Page 1
SEMICONDUCTOR TECHNICAL DATA
1
REV 6
Motorola, Inc. 1995
10/95
High–Performance Silicon–Gate CMOS
The MC74HC76 is identical in pinout to the LS76. The device inputs
are compatible with Standard CMOS outputs; with pullup resistors, they
are compatible with LSTTL outputs.
Each flip–flop is negative–edge clocked and has active–low asynchronous Set and Reset inputs.
The HC76 is identical in function to the HC112, but has a different
pinout.
• Similar in Function to the LS76 Except When Set and Reset Are
Low Simultaneously
• Output Drive Capability: 10 LSTTL Loads
• Outputs Directly Interface to CMOS, NMOS and TTL
• Operating Voltage Range: 2 to 6V
• Low Input Current: 1µA
• High Noise Immunity Characteristic of CMOS Devices
• In Compliance With the JEDEC Standard No. 7A Requirements
• Chip Complexity: 100 FETs or 25 Equivalent Gates
15
Q1
2
Set1
PIN 5 = V
CC
PIN 13 = GND
LOGIC DIAGRAM
16
K1
1
Clock1
4
J1
3
Reset1
14
Q1
11
Q2
7
Set2
12
K2
6
Clock2
9
J2
8
Reset2
10
Q2
FUNCTION TABLE
Inputs Outputs
Set Reset Clock J K Q Q
L H X X X H L
H L X X X L H
L L X X X L* L*
H H L L No Change
H H L H L H
H H H L H L
H H H H Toggle
H H L X X No Change
H H H X X No Change
H H X X No Change
* Both outputs will remain low as long as Set and Reset are low, but the output states are
unpredictable if Set and Reset go high simultaneously.
161
152
143
134
K1Clock1
125
116
107
98
Q1Set1
Q1Reset1
GNDJ1
K2V
CC
Q2
Clock2
Q2
Set2
J2Reset2
Pinout: 16–Lead Packages (Top View)
D SUFFIX
SOIC PACKAGE
CASE 751B–05
N SUFFIX
PLASTIC PACKAGE
CASE 648–08
ORDERING INFORMATION
MC74HCXXN
MC74HCXXD
Plastic
SOIC
1
16
1
16
Page 2
MC74HC76
MOTOROLA High–Speed CMOS Logic Data
DL129 — Rev 6
2
MAXIMUM RATINGS*
Symbol
Parameter
Value
Unit
V
CC
DC Supply Voltage (Referenced to GND)
– 0.5 to + 7.0
V
V
in
DC Input Voltage (Referenced to GND)
– 0.5 to VCC + 0.5
V
V
out
DC Output Voltage (Referenced to GND)
– 0.5 to VCC + 0.5
V
I
in
DC Input Current, per Pin
± 20
mA
I
out
DC Output Current, per Pin
± 25
mA
I
CC
DC Supply Current, VCC and GND Pins
± 50
mA
P
D
Power Dissipation in Still Air Plastic DIP†
SOIC Package†
750
500
mW
T
stg
Storage Temperature Range
– 65 to + 150
_
C
T
L
Lead Temperature, 1 mm from Case for 10 Seconds
Plastic DIP or SOIC Package
260
_
C
*Maximum Ratings are those values beyond which damage to the device may occur.
Functional operation should be restricted to the Recommended Operating Conditions.
†Derating — Plastic DIP: – 10 mW/_C from 65_ to 125_C
SOIC Package: – 7 mW/_C from 65_ to 125_C
For high frequency or heavy load considerations, see Chapter 2 of the Motorola High–Speed CMOS Data Book (DL129/D).
RECOMMENDED OPERATING CONDITIONS
Symbol
Parameter
Min
Max
Unit
V
CC
DC Supply Voltage (Referenced to GND)
2.0
6.0
V
Vin, V
out
DC Input Voltage, Output Voltage (Referenced to GND)
0
V
CC
V
T
A
Operating Temperature, All Package Types
– 55
+ 125
_
C
tr, t
f
Input Rise/Fall Time VCC = 2.0 V
(Figure 1) VCC = 4.5 V
VCC = 6.0 V
0
0
0
1000
500
400
ns
DC CHARACTERISTICS (Voltages Referenced to GND)
Guaranteed Limit
Symbol Parameter Condition
V
CC
V
–55 to 25°C ≤85°C ≤125°C Unit
V
IH
Minimum High–Level Input Voltage V
out
= 0.1V or VCC –0.1V
|I
out
| ≤ 20µA
2.0
4.5
6.0
1.50
3.15
4.20
1.50
3.15
4.20
1.50
3.15
4.20
V
V
IL
Maximum Low–Level Input Voltage V
out
= 0.1V or VCC – 0.1V
|I
out
| ≤ 20µA
2.0
4.5
6.0
0.3
0.9
1.2
0.3
0.9
1.2
0.3
0.9
1.2
V
V
OH
Minimum High–Level Output
Voltage
Vin = VIH or V
IL
|I
out
| ≤ 20µA
2.0
4.5
6.0
1.9
4.4
5.9
1.9
4.4
5.9
1.9
4.4
5.9
V
Vin =VIH or VIL|I
out
| ≤ 4.0mA
|I
out
| ≤ 5.2mA
4.5
6.0
3.98
5.48
3.84
5.34
3.70
5.20
V
OL
Maximum Low–Level Output
Voltage
Vin = VIH or V
IL
|I
out
| ≤ 20µA
2.0
4.5
6.0
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
V
Vin = VIH or VIL|I
out
| ≤ 4.0mA
|I
out
| ≤ 5.2mA
4.5
6.0
0.26
0.26
0.33
0.33
0.40
0.40
I
in
Maximum Input Leakage Current Vin = VCC or GND 6.0 ±0.1 ±1.0 ±1.0 µA
I
CC
Maximum Quiescent Supply
Current (per Package)
Vin = VCC or GND
I
out
= 0µA
6.0 4 40 80 µA
NOTE: Information on typical parametric values can be found in Chapter 2 of the Motorola High–Speed CMOS Data Book (DL129/D).
This device contains protection
circuitry to guard against damage
due to high static voltages or electric
fields. However, precautions must
be taken to avoid applications of any
voltage higher than maximum rated
voltages to this high–impedance circuit. For proper operation, Vin and
V
out
should be constrained to the
range GND v (Vin or V
out
) v VCC.
Unused inputs must always be
tied to an appropriate logic voltage
level (e.g., either GND or VCC).
Unused outputs must be left open.
Page 3
MC74HC76
High–Speed CMOS Logic Data
DL129 — Rev 6
3 MOTOROLA
AC CHARACTERISTICS (C
L
= 50pF, Input tr = tf = 6ns)
Guaranteed Limit
Symbol Parameter
V
CC
V
–55 to 25°C ≤85°C ≤125°C Unit
f
max
Maximum Clock Frequency (50% Duty Cycle)
(Figures 1 and 4)
2.0
4.5
6.0
6.0
30
35
4.8
24
28
4.0
20
24
MHz
t
PLH
,
t
PHL
Maximum Propagation Delay, Clock to Q or Q
(Figures 1 and 4)
2.0
4.5
6.0
125
25
21
155
31
26
190
38
32
ns
t
PLH
,
t
PHL
Maximum Propagation Delay, Reset to Q or Q
(Figures 2 and 4)
2.0
4.5
6.0
155
31
26
195
39
33
235
47
40
ns
t
PLH
,
t
PHL
Maximum Propagation Delay, Set to Q or Q
(Figures 2 and 4)
2.0
4.5
6.0
165
33
28
205
41
35
250
50
43
ns
t
TLH
,
t
THL
Maximum Output Transition Time, Any Output
(Figures 1 and 4)
2.0
4.5
6.0
75
15
13
95
19
16
110
22
19
ns
C
in
Maximum Input Capacitance 10 10 10 pF
NOTE: For propagation delays with loads other than 50 pF, and information on typical parametric values, see Chapter 2 of the Motorola High–
Speed CMOS Data Book (DL129/D).
Typical @ 25°C, VCC = 5.0 V, VEE = 0 V
35
*Used to determine the no–load dynamic power consumption: PD = CPD V
CC
2
f + ICC VCC. For load considerations, see Chapter 2 of the
Motorola High–Speed CMOS Data Book (DL129/D).
TIMING REQUIREMENTS (Input t
r
= tf = 6ns)
Guaranteed Limit
Symbol Parameter
V
CC
V
–55 to 25°C ≤85°C ≤125°C Unit
t
su
Minimum Setup Time, J or K to Clock
(Figure 3)
2.0
4.5
6.0
100
20
17
125
25
21
150
30
26
ns
t
h
Minimum Hold Time, Clock to J or K
(Figure 3)
2.0
4.5
6.0
3
3
3
3
3
3
3
3
3
ns
t
rec
Minimum Recovery Time, Set or Reset Inactive to Clock
(Figure 2)
2.0
4.5
6.0
100
20
17
125
25
21
150
30
26
ns
t
w
Minimum Pulse Width, Clock
(Figure 1)
2.0
4.5
6.0
80
16
14
100
20
17
120
24
20
ns
t
w
Minimum Pulse Width, Set or Reset
(Figure 2)
2.0
4.5
6.0
80
16
14
100
20
17
120
24
20
ns
tr, t
f
Maximum Input Rise and Fall Times
(Figure 1)
2.0
4.5
6.0
1000
500
400
1000
500
400
1000
500
400
ns
NOTE: For information on typical parametric values, see Chapter 2 of the Motorola High–Speed CMOS Data Book (DL129/D).
C
PD
Power Dissipation Capacitance (Per Flip–Flop)*
pF
Page 4
MC74HC76
MOTOROLA High–Speed CMOS Logic Data
DL129 — Rev 6
4
SWITCHING WAVEFORMS
t
f
Clock
Q or Q
V
CC
GND
90%
50%
10%
t
r
t
w
90%
50%
10%
t
PHL
1/f
MAX
t
PLH
t
TLH
t
THL
Set or
Reset
V
CC
GND
t
w
Q
or Q
V
CC
GND
Clock
t
PHL
t
rec
50%
50%
50%
Figure 1. Figure 2.
Q or Q
t
PLH
50%
V
CC
GND
50%
J or K
V
CC
GND
50%
t
h
t
su
Valid
Clock
CL*
*Includes all probe and jig capacitance
TEST
POINT
DEVICE
UNDER
TEST
OUTPUT
Figure 3. Figure 4. Test Circuit
Figure 5. Expanded Logic Diagram
3,8
Reset
4,9
J
16,12
K
CL
CL
CLCL
1,6
Clock
2,7
Set
CL
CL
CLCL
CL
CL
CL
CL
15,11
Q
14,10
Q
CLCL
Page 5
MC74HC76
High–Speed CMOS Logic Data
DL129 — Rev 6
5 MOTOROLA
OUTLINE DIMENSIONS
N SUFFIX
PLASTIC PACKAGE
CASE 648–08
ISSUE R
MIN MINMAX MAX
INCHES MILLIMETERS
DIM
A
B
C
D
F
G
H
J
K
L
M
S
18.80
6.35
3.69
0.39
1.02
0.21
2.80
7.50
0
°
0.51
19.55
6.85
4.44
0.53
1.77
0.38
3.30
7.74
10
°
1.01
0.740
0.250
0.145
0.015
0.040
0.008
0.110
0.295
0
°
0.020
0.770
0.270
0.175
0.021
0.070
0.015
0.130
0.305
10
°
0.040
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
5. ROUNDED CORNERS OPTIONAL.
2.54 BSC
1.27 BSC
0.100 BSC
0.050 BSC
–A
–
B
1 8
916
F
H
G
D
16 PL
S
C
–T
–
SEATING
PLANE
K
J
M
L
T A0.25 (0.010)
M M
0.25 (0.010) T B A
M
S S
MIN MINMAX MAX
MILLIMETERS INCHES
DIM
A
B
C
D
F
G
J
K
M
P
R
9.80
3.80
1.35
0.35
0.40
0.19
0.10
0
°
5.80
0.25
10.00
4.00
1.75
0.49
1.25
0.25
0.25
7
°
6.20
0.50
0.386
0.150
0.054
0.014
0.016
0.008
0.004
0
°
0.229
0.010
0.393
0.157
0.068
0.019
0.049
0.009
0.009
7
°
0.244
0.019
1.27 BSC 0.050 BSC
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
1
8
916
–A
–
–B
–
D 16 PL
K
C
G
–T
–
SEATING
PLANE
R X 45°
M
J
F
P 8 PL
0.25 (0.010) B
M M
D SUFFIX
PLASTIC SOIC PACKAGE
CASE 751B–05
ISSUE J
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the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit,
and specifically disclaims any and all liability, including without limitation consequential or incidental damages. “T ypical” parameters can and do vary in different
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MC74HC76/D
*MC74HC76/D*
◊
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