min

Max

1.5

2.0

2.4

ÎÎÎÎ

0.5

ÎÎÎÎÎ

0.8

1.9

ÎÎ

2.9

2.48

ÎÎ

0.1

ÎÎÎÎÎ

0.44 ±1.0

ÎÎÎÎÎ

±2.5

40.0

Unit

V

Î

V

Î

V

Î

µA

Î

µA

LCX DATA BR1339 — REV 3

3 MOTOROLA

MC74LVX245

Î

AC ELECTRICAL CHARACTERISTICS (Input t

Symbol

t

PLH

t

ÎÎ

PHL

ÎÎÎООООООÎООООООО

t

PZL

ÎÎ

t

PZH

ÎÎÎООООООÎООООООО

t

PLZ

t

PHZ

ÎÎ

Propagation Delay

,

Input to Output

Output Enable Time to

,

High and Low Level

Output Disable Time From

,

High and Low Level

Parameter

ОООООО

= tf = 3.0ns)

r

Test Conditions

VCC = 2.7V CL = 15pF

ООООООО

CL = 50pF

VCC = 3.3 ± 0.3V CL = 15pF

CL = 50pF

VCC = 2.7V CL = 15pF

ООООООО

RL = 1kΩ CL = 50pF VCC = 3.3 ± 0.3V CL = 15pF

RL = 1kΩ CL = 50pF VCC = 2.7V CL = 50pF

RL = 1kΩ

ООООООО

VCC = 3.3 ± 0.3V CL = 50pF

TA = 25°C

Min

Typ

6.1

ÎÎÎÎ

8.6

4.7

ÎÎÎÎ

7.2

9.0

11.5

7.1

ÎÎÎÎ

9.6

11.5

ÎÎÎÎ

9.6

Max

10.7

14.2

ÎÎ

6.6

10.1

ÎÎ

16.9

ÎÎ

20.4

11.0

ÎÎ

14.5

18.0

ÎÎ

12.8

TA = – 40 to 85°C

Min

1.0

Î

1.0

Î

1.0

Î

1.0

Î

1.0

Î

1.0

Max

13.5

17.0

ÎÎ

8.0

11.5

ÎÎ

20.5

ÎÎ

24.0

13.0

ÎÎ

16.5

21.0

ÎÎ

14.5

Unit

ns

RL = 1kΩ

t

OSHL

ÎÎ

t

OSLH

Output–to–Output Skew

ОООООО

(Note 1.)

VCC = 2.7V CL = 50pF

ООООООО

VCC = 3.3 ±0.3V CL = 50pF

ÎÎÎÎÎÎÎ

1.5

ÎÎÎÎ

1.5

ns

1. Skew is defined as the absolute value of the difference between the actual propagation delay for any two separate outputs of the same device. The specification applies to any outputs switching in the same direction, either HIGH–to–LOW (t guaranteed by design.

) or LOW–to–HIGH (t

OSHL

OSLH

); parameter

CAPACITIVE CHARACTERISTICS

TA = 25°C

Symbol

C

in

C

I/O

C

PD

Input Capacitance (T/R, OE) Maximum Three–State I/O Capacitance Power Dissipation Capacitance (Note 2.)

Parameter

Min

Typ

4 8

21

Max

2. CPD is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load. Average operating current can be obtained by the equation: I dynamic power consumption; PD = CPD  V

2

 fin + ICC  VCC.

CC

CC(OPR

= CPD  VCC  fin + ICC/8 (per bit). CPD is used to determine the no–load

)

10

TA = – 40 to 85°C

Min

Max

10

Unit

pF pF pF

NOISE CHARACTERISTICS (Input t

= tf = 3.0ns, CL = 50pF, VCC = 3.3V , Measured in SOIC Package)

r

Symbol Characteristic

V V

OLP OLV

IHD

Quiet Output Maximum Dynamic V Quiet Output Minimum Dynamic V

OL

Minimum High Level Dynamic Input Voltage 2.0 V Maximum Low Level Dynamic Input Voltage 0.8 V

ILD

TA = 25°C

Typ Max

Unit

0.5 0.8 V

–0.5 –0.8 V

MOTOROLA LCX DATA

4

BR1339 — REV 3

Input

A or B

Output

B or A

t

PLH

SWITCHING WAVEFORMS

T/R

V

50%

50% V

CC

t

PHL

CC

GND

OE

A or B

50% V

Figure 3. Figure 4.

TEST CIRCUITS

CC

t

PZL

50% V

t

PZHtPHZ

50% V

CC

t

PLZ

MC74LVX245

50%

50% V

CC

V

CC

GND V

CC

GND HIGH

IMPEDANCE VOL +0.3V

VOH –0.3V HIGH

IMPEDANCE

TEST POINT

OUTPUT

DEVICE UNDER

TEST

*Includes all probe and jig capacitance

CL*

DEVICE

UNDER

TEST

TEST POINT

1 k

OUTPUT

*Includes all probe and jig capacitance

Ω

CL*

CONNECT TO VCC WHEN TESTING t CONNECT TO GND WHEN TESTING t

Figure 5. Propagation Delay T est Circuit Figure 6. Three–State T est Circuit

PLZ

PHZ

AND t

PZL

PZH

.

LCX DATA BR1339 — REV 3

5 MOTOROLA

MC74LVX245

20

1

18X

–A–

11

–B–

10

D20X

0.010 (0.25) B

M

S

A

T

C

G

K

S

–T–

OUTLINE DIMENSIONS

DW SUFFIX

PLASTIC SOIC PACKAGE

CASE 751D–04

ISSUE E

P10X

M

0.010 (0.25)

SEATING PLANE

B

J

F

M

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.

2. CONTROLLING DIMENSION: MILLIMETER.

3. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION.

4. MAXIMUM MOLD PROTRUSION 0.150 (0.006) PER SIDE.

5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.13 (0.005) TOTAL IN EXCESS OF D DIMENSION AT MAXIMUM MATERIAL CONDITION.

DIM MIN MAX MIN MAX

A 12.65 12.95 0.499 0.510 B 7.40 7.60 0.292 0.299 C 2.35 2.65 0.093 0.104 D 0.35 0.49 0.014 0.019

F 0.50 0.90 0.020 0.035

G 1.27 BSC 0.050 BSC

R

X 45

_

J 0.25 0.32 0.010 0.012 K 0.10 0.25 0.004 0.009 M 0 7 0 7

__

P 10.05 10.55 0.395 0.415 R 0.25 0.75 0.010 0.029

INCHESMILLIMETERS

__

DT SUFFIX

PLASTIC TSSOP PACKAGE

CASE 948E–02

ISSUE A

20X REFK

S

U0.15 (0.006) T

0.10 (0.004) V

M

S

U

T

S

K

2X

L/2

L

PIN 1 IDENT

110

1120

B

JJ1

–U–

N

S

U0.15 (0.006) T

A

K1

SECTION N–N

0.25 (0.010)

M

–V–

N

F

DETAIL E

C

G

H

DETAIL E

0.100 (0.004)

SEATING

–T–

PLANE

D

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.

2. CONTROLLING DIMENSION: MILLIMETER.

3. DIMENSION A DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. MOLD FLASH OR GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER SIDE.

4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE.

5. DIMENSION K DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE K DIMENSION AT MAXIMUM MATERIAL CONDITION.

6. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY.

7. DIMENSION A AND B ARE TO BE DETERMINED AT DATUM PLANE –W–.

INCHES

6.60 0.260

–W–

MILLIMETERS

DIMAMIN MAX MIN MAX

6.40 0.252

B 4.30 4.50 0.169 0.177 C 1.20 0.047

––– –––

D 0.05 0.15 0.002 0.006 F 0.50 0.75 0.020 0.030 G 0.65 BSC 0.026 BSC H 0.27 0.37 0.011 0.015 J 0.09 0.20 0.004 0.008

J1 0.09 0.16 0.004 0.006

K 0.19 0.30 0.007 0.012

K1 0.19 0.25 0.007 0.010

L 6.40 BSC 0.252 BSC M 0 8 0 8

____

MOTOROLA LCX DATA

6

BR1339 — REV 3

OUTLINE DIMENSIONS

M SUFFIX

PLASTIC SOIC EIAJ PACKAGE

CASE 967–01

ISSUE O

20

110

11

H

E

Z

D

e

0.13 (0.005)

A

b

M

A

0.10 (0.004)

VIEW P

1

L

E

_

M

L

DETAIL P

MC74LVX245

NOTES:

1 DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982. 2 CONTROLLING DIMENSION: MILLIMETER. 3 DIMENSIONS D AND E DO NOT INCLUDE MOLD

FLASH OR PROTRUSIONS AND ARE MEASURED

AT THE PARTING LINE. MOLD FLASH OR

Q

1

PROTRUSIONS SHALL NOT EXCEED 0.15 (0.006)

PER SIDE. 4 TERMINAL NUMBERS ARE SHOWN FOR

REFERENCE ONLY. 5 THE LEAD WIDTH DIMENSION (b) DOES NOT

INCLUDE DAMBAR PROTRUSION. ALLOWABLE

DAMBAR PROTRUSION SHALL BE 0.08 (0.003)

TOTAL IN EXCESS OF THE LEAD WIDTH

DIMENSION AT MAXIMUM MATERIAL CONDITION.

DAMBAR CANNOT BE LOCATED ON THE LOWER

RADIUS OR THE FOOT. MINIMUM SPACE

BETWEEN PROTRUSIONS AND ADJACENT LEAD

TO BE 0.46 ( 0.018).

MILLIMETERS

c

DIM MIN MAX MIN MAX

––– 2.05 ––– 0.081

A

0.05 0.20 0.002 0.008

1

0.35 0.50 0.014 0.020

b

0.18 0.27 0.007 0.011

c

12.35 12.80 0.486 0.504

D

5.10 5.45 0.201 0.215

E

1.27 BSC 0.050 BSC

e

H

7.40 8.20 0.291 0.323

E

0.50 0.85 0.020 0.033

L

1.10 1.50 0.043 0.059

E

0

M

_

Q

0.70 0.90 0.028 0.035

1

––– 0.81 ––– 0.032

Z

10

INCHES

0

_

10

_

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MC74LVX245/D

LCX DATA

◊

7 MOTOROLA

BR1339 — REV 3

Datasheet MC74LVX245DWR2, MC74LVX245DTR2, MC74LVX245DW Datasheet (MOTOROLA)

Specifications and Main Features

Frequently Asked Questions

User Manual