Datasheet MC145170P2, MC145170D2, MC145170DT2, MC74LVQ245DW, MC74LVQ245M Datasheet (Motorola)

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Page 1

SEMICONDUCTOR TECHNICAL DATA
1
REV 1
Motorola, Inc. 1995
12/95
$! "!  !  #
!! #!
The MC74LVQ245 is a high performance, non–inverting octal transceiver operating from a 2.7 to 3.6V supply. The MC74LVQ245 is suitable for memory address driving and all TTL level bus oriented transceiver applications.
Current drive capability is 12mA at both A and B ports. The Transmit/Receive (T/R
) input determines the direction of data flow through the bi–directional transceiver. Transmit (active–HIGH) enables data from A ports to B ports; Receive (active–LOW) enables data from B to A ports. The Output Enable input, when HIGH, disables both A and B ports by placing them in a HIGH Z condition.
Designed for 2.7 to 3.6V V
CC
Operation – Ideal for Low Power/Low
Noise Applications
Guaranteed Simultaneous Switching Noise Level and Dynamic
Threshold Performance
Guaranteed Skew Specifications
Guaranteed Incident Wave Switching into 75
Low Static Supply Current (10µA) Substantially Reduces System Power
Requirements
Latchup Performance Exceeds 500mA
ESD Performance: Human Body Model >2000V
Pinout: 20–Lead (Top View)
1920 18 17 16 15 14
21 3 4 5 6 7
V
CC
13
8
12
9
11
10
OE B0 B1 B2 B3 B4 B5 B6 B7
T/R
A0 A1 A2 A3 A4 A5 A6 A7 GND

LOW–VOLTAGE CMOS OCTAL TRANSCEIVER
LVQ
DW SUFFIX
PLASTIC SOIC CASE 751D–04
DT SUFFIX
PLASTIC TSSOP
CASE 948E–02
20
1
20
1
M SUFFIX
PLASTIC SOIC EIAJ
CASE 967–01
20
1
SD SUFFIX
PLASTIC SSOP
CASE 940C–03
20
1
PIN NAMES
Function
Output Enable Input Transmit/Receive Input Side A 3–State Inputs or 3–State Outputs Side B 3–State Inputs or 3–State Outputs
Pins
OE T/R A0–A7
B0–B7
Page 2
MC74LVQ245
MOTOROLA ECLinPS and ECLinPS Lite
DL140 — Rev 3
2
B0
OE
19
T/R 1
A0
B1
A1
B2
A2
B3
A3
B4
A4
B5
A5
B6
A6
B7
A7
LOGIC DIAGRAM
2
3
4
5
6
7
8
9
18
17
16
15
14
13
12
11
INPUTS
OE T/R
OPERATING MODE
Non–Inverting
L L B Data to A Bus L H A Data to B Bus
H X Z
H = High Voltage Level; L = Low Voltage Level; Z = High Impedance State; X = High or Low Voltage Level and Transitions are Acceptable; For ICC reasons, Do Not Float Inputs
Page 3
MC74LVQ245
ECLinPS and ECLinPS Lite DL140 — Rev 3
3 MOTOROLA
ABSOLUTE MAXIMUM RATINGS*
Symbol Parameter Value Condition Unit
V
CC
DC Supply Voltage –0.5 to +7.0 V
V
I
DC Input Voltage –0.5 VI VCC + 0.5V V
V
O
DC Output Voltage –0.5 VO VCC + 0.5 Output in HIGH or LOW State V
I
IK
DC Input Diode Current –20 VI = –0.5V mA
+20 VI = VCC + 0.5V mA
I
OK
DC Output Diode Current –20 VO = –0.5V mA
+20 VI = VCC + 0.5V mA
I
O
DC Output Source/Sink Current ±50 mA
I
CC
DC Supply Current ±400 mA
I
GND
DC Ground Current ±400 mA
T
STG
Storage Temperature Range –65 to +150 °C
* Absolute maximum continuous ratings are those values beyond which damage to the device may occur. Exposure to these conditions or
conditions beyond those indicated may adversely affect device reliability. Functional operation under absolute–maximum–rated conditions is not implied.
RECOMMENDED OPERATING CONDITIONS
Symbol Parameter Min Typ Max Unit
V
CC
Supply Voltage 2.0 3.3 3.6 V
V
I
Input Voltage 0 V
CC
V
V
O
Output Voltage 0 V
CC
V
T
A
Operating Free–Air Temperature –40 +85 °C
V/t Input Transition Rise or Fall Rate, VIN from 0.8V to 2.0V, VCC = 3.0V 0 125 mV/ns
DC ELECTRICAL CHARACTERISTICS
TA = –40°C to +85°C
Symbol Characteristic Condition Min Max Unit
V
IH
HIGH Level Input Voltage (Note 1) 2.7V VCC 3.6V,
VO = 0.1V or VCC – 0.1V
2.0 V
V
IL
LOW Level Input Voltage (Note 1) 2.7V VCC 3.6V,
VO = 0.1V or VCC – 0.1V
0.8 V
V
OH
HIGH Level Output Voltage 2.7V VCC 3.6V; IOH = –50µA VCC– 0.1 V
VCC = 2.7V; IOH = –12mA 2.2 VCC = 3.0V; IOH = –12mA 2.48
V
OL
LOW Level Output Voltage 2.7V VCC 3.6V; IOL = 50µA 0.1 V
2.7V VCC 3.6V; IOL= 12mA 0.4
I
I
Input Leakage Current 2.7V VCC 3.6V; VI= VCC, GND ±1.0 µA
I
OZT
Maximum I/O Leakage Current VI(OE) = VIL, VIH; VI, VO= VCC, GND ±3 µA
I
OLD
Minimum Dynamic Output Current (Note 2) VCC = 3.6V; V
OLD
= 0.8V Max 36 mA
I
OHD
VCC = 3.6V; V
OHD
= 2.0V Min –25 mA
I
CC
Quiescent Supply Current 2.7V VCC 3.6V; VI = VCC, GND 10 µA
1. These values of VI are used to test DC electrical characteristics only. Functional test should use VIH 2.4V, VIL 0.5V.
2. Incident wave switching on transmission lines with impedances as low as 75 for commercial temperature range is guaranteed. Maximum test
duration is 2ms, one output loaded at a time.
Page 4
MC74LVQ245
MOTOROLA ECLinPS and ECLinPS Lite
DL140 — Rev 3
4
DYNAMIC SWITCHING CHARACTERISTICS (VCC = 3.3V)
TA = +25°C
Symbol Characteristic Condition Min Typ Max Unit
V
OLP
Dynamic LOW Peak Voltage (Note 1) CL = 50pF, VIH = 3.3V, VIL = 0V 0.6 1.0 V
V
OLV
Dynamic LOW Valley Voltage (Note 1) CL = 50pF, VIH = 3.3V, VIL = 0V –0.5 –1.0 V
V
IHD
High Level Dynamic Input Voltage (Note 2)
Input–Under–Test Switching 0V to Threshold,
f=1MHz
1.5 2.0 V
V
ILD
Low Level Dynamic Input Voltage (Note 2)
Input–Under–Test Switching 3.3V to Threshold,
f=1MHz
1.5 0.8 V
1. Number of outputs defined as “n”. Measured with “n–1” outputs switching from HIGH–to–LOW. The remaining output is measured in the
LOW state.
2. Number of data inputs is defined as “n” switching, “n–1” inputs switching 0V to 3.3V.
AC CHARACTERISTICS (tR = tF = 2.5ns; CL = 50pF; RL = 500)
Limits
TA = +25°C TA = –40°C to +85°C
VCC = 3.0V to 3.6V VCC = 2.7V VCC = 3.0V to 3.6V VCC = 2.7V
Symbol Parameter Min Typ Max Min Typ Max Min Max Max Unit
t
PLH
t
PHL
Propagation Delay Input to Output
2.0
2.0
7.0
7.0
10.0
10.0
2.0
2.0
8.0
8.0
11.5
11.5
2.0
2.0
10.5
10.5
12.5
12.5
ns
t
PZH
t
PZL
Output Enable Time to High and Low Level
2.5
2.5
8.0
8.5
11.5
13.0
2.5
2.5
9.5
11.0
13.5
15.0
2.5
2.5
13.0
13.5
15.0
16.5
ns
t
PHZ
t
PLZ
Output Disable Time From High and Low Level
1.0
1.0
8.5
8.5
12.5
12.5
1.0
1.0
10.5
10.5
14.0
15.0
1.0
1.0
14.0
14.0
15.0
17.0
ns
t
OSHL
t
OSLH
Output–to–Output Skew (Note 1)
1.0
1.0
1.5
1.5
1.0
1.0
1.5
1.5
1.5
1.5
ns
1. Skew is defined as the absolute value of the difference between the actual propagation delay for any two separate outputs of the same device.
The specification applies to any outputs switching in the same direction, either HIGH–to–LOW (t
OSHL
) or LOW–to–HIGH (t
OSLH
); parameter
guaranteed by design.
CAPACITIVE CHARACTERISTICS
Symbol Parameter Condition Typical Unit
C
PD
Power Dissipation Capacitance 10MHz, VCC = 3.3V, VI = 0V or V
CC
27 pF
C
IN
Input Capacitance VCC = Open, VI = 0V or V
CC
4.5 pF
C
I/O
Input/Output Capacitance VCC = 3.3V, VI = 0V or V
CC
15 pF
Page 5
MC74LVQ245
ECLinPS and ECLinPS Lite DL140 — Rev 3
5 MOTOROLA
WAVEFORM 1 – PROPAGATION DELAYS
tR = tF = 2.5ns, 10% to 90%; f = 1MHz; tW = 500ns
V
CC
0V
V
OH
V
OL
An, Bn
Bn, An
t
PHL
t
PLH
WAVEFORM 2 – OUTPUT ENABLE AND DISABLE TIMES
tR = tF = 2.5ns, 10% to 90%; f = 1MHz; tW = 500ns
V
CC
0V
OE
, T/R
An, Bn
t
PZH
t
PHZ
t
PZL
t
PLZ
An, Bn
50% V
CC
50% V
CC
50% V
CC
50% V
CC
50% VCC 50% V
CC
Figure 1. AC Waveforms
50% V
CC
V
CC
VOH – 0.3V
VOL + 0.3V GND
50% V
CC
OPEN
PULSE
GENERATOR
R
T
DUT
V
CC
R
L
R
1
C
L
2
V
CC
TEST SWITCH
t
PLH
, t
PHL
Open
t
PZL
, t
PLZ
2 V
CC
Open Collector/Drain t
PLH
and t
PHL
2 V
CC
t
PZH
, t
PHZ
Open
CL = 50pF or equivalent (Includes jig and probe capacitance) RL = R1 = 500 or equivalent RT = Z
OUT
of pulse generator (typically 50)
Figure 2. Test Circuit
Page 6
MC74LVQ245
MOTOROLA ECLinPS and ECLinPS Lite
DL140 — Rev 3
6
OUTLINE DIMENSIONS
DW SUFFIX
PLASTIC SOIC PACKAGE
CASE 751D–04
ISSUE E
M SUFFIX
PLASTIC SOIC EIAJ PACKAGE
CASE 967–01
ISSUE O
MIN MINMAX MAX
MILLIMETERS INCHES
DIM
A B C D F G J K M P R
0.510
0.299
0.104
0.019
0.035
0.012
0.009 7
°
0.415
0.029
0.499
0.292
0.093
0.014
0.020
0.010
0.004 0°
0.395
0.010
12.95
7.60
2.65
0.49
0.90
0.32
0.25 7°
10.55
0.75
12.65
7.40
2.35
0.35
0.50
0.25
0.10 0°
10.05
0.25
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.150 (0.006) PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.13 (0.005) TOTAL IN EXCESS OF D DIMENSION AT MAXIMUM MATERIAL CONDITION.
1.27 BSC 0.050 BSC
–A
–B
P 10 PL
1 10
1120
–T
D
20 PL
K
C
SEATING PLANE
R X 45°
M
0.010 (0.25)
B
M M
0.010 (0.25) T A B
M
S S
G 18 PL
F
J
DIM MIN MAX MIN MAX
INCHES
--- 2.05 --- 0.081
MILLIMETERS
0.05 0.20 0.002 0.008
0.35 0.50 0.014 0.020
0.18 0.27 0.007 0.011
12.35 12.80 0.486 0.504
5.10 5.45 0.201 0.215
1.27 BSC 0.050 BSC
7.40 8.20 0.291 0.323
0.50 0.85 0.020 0.033
1.10 1.50 0.043 0.059 0
0.70 0.90 0.028 0.035
--- 0.81 --- 0.032
A
1
A
b c D E e
L
M
Z
H
E
Q
1
L
E
_
10
_
0
_
10
_
NOTES:
1 DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982. 2 CONTROLLING DIMENSION: MILLIMETER. 3 DIMENSIONS D AND E DO NOT INCLUDE MOLD
FLASH OR PROTRUSIONS AND ARE MEASURED
AT THE PARTING LINE. MOLD FLASH OR
PROTRUSIONS SHALL NOT EXCEED 0.15 (0.006)
PER SIDE. 4 TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY. 5 THE LEAD WIDTH DIMENSION (b) DOES NOT
INCLUDE DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08 (0.003)
TOTAL IN EXCESS OF THE LEAD WIDTH
DIMENSION AT MAXIMUM MATERIAL CONDITION.
DAMBAR CANNOT BE LOCATED ON THE LOWER
RADIUS OR THE FOOT. MINIMUM SPACE
BETWEEN PROTRUSIONS AND ADJACENT LEAD
TO BE 0.46 ( 0.018).
Z
D
HEE
1
20 11
10
b
A
1
e
L
L
E
Q
1
M
_
VIEW P
DETAIL P
0.13 (0.005)
M
0.10 (0.004)
c
A
Page 7
MC74LVQ245
ECLinPS and ECLinPS Lite DL140 — Rev 3
7 MOTOROLA
OUTLINE DIMENSIONS
SD SUFFIX
PLASTIC SSOP PACKAGE
CASE 940C–03
ISSUE B
DT SUFFIX
PLASTIC TSSOP PACKAGE
CASE 948E–02
ISSUE A
DIMAMIN MAX MIN MAX
INCHES
6.60 0.260
MILLIMETERS
B 4.30 4.50 0.169 0.177 C 1.20 0.047 D 0.05 0.15 0.002 0.006
F 0.50 0.75 0.020 0.030 G 0.65 BSC 0.026 BSC H 0.27 0.37 0.011 0.015 J 0.09 0.20 0.004 0.008
J1 0.09 0.16 0.004 0.006
K 0.19 0.30 0.007 0.012
K1 0.19 0.25 0.007 0.010
L 6.40 BSC 0.252 BSC M 0 8 0 8
_ _ _ _
NOTES:
6 DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982. 7 CONTROLLING DIMENSION: MILLIMETER. 8 DIMENSION A DOES NOT INCLUDE MOLD FLASH,
PROTRUSIONS OR GATE BURRS. MOLD FLASH
OR GATE BURRS SHALL NOT EXCEED 0.15
(0.006) PER SIDE. 9 DIMENSION B DOES NOT INCLUDE INTERLEAD
FLASH OR PROTRUSION. INTERLEAD FLASH OR
PROTRUSION SHALL NOT EXCEED 0.25 (0.010)
PER SIDE.
10 DIMENSION K DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN
EXCESS OF THE K DIMENSION AT MAXIMUM
MATERIAL CONDITION.
11 TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
12 DIMENSION A AND B ARE TO BE DETERMINED
AT DATUM PLANE –W–.
1 10
1120
PIN 1 IDENT
A
B
–T–
0.100 (0.004)
C
D
G
H
SECTION N–N
K
K1
J J1
N
N
M
F
–W–
SEATING PLANE
–V–
–U–
S
U
M
0.10 (0.004) V
S
T
20X REFK
L
L/2
2X
S
U0.15 (0.006) T
DETAIL E
0.25 (0.010)
DETAIL E
6.40 0.252 ––– –––
S
U0.15 (0.006) T
20 11
101
H
A
B
F
M
K20X REF
S
U
M
0.12 (0.005) V
S
T
L
L/2
PIN 1 IDENT
S
U
M
0.20 (0.008) T
–V–
–U–
D
C
0.076 (0.003)
G
–T–
SEATING PLANE
DETAIL E
N
N
0.25 (0.010)
K
J
J1
K1
SECTION N–N
DIMAMIN MAX MIN MAX
INCHES
7.07 7.33 0.278 0.288
MILLIMETERS
B 5.20 5.38 0.205 0.212 C 1.73 1.99 0.068 0.078 D 0.05 0.21 0.002 0.008
F 0.63 0.95 0.024 0.037 G 0.65 BSC 0.026 BSC H 0.59 0.75 0.023 0.030
J 0.09 0.20 0.003 0.008
J1 0.09 0.16 0.003 0.006
K 0.25 0.38 0.010 0.015
K1 0.25 0.33 0.010 0.013
_ _ _ _
NOTES:
13 DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982. 14 CONTROLLING DIMENSION: MILLIMETER. 15 DIMENSION A DOES NOT INCLUDE MOLD FLASH,
PROTRUSIONS OR GATE BURRS. MOLD FLASH
OR GATE BURRS SHALL NOT EXCEED 0.15
(0.006) PER SIDE. 16 DIMENSION B DOES NOT INCLUDE INTERLEAD
FLASH OR PROTRUSION. INTERLEAD FLASH OR
PROTRUSION SHALL NOT EXCEED 0.15 (0.006)
PER SIDE. 17 DIMENSION K DOES NOT INCLUDE DAMBAR
PROTRUSION/INTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.13 (0.005) TOTAL IN
EXCESS OF K DIMENSION AT MAXIMUM
MATERIAL CONDITION. DAMBAR INTRUSION
SHALL NOT REDUCE DIMENSION K BY MORE
THAN 0.07 (0.002) AT LEAST MATERIAL
CONDITION. 18 TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY. 19 DIMENSION A AND B ARE TO BE DETERMINED
AT DATUM PLANE –W–.
L 7.65 7.90 0.301 0.311
M 0 8 0 8
DETAIL E
–W–
Page 8
MC74LVQ245
MOTOROLA ECLinPS and ECLinPS Lite
DL140 — Rev 3
8
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MC74LVQ245/D
*MC74LVQ245/D*
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