Datasheet MC74HC4046AFR1, MC74HC4046AFR2, MC74HC4046AFL1, MC74HC4046ADTR2, MC74HC4046AF Datasheet (MOTOROLA)

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Semiconductor Components Industries, LLC, 2000
March, 2000 – Rev. 7
1 Publication Order Number:
MC74HC4046A/D
MC74HC4046A
Phase-Locked Loop
High–Performance Silicon–Gate CMOS
The MC74HC4046A is similar in function to the MC14046 Metal gate CMOS device. The device inputs are compatible with standard CMOS outputs; with pullup resistors, they are compatible with LSTTL outputs.
The HC4046A phase–locked loop contains three phase comparators, a voltage–controlled oscillator (VCO) and unity gain op–amp DEM
OUT
. The comparators have two common signal inputs, COMPIN, and SIGIN. Input SIGIN and COMPIN can be used directly coupled to large voltage signals, or indirectly coupled (with a series capacitor to small voltage signals). The self–bias circuit adjusts small voltage signals in the linear region of the amplifier. Phase comparator 1 (an exclusive OR gate) provides a digital error signal PC1
OUT
and maintains 90 degrees phase shift at the center frequency between SIGIN and COMPIN signals (both at 50% duty cycle). Phase comparator 2 (with leading–edge sensing logic) provides digital error signals PC2
OUT
and PCP
OUT
and maintains a 0 degree phase shift between SIGIN and COMPIN signals (duty cycle is immaterial). The linear VCO produces an output signal VCO
OUT
whose frequency is determined by the voltage of input VCOIN signal and the capacitor and resistors connected to pins C1A, C1B, R1 and R2. The unity gain op–amp output DEM
OUT
with an external resistor is used where the VCOIN signal is needed but no loading can be tolerated. The inhibit input, when high, disables the VCO and all op–amps to minimize standby power consumption.
Applications include FM and FSK modulation and demodulation, frequency synthesis and multiplication, frequency discrimination, tone decoding, data synchronization and conditioning, voltage–to–frequency conversion and motor speed control.
Output Drive Capability: 10 LSTTL Loads
Low Power Consumption Characteristic of CMOS Devices
Operating Speeds Similar to LSTTL
Wide Operating Voltage Range: 3.0 to 6.0 V
Low Input Current: 1.0 µA Maximum (except SIG
IN
and COMPIN)
In Compliance with the Requirements Defined by JEDEC Standard
No. 7A
Low Quiescent Current: 80 µA Maximum (VCO disabled)
High Noise Immunity Characteristic of CMOS Devices
Diode Protection on all Inputs
Chip Complexity: 279 FETs or 70 Equivalent Gates
SO–16
D SUFFIX
CASE 751B
http://onsemi.com
1
16
PDIP–16 N SUFFIX CASE 648
1
16
MARKING
DIAGRAMS
1
16
MC74HC4046AN
AWLYYWW
1
16
HC4046A
AWLYWW
A = Assembly Location WL = Wafer Lot YY = Year WW = Work Week
Device Package Shipping
ORDERING INFORMATION
MC74HC4046AN PDIP–16 2000 / Box MC74HC4046AD SOIC–16
48 / Rail
MC74HC4046ADR2 SOIC–16 2500 / Reel
TSSOP–16 DT SUFFIX
CASE 948F
1
16
HC40
46A
ALYW
1
16
SOEIAJ–16
F SUFFIX CASE 966
1
16
74HC4046B
AWLYWW
1
16
MC74HC4046AF SOIC–EIAJ See Note
NO TAG
MC74HC4046AFEL SOIC–EIAJ See Note
NO TAG
1. For ordering information on the EIAJ version of the SOIC packages, please contact your local ON Semiconductor representative.
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Pin No. Symbol Name and Function
1 2 3 4 5 6 7 8
9 10 11 12 13 14 15 16
PCP
OUT
PC1
OUT
COMP
IN
VCO
OUT
INH C1A C1B
GND
VCO
IN
DEM
OUT
R1 R2
PC2
OUT
SIG
IN
PC3
OUT
V
CC
Phase Comparator Pulse Output Phase Comparator 1 Output Comparator Input VCO Output Inhibit Input Capacitor C1 Connection A Capacitor C1 Connection B Ground (0 V) V
SS
VCO Input Demodulator Output Resistor R1 Connection Resistor R2 Connection Phase Comparator 2 Output Signal Input Phase Comparator 3 Output Positive Supply Voltage
MAXIMUM RATINGS*
Symbol
Parameter
Value
Unit
V
CC
DC Supply Voltage (Referenced to GND)
– 0.5 to + 7.0
V
V
in
DC Input Voltage (Referenced to GND)
– 1.5 to VCC + 1.5
V
V
out
DC Output Voltage (Referenced to GND)
– 0.5 to VCC + 0.5
V
I
in
DC Input Current, per Pin
± 20
mA
I
out
DC Output Current, per Pin
± 25
mA
I
CC
DC Supply Current, VCC and GND Pins
± 50
mA
ÎÎ
Î
P
D
ОООООООООООО
Î
Power Dissipation in Still Air Plastic DIP†
SOIC Package†
ÎÎÎ
Î
750 500
Î
Î
mW
T
stg
Storage Temperature
– 65 to + 150
_
C
ÎÎ
Î
T
L
ОООООООООООО
Î
Lead Temperature, 1 mm from Case for 10 Seconds
Plastic DIP and SOIC Package†
ÎÎÎ
Î
260
Î
Î
_
C
*Maximum Ratings are those values beyond which damage to the device may occur.
Functional operation should be restricted to the Recommended Operating Conditions.
†Derating — Plastic DIP: – 10 mW/_C from 65_ to 125_C
SOIC Package: – 7 mW/_C from 65_ to 125_C
For high frequency or heavy load considerations, see Chapter 2 of the ON Semiconductor High–Speed CMOS Data Book (DL129/D).
RECOMMENDED OPERATING CONDITIONS
Symbol
Parameter
Min
ÎÎ
Max
Unit
V
CC
DC Supply Voltage (Referenced to GND)
3.0
ÎÎ
6.0
V
V
CC
DC Supply Voltage (Referenced to GND) NON–VCO 2.0 6.0 V
Vin, V
out
DC Input Voltage, Output Voltage (Referenced to GND)
0
ÎÎ
V
CC
V
T
A
Operating Temperature, All Package Types
– 55
ÎÎ
+ 125
_
C
ÎÎ
Î
tr, t
f
ООООООООООООО
Î
Input Rise and Fall Time VCC = 2.0 V (Pin 5) VCC = 4.5 V
VCC = 6.0 V
Î
Î
0 0 0
ÎÎ
ÎÎ
1000
500 400
Î
Î
ns
This device contains protection circuitry to guard against damage due to high static voltages or electric fields. However, precautions must be taken to avoid applications of any voltage higher than maximum rated voltages to this high–impedance cir­cuit. For proper operation, Vin and V
out
should be constrained to the
range GND v (Vin or V
out
) v VCC.
Unused inputs must always be tied to an appropriate logic voltage level (e.g., either GND or VCC). Unused outputs must be left open.
PIN ASSIGNMENT
13
14
15
16
9
10
11
125
4
3
2
1
8
7
6
R2
PC2
out
SIG
in
PC3
out
V
CC
VCO
in
DEM
out
R1
VCO
out
COMP
in
PC1
out
PCP
out
GND
C1B
C1A
INH
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[Phase Comparator Section] DC ELECTRICAL CHARACTERISTICS
(Voltages Referenced to GND)
Guaranteed Limit
Symbol Parameter Test Conditions
V
CC
Volts
– 55 to
25_C
85°C
125°C
Unit
V
IH
Minimum High–Level Input Voltage DC Coupled SIGIN, COMP
IN
V
out
= 0.1 V or VCC – 0.1 V
|I
out
| 20 µA
2.0
4.5
6.0
1.5
3.15
4.2
1.5
3.15
4.2
1.5
3.15
4.2
V
V
IL
Maximum Low–Level Input Voltage DC Coupled SIGIN, COMP
IN
V
out
= 0.1 V or VCC – 0.1 V
|I
out
| 20 µA
2.0
4.5
6.0
0.5
1.35
1.8
0.5
1.35
1.8
0.5
1.35
1.8
V
V
OH
Minimum High–Level Output Voltage PCP
OUT
, PCn
OUT
Vin = VIH or V
IL
|I
out
| 20 µA
2.0
4.5
6.0
1.9
4.4
5.9
1.9
4.4
5.9
1.9
4.4
5.9
V
Vin = VIH or V
IL
|I
out
| 4.0 mA
|I
out
| 5.2 mA
4.5
6.0
3.98
5.48
3.84
5.34
3.7
5.2 (continued)
[Phase Comparator Section] DC ELECTRICAL CHARACTERISTICS – continued (Voltages Referenced to GND)
Guaranteed Limit
Symbol Parameter Test Conditions
V
CC
Volts
– 55 to
25_C
85°C
125°C
Unit
V
OL
Maximum Low–Level Output Voltage Qa–Qh PCP
OUT
, PCn
OUT
V
out
= 0.1 V or VCC – 0.1 V
|I
out
| 20 µA
2.0
4.5
6.0
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
V
Vin = VIH or V
IL
|I
out
| 4.0 mA
|I
out
| 5.2 mA
4.5
6.0
0.26
0.26
0.33
0.33
0.4
0.4
I
in
Maximum Input Leakage Cur­rent SIGIN, COMP
IN
Vin = VCC or GND
2.0
3.0
4.5
6.0
± 3.0
± 7.0 ± 18.0 ± 30.0
± 4.0
± 9.0 ± 23.0 ± 38.0
± 5.0 ± 11.0 ± 27.0 ± 45.0
µA
I
OZ
Maximum Three–State Leakage Current PC2
OUT
Output in High–Impedance State Vin = VIH or V
IL
V
out
= VCC or GND
6.0 ± 0.5 ± 5.0 ± 10 µA
I
CC
Maximum Quiescent Supply Current (per Package) (VCO disabled) Pins 3, 5 and 14 at V
CC
Pin 9 at GND; Input Leakage at Pins 3 and 14 to be excluded
Vin = VCC or GND |I
out
| = 0 µA
6.0 4.0 40 160 µA
NOTE: Information on typical parametric values can be found in Chapter 2 of the ON Semiconductor High–Speed CMOS Data Book
(DL129/D).
[Phase Comparator Section] AC ELECTRICAL CHARACTERISTICS
(CL = 50 pF, Input tr = tf = 6.0 ns)
Guaranteed Limit
Symbol Parameter
V
CC
Volts
– 55 to 25_C
85°C 125°C
Unit
t
PLH
,
t
PHL
Maximum Propagation Delay, SIGIN/COMPIN to PC1
OUT
(Figure 1)
2.0
4.5
6.0
175
35 30
220
44 37
265
53 45
ns
t
PLH
,
t
PHL
Maximum Propagation Delay, SIGIN/COMPIN to PCP
OUT
(Figure 1)
2.0
4.5
6.0
340
68 58
425
85 72
510 102
87
ns
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[Phase Comparator Section] AC ELECTRICAL CHARACTERISTICS
(CL = 50 pF, Input tr = tf = 6.0 ns)
t
PLH
,
t
PHL
Maximum Propagation Delay, SIGIN/COMPIN to PC3
OUT
(Figure 1)
2.0
4.5
6.0
270
54 46
340
68 58
405
81 69
ns
t
PLZ
,
t
PHZ
Maximum Propagation Delay, SIGIN/COMPIN Output
Disable Time to PC2
OUT
(Figures 2 and 3)
2.0
4.5
6.0
200
40 34
250
50 43
300
60 51
ns
t
PZH
,
t
PZL
Maximum Propagation Delay, SIGIN/COMPIN Output
Enable Time to PC2
OUT
(Figures 2 and 3)
2.0
4.5
6.0
230
46 39
290
58 49
345
69 59
ns
t
TLH
,
t
THL
Maximum Output Transition Time
(Figure 1)
2.0
4.5
6.0
75 15 13
95 19 16
110
22 19
ns
[VCO Section] DC ELECTRICAL CHARACTERISTICS (Voltages Referenced to GND)
Guaranteed Limit
Symbol Parameter Test Conditions
V
CC
Volts
– 55 to
25_C
85°C
125°C
Unit
V
IH
Minimum High–Level Input Voltage INH
V
out
= 0.1 V or VCC – 0.1 V
|I
out
| 20 µA
3.0
4.5
6.0
2.1
3.15
4.2
2.1
3.15
4.2
2.1
3.15
4.2
V
V
IL
Maximum Low–Level Input Voltage INH
V
out
= 0.1 V or VCC – 0.1 V
|I
out
| 20 µA
3.0
4.5
6.0
0.90
1.35
1.8
0.9
1.35
1.8
0.9
1.35
1.8
V
V
OH
Minimum High–Level Output Voltage VCO
OUT
Vin=VIH or V
IL
|I
out
| 20 µA
3.0
4.5
6.0
1.9
4.4
5.9
1.9
4.4
5.9
1.9
4.4
5.9
V
Vin=VIH or V
IL
|I
out
| 4.0 mA
|I
out
| 5.2 mA
4.5
6.0
3.98
5.48
3.84
5.34
3.7
5.2
V
OL
Maximum Low–Level Output Voltage VCO
OUT
V
out
= 0.1 V or VCC – 0.1 V
|I
out
| 20 µA
3.0
4.5
6.0
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
V
Vin=VIH or V
IL
|I
out
| 4.0 mA
|I
out
| 5.2 mA
4.5
6.0
0.26
0.26
0.33
0.33
0.4
0.4
I
in
Maximum Input Leakage Current INH, VCO
IN
Vin=VCC or GND 6.0 0.1 1.0 1.0 µA
Min Max Min Max Min Max
V
VCO
IN
Operating Voltage Range at VCOIN over the range specified for R1; For linearity see Fig. 15A, Parallel value of R1 and R2 should be > 2.7 k
INH = V
IL
3.0
4.5
6.0
0.1
0.1
0.1
1.0
2.5
4.0
0.1
0.1
0.1
1.0
2.5
4.0
0.1
0.1
0.1
1.0
2.5
4.0
V
R1 Resistor Range 3.0
4.5
6.0
3.0
3.0
3.0
300 300 300
3.0
3.0
3.0
300 300 300
3.0
3.0
3.0
300 300 300
k
R2 3.0
4.5
6.0
3.0
3.0
3.0
300 300 300
3.0
3.0
3.0
300 300 300
3.0
3.0
3.0
300 300 300
C1 Capacitor Range 3.0
4.5
6.0
40 40 40
No
Limit
pF
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[VCO Section] AC ELECTRICAL CHARACTERISTICS
(CL = 50 pF, Input tr = tf = 6.0 ns)
Guaranteed Limit
V
– 55 to 25_C
85°C
125°C
Symbol Parameter
V
CC
Volts
Min Max Min Max Min Max
Unit
f/T Frequency Stability with
T emperature Changes (Figure 13A, B, C)
3.0
4.5
6.0
%/K
fo VCO Center Frequency
(Duty Factor = 50%) (Figure 14A, B, C, D)
3.0
4.5
6.0
3
11
13
MHz
fVCO VCO Frequency Linearity 3.0
4.5
6.0
See Figures 15A, B, C %
VCO Duty Factor at VCO
OUT
3.0
4.5
6.0
Typical 50% %
[Demodulator Section] DC ELECTRICAL CHARACTERISTICS
Guaranteed Limit
V
– 55 to 25_C
85°C
125°C
Symbol Parameter Test Conditions
V
CC
Volts
Min Max Min Max Min Max
Unit
RS Resistor Range At RS > 300 k the
Leakage Current can Influence VDEM
OUT
3.0
4.5
6.0
50 50 50
300 300 300
k
V
OFF
Offset Voltage VCOIN to VDEM
OUT
Vi = VVCOIN = 1/2 VCC; Values taken over RS Range.
3.0
4.5
6.0
See Figure 12 mV
RD Dynamic Output
Resistance at DEM
OUT
VDEM
OUT
= 1/2 V
CC
3.0
4.5
6.0
Typical 25
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SWITCHING W AVEFORMS
Figure 1. Figure 2.
Figure 3. Figure 4. Test Circuit
SIGIN, COMP
IN
INPUTS
50%
90%
50%
10%
PCP
OUT
, PC1
OUT
PC3
OUT
OUTPUTS
V
CC
GND
t
PHL
t
PLH
t
TLH
t
THL
SIGIN INPUT
COMP
IN
INPUT
50%
90%
50%
PC2
OUT
OUTPUT
V
CC
GND
t
PZH
t
PHZ
50%
V
CC
GND V
OH
HIGH IMPEDANCE
SIGIN INPUT
COMP
IN
INPUT
50%
10%
PC2
OUT
OUTPUT
V
CC
GND
t
PZL
t
PLZ
50%
V
CC
GND
V
OL
HIGH IMPEDANCE
TEST POINT
CL*
OUTPUT
DEVICE
UNDER
TEST
*INCLUDES ALL PROBE AND JIG CAPACITANCE
50%
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DET AILED CIRCUIT DESCRIPTION
Voltage Controlled Oscillator/Demodulator Output
The VCO requires two or three external components to operate. These are R1, R2, C1. Resistor R1 and Capacitor C1 are selected to determine the center frequency of the VCO (see typical performance curves Figure 14). R2 can be used to set the offset frequency with 0 volts at VCO input. For example, if R2 is decreased, the offset frequency is increased. If R2 is omitted the VCO range is from 0 Hz. The effect of R2 is shown in Figure 24, typical performance curves. By increasing the value of R2 the lock range of the PLL is increased and the gain (volts/Hz) is decreased. Thus, for a narrow lock range, large swings on the VCO input will cause less frequency variation.
Internally, the resistors set a current in a current mirror , as shown in Figure 5. The mirrored current drives one side of the capacitor. Once the voltage across the capacitor char ges
up to V
ref
of the comparators, the oscillator logic flips the capacitor which causes the mirror to charge the opposite side of the capacitor. The output from the internal logic is then taken to VCO output (Pin 4).
The input to the VCO is a very high impedance CMOS input and thus will not load down the loop filter, easing the filters design. In order to make signals at the VCO input accessible without degrading the loop performance, the VCO input voltage is buffered through a unity gain Op–amp to Demod Output. This Op–amp can drive loads of 50K ohms or more and provides no loading effects to the VCO input voltage (see Figure 12).
An inhibit input is provided to allow disabling of the VCO and all Op–amps (see Figure 5). This is useful if the internal VCO is not being used. A logic high on inhibit disables the VCO and all Op–amps, minimizing standby power consumption.
Figure 5. Logic Diagram for VCO
_
+
_
+
_
+
I
1
I
2
R
2
12
V
REF
VCO
IN
R
1
9
11
10
5
6
7
4
++
V
ref
C1
(EXTERNAL)
DEMOD
OUT
CURRENT
MIRROR
I1 + I2 = I
3
VCO
OUT
INH
I
3
The output of the VCO is a standard high speed CMOS output with an equivalent LS–TTL fan out of 10. The VCO output is approximately a square wave. This output can either directly feed the COMPIN of the phase comparators or
feed external prescalers (counters) to enable frequency synthesis.
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Phase Comparators
All three phase comparators have two inputs, SIGIN and COMPIN. The SIGIN and COMPIN have a special DC bias network that enables AC coupling of input signals. If the signals are not AC coupled, standard 74HC input levels are required. Both input structures are shown in Figure 6. The
outputs of these comparators are essentially standard 74HC outputs (comparator 2 is TRI–STATEABLE). In normal operation VCC and ground voltage levels are fed to the loop filter. This differs from some phase detectors which supply a current to the loop filter and should be considered in the design. (The MC14046 also provides a voltage).
Figure 6. Logic Diagram for Phase Comparators
SIG
IN
COMP
IN
V
CC
V
CC
V
CC
14
3
13
1
15
2
PC2
OUT
PCP
OUT
PC3
OUT
PC1
OUT
Phase Comparator 1
This comparator is a simple XOR gate similar to the 74HC86. Its operation is similar to an overdriven balanced modulator. To maximize lock range the input frequencies must have a 50% duty cycle. Typical input and output waveforms are shown in Figure 7. The output of the phase detector feeds the loop filter which averages the output voltage. The frequency range upon which the PLL will lock onto if initially out of lock is defined as the capture range. The capture range for phase detector 1 is dependent on the loop filter design. The capture range can be as large as the lock range, which is equal to the VCO frequency range.
To see how the detector operates, refer to Figure 7. When two square wave signals are applied to this comparator, an output waveform (whose duty cycle is dependent on the phase difference between the two signals) results. As the phase difference increases, the output duty cycle increases and the voltage after the loop filter increases. In order to achieve lock when the PLL input frequency increases, the VCO input voltage must increase and the phase difference between COMPIN and SIGIN will increase. At an input frequency equal to f
min
, the VCO input is at 0 V. This
requires the phase detector output to be grounded; hence, the
two input signals must be in phase. When the input frequency is f
max
, the VCO input must be VCC and the phase
detector inputs must be 180 degrees out of phase.
Figure 7. Typical Waveforms for PLL Using
Phase Comparator 1
V
CC
GND
SIG
IN
COMP
IN
PC1
OUT
VCO
IN
The XOR is more susceptible to locking onto harmonics of the SIGIN than the digital phase detector 2. For instance, a signal 2 times the VCO frequency results in the same output duty cycle as a signal equal to the VCO frequency. The difference is that the output frequency of the 2f example is twice that of the other example. The loop filter and VCO range should be designed to prevent locking on to harmonics.
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Phase Comparator 2
This detector is a digital memory network. It consists of four flip–flops and some gating logic, a three state output and a phase pulse output as shown in Figure 6. This comparator acts only on the positive edges of the input signals and is independent of duty cycle.
Phase comparator 2 operates in such a way as to force the PLL into lock with 0 phase difference between the VCO output and the signal input positive waveform edges. Figure 8 shows some typical loop waveforms. First assume that SIGIN is leading the COMPIN. This means that the VCO’s frequency must be increased to bring its leading edge into proper phase alignment. Thus the phase detector 2 output is set high. This will cause the loop filter to charge up the VCO input, increasing the VCO frequency. Once the leading edge of the COMPIN is detected, the output goes TRI–STATE holding the VCO input at the loop filter voltage. If the VCO still lags the SIGIN then the phase detector will again charge up the VCO input for the time between the leading edges of both waveforms.
If the VCO leads the SIGIN then when the leading edge of the VCO is seen; the output of the phase comparator goes low. This dischar ges the loop filter until the leading edge of the SIGIN is detected at which time the output disables itself again. This has the effect of slowing down the VCO to again make the rising edges of both waveforms coincidental.
When the PLL is out of lock, the VCO will be running either slower or faster than the SIGIN. If it is running slower the phase detector will see more SIGIN rising edges and so the output of the phase comparator will be high a majority of the time, raising the VCO’s frequency. Conversely, if the VCO is running faster than the SIGIN, the output of the detector will be low most of the time and the VCO’s output frequency will be decreased.
As one can see, when the PLL is locked, the output of phase comparator 2 will be disabled except for minor corrections at the leading edge of the waveforms. When PC
2
is TRI–ST A TED, the PCP output is high. This output can be used to determine when the PLL is in the locked condition.
This detector has several interesting characteristics. Over the entire VCO frequency range there is no phase difference between the COMPIN and the SIGIN. The lock range of the PLL is the same as the capture range. Minimal power was consumed in the loop filter since in lock the detector output is a high impedance. When no SIGIN is present, the detector will see only VCO leading edges, so the comparator output will stay low, forcing the VCO to f
min
.
Phase comparator 2 is more susceptible to noise, causing the PLL to unlock. If a noise pulse is seen on the SIGIN, the comparator treats it as another positive edge of the SIG
IN
and will cause the output to go high until the VCO leading edge is seen, potentially for an entire SIGIN period. This would cause the VCO to speed up during that time. When using PC1, the output of that phase detector would be disturbed for only the short duration of the noise spike and would cause less upset.
Phase Comparator 3
This is a positive edge–triggered sequential phase detector using an RS flip–flop as shown in Figure 6. When the PLL is using this comparator, the loop is controlled by positive signal transitions and the duty factors of SIGIN and COMP
IN
are not important. It has some similar characteristics to the edge sensitive comparator . To see how this detector works, assume input pulses are applied to the SIGIN and COMPIN’s as shown in Figure 9. When the SIGIN leads the COMPIN, the flop is set. This will charge the loop filter and cause the VCO to speed up, bringing the comparator into phase with the SIGIN. The phase angle between SIGIN and COMPIN varies from 0° to 360° and is 180° at fo. The voltage swing for PC3 is greater than for PC2 but consequently has more ripple in the signal to the VCO. When no SIGIN is present the VCO will be forced to f
max
as
opposed to f
min
when PC2 is used.
The operating characteristics of all three phase comparators should be compared to the requirements of the system design and the appropriate one should be used.
Figure 8. Typical Waveforms for PLL Using
Phase Comparator 2
V
CC
GN
D
SIG
IN
COMP
IN
PC2
OUT
VCO
IN
PCP
OUT
HIGH IMPEDANCE OFF–STATE
Figure 9. Typical Waveform for PLL Using
Phase Comparator 3
VCC GN
D
SIG
IN
COMP
IN
PC3
OUT
VCO
IN
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10
Figure 10. Input Resistance at SIGIN, COMPIN with
VI = 1.0 V at Self–Bias Point
Figure 11. Input Current at SIGIN, COMPIN with
VI = 500 mV at Self–Bias Point
Figure 12. Offset Voltage at Demodulator Output as
a Function of VCOIN and R
S
Figure 13A. Frequency Stability versus Ambient
Temperature: VCC = 3.0 V
800
0
VCC=3.0 V
VCC=4.5 V
VCC=6.0 V
1/2 VCC–1.0 V 1/2 V
CC
4.0
–4.0
1/2VCC – 500 mV
VI (V)
1/2 V
CC
1/2 VCC + 500 mV
0
6.0
0
0
3.0 6.0
VCC=4.5 V RS=300 k VCC=4.5 V RS=50 k
VCC=3.0 V RS=300 k VCC=3.0 V RS=50 k
DEMOD OUT
15
10
5.0
0
–5.0
–10
–15
–100 –50 0 50 100 150
R1=100 k
R1=300 k
R1=3.0 k
R1=100 k
R1=300 k
R1=3.0 k
VCC = 3.0 V
C1 = 100 pF; R2 = ; V
VCOIN
=1/3 V
CC
FREQUENCY STABILITY (%)
AMBIENT TEMPERATURE (°C)
VCC=3.0 V
VCC=4.5 V
VCC=6.0 V
R
I
)(k
400
I
I
(A)µ
V
DEM
OUT
VCC=6.0 V RS=300 k VCC=6.0 V RS=50 k
Figure 13B. Frequency Stability versus Ambient
Temperature: VCC = 4.5 V
Figure 13C. Frequency Stability versus Ambient
Temperature: VCC = 6.0 V
R1=100 k
R1=300 k
R1=3.0 k
15
10
5.0
0
–5.0
–10
–15
–100 –50 0 50 100 150
VCC= 4.5 V
C1 = 100 pF; R2 = ; V
VCOIN
= 1/2 V
CC
AMBIENT TEMPERATURE (°C)
FREQUENCY STABILITY (%)
FREQUENCY STABILITY (%)
R1=100 k
R1=3.0 k
6.0
4.0
0
–2.0
–10
–100 –50 0 50 100 150
VCC= 6.0 V
C1 = 100 pF; R2 = ; V
VCOIN
=1/2 V
CC
AMBIENT TEMPERATURE (°C)
–8.0
–6.0
–4.0
2.0
8.0
10
R1=300 k
1/2 VCC+1.0 V
VI (V)
VCOIN (V)
=
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11
Figure 14A. VCO Frequency (f
VCO
) as a Function
of the VCO Input Voltage (V
VCOIN
)
Figure 14B. VCO Frequency (f
VCO
) as a Function
of the VCO Input Voltage (V
VCOIN
)
VCC = 6.0 V
VCC = 4.5 V
VCC = 3.0 V
R1 = 3.0 k C1 = 39 pF
0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0
23 21
19 17 15
13 11
9
7.0 V
VCOIN
(V)
(MHz)f
VCO
0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0
70 60 50 40
30 20
10
0
V
VCOIN
(V)
(KHz)f
VCO
VCC = 6.0 V
VCC = 4.5 V
VCC = 3.0 V
R1 = 3.0 k C1 = 0.1 µF
Figure 14C. VCO Frequency (f
VCO
) as a Function
of the VCO Input Voltage (V
VCOIN
)
Figure 14D. VCO Frequency (f
VCO
) as a Function
of the VCO Input Voltage (V
VCOIN
)
0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0
2.0
1.0
0
V
VCOIN
(V)
(MHz)f
VCO
VCC = 6.0 V
VCC = 4.5 V
VCC = 3.0 V
R1 = 300 k C1 = 39 pF
4.5
0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0
1.0
V
VCOIN
(V)
(KHz)f
VCO
4.5
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1 0
VCC = 6.0 V
VCC = 4.5 V
VCC = 3.0 V
R1 = 300 k C1 = 0.1 µF
Figure 15A. Frequency Linearity versus
R1, C1 and V
CC
Figure 15B. Definition of VCO Frequency Linearity
f
VCO
(%)
2.0
1.0
–2.0
0
–1.0
10
0
10
1
10
2
10
3
R1 (kΩ)
R2 = ∞; ∆V = 0.5 V
C1 = 39 pF
C1 = 1.0 µF
f
2
f
0
f0′
f
1
MIN 1/2 V
CC
MAX
V = 0.5 V OVER THE VCC RANGE: FOR VCO LINEARITY
f0′ = (f1 + f2) / 2 LINEARITY = (f0′ – f0) / f0′) x 100%
VCC=
4.5 V
6.0 V
3.0 V
4.5 V
6.0 V
3.0 V
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12
Figure 16. Power Dissipation versus R1 Figure 17. Power Dissipation versus R2
Figure 18. DC Power Dissipation of
Demodulator versus R
S
Figure 19. VCO Center Frequency versus C1
R1 (kΩ)
10
6
10
5
10
4
10
3
10
0
10
1
10
2
10
3
P
R1
W)µ(
VCC= 6.0 V, C1= 40 pF
VCC= 6.0 V, C1= 1.0 µF
VCC= 4.5 V, C1= 40 pF
VCC= 3.0 V, C1= 40 pF
VCC= 3.0 V, C1= 1.0 µF
CL= 50 pF; R2 = ; V
VCOIN
= 1/2 VCC FOR VCC= 4.5 V AND 6.0 V;
V
VCOIN
= 1/3 VCC FOR VCC= 3.0V; T
amb
=25°C
VCC= 6.0 V, C1= 40 pF
VCC= 6.0 V, C1= 1.0 µF
VCC= 4.5 V, C1= 40 pF
VCC= 4.5 V, C1= 1.0 µF
VCC= 4.5 V, C1= 1.0 µF
VCC= 3.0 V, C1= 1.0 µF
CL= 50 pF; R1 = ; V
VCOIN
=0V; T
amb
=25°C
10
6
10
5
10
4
10
3
10
0
10
1
10
2
10
3
R2 (kΩ)
P
R2
W)µ(
P
DEM
(W)µ
RS (kΩ)
10
3
10
2
10
1
10
0
10
1
10
2
10
3
R1 = R2 = ; T
amb
=25°C
VCC=6.0 V
VCC=4.5 V
VCC=3.0 V
10
1
10
2
10
3
10
4
10
5
10
6
C1 (pF)
6.0 V
4.5 V
3.0 V
6.0 V
4.5 V
3.0 V
VCC=
INH =GND; T
amb
=25°C; R2 =∞; V
VCOIN
= 1/3 V
CC
R1=3.0 k
R1=100 k
R1=300 k
f
VCO
(Hz)
10
8
10
7
10
6
10
5
10
4
10
3
10
2
VCC= 3.0 V, C1= 40 pF
6.0 V
4.5 V
3.0 V
Figure 20. Frequency Offset versus C1 Figure 21. Typical Frequency Lock Range (2fL)
versus R1C
1
f
off
(Hz)
10
8
10
7
10
6
10
5
10
4
10
3
10
2
10
1
C1 (pF)
10
1
10
2
10
3
10
4
10
5
10
6
6.0 V
4.5 V
3.0 V
6.0 V
4.5 V
3.0 V
6.0 V
4.5 V
3.0 V
VCC=
10
8
10
7
10
6
10
5
10
4
10
3
10
2
2
fL
(Hz)
10
–7
10
–6 10–5
10
–4
10
–3
10
–2
10
–1
R1C1
R1 = ; V
VCOIN
= 1/2 VCC FOR VCC= 4.5 V AND 6.0 V;
V
VCOIN
= 1/3 VCC FOR VCC= 3.0 V; INH =GND; T
amb
=25°C
R2=3.0 k
R2=100 k R2=300 k
VCC= 4.5 V; R2 =
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13
Figure 22. R2 versus f
max
Figure 23. R2 versus f
min
Figure 24. R2 versus Frequency Lock Range (2fL)
FREQ.
(MHz)
1.0 10
1
10
4
10
5
10
2
10
3
0
5.0
10
15
20
C1=39 pF
R2 ( kΩ)
10
0
10
1
10
4
10
5
10
6
C1=39 pF
10
2
10
3
–2.0
0
4.0
2.0
6.0
8.0
10
12
14
FREQ. (MHz)
R2 ( kΩ)
R1=10 k
R1=3 k
R1=20 k R1=30 k R1=40 k R1=50 k R1=100 k R1=300 k
R1=3.0 k
R1=20 k
R1=30 k
R1=100 k
R1=300 k
R1=50 k
R2 ( kΩ)
1.0 10
1
10
2
10
3
10
4
10
5
2f
0
10
20
C1=39 pF
R1=10 k R1=3.0 k
R1=20 k
R1=30 k R1=40 k
R1=50 k
R1=100 k
R1=300 k
R1=40 k
L
(MHz)
R1=10 k
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14
APPLICATION INFORMATION
The following information is a guide for approximate values of R1, R2, and C1. Figures 19, 20, and 21 should be used as references as indicated below , also the values of R1, R2, and C1 should not violate the Maximum values indicated in the DC ELECTRICAL CHARACTERISTICS tables.
Phase Comparator 1 Phase Comparator 2 Phase Comparator 3
R2 = R2 0
R
R2 = R2 0
R
R2 = R2 0
R
Given f0
Use f0 with
Figure 19 to determine R1 and C1.
(see Figure 23 for characteristics of the VCO operation)
Given f0 and fL
Calculate f
min
f
min
= f0–fL
Determine values of C1 and R2 from Figure 20.
Determine R1–C1 from Figure 21.
Calculate value of R1 from the value of C1 and the product of R1C1 from Figure 21.
(see Figure 24 for characteristics of the VCO operation)
Given f
max
and f0
Determine the value of R1 and C1 using Figure 19 and use Figure 21 to obtain 2fL and then use this to calculate f
min
.
Given f0 and fL
Calculate f
min
f
min
= f0–fL
Determine values of C1 and R2 from Figure 20.
Determine R1–C1 from Figure 21.
Calculate value of R1 from the value of C1 and the product of R1C1 from Figure 21.
(see Figure 24 for characteristics of the VCO operation)
Given f
max
and f0
Determine the value of R1 and C1 using Figure 19 and Figure 21 to obtain 2fL and then use this to calculate f
min
.
Given f0 and fL
Calculate f
min:
f
min
= f0–fL
Determine values of C1 and R2 from Figure 20.
Determine R1–C1 from Figure 21.
Calculate value of R1 from the value of C1 and the product of R1C1 from Figure 21.
(see Figure 24 for characteristics of the VCO operation)
P ACKAGE DIMENSIONS
PDIP–16
N SUFFIX
CASE 648–08
ISSUE R
MIN MINMAX MAX
INCHES MILLIMETERS
DIM
A B C D F
G
H J K L
M
S
18.80
6.35
3.69
0.39
1.02
0.21
2.80
7.50 0°
0.51
19.55
6.85
4.44
0.53
1.77
0.38
3.30
7.74 10°
1.01
0.740
0.250
0.145
0.015
0.040
0.008
0.110
0.295 0°
0.020
0.770
0.270
0.175
0.021
0.070
0.015
0.130
0.305 10°
0.040
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS WHEN FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
5. ROUNDED CORNERS OPTIONAL.
2.54 BSC
1.27 BSC
0.100 BSC
0.050 BSC
–A
B
18
916
F
H
G
D
16 PL
S
C
–T
SEATING PLANE
K
J
M
L
TA0.25 (0.010)
M M
Page 15
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15
P ACKAGE DIMENSIONS
0.25 (0.010) T B A
M
S S
MIN MINMAX MAX
MILLIMETERS INCHES
DIM
A B C D F G J K M P R
9.80
3.80
1.35
0.35
0.40
0.19
0.10 0°
5.80
0.25
10.00
4.00
1.75
0.49
1.25
0.25
0.25 7°
6.20
0.50
0.386
0.150
0.054
0.014
0.016
0.008
0.004 0°
0.229
0.010
0.393
0.157
0.068
0.019
0.049
0.009
0.009 7°
0.244
0.019
1.27 BSC 0.050 BSC
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION.
1
8
916
–A
–B
D
16 PL
K
C
G
–T
SEATING
PLANE
R X 45°
M
J
F
P 8 PL
0.25 (0.010) B
M M
SOIC–16
D SUFFIX
CASE 751B–05
ISSUE J
TSSOP–16
DT SUFFIX
CASE 948F–01
ISSUE O
DIM MIN MAX MIN MAX
INCHESMILLIMETERS
A 4.90 5.10 0.193 0.200 B 4.30 4.50 0.169 0.177 C ––– 1.20 ––– 0.047 D 0.05 0.15 0.002 0.006 F 0.50 0.75 0.020 0.030 G 0.65 BSC 0.026 BSC H 0.18 0.28 0.007 0.011
J 0.09 0.20 0.004 0.008 J1 0.09 0.16 0.004 0.006 K 0.19 0.30 0.007 0.012
K1 0.19 0.25 0.007 0.010
L 6.40 BSC 0.252 BSC M 0 8 0 8
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD FLASH. PROTRUSIONS OR GATE BURRS. MOLD FLASH OR GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED
0.25 (0.010) PER SIDE.
5. DIMENSION K DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE K DIMENSION AT MAXIMUM MATERIAL CONDITION.
6. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY.
7. DIMENSION A AND B ARE TO BE DETERMINED AT DATUM PLANE –W–.
____
SECTION N–N
SEATING PLANE
IDENT.
PIN 1
1
8
16
9
DETAIL E
J
J1
B
C
D
A
K
K1
H
G
DETAIL E
F
M
L
2X L/2
–U–
S
U0.15 (0.006) T
S
U0.15 (0.006) T
S
U
M
0.10 (0.004) V
S
T
0.10 (0.004)
–T–
–V–
–W–
0.25 (0.010)
16X REFK
N
N
Page 16
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16
P ACKAGE DIMENSIONS
H
E
A
1
DIM MIN MAX MIN MAX
INCHES
––– 2.05 ––– 0.081
MILLIMETERS
0.05 0.20 0.002 0.008
0.35 0.50 0.014 0.020
0.18 0.27 0.007 0.011
9.90 10.50 0.390 0.413
5.10 5.45 0.201 0.215
1.27 BSC 0.050 BSC
7.40 8.20 0.291 0.323
0.50 0.85 0.020 0.033
1.10 1.50 0.043 0.059 0
0.70 0.90 0.028 0.035 ––– 0.78 ––– 0.031
A
1
H
E
Q
1
L
E
_
10
_
0
_
10
_
L
E
Q
1
_
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS AND ARE MEASURED AT THE PARTING LINE. MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.15 (0.006) PER SIDE.
4. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY.
5. THE LEAD WIDTH DIMENSION (b) DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE LEAD WIDTH DIMENSION AT MAXIMUM MATERIAL CONDITION. DAMBAR CANNOT BE LOCATED ON THE LOWER RADIUS OR THE FOOT. MINIMUM SPACE BETWEEN PROTRUSIONS AND ADJACENT LEAD TO BE 0.46 ( 0.018).
M
L
DETAIL P
VIEW P
c
A
b
e
M
0.13 (0.005)
0.10 (0.004)
1
16 9
8
D
Z
E
A
b c D E e
L
M
Z
SOEIAJ–16
F SUFFIX
PLASTIC EIAJ SOIC PACKAGE
CASE 966–01
ISSUE O
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