Datasheet MC74LVX157DTR2, MC74LVX157M, MC74LVX157DT, MC74LVX157D, MC74LVX157DR2 Datasheet (Motorola)

Page 1

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SEMICONDUCTOR TECHNICAL DATA

    !

   

The MC74L VX157 is an advanced high speed CMOS quad 2–channel multiplexer. The inputs tolerate voltages up to 7V, allowing the interface of 5V systems to 3V systems.

It consists of four 2–input digital multiplexers with common select (S) and enable (E and all the outputs go Low.

The select decoding determines whether the I0n or I1n inputs get routed to the corresponding Zn outputs.

) inputs. When E is held High, selection of data is inhibited



LVX

LOW–VOLTAGE CMOS

• High Speed: t

• Low Power Dissipation: I

= 5.1ns (Typ) at VCC = 3.3V

= 4µA (Max) at TA = 25°C

• Power Down Protection Provided on Inputs

• Balanced Propagation Delays

• Low Noise: V

= 0.5V (Max)

OLP

• Pin and Function Compatible with Other Standard Logic Families

• Latchup Performance Exceeds 300mA

• ESD Performance: HBM > 2000V; Machine Model > 200V

I0c I1c Zc I0d I1d Zd

1516 14 13 12 11 10

21 34567

Figure 2. Logic Diagram

I0a I1a

I0b I1b

I0c I1c

I0d I1d

S I0a I1a Za I0b I1b Zb GND

Figure 1. 16–Lead Pinout (Top View)

2 3

5 6

14 13

11 10

D SUFFIX

16–LEAD SOIC PACKAGE

CASE 751B–05

16–LEAD TSSOP PACKAGE

16–LEAD SOIC EIAJ PACKAGE

DT SUFFIX

CASE 948F–01

M SUFFIX

CASE 966–01

PIN NAMES

Pins

I0n I1n E S Zn

Function

Source 0 Data Inputs Source 1 Data Inputs Enable Input Select Input Outputs

TRUTH TABLE

INPUTS OUTPUT

I0n

H = High Voltage Level; L = Low Voltage Level; X = High or Low Voltage Level ; For ICC Reasons DO NOT FLOAT Inputs

I1n

L L

6/97

 Motorola, Inc. 1997

REV 0

Page 2

MC74LVX157

ОООООО

MAXIMUM RATINGS*

Symbol

V V V I I I I P T

CC in

out IK OK out CC

stg

DC Supply Voltage DC Input Voltage DC Output Voltage Input Diode Current Output Diode Current DC Output Current, per Pin DC Supply Current, VCC and GND Pins Power Dissipation Storage Temperature

* Absolute maximum continuous ratings are those values beyond which damage to the device may occur. Exposure to these conditions or

conditions beyond those indicated may adversely affect device reliability. Functional operation under absolute–maximum–rated conditions is

not implied.

RECOMMENDED OPERATING CONDITIONS

Symbol

out

∆t/∆V

DC Supply Voltage DC Input Voltage DC Output Voltage Operating Temperature, All Package Types Input Rise and Fall Time

Parameter

Value

–0.5 to +7.0 –0.5 to +7.0

–0.5 to VCC +0.5

–20

±20 ±25 ±50

180

–65 to +150

Min

2.0 0 0

–40

Max

3.6

5.5

+85 100

Unit

V V

V mA mA mA mA

Unit

ns/V

DC ELECTRICAL CHARACTERISTICS

Symbol

ÎÎ

Parameter

High–Level Input Voltage

ОООООО

Low–Level Input Voltage

ОООООО

High–Level Output Voltage

ОООООО

(Vin = VIH or VIL)

ОООООО

Low–Level Output Voltage (Vin = VIH or VIL)

ОООООО

Input Leakage Current Quiescent Supply Current

ОООООÎÎ

IOH = –50µA

ООООО

IOH = –50µA IOH = –4mA

ООООО

IOL = 50µA IOL = 50µA

ООООО

IOL = 4mA Vin = 5.5V or GND Vin = VCC or GND

Test Conditions

2.0

3.0

3.6

2.0

3.0

3.6

2.0

3.0

2.0

3.0

3.6

TA = 25°C

Min

Typ

Max

1.5

2.0

ÎÎ

2.4

ÎÎÎÎÎÎÎ

0.5

ÎÎÎÎÎÎÎ

1.9

ÎÎ

2.9

2.58

ÎÎ

2.0

3.0

0.0

ÎÎÎÎ

0.8

ÎÎ

0.1

ÎÎ

0.36 ±0.1

4.0

TA = – 40 to 85°C

Min

Max

1.5

2.0

2.4

ÎÎÎÎ

0.5

ÎÎÎÎÎ

0.8

1.9

ÎÎ

2.9

2.48

ÎÎ

0.1

ÎÎÎÎÎ

0.44 ±1.0

40.0

Unit

µA µA

MOTOROLA LCX DATA

BR1339 — REV 3

Page 3

MC74LVX157

AC ELECTRICAL CHARACTERISTICS (Input t

Symbol

PLH

ÎÎ

PHL

ÎÎÎООООООÎООООООО

PLH

ÎÎ

PHL

ÎÎÎООООООÎООООООО

PLH

PHL

ÎÎ

OSHL

ÎÎ

OSLH

Propagation Delay , Input to

Output

Propagation Delay,

S to Zn

Propagation Delay,

to Zn

Output–to–Output Skew (Note 1.)

Parameter

ОООООО

= tf = 3.0ns)

Test Conditions

VCC = 2.7V CL = 15pF

ООООООО

CL = 50pF

VCC = 3.3 ± 0.3V CL = 15pF

CL = 50pF

VCC = 2.7V CL = 15pF

ООООООО

CL = 50pF

VCC = 3.3 ± 0.3V CL = 15pF

CL = 50pF

VCC = 2.7V CL = 15pF

ООООООО

CL = 50pF

VCC = 3.3 ± 0.3V CL = 15pF

CL = 50pF

VCC = 2.7V CL = 50pF

ООООООО

VCC = 3.3 ±0.3V CL = 50pF

TA = 25°C

Min

ÎÎÎÎ

Typ

6.6

9.1

5.1

7.6

8.9

11.4

7.0

9.5

9.1

11.6

7.2

9.7

Max

12.5

16.0

ÎÎ

7.9

11.4

ÎÎ

16.9

ÎÎ

20.4

11.0

ÎÎ

14.5

17.6

21.1

ÎÎ

11.5

15.0

1.5

ÎÎÎÎÎÎÎ

1.5

TA = – 40 to 85°C

Min

1.0

Max

15.5

19.0

ÎÎ

9.5

13.0

ÎÎ

20.5

ÎÎ

24.0

13.0

ÎÎ

16.5

20.5

24.0

ÎÎ

13.5

17.0

1.5

ÎÎÎÎ

1.5

Unit

1. Skew is defined as the absolute value of the difference between the actual propagation delay for any two separate outputs of the same device. The specification applies to any outputs switching in the same direction, either HIGH–to–LOW (t guaranteed by design.

) or LOW–to–HIGH (t

OSHL

OSLH

); parameter

CAPACITIVE CHARACTERISTICS

TA = 25°C

Symbol

Input Capacitance Power Dissipation Capacitance (Note 2.)

Parameter

Min

Typ

Max

2. CPD is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load. Average operating current can be obtained by the equation: I dynamic power consumption; PD = CPD  V

 fin + ICC  VCC.

CC(OPR

= CPD  VCC  fin + ICC/4 (per bit). CPD is used to determine the no–load

)

TA = – 40 to 85°C

Min

Max

Unit

pF pF

NOISE CHARACTERISTICS (Input t

= tf = 3.0ns, CL = 50pF, VCC = 3.3V , Measured in SOIC Package)

Symbol Characteristic

V V

OLP OLV IHD

Quiet Output Maximum Dynamic V Quiet Output Minimum Dynamic V

Minimum High Level Dynamic Input Voltage 2.0 V Maximum Low Level Dynamic Input Voltage 0.8 V

ILD

TA = 25°C

Typ Max

Unit

0.3 0.5 V

–0.3 –0.5 V

LCX DATA BR1339 — REV 3

3 MOTOROLA

Page 4

MC74LVX157

SWITCHING WAVEFORMS

In or S

PLH

50% V

50%

PHL

GND

PHL

50%

Figure 3. Figure 4.

TEST CIRCUIT

TEST POINT

OUTPUT

DEVICE UNDER

TEST

*Includes all probe and jig capacitance

Figure 5. Propagation Delay T est Circuit

CL*

50% V

PLH

GND

MOTOROLA LCX DATA

BR1339 — REV 3

Page 5

–T–

OUTLINE DIMENSIONS

D SUFFIX

PLASTIC SOIC PACKAGE

CASE 751B–05

–A–

16 9

–B–

8 PLP

SEATING

PLANE

16 PL

0.25 (0.010) A

ISSUE J

0.25 (0.010) B

MC74LVX157

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.

2. CONTROLLING DIMENSION: MILLIMETER.

3. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION.

4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)

X 45

PER SIDE.

5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION.

DIM MIN MAX MIN MAX

A 9.80 10.00 0.386 0.393 B 3.80 4.00 0.150 0.157 C 1.35 1.75 0.054 0.068 D 0.35 0.49 0.014 0.019 F 0.40 1.25 0.016 0.049

G 1.27 BSC 0.050 BSC

J 0.19 0.25 0.008 0.009 K 0.10 0.25 0.004 0.009

M 0 7 0 7

____

P 5.80 6.20 0.229 0.244 R 0.25 0.50 0.010 0.019

INCHESMILLIMETERS

16 9

0.13 (0.005)

VIEW P

0.10 (0.004)

M SUFFIX

PLASTIC SOIC EIAJ PACKAGE

CASE 966–01

ISSUE O

DETAIL P

NOTES:

1 DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982. 2 CONTROLLING DIMENSION: MILLIMETER. 3 DIMENSIONS D AND E DO NOT INCLUDE MOLD

FLASH OR PROTRUSIONS AND ARE MEASURED

AT THE PARTING LINE. MOLD FLASH OR

PROTRUSIONS SHALL NOT EXCEED 0.15 (0.006)

PER SIDE. 4 TERMINAL NUMBERS ARE SHOWN FOR

REFERENCE ONLY. 5 THE LEAD WIDTH DIMENSION (b) DOES NOT

INCLUDE DAMBAR PROTRUSION. ALLOWABLE

DAMBAR PROTRUSION SHALL BE 0.08 (0.003)

TOTAL IN EXCESS OF THE LEAD WIDTH

DIMENSION AT MAXIMUM MATERIAL CONDITION.

DAMBAR CANNOT BE LOCATED ON THE LOWER

RADIUS OR THE FOOT. MINIMUM SPACE

BETWEEN PROTRUSIONS AND ADJACENT LEAD

TO BE 0.46 ( 0.018).

INCHES

MILLIMETERS

DIM MIN MAX MIN MAX

––– 2.05 ––– 0.081

A A

0.05 0.20 0.002 0.008

0.35 0.50 0.014 0.020

0.18 0.27 0.007 0.011

9.90 10.50 0.390 0.413

5.10 5.45 0.201 0.215

1.27 BSC 0.050 BSC

7.40 8.20 0.291 0.323

0.50 0.85 0.020 0.033

1.10 1.50 0.043 0.059

0.70 0.90 0.028 0.035

––– 0.78 ––– 0.031

LCX DATA BR1339 — REV 3

5 MOTOROLA

Page 6

MC74LVX157

0.10 (0.004)

SEATING

–T–

PLANE

U0.15 (0.006) T

PIN 1 IDENT.

U0.15 (0.006) T

2X L/2

OUTLINE DIMENSIONS

DT SUFFIX

PLASTIC TSSOP PACKAGE

CASE 948F–01

ISSUE O

16X REFK

–U–

DETAIL E

0.25 (0.010)

SECTION N–N

NOTES:

1 DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982. 2 CONTROLLING DIMENSION: MILLIMETER. 3 DIMENSION A DOES NOT INCLUDE MOLD FLASH.

PROTRUSIONS OR GATE BURRS. MOLD FLASH

OR GATE BURRS SHALL NOT EXCEED 0.15

(0.006) PER SIDE. 4 DIMENSION B DOES NOT INCLUDE INTERLEAD

FLASH OR PROTRUSION. INTERLEAD FLASH OR

PROTRUSION SHALL NOT EXCEED

0.25 (0.010) PER SIDE.

5 DIMENSION K DOES NOT INCLUDE DAMBAR

PROTRUSION. ALLOWABLE DAMBAR

PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN

EXCESS OF THE K DIMENSION AT MAXIMUM

MATERIAL CONDITION. 6 TERMINAL NUMBERS ARE SHOWN FOR

REFERENCE ONLY. 7 DIMENSION A AND B ARE TO BE DETERMINED

AT DATUM PLANE –W–.

DIM MIN MAX MIN MAX

A 4.90 5.10 0.193 0.200 B 4.30 4.50 0.169 0.177 C ––– 1.20 ––– 0.047 D 0.05 0.15 0.002 0.006 F 0.50 0.75 0.020 0.030

–W–

G 0.65 BSC 0.026 BSC H 0.18 0.28 0.007 0.011 J 0.09 0.20 0.004 0.008

J1 0.09 0.16 0.004 0.006

K 0.19 0.30 0.007 0.012

K1 0.19 0.25 0.007 0.010

L 6.40 BSC 0.252 BSC M 0 8 0 8

____

INCHESMILLIMETERS

0.10 (0.004) V

–V–

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MC74LVX157/D

BR1339 — REV 3