Datasheet MC74LCX374DW, MC74LCX374DWR2, MC74LCX374DTEL, MC74LCX374MEL, MC74LCX374ML1 Datasheet (MOTOROLA)



SEMICONDUCTOR TECHNICAL DATA

1

REV 3

 Motorola, Inc. 1996

11/96

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&& "!!($&!

The MC74LCX374 is a high performance, non–inverting octal D–type
flip–flop operating from a 2.7 to 3.6V supply. High impedance TTL
compatible inputs significantly reduce current loading to input drivers
while TTL compatible outputs offer improved switching noise
performance. A VI specification of 5.5V allows MC74LCX374 inputs to be
safely driven from 5V devices.

The MC74LCX374 consists of 8 edge–triggered flip–flops with
individual D–type inputs and 3–state true outputs. The buffered clock and
buffered Output Enable (OE

) are common to all flip–flops. The eight
flip–flops will store the state of individual D inputs that meet the setup and
hold time requirements on the LOW–to–HIGH Clock (CP) transition. With
the OE

LOW, the contents of the eight flip–flops are available at the

outputs. When the OE

is HIGH, the outputs go to the high impedance

state. The OE

input level does not affect the operation of the flip–flops.

• Designed for 2.7 to 3.6V V

CC

Operation

• 5V T olerant — Interface Capability With 5V TTL Logic

• Supports Live Insertion and Withdrawal

• I

OFF

Specification Guarantees High Impedance When VCC = 0V

• LVTTL Compatible

• LVCMOS Compatible

• 24mA Balanced Output Sink and Source Capability

• Near Zero Static Supply Current in All Three Logic States (10µA)

Substantially Reduces System Power Requirements

• Latchup Performance Exceeds 500mA

• ESD Performance: Human Body Model >2000V; Machine Model >200V

Pinout: 20–Lead (Top View)

1920 18 17 16 15 14

21 34567

V

CC

13

8

12

9

11

10

O7 D7 D6 O6 O5 D5 D4 O4 CP

OE

O0 D0 D1 O1 O2 D2 D3 O3 GND

DW SUFFIX

PLASTIC SOIC
CASE 751D–04

DT SUFFIX

PLASTIC TSSOP

CASE 948E–02

20

1

20

1

M SUFFIX

PLASTIC SOIC EIAJ

CASE 967–01

20

1

SD SUFFIX

PLASTIC SSOP

CASE 940C–03

20

1

PIN NAMES

Function

Output Enable Input
Clock Pulse Input
Data Inputs
3–State Outputs

Pins

OE
CP
D0–D7
O0–O7



LOW–VOLTAGE CMOS

OCTAL D–TYPE FLIP–FLOP

MC74LCX374

MOTOROLA LCX DATA

BR1339 — REV 3

2

O0

D0

O1

D1

O2

D2

O3

D3

O4

D4

O5

D5

O6

D6

O7

D7

LOGIC DIAGRAM

nCP

Q

D

nCP

Q

D

nCP

Q

D

nCP

Q

D

nCP

Q

D

nCP

Q

D

nCP

Q

D

nCP

Q

D

CP

OE

3

4

7

8

13

14

17

18

2

5

6

9

12

15

16

19

11

1

INPUTS OUTPUTS

OE CP Dn On

OPERATING MODE

L
L

↑

↑

l

h

L
H

Load and Read Register

L ↑ X NC Hold and Read Register
H ↑ X Z Hold and Disable Outputs
H

H

↑
↑

l

h

Z
Z

Load Internal Register and Disable Outputs

H = High Voltage Level; h = High V oltage Level One Setup Time Prior to the Low–to–High Clock Transition; L = Low
Voltage Level; l = Low V oltage Level One Setup Time Prior to the Low–to–High Clock Transition; NC = No Change, State
Prior to Low–to–High Clock Transition; X = High or Low Voltage Level and Transitions are Acceptable; Z = High
Impedance State; ↑= Low–to–High Transition; ↑

= Not a Low–to–High Transition; For ICC Reasons DO NOT FLOAT

Inputs

MC74LCX374

LCX DATA
BR1339 — REV 3

3 MOTOROLA

ABSOLUTE MAXIMUM RATINGS*

Symbol Parameter Value Condition Unit

V

CC

DC Supply Voltage –0.5 to +7.0 V

V

I

DC Input Voltage –0.5 ≤ VI ≤ +7.0 V

V

O

DC Output Voltage –0.5 ≤ VO ≤ +7.0 Output in 3–State V

–0.5 ≤ VO ≤ VCC + 0.5 Note 1. V

I

IK

DC Input Diode Current –50 VI < GND mA

I

OK

DC Output Diode Current –50 VO < GND mA

+50 VO > V

CC

mA

I

O

DC Output Source/Sink Current ±50 mA

I

CC

DC Supply Current Per Supply Pin ±100 mA

I

GND

DC Ground Current Per Ground Pin ±100 mA

T

STG

Storage Temperature Range –65 to +150 °C

* Absolute maximum continuous ratings are those values beyond which damage to the device may occur. Exposure to these conditions or conditions

beyond those indicated may adversely affect device reliability. Functional operation under absolute–maximum–rated conditions is not implied.

1. Output in HIGH or LOW State. IO absolute maximum rating must be observed.

RECOMMENDED OPERATING CONDITIONS

Symbol Parameter Min Typ Max Unit

V

CC

Supply Voltage Operating

Data Retention Only

2.0

1.5

3.3

3.3

3.6

3.6

V

V

I

Input Voltage 0 5.5 V

V

O

Output Voltage (HIGH or LOW State)

(3–State)

0
0

V

CC

5.5

V

I

OH

HIGH Level Output Current, VCC = 3.0V – 3.6V –24 mA

I

OL

LOW Level Output Current, VCC = 3.0V – 3.6V 24 mA

I

OH

HIGH Level Output Current, VCC = 2.7V – 3.0V –12 mA

I

OL

LOW Level Output Current, VCC = 2.7V – 3.0V 12 mA

T

A

Operating Free–Air Temperature –40 +85 °C

∆t/∆V Input Transition Rise or Fall Rate, VIN from 0.8V to 2.0V ,

VCC = 3.0V

0 10 ns/V

DC ELECTRICAL CHARACTERISTICS

TA = –40°C to +85°C

Symbol Characteristic Condition Min Max Unit

V

IH

HIGH Level Input Voltage (Note 2.) 2.7V ≤ VCC ≤ 3.6V 2.0 V

V

IL

LOW Level Input Voltage (Note 2.) 2.7V ≤ VCC ≤ 3.6V 0.8 V

V

OH

HIGH Level Output Voltage 2.7V ≤ VCC ≤ 3.6V; IOH = –100µA VCC– 0.2 V

VCC = 2.7V; IOH = –12mA 2.2
VCC = 3.0V; IOH = –18mA 2.4
VCC = 3.0V; IOH = –24mA 2.2

V

OL

LOW Level Output Voltage 2.7V ≤ VCC ≤ 3.6V; IOL = 100µA 0.2 V

VCC = 2.7V; IOL= 12mA 0.4
VCC = 3.0V; IOL = 16mA 0.4
VCC = 3.0V; IOL = 24mA 0.55

2. These values of VI are used to test DC electrical characteristics only.

MC74LCX374

MOTOROLA LCX DATA

BR1339 — REV 3

4

DC ELECTRICAL CHARACTERISTICS (continued)

TA = –40°C to +85°C

Symbol Characteristic Condition Min Max Unit

I

I

Input Leakage Current 2.7V ≤ VCC ≤ 3.6V; 0V ≤ VI ≤ 5.5V ±5.0 µA

I

OZ

3–State Output Current 2.7 ≤ VCC ≤ 3.6V; 0V ≤ VO ≤ 5.5V;

VI = VIH or V

IL

±5.0 µA

I

OFF

Power–Off Leakage Current VCC = 0V; VI or VO = 5.5V 10 µA

I

CC

Quiescent Supply Current

2.7 ≤ VCC ≤ 3.6V; VI = GND or V

CC

10 µA

2.7 ≤ VCC ≤ 3.6V; 3.6 ≤ VI or VO ≤ 5.5V ±10 µA

∆I

CC

Increase in ICC per Input 2.7 ≤ VCC ≤ 3.6V; VIH = VCC – 0.6V 500 µA

AC CHARACTERISTICS (tR = tF = 2.5ns; CL = 50pF; RL = 500Ω)

Limits

TA = –40°C to +85°C

VCC = 3.0V to 3.6V VCC = 2.7V

Symbol Parameter Waveform Min Max Min Max Unit

f

max

Clock Pulse Frequency 1 150 MHz

t

PLH

t

PHL

Propagation Delay
CP to O

n

1 1.5

1.5

8.5

8.5

1.5

1.5

9.5

9.5

ns

t

PZH

t

PZL

Output Enable Time to HIGH and LOW
Levels

2 1.5

1.5

8.5

8.5

1.5

1.5

9.5

9.5

ns

t

PHZ

t

PLZ

Output Disable Time from HIGH and
LOW Levels

2 1.5

1.5

7.5

7.5

1.5

1.5

8.5

8.5

ns

t

s

Setup TIme, HIGH or LOW Dn to CP 1 2.5 2.5 ns

t

h

Hold TIme, HIGH or LOW Dn to CP 1 1.5 1.5 ns

t

w

CP Pulse Width, HIGH or LOW 3 3.3 3.3 ns

t

OSHL

t

OSLH

Output–to–Output Skew
(Note 3.)

1.0

1.0

ns

3. Skew is defined as the absolute value of the difference between the actual propagation delay for any two separate outputs of the same device.
The specification applies to any outputs switching in the same direction, either HIGH–to–LOW (t

OSHL

) or LOW–to–HIGH (t

OSLH

); parameter

guaranteed by design.

DYNAMIC SWITCHING CHARACTERISTICS

TA = +25°C

Symbol Characteristic Condition Min Typ Max Unit

V

OLP

Dynamic LOW Peak Voltage (Note 4.) VCC = 3.3V , CL = 50pF, VIH = 3.3V , VIL = 0V 0.8 V

V

OLV

Dynamic LOW Valley Voltage (Note 4.) VCC = 3.3V , CL = 50pF, VIH = 3.3V , VIL = 0V 0.8 V

4. Number of outputs defined as “n”. Measured with “n–1” outputs switching from HIGH–to–LOW or LOW–to–HIGH. The remaining output is
measured in the LOW state.

CAPACITIVE CHARACTERISTICS

Symbol Parameter Condition Typical Unit

C

IN

Input Capacitance VCC = 3.3V , VI = 0V or V

CC

7 pF

C

OUT

Output Capacitance VCC = 3.3V , VI = 0V or V

CC

8 pF

C

PD

Power Dissipation Capacitance 10MHz, VCC = 3.3V , VI = 0V or V

CC

25 pF

MC74LCX374

LCX DATA
BR1339 — REV 3

5 MOTOROLA

WAVEFORM 3 – PULSE WIDTH

tR = tF = 2.5ns (or fast as required) from 10% to 90%;

Output requirements: VOL

≤

0.8V , VOH ≥ 2.0V

2.7V

0V

2.7V

0V

1.5V

1.5V

Figure 1. AC Waveforms

t

w

1.5V

1.5V

t

w

WAVEFORM 2 – OUTPUT ENABLE AND DISABLE TIMES

tR = tF = 2.5ns, 10% to 90%; f = 1MHz; tW = 500ns

2.7V

0V

≈

0V

OE

On

t

PZH

≈

3.0V

t

PHZ

t

PZL

t

PLZ

On

1.5V

1.5V

1.5V

V

CC

VOH – 0.3V

VOL + 0.3V
GND

1.5V

CP

CP

WAVEFORM 1 – PROPAGATION DELAYS, SETUP AND HOLD TIMES

tR = tF = 2.5ns, 10% to 90%; f = 1MHz; tW = 500ns

2.7V

0V

Dn

CP

1.5V

On

2.7V

0V

V

OH

V

OL

t

PLH

, t

PHL

t

h

t

s

1.5V

1.5V

f

max

OPEN

PULSE

GENERATOR

R

T

DUT

V

CC

R

L

R

1

C

L

6V
GND

TEST SWITCH

t

PLH

, t

PHL

Open

t

PZL

, t

PLZ

6V

Open Collector/Drain t

PLH

and t

PHL

6V

t

PZH

, t

PHZ

GND

CL = 50pF or equivalent (Includes jig and probe capacitance)
RL = R1 = 500Ω or equivalent
RT = Z

OUT

of pulse generator (typically 50Ω)

Figure 2. Test Circuit

MC74LCX374

MOTOROLA LCX DATA

BR1339 — REV 3

6

OUTLINE DIMENSIONS

DW SUFFIX

PLASTIC SOIC PACKAGE

CASE 751D–04

ISSUE E

M SUFFIX

PLASTIC SOIC EIAJ PACKAGE

CASE 967–01

ISSUE O

MIN MINMAX MAX

MILLIMETERS INCHES

DIM

A
B
C
D
F
G
J
K
M
P
R

0.510

0.299

0.104

0.019

0.035

0.012

0.009
7

°

0.415

0.029

0.499

0.292

0.093

0.014

0.020

0.010

0.004
0

°

0.395

0.010

12.95

7.60

2.65

0.49

0.90

0.32

0.25
7

°

10.55

0.75

12.65

7.40

2.35

0.35

0.50

0.25

0.10
0

°

10.05

0.25

NOTES:

1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.

2. CONTROLLING DIMENSION: MILLIMETER.

3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.

4. MAXIMUM MOLD PROTRUSION 0.150
(0.006) PER SIDE.

5. DIMENSION D DOES NOT INCLUDE
DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.13
(0.005) TOTAL IN EXCESS OF D DIMENSION
AT MAXIMUM MATERIAL CONDITION.

1.27 BSC 0.050 BSC

–A

–

–B

–

P 10 PL

110

1120

–T

–

D

20 PL

K

C

SEATING
PLANE

R X 45°

M

0.010 (0.25)

B

M M

0.010 (0.25) T A B

M

S S

G 18 PL

F

J

DIM MIN MAX MIN MAX

INCHES

--- 2.05 --- 0.081

MILLIMETERS

0.05 0.20 0.002 0.008

0.35 0.50 0.014 0.020

0.18 0.27 0.007 0.011

12.35 12.80 0.486 0.504

5.10 5.45 0.201 0.215

1.27 BSC 0.050 BSC

7.40 8.20 0.291 0.323

0.50 0.85 0.020 0.033

1.10 1.50 0.043 0.059
0

0.70 0.90 0.028 0.035

--- 0.81 --- 0.032

A

1

A

b
c
D
E
e

L

M

Z

H

E

Q

1

L

E

_

10

_

0

_

10

_

NOTES:

1 DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.
2 CONTROLLING DIMENSION: MILLIMETER.
3 DIMENSIONS D AND E DO NOT INCLUDE MOLD

FLASH OR PROTRUSIONS AND ARE MEASURED

AT THE PARTING LINE. MOLD FLASH OR

PROTRUSIONS SHALL NOT EXCEED 0.15 (0.006)

PER SIDE.
4 TERMINAL NUMBERS ARE SHOWN FOR

REFERENCE ONLY.
5 THE LEAD WIDTH DIMENSION (b) DOES NOT

INCLUDE DAMBAR PROTRUSION. ALLOWABLE

DAMBAR PROTRUSION SHALL BE 0.08 (0.003)

TOTAL IN EXCESS OF THE LEAD WIDTH

DIMENSION AT MAXIMUM MA TERIAL CONDITION.

DAMBAR CANNOT BE LOCATED ON THE LOWER

RADIUS OR THE FOOT. MINIMUM SPACE

BETWEEN PROTRUSIONS AND ADJACENT LEAD

TO BE 0.46 ( 0.018).

Z

D

HEE

1

20 11

10

b

A

1

e

L

L

E

Q

1

M

_

VIEW P

DETAIL P

0.13 (0.005)

M

0.10 (0.004)

c

A

MC74LCX374

LCX DATA
BR1339 — REV 3

7 MOTOROLA

OUTLINE DIMENSIONS

SD SUFFIX

PLASTIC SSOP PACKAGE

CASE 940C–03

ISSUE B

DT SUFFIX

PLASTIC TSSOP PACKAGE

CASE 948E–02

ISSUE A

DIMAMIN MAX MIN MAX

INCHES

6.60 0.260

MILLIMETERS

B 4.30 4.50 0.169 0.177
C 1.20 0.047
D 0.05 0.15 0.002 0.006
F 0.50 0.75 0.020 0.030
G 0.65 BSC 0.026 BSC
H 0.27 0.37 0.011 0.015

J 0.09 0.20 0.004 0.008

J1 0.09 0.16 0.004 0.006

K 0.19 0.30 0.007 0.012

K1 0.19 0.25 0.007 0.010

L 6.40 BSC 0.252 BSC
M 0 8 0 8

____

NOTES:

6 DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.
7 CONTROLLING DIMENSION: MILLIMETER.
8 DIMENSION A DOES NOT INCLUDE MOLD FLASH,

PROTRUSIONS OR GATE BURRS. MOLD FLASH

OR GATE BURRS SHALL NOT EXCEED 0.15

(0.006) PER SIDE.
9 DIMENSION B DOES NOT INCLUDE INTERLEAD

FLASH OR PROTRUSION. INTERLEAD FLASH OR

PROTRUSION SHALL NOT EXCEED 0.25 (0.010)

PER SIDE.

10 DIMENSION K DOES NOT INCLUDE DAMBAR

PROTRUSION. ALLOWABLE DAMBAR

PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN

EXCESS OF THE K DIMENSION AT MAXIMUM

MATERIAL CONDITION.

11 TERMINAL NUMBERS ARE SHOWN FOR

REFERENCE ONLY.

12 DIMENSION A AND B ARE TO BE DETERMINED

AT DATUM PLANE –W–.

110

1120

PIN 1
IDENT

A

B

–T–

0.100 (0.004)

C

D

G

H

SECTION N–N

K

K1

JJ1

N

N

M

F

–W–

SEATING
PLANE

–V–

–U–

S

U

M

0.10 (0.004) V

S

T

20X REFK

L

L/2

2X

S

U0.15 (0.006) T

DETAIL E

0.25 (0.010)

DETAIL E

6.40 0.252
––– –––

S

U0.15 (0.006) T

20 11

101

H

A

B

F

M

K20X REF

S

U

M

0.12 (0.005) V

S

T

L

L/2

PIN 1
IDENT

S

U

M

0.20 (0.008) T

–V–

–U–

D

C

0.076 (0.003)

G

–T–

SEATING
PLANE

DETAIL E

N

N

0.25 (0.010)

K

J

J1

K1

SECTION N–N

DIMAMIN MAX MIN MAX

INCHES

7.07 7.33 0.278 0.288

MILLIMETERS

B 5.20 5.38 0.205 0.212
C 1.73 1.99 0.068 0.078
D 0.05 0.21 0.002 0.008
F 0.63 0.95 0.024 0.037
G 0.65 BSC 0.026 BSC
H 0.59 0.75 0.023 0.030

J 0.09 0.20 0.003 0.008

J1 0.09 0.16 0.003 0.006

K 0.25 0.38 0.010 0.015

K1 0.25 0.33 0.010 0.013

____

NOTES:

13 DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.
14 CONTROLLING DIMENSION: MILLIMETER.
15 DIMENSION A DOES NOT INCLUDE MOLD FLASH,

PROTRUSIONS OR GATE BURRS. MOLD FLASH

OR GATE BURRS SHALL NOT EXCEED 0.15

(0.006) PER SIDE.
16 DIMENSION B DOES NOT INCLUDE INTERLEAD

FLASH OR PROTRUSION. INTERLEAD FLASH OR

PROTRUSION SHALL NOT EXCEED 0.15 (0.006)

PER SIDE.
17 DIMENSION K DOES NOT INCLUDE DAMBAR

PROTRUSION/INTRUSION. ALLOWABLE DAMBAR

PROTRUSION SHALL BE 0.13 (0.005) TOTAL IN

EXCESS OF K DIMENSION AT MAXIMUM

MATERIAL CONDITION. DAMBAR INTRUSION

SHALL NOT REDUCE DIMENSION K BY MORE

THAN 0.07 (0.002) AT LEAST MATERIAL

CONDITION.
18 TERMINAL NUMBERS ARE SHOWN FOR

REFERENCE ONLY.
19 DIMENSION A AND B ARE TO BE DETERMINED

AT DATUM PLANE –W–.

L 7.65 7.90 0.301 0.311
M 0 8 0 8

DETAIL E

–W–

MC74LCX374

MOTOROLA LCX DATA

BR1339 — REV 3

8

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the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and
specifically disclaims any and all liability, including without limitation consequential or incidental damages. “T ypical” parameters which may be provided in Motorola
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MC74LCX374/D

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