Datasheet MC74LVQ646DT, MC74LVQ646DW, MC74LVQ646SD Datasheet (Motorola)

Page 1

SEMICONDUCTOR TECHNICAL DATA
1
REV 0
Motorola, Inc. 1995
12/95
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The MC74LVQ646 is a high performance, non–inverting octal transceiver/registered transceiver operating from a 2.7 to 3.6V supply. High impedance TTL compatible inputs significantly reduce current loading to input drivers while TTL compatible outputs offer improved switching noise performance. The MC74LVQ646 is suitable for memory address driving and all TTL level bus oriented transceiver applications.
Data on the A or B bus will be clocked into the registers as the appropriate clock pin goes from a LOW–to–HIGH logic level. Output Enable (OE
) and DIR pins are provided to control the transceiver outputs. In the transceiver mode, data present at the high impedance port may be stored in either the A or the B register or in both. The select controls (SBA, SAB) can multiplex stored and real–time (transparent mode) data. The direction control (DIR) determines which bus will receive data when the enable OE
is active LOW. In the isolation mode (OE HIGH), A data may be stored in the B register or B data may be stored in the A register. Only one of the two buses, A or B, may be driven at one time.
Designed for 2.7 to 3.6V V
CC
Operation – Ideal for Low Power/Low
Noise Applications
Guaranteed Simultaneous Switching Noise Level and Dynamic
Threshold Performance
Guaranteed Skew Specifications
Guaranteed Incident Wave Switching into 75
Low Static Supply Current (10µA) Substantially Reduces System Power
Requirements
Latchup Performance Exceeds 500mA
ESD Performance: Human Body Model >2000V
Pinout: 24–Lead Package (Top View)
2324 22 21 20 19 18
21 3 4 5 6 7
V
CC
17
8
16
9
15
10
CBA SBA OE
B0 B1 B2 B3 B4 B5
CAB SAB DIR A0 A1 A2 A3 A4 A5 A6
14
11
13
12
B6 B7
A7 GND

LVQ
DW SUFFIX
PLASTIC SOIC CASE 751E–04
DT SUFFIX
PLASTIC TSSOP
CASE 948H–01
24
1
24
1
SD SUFFIX
PLASTIC SSOP
CASE 940D–03
24
1
LOW–VOLTAGE CMOS
OCTAL TRANSCEIVER/
REGISTERED TRANSCEIVER
PIN NAMES
Function
Side A Inputs/Outputs Side B Inputs/Outputs Clock Pulse Inputs Select Control Inputs Output Enable Inputs
Pins
A0–A7 B0–B7 CAB, CBA SAB, SBA DIR, OE
Page 2
LOGIC DIAGRAM
C
D
Q
OE
DIR
CBA
SBA
SAB
CAB
C
D
Q
A0
B0
1 of 8 Channels
To 7 Other Channels
1 3
21
22
2
23
MC74LVQ646
MOTOROLA LVQ DATA
BR1478
2
FUNCTION TABLE
Inputs
Storage
Registers
Data
Ports
Operating Mode
OE DIR CAB CBA SAB SBA QA QB An Bn Operating Mode
H X Input Input
X X NC NC X X Isolation, Hold Storage X X L
H X X
X X L H
L H X X
X X L H
Store A and/or B Data
L H Input Output
X* L X NCNCNC
NC
L H
L H
Real Time A Data to B Bus
H X NC NC X QA Stored A Data to B Bus
X* L X L
H
NC NC
L H
L H
Real Time A Data to B Bus; Store A Data
H X L
H
NC NC
L H
QA QA
Stored A Data to B Bus; Store A Data
L L Output Input
X* X L NCNCNC
NC
L H
L H
Real Time B Data to A Bus
X H NC NC QB X Stored B Data to A Bus
X* X L NC
NC
L H
L H
L H
Real Time B Data to A Bus; Store B Data
X H NC
NC
L H
QB QB
L H
Stored B Data to A Bus; Store B Data
H = High Voltage Level; L = Low V oltage Level; X = Don’t Care; = Low–to–High Clock T ransition; ↑ = NOT Low–to–High Clock Transition; NC = No Change; * = The clocks are not internally gated with either the Output Enables or the Source Inputs. Therefore, data at the A or B ports may be clocked into the storage registers, at any time. For ICC reasons, Do Not Float Inputs.
Page 3
MC74LVQ646
LCX DATA BR1478
3 MOTOROLA
BUS APPLICATIONS
BUS A
BUS B
OELDIRLCABXCBAXSABXSBA
L
Real Time Transfer – Bus B to
Bus A
BUS A
BUS B
OELDIRHCABXCBAXSABLSBA
X
Real Time Transfer – Bus A to
Bus B
BUS B
OE
X X H
DIR
X X X
CAB
X
CBA
X
↑ ↑
SAB
X X X
SBA
X X X
Store Data from Bus A, Bus B or
Busses A and B
BUS A
BUS B
OE
L L
DIR
L H
CAB
X
H or L
CBA
H or L
X
SAB
X H
SBA
H X
Transfer Storage Data to Bus A
or Bus B
BUS A
Page 4
MC74LVQ646
MOTOROLA LVQ DATA
BR1478
4
ABSOLUTE MAXIMUM RATINGS*
Symbol Parameter Value Condition Unit
V
CC
DC Supply Voltage –0.5 to +7.0 V
V
I
DC Input Voltage –0.5 VI VCC + 0.5V V
V
O
DC Output Voltage –0.5 VO VCC + 0.5 Output in HIGH or LOW State V
I
IK
DC Input Diode Current –20 VI = –0.5V mA
+20 VI = VCC + 0.5V mA
I
OK
DC Output Diode Current –20 VO = –0.5V mA
+20 VI = VCC + 0.5V mA
I
O
DC Output Source/Sink Current ±50 mA
I
CC
DC Supply Current ±400 mA
I
GND
DC Ground Current ±400 mA
T
STG
Storage Temperature Range –65 to +150 °C
* Absolute maximum continuous ratings are those values beyond which damage to the device may occur. Exposure to these conditions or
conditions beyond those indicated may adversely affect device reliability. Functional operation under absolute–maximum–rated conditions is not implied.
RECOMMENDED OPERATING CONDITIONS
Symbol Parameter Min Typ Max Unit
V
CC
Supply Voltage 2.0 3.3 3.6 V
V
I
Input Voltage 0 V
CC
V
V
O
Output Voltage 0 V
CC
V
T
A
Operating Free–Air Temperature –40 +85 °C
V/t Input Transition Rise or Fall Rate, VIN from 0.8V to 2.0V, VCC = 3.0V 0 125 mV/ns
DC ELECTRICAL CHARACTERISTICS
TA = –40°C to +85°C
Symbol Characteristic Condition Min Max Unit
V
IH
HIGH Level Input Voltage (Note 1) 2.7V VCC 3.6V,
VO = 0.1V or VCC – 0.1V
2.0 V
V
IL
LOW Level Input Voltage (Note 1) 2.7V VCC 3.6V,
VO = 0.1V or VCC – 0.1V
0.8 V
V
OH
HIGH Level Output Voltage 2.7V VCC 3.6V; IOH = –50µA VCC– 0.1 V
VCC = 2.7V; IOH = –12mA 2.2 VCC = 3.0V; IOH = –12mA 2.48
V
OL
LOW Level Output Voltage 2.7V VCC 3.6V; IOL = 50µA 0.1 V
2.7V VCC 3.6V; IOL= 12mA 0.4
I
I
Input Leakage Current 2.7V VCC 3.6V; VI= VCC, GND ±1.0 µA
I
OZT
Maximum I/O Leakage Current VI(OE) = VIL, VIH; VI, VO= VCC, GND ±3 µA
I
OLD
Minimum Dynamic Output Current (Note 2) VCC = 3.6V; V
OLD
= 0.8V Max 36 mA
I
OHD
VCC = 3.6V; V
OHD
= 2.0V Min –25 mA
I
CC
Quiescent Supply Current 2.7V VCC 3.6V; VI = VCC, GND 10 µA
1. These values of VI are used to test DC electrical characteristics only. Functional test should use VIH 2.4V, VIL 0.5V.
2. Incident wave switching on transmission lines with impedances as low as 75 for commercial temperature range is guaranteed. Maximum test duration is 2ms, one output loaded at a time.
Page 5
MC74LVQ646
LCX DATA BR1478
5 MOTOROLA
DYNAMIC SWITCHING CHARACTERISTICS (VCC = 3.3V)
TA = +25°C
Symbol Characteristic Condition Min Typ Max Unit
V
OLP
Dynamic LOW Peak Voltage (Note 1) CL = 50pF, VIH = 3.3V, VIL = 0V 0.6 1.0 V
V
OLV
Dynamic LOW Valley Voltage (Note 1) CL = 50pF, VIH = 3.3V, VIL = 0V –0.5 –1.0 V
V
IHD
High Level Dynamic Input Voltage (Note 2)
Input–Under–Test Switching 0V to Threshold,
f=1MHz
1.5 2.0 V
V
ILD
Low Level Dynamic Input Voltage (Note 2)
Input–Under–Test Switching 3.3V to Threshold,
f=1MHz
1.5 0.8 V
1. Number of outputs defined as “n”. Measured with “n–1” outputs switching from HIGH–to–LOW. The remaining output is measured in the LOW state.
2. Number of data inputs is defined as “n” switching, “n–1” inputs switching 0V to 3.3V.
AC CHARACTERISTICS1 (tR = tF = 2.5ns; CL = 50pF; RL = 500)
Limits
TA = +25°C TA = –40°C to +85°C
VCC = 3.0V to 3.6V VCC = 2.7V VCC = 3.0V to 3.6V VCC = 2.7V
Symbol Parameter Min Typ Max Min Typ Max Min Max Max Unit
f
max
Clock Pulse Frequency 150 150 MHz
t
PLH
t
PHL
Propagation Delay Clock to Output
1.5
1.5
12.5
10.0
15.0
13.0
1.5
1.5
14.0
12.0
18.0
15.0
1.5
1.5
17.0
14.5
20.0
17.0
ns
t
PLH
t
PHL
Propagation Delay Input to Output
1.5
1.5
9.5
8.0
12.0
11.0
1.5
1.5
11.0
9.5
13.5
12.5
1.5
1.5
13.5
12.0
14.5
14.0
ns
t
PLH
t
PHL
Propagation Delay Select to Output
1.5
1.5
9.5
8.5
12.0
11.0
1.5
1.5
11.0
10.0
13.0
12.5
1.5
1.5
13.0
12.5
14.5
14.0
ns
t
PZH
t
PZL
Output Enable Time OE
to An, Bn
1.5
1.5
8.0
9.0
10.5
11.0
1.5
1.5
9.5
10.0
12.0
12.5
1.5
1.5
11.0
12.0
13.0
14.0
ns
t
PHZ
t
PLZ
Output Disable Time OE
to An, Bn
1.5
1.5
9.0
8.5
11.0
10.5
1.5
1.5
10.5
9.5
12.5
12.5
1.5
1.5
12.0
12.0
14.0
14.0
ns
t
PZH
t
PZL
Output Enable Time DIR to An, Bn
1.5
1.5
9.0
10.0
12.0
12.0
1.5
1.5
12.0
11.0
14.0
14.0
1.5
1.5
13.0
12.5
16.0
16.0
ns
t
PHZ
t
PLZ
Output Disable Time DIR to An, Bn
1.5
1.5
9.0
10.0
11.0
12.5
1.5
1.5
10.0
13.0
13.0
15.5
1.5
1.5
12.0
14.0
15.0
18.0
ns
t
OSHL
t
OSLH
Output–to–Output Skew (Note 2)
1.0
1.0
1.5
1.5
1.0
1.0
1.5
1.5
1.5
1.5
ns
1. These AC parameters are preliminary and may be modified prior to release. The maximum AC limits are design targets. Actual performance will be specified upon completion of characterization.
2. Skew is defined as the absolute value of the difference between the actual propagation delay for any two separate outputs of the same device. The specification applies to any outputs switching in the same direction, either HIGH–to–LOW (t
OSHL
) or LOW–to–HIGH (t
OSLH
); parameter
guaranteed by design.
AC OPERATING REQUIREMENTS (tR = tF = 2.5ns; CL = 50pF; RL = 500)
Limits
TA = +25°C TA = –40°C to +85°C
VCC = 3.0V to 3.6V VCC = 2.7V VCC = 3.0V to 3.6V VCC = 2.7V
Symbol Parameter Min Min Min Min Unit
t
s
Setup TIme, HIGH or LOW Dn to LE 2.5 4.0 2.5 4.5 ns
t
h
Hold TIme, HIGH or LOW Dn to LE 1.5 1.5 1.5 1.5 ns
t
w
LE Pulse Width, HIGH 3.3 5.0 3.3 6.0 ns
Page 6
MC74LVQ646
MOTOROLA LVQ DATA
BR1478
6
CAPACITIVE CHARACTERISTICS
Symbol Parameter Condition Typical Unit
C
PD
Power Dissipation Capacitance 10MHz, VCC = 3.3V, VI = 0V or V
CC
50 pF
C
IN
Input Capacitance VCC = Open, VI = 0V or V
CC
4.5 pF
C
I/O
Input/Output Capacitance VCC = 3.3V, VI = 0V or V
CC
15 pF
WAVEFORM 2 – OE/DIR to An/Bn OUTPUT ENABLE AND DISABLE TIMES
tR = tF = 2.5ns, 10% to 90%; f = 1MHz; tW = 500ns
V
CC
0V
VOH – 0.3V
0V
OE
An, Bn
t
PZH
3.0V
VOL + 0.3V
50% V
CC
50% V
CC
t
PHZ
t
PZL
t
PLZ
An, Bn
50% V
CC
50% V
CC
Figure 1. AC Waveforms
WAVEFORM 1 – SAB to B and SBA to A, An to Bn PROPAGATION DELAYS
tR = tF = 2.5ns, 10% to 90%; f = 1MHz; tW = 500ns
V
CC
0V
An, Bn,
SBA, SAB
Bn, An
50% V
CC
V
OH
V
OL
t
PLH
, t
PHL
50% V
CC
DIR
Page 7
MC74LVQ646
LCX DATA BR1478
7 MOTOROLA
Figure 2. AC Waveforms
WAVEFORM 4 – INPUT PULSE DEFINITION
tR = tF = 2.5ns, 10% to 90% of 0V to V
CC
POSITIVE PULSE
NEGATIVE PULSE
50% V
CC
50% V
CC
t
w
50% V
CC
50% V
CC
t
w
WAVEFORM 3 – CLOCK to Bn/An PROPAGATION DELAYS, CLOCK MINIMUM PULSE WIDTH,
An/Bn to CLOCK SETUP AND HOLD TIMES
tR = tF = 2.5ns, 10% to 90%; f = 1MHz; tW = 500ns except when noted
V
CC
0V
An, Bn
CAB,
CBA
50% V
CC
Bn, An
V
CC
0V
V
OH
V
OL
t
PLH
, t
PHL
t
w
50% V
CC
50% V
CC
50% V
CC
t
h
t
s
f
max
OPEN
PULSE
GENERATOR
R
T
DUT
V
CC
R
L
R
1
C
L
6V GND
TEST SWITCH
t
PLH
, t
PHL
Open
t
PZL
, t
PLZ
6V
Open Collector/Drain t
PLH
and t
PHL
6V
t
PZH
, t
PHZ
GND
CL = 50pF or equivalent (Includes jig and probe capacitance) RL = R1 = 500 or equivalent RT = Z
OUT
of pulse generator (typically 50)
Figure 3. Test Circuit
Page 8
MC74LVQ646
MOTOROLA LVQ DATA
BR1478
8
OUTLINE DIMENSIONS
DW SUFFIX
PLASTIC SOIC PACKAGE
CASE 751E–04
ISSUE E
T
0.010 (0.25) A B
M
S S
MIN MINMAX MAX
MILLIMETERS INCHES
DIM
A B C D F G
J K M P R
15.25
7.40
2.35
0.35
0.41
0.23
0.13 0
°
10.05
0.25
15.54
7.60
2.65
0.49
0.90
0.32
0.29 8°
10.55
0.75
0.601
0.292
0.093
0.014
0.016
0.009
0.005 0°
0.395
0.010
0.612
0.299
0.104
0.019
0.035
0.013
0.011 8°
0.415
0.029
1.27 BSC 0.050 BSC
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.13 (0.005) TOTAL IN EXCESS OF D DIMENSION AT MAXIMUM MATERIAL CONDITION.
–A
–B
1 12
24 13
–T
C
K
SEATING PLANE
R X 45°
G 22 PL
P 12 PL
0.010 (0.25)
B
M M
F
J
M
D 24 PL
SD SUFFIX
PLASTIC SSOP PACKAGE
CASE 940D–03
ISSUE B
24 13
121
DIMAMIN MAX MIN MAX
INCHES
8.07 8.33 0.317 0.328
MILLIMETERS
B 5.20 5.38 0.205 0.212 C 1.73 1.99 0.068 0.078 D 0.05 0.21 0.002 0.008
F 0.63 0.95 0.024 0.037 G 0.65 BSC 0.026 BSC H 0.44 0.60 0.017 0.024
J 0.09 0.20 0.003 0.008
J1 0.09 0.16 0.003 0.006
K 0.25 0.38 0.010 0.015
K1 0.25 0.33 0.010 0.013
_ _ _ _
NOTES:
4 DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982. 5 CONTROLLING DIMENSION: MILLIMETER. 6 DIMENSION A DOES NOT INCLUDE MOLD FLASH,
PROTRUSIONS OR GATE BURRS. MOLD FLASH
OR GATE BURRS SHALL NOT EXCEED 0.15
(0.006) PER SIDE. 7 DIMENSION B DOES NOT INCLUDE INTERLEAD
FLASH OR PROTRUSION. INTERLEAD FLASH OR
PROTRUSION SHALL NOT EXCEED 0.15 (0.006)
PER SIDE. 8 DIMENSION K DOES NOT INCLUDE DAMBAR
PROTRUSION/INTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.13 (0.005) TOTAL IN
EXCESS OF K DIMENSION AT MAXIMUM
MATERIAL CONDITION. DAMBAR INTRUSION
SHALL NOT REDUCE DIMENSION K BY MORE
THAN 0.07 (0.002) AT LEAST MATERIAL
CONDITION. 9 TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
10 DIMENSION A AND B ARE TO BE DETERMINED
AT DATUM PLANE –W–.
L 7.65 7.90 0.301 0.311
M 0 8 0 8
F
M
DETAIL E
N
N
0.25 (0.010)
K
J
J1
K1
SECTION N–N
A
B
K24X REF
S
U
M
0.12 (0.005) V
S
T
L
L/2
PIN 1 IDENT
S
U
M
0.20 (0.008) T
–V–
–U–
H
D
C
0.076 (0.003)
G
–T–
SEATING PLANE
DETAIL E
–W–
Page 9
MC74LVQ646
LCX DATA BR1478
9 MOTOROLA
OUTLINE DIMENSIONS
DT SUFFIX
PLASTIC TSSOP PACKAGE
CASE 948H–01
ISSUE O
DIM MIN MAX MIN MAX
INCHESMILLIMETERS
A 7.70 7.90 0.303 0.311 B 4.30 4.50 0.169 0.177 C ––– 1.20 ––– 0.047 D 0.05 0.15 0.002 0.006 F 0.50 0.75 0.020 0.030 G 0.65 BSC 0.026 BSC H 0.27 0.37 0.011 0.015 J 0.09 0.20 0.004 0.008
J1 0.09 0.16 0.004 0.006
K 0.19 0.30 0.007 0.012
K1 0.19 0.25 0.007 0.010
L 6.40 BSC 0.252 BSC
M 0 8 0 8
NOTES:
1 DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982. 2 CONTROLLING DIMENSION: MILLIMETER. 3 DIMENSION A DOES NOT INCLUDE MOLD FLASH,
PROTRUSIONS OR GATE BURRS. MOLD FLASH
OR GATE BURRS SHALL NOT EXCEED 0.15
(0.006) PER SIDE. 4 DIMENSION B DOES NOT INCLUDE INTERLEAD
FLASH OR PROTRUSION. INTERLEAD FLASH OR
PROTRUSION SHALL NOT EXCEED
0.25 (0.010) PER SIDE.
5 DIMENSION K DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN
EXCESS OF THE K DIMENSION AT MAXIMUM
MATERIAL CONDITION. 6 TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY. 7 DIMENSION A AND B ARE TO BE DETERMINED
AT DATUM PLANE –W–.
_ _ _ _
S
U0.15 (0.006) T
2X L/2
S
U
M
0.10 (0.004) V
S
T
L
–U–
SEATING PLANE
0.10 (0.004)
–T–
SECTION N–N
DETAIL E
J
J1
K
K1
DETAIL E
F
M
–W–
0.25 (0.010)
13
24
12
1
PIN 1 IDENT.
H
G
A
D
C
B
S
U0.15 (0.006) T
–V–
24X REFK
N
N
Page 10
MC74LVQ646
MOTOROLA LVQ DATA
BR1478
10
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MC74LVQ646/D
*MC74LVQ646/D*
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