Datasheet MC74LVX138D, MC74LVX138DTR2, MC74LVX138M, MC74LVX138DT, MC74LVX138DR2 Datasheet (Motorola)

Page 1

SEMICONDUCTOR TECHNICAL DATA
!  
! ! "!
When the device is enabled, three Binary Select inputs (A0 – A2) determine which one of the outputs (O0 input E3 is held Low or either E2 inhibited and all outputs go high. E3, E2 ease cascade connection and for use as an address decoder for memory systems.
– O7) will go Low. When enable
or E1 is held High, decoding function is
, and E1 inputs are provided to

LVX
LOW–VOLTAGE CMOS
High Speed: t
Low Power Dissipation: I
= 5.5ns (Typ) at VCC = 3.3V
PD
= 4µA (Max) at TA = 25°C
CC
Power Down Protection Provided on Inputs
Balanced Propagation Delays
Low Noise: V
= 0.5V (Max)
OLP
Pin and Function Compatible with Other Standard Logic Families
Latchup Performance Exceeds 300mA
ESD Performance: HBM > 2000V; Machine Model > 200V
V
CC
A0 A1 A2 E1 E2 E3 O7 GND
Figure 1. 16–Lead Pinout (Top View)
O1 O2 O3 O4 O5 O6
O0
1516 14 13 12 11 10
21 34567
9
8
16–LEAD TSSOP PACKAGE
16–LEAD SOIC EIAJ PACKAGE
PIN NAMES
Pins
A0–A2 E1
–E2 E3 O0–O7
D SUFFIX
16–LEAD SOIC PACKAGE
CASE 751B–05
DT SUFFIX
CASE 948F–01
M SUFFIX
CASE 966–01
Function
Address Inputs Enable Inputs Enable Input Outputs
6/97
Motorola, Inc. 1997
1
REV 0
Page 2
MC74LVX138
SELECT
INPUTS
ENABLE
INPUTS
A0
A1
A2
E1 E2 E3
15
O0
14
13
12
11
10
O1
O2
O3
DATA OUTPUTS
O4
O5
9
O6
7
O7
1
2
3
4 5 6
Figure 2. Logic Diagram
INPUTS OUTPUTS
E1 E2 E3 A0 A1 A2 O0 O1 O2 O3 O4 O5 O6 O7
H X X
L L L L
L L L L
H = High Voltage Level; L = Low V oltage Level; X = High or Low V oltage Level and T ransitions Are Acceptable; For ICC reasons, DO NOT FLOAT Inputs
X H X
L L L L
L L L L
A0 A1 A2
A3 A4
A0 A1 A2 E
X X L
H H H H
H H H H
X X X
L H L H
L H L H
H
123 123 123 123
X X X
L L H H
L L H H
X X X
L L L L
H H H H
A0 A1 A2 E
H H H
L H H H
H H H H
H H H
H
L H H
H H H H
H H H
H H
L
H H
H H H
A0 A1 A2 E
H H H
H H H
L
H H H H
H H H
H H H H
L H H H
H H H
H H H H
H
L H H
A0 A1 A2 E
‘04
H H H
H H H H
H H
L
H
H H H
H H H H
H H H
L
O0 O1 O2 O3 O4 O5 O6 O7
O0
O0 O1 O2 O3 O4 O5 O6 O7
O0 O1 O2 O3 O4 O5 O6 O7
O0 O1 O2 O3 O4 O5 O6 O7
O31
Figure 3. Expansion to 1–of–32 Decoding
MOTOROLA LCX DATA
2
BR1339 — REV 3
Page 3
MC74LVX138
ОООООО
ОООООО
V
CC
Î
Î
ОООООО
Î
Î
Î
Î
Î
ОООООО
Î
Î
Î
Î
Î
Î
Î
ОООООО
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
ОООООО
Î
Î
Î
Î
Î
ОООООО
ОООООО
MAXIMUM RATINGS*
Symbol
V V V I I I I P T
CC in
out IK OK out CC
D
stg
DC Supply Voltage DC Input Voltage DC Output Voltage Input Diode Current Output Diode Current DC Output Current, per Pin DC Supply Current, VCC and GND Pins Power Dissipation Storage Temperature
* Absolute maximum continuous ratings are those values beyond which damage to the device may occur. Exposure to these conditions or
conditions beyond those indicated may adversely affect device reliability. Functional operation under absolute–maximum–rated conditions is
not implied.
RECOMMENDED OPERATING CONDITIONS
Symbol
V
CC
V
in
V
out
T
A
t/V
DC Supply Voltage DC Input Voltage DC Output Voltage Operating Temperature, All Package Types Input Rise and Fall Time
Parameter
Parameter
Value
–0.5 to +7.0 –0.5 to +7.0
–0.5 to VCC +0.5
–20
±20 ±25 ±75
180
–65 to +150
Min
2.0 0 0
–40
0
Max
3.6
5.5
V
CC
+85 100
Unit
V V
V mA mA mA mA
mW
_
C
Unit
V
V
V
_
C
ns/V
DC ELECTRICAL CHARACTERISTICS
Symbol
V
IH
ÎÎ
V
IL
ÎÎ
V
OH
ÎÎ
ÎÎ
V
OL
ÎÎ
I
in
I
CC
High–Level Output Voltage
Low–Level Output Voltage
Parameter
High–Level Input Voltage
ОООООО
Low–Level Input Voltage
ОООООО
ОООООО
(Vin = VIH or VIL)
ОООООО
(Vin = VIH or VIL)
ОООООО
Input Leakage Current Quiescent Supply Current
ОООООÎÎ
ОООООÎÎ
IOH = –50µA
ООООО
IOH = –50µA IOH = –4mA
ООООО
IOL = 50µA IOL = 50µA
ООООО
IOL = 4mA Vin = 5.5V or GND Vin = VCC or GND
Test Conditions
V
V
2.0
3.0
3.6
2.0
3.0
3.6
2.0
Î
3.0
3.0
Î
2.0
3.0
Î
3.0
3.6
3.6
TA = 25°C
Min
Typ
Max
1.5
2.0
ÎÎ
2.4
ÎÎÎÎÎÎÎ
0.5
ÎÎÎÎÎÎÎ
1.9
ÎÎ
2.9
2.58
ÎÎ
2.0
Î
3.0
Î
0.0
0.0
ÎÎÎÎ
0.8
0.8
ÎÎ
ÎÎ
0.1
0.1
ÎÎ
0.36 ±0.1
4.0
TA = – 40 to 85°C
Min
Max
1.5
2.0
2.4
ÎÎÎÎ
0.5
ÎÎÎÎÎ
0.8
0.8
1.9
ÎÎ
2.9
2.48
ÎÎ
ÎÎ
ÎÎ
0.1
0.1
ÎÎÎÎÎ
0.44 ±1.0
40.0
Unit
V
V
Î
V
Î
Î
V
Î
µA µA
LCX DATA BR1339 — REV 3
3 MOTOROLA
Page 4
MC74LVX138
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
Î
AC ELECTRICAL CHARACTERISTICS (Input t
Symbol
t
PLH
t
ÎÎ
PHL
ÎÎÎООООООÎООООООО
t
PLH
ÎÎ
t
PHL
ÎÎÎООООООÎООООООО
t
PLH
t
PHL
ÎÎ
t
OSHL
ÎÎ
t
OSLH
Propagation Delay
,
Input to Output
Propagation Delay
,
E3 to O
Propagation Delay
,
E1
Output–to–Output Skew (Note 1.)
Parameter
ОООООО
ОООООО
or E2 to O
ОООООО
ОООООО
= tf = 3.0ns)
r
Test Conditions
VCC = 2.7V CL = 15pF
ООООООО
CL = 50pF
VCC = 3.3 ± 0.3V CL = 15pF
CL = 50pF
VCC = 2.7V CL = 15pF
ООООООО
CL = 50pF
VCC = 3.3 ± 0.3V CL = 15pF
CL = 50pF
VCC = 2.7V CL = 15pF
ООООООО
CL = 50pF
VCC = 3.3 ± 0.3V CL = 15pF
CL = 50pF
VCC = 2.7V CL = 50pF
ООООООО
VCC = 3.3 ±0.3V CL = 50pF
TA = 25°C
Min
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
Typ
7.1
9.6
5.5
8.0
8.7
11.2
6.8
9.3
8.8
11.3
6.9
9.4
Max
13.8
17.3
ÎÎ
8.8
12.3
ÎÎ
16.3
ÎÎ
19.8
10.6
ÎÎ
14.1
16.0
19.5
ÎÎ
10.4
13.9
2.5
ÎÎÎÎÎÎÎ
2.5
TA = – 40 to 85°C
Min
1.0
1.0
Î
1.0
1.0
Î
1.0
Î
1.0
1.0
Î
1.0
1.0
1.0
Î
1.0
1.0
Max
16.5
20.0
ÎÎ
10.5
14.0
ÎÎ
19.5
ÎÎ
23.0
12.5
ÎÎ
16.0
18.5
22.0
ÎÎ
11.5
15.0
2.5
ÎÎÎÎ
2.5
Unit
ns
ns
ns
ns
1. Skew is defined as the absolute value of the difference between the actual propagation delay for any two separate outputs of the same device. The specification applies to any outputs switching in the same direction, either HIGH–to–LOW (t guaranteed by design.
) or LOW–to–HIGH (t
OSHL
OSLH
); parameter
CAPACITIVE CHARACTERISTICS
TA = 25°C
Symbol
C
in
C
PD
Input Capacitance Power Dissipation Capacitance (Note 2.)
Parameter
Min
Typ
4
34
Max
2. CPD is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load. Average operating current can be obtained by the equation: I power consumption; PD = CPD V
2
fin + ICC VCC.
CC
CC(OPR
= CPD VCC fin + ICC. CPD is used to determine the no–load dynamic
)
10
TA = – 40 to 85°C
Min
Max
10
Unit
pF pF
NOISE CHARACTERISTICS (Input t
= tf = 3.0ns, CL = 50pF, VCC = 3.3V , Measured in SOIC Package)
r
Symbol Characteristic
V V
V V
OLP OLV
IHD
Quiet Output Maximum Dynamic V Quiet Output Minimum Dynamic V
OL
OL
Minimum High Level Dynamic Input Voltage 2.0 V Maximum Low Level Dynamic Input Voltage 0.8 V
ILD
TA = 25°C
Typ Max
0.5 V
–0.5 V
Unit
MOTOROLA LCX DATA
4
BR1339 — REV 3
Page 5
SWITCHING WAVEFORMS
MC74LVX138
VALID VALID
A
t
PLH
O 50% V
50%
Figure 4. Figure 5.
CC
t
PHL
E2 or E1
O
50%
V
CC
GND
t
PHL
50% V
CC
Figure 6.
TEST CIRCUIT
E3
O
t
PHL
t
PLH
50%
V
CC
GND
50% V
CC
t
PLH
V
CC
GND
TEST POINT
OUTPUT DEVICE UNDER
TEST
*Includes all probe and jig capacitance
CL*
Figure 7. T est Circuit
LCX DATA BR1339 — REV 3
5 MOTOROLA
Page 6
MC74LVX138
1
–T
SEATING
PLANE
–A
G
D
16 PL
0.25 (0.010) T B A
OUTLINE DIMENSIONS
D SUFFIX
PLASTIC SOIC PACKAGE
CASE 751B–05
ISSUE J
916
–B
P 8 PL
8
0.25 (0.010) B
K
C
M
S S
M M
R X 45°
M
F
J
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION.
MILLIMETERS INCHES
MIN MINMAX MAX
DIM
A
9.80
B
3.80
C
1.35
D
0.35
F
0.40
1.27 BSC 0.050 BSC
G J
0.19
K
0.10
M
0
°
P
5.80
R
0.25
10.00
4.00
1.75
0.49
1.25
0.25
0.25 7
6.20
0.50
0.386
0.393
0.150
0.157
0.054
0.068
0.014
0.019
0.016
0.049
0.008
0.009
0.004
0.009
0
7
°
°
°
0.229
0.010
0.244
0.019
16 9
1
Z
D
e
b
0.13 (0.005)
M
8
A
A
0.10 (0.004)
M SUFFIX
PLASTIC SOIC EIAJ PACKAGE
CASE 966–01
ISSUE O
L
E
Q
1
HEE
VIEW P
1
_
M
L
DETAIL P
c
NOTES:
1 DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982. 2 CONTROLLING DIMENSION: MILLIMETER. 3 DIMENSIONS D AND E DO NOT INCLUDE MOLD
FLASH OR PROTRUSIONS AND ARE MEASURED
AT THE PARTING LINE. MOLD FLASH OR
PROTRUSIONS SHALL NOT EXCEED 0.15 (0.006)
PER SIDE. 4 TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY. 5 THE LEAD WIDTH DIMENSION (b) DOES NOT
INCLUDE DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08 (0.003)
TOTAL IN EXCESS OF THE LEAD WIDTH
DIMENSION AT MAXIMUM MATERIAL CONDITION.
DAMBAR CANNOT BE LOCATED ON THE LOWER
RADIUS OR THE FOOT. MINIMUM SPACE
BETWEEN PROTRUSIONS AND ADJACENT LEAD
TO BE 0.46 ( 0.018).
MILLIMETERS DIM MIN MAX MIN MAX A
--- 2.05 --- 0.081
A
0.05 0.20 0.002 0.008
1
b
0.35 0.50 0.014 0.020
c
0.18 0.27 0.007 0.011
D
9.90 10.50 0.390 0.413
E
5.10 5.45 0.201 0.215
e
1.27 BSC 0.050 BSC
H
7.40 8.20 0.291 0.323
E
L
0.50 0.85 0.020 0.033
L
1.10 1.50 0.043 0.059
E
M
0
_
Q
0.70 0.90 0.028 0.035
1
Z
--- 0.78 --- 0.031
10
_
INCHES
0
_
10
_
MOTOROLA LCX DATA
6
BR1339 — REV 3
Page 7
0.10 (0.004)
SEATING
–T–
PLANE
L
U0.15 (0.006) T
PIN 1 IDENT.
U0.15 (0.006) T
D
S
2X L/2
S
MC74LVX138
OUTLINE DIMENSIONS
DT SUFFIX
PLASTIC TSSOP PACKAGE
CASE 948F–01
ISSUE O
16X REFK
T
U
B
–U–
S
H
N
S
J
N
DETAIL E
DETAIL E
J1
0.25 (0.010)
F
K
K1
SECTION N–N
M
NOTES:
1 DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982. 2 CONTROLLING DIMENSION: MILLIMETER. 3 DIMENSION A DOES NOT INCLUDE MOLD FLASH.
PROTRUSIONS OR GATE BURRS. MOLD FLASH
OR GATE BURRS SHALL NOT EXCEED 0.15
(0.006) PER SIDE. 4 DIMENSION B DOES NOT INCLUDE INTERLEAD
FLASH OR PROTRUSION. INTERLEAD FLASH OR
PROTRUSION SHALL NOT EXCEED
0.25 (0.010) PER SIDE.
5 DIMENSION K DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN
EXCESS OF THE K DIMENSION AT MAXIMUM
MATERIAL CONDITION. 6 TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY. 7 DIMENSION A AND B ARE TO BE DETERMINED
AT DATUM PLANE –W–.
DIM MIN MAX MIN MAX
A 4.90 5.10 0.193 0.200 B 4.30 4.50 0.169 0.177 C ––– 1.20 ––– 0.047 D 0.05 0.15 0.002 0.006 F 0.50 0.75 0.020 0.030
–W–
G 0.65 BSC 0.026 BSC H 0.18 0.28 0.007 0.011
J 0.09 0.20 0.004 0.008
J1 0.09 0.16 0.004 0.006
K 0.19 0.30 0.007 0.012
K1 0.19 0.25 0.007 0.010
L 6.40 BSC 0.252 BSC M 0 8 0 8
____
INCHESMILLIMETERS
0.10 (0.004) V
16
1
M
9
8
A
–V–
C
G
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LCX DATA
7 MOTOROLA
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MC74LVX138/D
BR1339 — REV 3
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