Datasheet MC74HC165AN, MC74HC165AD, MC74HC165AFR2, MC74HC165ADT, MC74HC165ADTR2 Datasheet (MOTOROLA)

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Page 1
Semiconductor Components Industries, LLC, 2000
March, 2000 – Rev. 2
1 Publication Order Number:
MC74HC165A/D
MC74HC165A
8-Bit Serial or Parallel-Input/ Serial-Output Shift Register
The MC74HC165A is identical in pinout to the LS165. The device inputs are compatible with standard CMOS outputs; with pullup resistors, they are compatible with LSTTL outputs.
This device is an 8–bit shift register with complementary outputs from the last stage. Data may be loaded into the register either in parallel or in serial form. When the Serial Shift/Parallel Load
input is low, the data is loaded asynchronously in parallel. When the Serial Shift/Parallel Load
input is high, the data is loaded serially on the
rising edge of either Clock or Clock Inhibit (see the Function Table).
The 2–input NOR clock may be used either by combining two independent clock sources or by designating one of the clock inputs to act as a clock inhibit.
Output Drive Capability: 10 LSTTL Loads
Outputs Directly Interface to CMOS, NMOS, and TTL
Operating Voltage Range: 2 to 6 V
Low Input Current: 1 µA
High Noise Immunity Characteristic of CMOS Devices
In Compliance with the Requirements Defined by JEDEC Standard
No. 7A
Chip Complexity: 286 FETs or 71.5 Equivalent Gates
Device Package Shipping
ORDERING INFORMATION
MC74HC165AN PDIP–14 2000 / Box MC74HC165AD SOIC–14
http://onsemi.com
55 / Rail
MC74HC165ADR2 SOIC–14 2500 / Reel
MARKING
DIAGRAMS
A = Assembly Location WL or L = Wafer Lot YY or Y = Year WW or W = Work Week
MC74HC165ADT TSSOP–14 96 / Rail MC74HC165ADTR2 TSSOP–14
2500 / Reel
TSSOP–14 DT SUFFIX
CASE 948G
HC
165A
ALYW
1
14
1
14
PDIP–14
N SUFFIX
CASE 646
MC74HC165AN
AWLYYWW
SOIC–14
D SUFFIX
CASE 751A
1
14
HC165A
AWLYWW
Page 2
MC74HC165A
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2
LOGIC DIAGRAM
PIN 16 = V
CC
PIN 8 = GND
11 12 13 14
3 4 5 6
10
A B C
D E F G H
S
A
PARALLEL
DATA
INPUTS
SERIAL
DATA
INPUT
SERIAL SHIFT/
PARALLEL LOAD
1
2
15
CLOCK
CLOCK INHIBIT
9
7
Q
H
Q
H
SERIAL
DATA
OUTPUTS
PIN ASSIGNMENT
13
14
15
16
9
10
11
125
4
3
2
1
8
7
6
B
C
D
CLOCK INHIBIT
V
CC
Q
H
S
A
A
F
E
CLOCK
SERIAL SHIFT/
PARALLEL LOAD
GND
Q
H
H
G
FUNCTION TABLE
Inputs Internal Stages Output
Serial Shift/
Parallel Load
Clock
Clock
Inhibit
S
A
A – H Q
A
Q
B
Q
H
Operation
L X X X a h a b h Asynchronous Parallel Load H
H
L L
L H
X X
L H
Q
An
Q
An
Q
Gn
Q
Gn
Serial Shift via Clock
H H
L L
L H
X X
L H
Q
An
Q
An
Q
Gn
Q
Gn
Serial Shift via Clock Inhibit
H H
X H
H X
X X
X X
No Change Inhibited Clock
H L L X X No Change No Clock
X = don’t care QAn – QGn = Data shifted from the preceding stage
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3
MAXIMUM RATINGS*
Symbol
Parameter
Value
Unit
V
CC
DC Supply Voltage (Referenced to GND)
– 0.5 to + 7.0
V
V
in
DC Input Voltage (Referenced to GND)
– 0.5 to VCC + 0.5
V
V
out
DC Output Voltage (Referenced to GND)
– 0.5 to VCC + 0.5
V
I
in
DC Input Current, per Pin
± 20
mA
I
out
DC Output Current, per Pin
± 25
mA
I
CC
DC Supply Current, VCC and GND Pins
± 50
mA
ÎÎ
Î
P
D
ОООООООООООО
Î
Power Dissipation in Still Air Plastic DIP†
SOIC Package†
TSSOP Package†
ÎÎÎ
Î
750 500 450
Î
Î
mW
T
stg
Storage Temperature
– 65 to + 150
_
C
ÎÎ
Î
T
L
ОООООООООООО
Î
Lead Temperature, 1 mm from Case for 10 Seconds
(Plastic DIP, SOIC or TSSOP Package)
ÎÎÎ
Î
260
Î
Î
_
C
*Maximum Ratings are those values beyond which damage to the device may occur.
Functional operation should be restricted to the Recommended Operating Conditions.
†Derating — Plastic DIP: – 10 mW/_C from 65_ to 125_C
SOIC Package: – 7 mW/_C from 65_ to 125_C TSSOP Package: – 6.1 mW/_C from 65_ to 125_C
For high frequency or heavy load considerations, see Chapter 2 of the ON Semiconductor High–Speed CMOS Data Book (DL129/D).
RECOMMENDED OPERATING CONDITIONS
Symbol
Parameter
Min
ÎÎ
Max
Unit
V
CC
DC Supply Voltage (Referenced to GND)
2.0
ÎÎ
6.0
V
Vin, V
out
DC Input Voltage, Output Voltage (Referenced to GND)
0
ÎÎ
V
CC
V
T
A
Operating Temperature, All Package Types
– 55
ÎÎ
+ 125
_
C
ÎÎ
Î
tr, t
f
ООООООООООООО
Î
Input Rise and Fall Time VCC = 2.0 V
(Figure 1) VCC = 3.0 V
VCC = 4.5 V VCC = 6.0 V
Î
Î
0 0 0
ÎÎ
ÎÎ
1000
600 500 400
Î
Î
ns
DC ELECTRICAL CHARACTERISTICS (Voltages Referenced to GND)
Guaranteed Limit
ÎÎ
Î
Symbol
ООООООО
Î
Parameter
ООООООО
Î
Test Conditions
ÎÎ
Î
V
CC V
ÎÎ
Î
– 55 to
25_C
ÎÎÎ
Î
Î
Î
v
85_C
ÎÎ
Î
v
125_C
Î
Î
Unit
ÎÎ
Î
ÎÎ
Î
V
IH
ООООООО
Î
ООООООО
Î
Minimum High–Level Input Voltage
ООООООО
Î
ООООООО
Î
V
out
= 0.1 V or VCC – 0.1 V
|I
out
| v 20 µA
ÎÎ
Î
ÎÎ
Î
2.0
3.0
4.5
6.0
ÎÎ
Î
ÎÎ
Î
1.5
2.1
3.15
4.2
ÎÎÎ
Î
Î
Î
Î
Î
Î
1.5
2.1
3.15
4.2
ÎÎ
Î
ÎÎ
Î
1.5
2.1
3.15
4.2
Î
Î
Î
Î
V
ÎÎ
Î
ÎÎ
Î
V
IL
ООООООО
Î
ООООООО
Î
Maximum Low–Level Input Voltage
ООООООО
Î
ООООООО
Î
V
out
= 0.1 V or VCC – 0.1 V
|I
out
| v 20 µA
ÎÎ
Î
ÎÎ
Î
2.0
3.0
4.5
6.0
ÎÎ
Î
ÎÎ
Î
0.5
0.9
1.35
1.80
ÎÎÎ
Î
Î
Î
Î
Î
Î
0.5
0.9
1.35
1.80
ÎÎ
Î
ÎÎ
Î
0.5
0.9
1.35
1.80
Î
Î
Î
Î
V
ÎÎ
Î
V
OH
ООООООО
Î
Minimum High–Level Output Voltage
ООООООО
Î
Vin = VIH or V
IL
|I
out
| v 20 µA
ÎÎ
Î
2.0
4.5
6.0
ÎÎ
Î
1.9
4.4
5.9
ÎÎÎ
Î
Î
Î
1.9
4.4
5.9
ÎÎ
Î
1.9
4.4
5.9
Î
Î
V
ÎÎÎОООООООÎООООООО
Î
Vin = VIH or VIL|I
out
| v 2.4 mA
|I
out
| v 4.0 mA
|I
out
| v 5.2 mA
ÎÎ
Î
3.0
4.5
6.0
ÎÎ
Î
2.48
3.98
5.48
ÎÎÎ
Î
Î
Î
2.34
3.84
5.34
ÎÎ
Î
2.20
3.70
5.20
Î
Î
V
This device contains protection circuitry to guard against damage due to high static voltages or electric fields. However, precautions must be taken to avoid applications of any voltage higher than maximum rated voltages to this high–impedance cir­cuit. For proper operation, Vin and V
out
should be constrained to the
range GND v (Vin or V
out
) v VCC.
Unused inputs must always be tied to an appropriate logic voltage level (e.g., either GND or VCC). Unused outputs must be left open.
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DC ELECTRICAL CHARACTERISTICS (Voltages Referenced to GND)
Unit
Guaranteed Limit
V
CC
V
Test Conditions
Parameter
Symbol
Unit
v
125_C
ÎÎÎ
v
85_C
– 55 to
25_C
V
CC
V
Test Conditions
Parameter
Symbol
ÎÎ
Î
ÎÎ
Î
V
OL
ООООООО
Î
ООООООО
Î
Maximum Low–Level Output Voltage
ООООООО
Î
ООООООО
Î
Vin = VIH or V
IL
|I
out
| v 20 µA
ÎÎ
Î
ÎÎ
Î
2.0
4.5
6.0
ÎÎ
Î
ÎÎ
Î
0.1
0.1
0.1
ÎÎÎ
Î
Î
Î
Î
Î
Î
0.1
0.1
0.1
ÎÎ
Î
ÎÎ
Î
0.1
0.1
0.1
Î
Î
Î
Î
V
ÎÎÎОООООООÎООООООО
Î
Vin = VIH or VIL|I
out
| v 2.4 mA
|I
out
| v 4.0 mA
|I
out
| v 5.2 mA
ÎÎ
Î
3.0
4.5
6.0
ÎÎ
Î
0.26
0.26
0.26
ÎÎÎ
Î
Î
Î
0.33
0.33
0.33
ÎÎ
Î
0.40
0.40
0.40
Î
Î
ÎÎ
Î
I
in
ООООООО
Î
Maximum Input Leakage Current
ООООООО
Î
Vin = VCC or GND
ÎÎ
Î
6.0
ÎÎ
Î
± 0.1
ÎÎÎ
Î
Î
Î
± 1.0
ÎÎ
Î
± 1.0
Î
Î
µA
I
CC
Maximum Quiescent Supply Current (per Package)
Vin = VCC or GND I
out
= 0 µA
6.0
4
ÎÎÎ
40
160
µA
NOTE: Information on typical parametric values can be found in Chapter 2 of the ON Semiconductor High–Speed CMOS Data Book
(DL129/D).
AC ELECTRICAL CHARACTERISTICS (C
L
= 50 pF, Input tr = tf = 6 ns)
Guaranteed Limit
ÎÎÎ
Î
Symbol
ОООООООООООООО
Î
Parameter
ÎÎ
Î
V
CC V
ÎÎ
Î
– 55 to
25_C
ÎÎÎ
Î
Î
Î
v
85_C
ÎÎ
Î
v
125_C
Î
Î
Unit
ÎÎÎ
Î
ÎÎÎ
Î
f
max
ОООООООООООООО
Î
ОООООООООООООО
Î
Maximum Clock Frequency (50% Duty Cycle)
(Figures 1 and 8)
ÎÎ
Î
ÎÎ
Î
2.0
3.0
4.5
6.0
ÎÎ
Î
ÎÎ
Î
6 18 30 35
ÎÎÎ
Î
Î
Î
Î
Î
Î
4.8 17 24 28
ÎÎ
Î
ÎÎ
Î
4 15 20 24
Î
Î
Î
Î
MHz
ÎÎÎ
Î
ÎÎÎ
Î
t
PLH
,
t
PHL
ОООООООООООООО
Î
ОООООООООООООО
Î
Maximum Propagation Delay, Clock (or Clock Inhibit) to QH or Q
H
(Figures 1 and 8)
ÎÎ
Î
ÎÎ
Î
2.0
3.0
4.5
6.0
ÎÎ
Î
ÎÎ
Î
150
52 30 26
ÎÎÎ
Î
Î
Î
Î
Î
Î
190
63 38 33
ÎÎ
Î
ÎÎ
Î
225
65 45 38
Î
Î
Î
Î
ns
ÎÎÎ
Î
ÎÎÎ
Î
t
PLH
,
t
PHL
ОООООООООООООО
Î
ОООООООООООООО
Î
Maximum Propagation Delay, Serial Shift/Parallel Load to QH or Q
H
(Figures 2 and 8)
ÎÎ
Î
ÎÎ
Î
2.0
3.0
4.5
6.0
ÎÎ
Î
ÎÎ
Î
175
58 35 30
ÎÎÎ
Î
Î
Î
Î
Î
Î
220
70 44 37
ÎÎ
Î
ÎÎ
Î
265
72 53 45
Î
Î
Î
Î
ns
ÎÎÎ
Î
ÎÎÎ
Î
t
PLH
,
t
PHL
ОООООООООООООО
Î
ОООООООООООООО
Î
Maximum Propagation Delay, Input H to QH or Q
H
(Figures 3 and 8)
ÎÎ
Î
ÎÎ
Î
2.0
3.0
4.5
6.0
ÎÎ
Î
ÎÎ
Î
150
52 30 26
ÎÎÎ
Î
Î
Î
Î
Î
Î
190
63 38 33
ÎÎ
Î
ÎÎ
Î
225
65 45 38
Î
Î
Î
Î
ns
ÎÎÎ
Î
ÎÎÎ
Î
t
TLH
,
t
THL
ОООООООООООООО
Î
ОООООООООООООО
Î
Maximum Output Transition Time, Any Output
(Figures 1 and 8)
ÎÎ
Î
ÎÎ
Î
2.0
3.0
4.5
6.0
ÎÎ
Î
ÎÎ
Î
75 27 15 13
ÎÎÎ
Î
Î
Î
Î
Î
Î
95 32 19 16
ÎÎ
Î
ÎÎ
Î
110
36 22 19
Î
Î
Î
Î
ns
C
in
Maximum Input Capacitance
10
ÎÎÎ
10
10
pF
NOTES:
1. For propagation delays with loads other than 50 pF , see Chapter 2 of the ON Semiconductor High–Speed CMOS Data Book (DL129/D).
2. Information on typical parametric values can be found in Chapter 2 of the ON Semiconductor High–Speed CMOS Data Book (DL129/D).
Typical @ 25°C, VCC = 5.0 V
C
PD
Power Dissipation Capacitance (Per Package)*
40
pF
*Used to determine the no–load dynamic power consumption: PD = CPD V
CC
2
f + ICC VCC. For load considerations, see Chapter 2 of the
ON Semiconductor High–Speed CMOS Data Book (DL129/D).
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5
TIMING REQUIREMENTS (Input t
r
= tf = 6 ns)
Guaranteed Limit
Symbol
Parameter
V
CC
V
– 55 to
25_C
v
85_Cv 125_C
Unit
ÎÎ
Î
ÎÎ
Î
t
su
ОООООООООООООООО
Î
ОООООООООООООООО
Î
Minimum Setup Time, Parallel Data Inputs to Serial Shift/Parallel Load
(Figure 4)
Î
Î
Î
Î
2.0
3.0
4.5
6.0
ÎÎ
Î
ÎÎ
Î
75 30 15 13
ÎÎ
Î
ÎÎ
Î
95 40 19 16
Î
Î
Î
Î
110
55 22 19
Î
Î
Î
Î
ns
ÎÎ
Î
ÎÎ
Î
t
su
ОООООООООООООООО
Î
ОООООООООООООООО
Î
Minimum Setup Time, Input SA to Clock (or Clock Inhibit)
(Figure 5)
Î
Î
Î
Î
2.0
3.0
4.5
6.0
ÎÎ
Î
ÎÎ
Î
75 30 15 13
ÎÎ
Î
ÎÎ
Î
95 40 19 16
Î
Î
Î
Î
110
55 22 19
Î
Î
Î
Î
ns
ÎÎ
Î
ÎÎ
Î
t
su
ОООООООООООООООО
Î
ОООООООООООООООО
Î
Minimum Setup Time, Serial Shift/Parallel Load to Clock (or Clock Inhibit)
(Figure 6)
Î
Î
Î
Î
2.0
3.0
4.5
6.0
ÎÎ
Î
ÎÎ
Î
75 30 15 13
ÎÎ
Î
ÎÎ
Î
95 40 19 16
Î
Î
Î
Î
110
55 22 19
Î
Î
Î
Î
ns
ÎÎ
Î
ÎÎ
Î
t
su
ОООООООООООООООО
Î
ОООООООООООООООО
Î
Minimum Setup Time, Clock to Clock Inhibit
(Figure 7)
Î
Î
Î
Î
2.0
3.0
4.5
6.0
ÎÎ
Î
ÎÎ
Î
75 30 15 13
ÎÎ
Î
ÎÎ
Î
95 40 19 16
Î
Î
Î
Î
110
55 22 19
Î
Î
Î
Î
ns
ÎÎ
Î
ÎÎ
Î
t
h
ОООООООООООООООО
Î
ОООООООООООООООО
Î
Minimum Hold Time, Serial Shift/Parallel Load to Parallel Data Inputs
(Figure 4)
Î
Î
Î
Î
2.0
3.0
4.5
6.0
ÎÎ
Î
ÎÎ
Î
5 5 5 5
ÎÎ
Î
ÎÎ
Î
5 5 5 5
Î
Î
Î
Î
5 5 5 5
Î
Î
Î
Î
ns
ÎÎ
Î
ÎÎ
Î
t
h
ОООООООООООООООО
Î
ОООООООООООООООО
Î
Minimum Hold Time, Clock (or Clock Inhibit) to Input SA
(Figure 5)
Î
Î
Î
Î
2.0
3.0
4.5
6.0
ÎÎ
Î
ÎÎ
Î
5 5 5 5
ÎÎ
Î
ÎÎ
Î
5 5 5 5
Î
Î
Î
Î
5 5 5 5
Î
Î
Î
Î
ns
ÎÎ
Î
ÎÎ
Î
t
h
ОООООООООООООООО
Î
ОООООООООООООООО
Î
Minimum Hold Time, Clock (or Clock Inhibit) to Serial Shift/Parallel Load
(Figure 6)
Î
Î
Î
Î
2.0
3.0
4.5
6.0
ÎÎ
Î
ÎÎ
Î
5 5 5 5
ÎÎ
Î
ÎÎ
Î
5 5 5 5
Î
Î
Î
Î
5 5 5 5
Î
Î
Î
Î
ns
ÎÎ
Î
ÎÎ
Î
t
rec
ОООООООООООООООО
Î
ОООООООООООООООО
Î
Minimum Recovery Time, Clock to Clock Inhibit
(Figure 7)
Î
Î
Î
Î
2.0
3.0
4.5
6.0
ÎÎ
Î
ÎÎ
Î
75 30 15 13
ÎÎ
Î
ÎÎ
Î
95 40 19 16
Î
Î
Î
Î
110
55 22 19
Î
Î
Î
Î
ns
ÎÎ
Î
ÎÎ
Î
t
w
ОООООООООООООООО
Î
ОООООООООООООООО
Î
Minimum Pulse Width, Clock (or Clock Inhibit)
(Figure 1)
Î
Î
Î
Î
2.0
3.0
4.5
6.0
ÎÎ
Î
ÎÎ
Î
70 27 15 13
ÎÎ
Î
ÎÎ
Î
90 32 19 16
Î
Î
Î
Î
100
36 22 19
Î
Î
Î
Î
ns
ÎÎ
Î
ÎÎ
Î
t
w
ОООООООООООООООО
Î
ОООООООООООООООО
Î
Minimum Pulse width, Serial Shift/Parallel Load
(Figure 2)
Î
Î
Î
Î
2.0
3.0
4.5
6.0
ÎÎ
Î
ÎÎ
Î
70 27 15 13
ÎÎ
Î
ÎÎ
Î
90 32 19 16
Î
Î
Î
Î
100
36 22 19
Î
Î
Î
Î
ns
ÎÎ
Î
ÎÎ
Î
tr, t
f
ОООООООООООООООО
Î
ОООООООООООООООО
Î
Maximum Input Rise and Fall Times
(Figure 1)
Î
Î
Î
Î
2.0
3.0
4.5
6.0
ÎÎ
Î
ÎÎ
Î
1000
800 500 400
ÎÎ
Î
ÎÎ
Î
1000
800 500 400
Î
Î
Î
Î
1000
800
500
400
Î
Î
Î
Î
ns
NOTE: Information on typical parametric values can be found in Chapter 2 of the ON Semiconductor High–Speed CMOS Data Book
(DL129/D).
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PIN DESCRIPTIONS
INPUTS A, B, C, D, E, F, G, H (Pins 11, 12, 13, 14, 3, 4, 5, 6)
Parallel Data inputs. Data on these inputs are asynchronously entered in parallel into the internal flip–flops when the Serial Shift/Parallel Load
input is low.
SA (Pin 10)
Serial Data input. When the Serial Shift/Parallel Load input is high, data on this pin is serially entered into the first stage of the shift register with the rising edge of the Clock.
CONTROL INPUTS Serial Shift/Parallel Load
(Pin 1)
Data–entry control input. When a high level is applied to this pin, data at the Serial Data input (SA) are shifted into the register with the rising edge of the Clock. When a low level
is applied to this pin, data at the Parallel Data inputs are asynchronously loaded into each of the eight internal stages.
Clock, Clock Inhibit (Pins 2, 15)
Clock inputs. These two clock inputs function identically . Either may be used as an active–high clock inhibit. However, to avoid double clocking, the inhibit input should go high only while the clock input is high.
The shift register is completely static, allowing Clock rates down to DC in a continuous or intermittent mode.
OUTPUTS QH, Q
H
(Pins 9, 7)
Complementary Shift Register outputs. These pins are the noninverted and inverted outputs of the eighth stage of the shift register.
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7
SWITCHING W AVEFORMS
t
r
t
f
V
CC
GND
90%
50%
10%
t
PLH
t
PHL
CLOCK
OR CLOCK INHIBIT
90%
50%
10%
t
TLH
t
THL
QH OR Q
H
Figure 1. Serial–Shift Mode
SERIAL SHIFT/
PARALLEL LOAD
QH OR Q
H
50%
t
PLH
50%
V
CC
GND
t
PHL
50%
Figure 2. Parallel–Load Mode
t
r
t
f
INPUT H
90%
50%
10%
90%
50%
10%
V
CC
GND
t
PHL
t
THL
t
TLH
t
PLH
QH OR Q
H
Figure 3. Parallel–Load Mode
50%
V
CC
GND
t
h
V
CC
GND
ASYNCHRONOUS P ARALLEL
LOAD
(LEVEL SENSITIVE)
SERIAL SHIFT/
PARALLEL LOAD
INPUTS A–H
Figure 4. Parallel–Load Mode
INPUT S
A
50%
50%
CLOCK
OR CLOCK INHIBIT
V
CC
GND
V
CC
GND
Figure 5. Serial–Shift Mode
SERIAL SHIFT/
PARALLEL LOAD
CLOCK
OR CLOCK INHIBIT
50%
50%
t
su
V
CC GND
V
CC GND
CLOCK 2 INHIBITED
CLOCK INHIBIT
CLOCK
50%
50%
t
su
t
rec
V
CC
GND
V
CC
GND
Figure 6. Serial–Shift Mode
Figure 7. Serial–Shift, Clock–Inhibit Mode Figure 8. Test Circuit
*Includes all probe and jig capacitance
CL*
TEST POINT
DEVICE UNDER
TEST
OUTPUT
t
w
1/f
max
t
w
VALID
t
su
VALID
t
su
t
h
t
h
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8
ABCFGH
11 12 13 4 5 6
9
Q
H
7
Q
H
SERIAL SHIFT/
PARALLEL LOAD
1
SERIAL DATA
INPUT S
A
10
CLOCK
2
CLOCK INHIBIT
15
EXPANDED LOGIC DIAGRAM
CLOCK
CLOCK INHIBIT
S
A
SERIAL SHIFT/
PARALLEL LOAD
A
B C D E F G H
Q
H
Q
H
H L
H L
H L H H
HHLLLHHLLHHLLHH
L
PARALLEL LOAD
PARALLEL
DATA
INPUTS
TIMING DIAGRAM
DQ
A
CC
DQ
B
CC
DQ
C
CC
DQ
F
CC
DQ
G
CC
DQ
H
CC
CLOCK
INHIBIT
MODE
SERIAL–SHIFT MODE
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P ACKAGE DIMENSIONS
PDIP–14
N SUFFIX
CASE 646–06
ISSUE L
NOTES:
1. LEADS WITHIN 0.13 (0.005) RADIUS OF TRUE POSITION AT SEATING PLANE AT MAXIMUM MATERIAL CONDITION.
2. DIMENSION L TO CENTER OF LEADS WHEN FORMED PARALLEL.
3. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
4. ROUNDED CORNERS OPTIONAL.
17
14 8
B
A
F
HG D
K
C
N
L
J
M
SEATING PLANE
DIM MIN MAX MIN MAX
MILLIMETERSINCHES
A 0.715 0.770 18.16 19.56 B 0.240 0.260 6.10 6.60 C 0.145 0.185 3.69 4.69 D 0.015 0.021 0.38 0.53 F 0.040 0.070 1.02 1.78
G 0.100 BSC 2.54 BSC
H 0.052 0.095 1.32 2.41 J 0.008 0.015 0.20 0.38 K 0.115 0.135 2.92 3.43 L 0.300 BSC 7.62 BSC
M 0 10 0 10
N 0.015 0.039 0.39 1.01
____
SOIC–14
D SUFFIX
CASE 751A–03
ISSUE F
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION.
–A–
–B–
G
P
7 PL
14 8
71
M
0.25 (0.010) B
M
S
B
M
0.25 (0.010) A
S
T
–T–
F
R
X 45
SEATING PLANE
D 14 PL
K
C
J
M
_
DIM MIN MAX MIN MAX
INCHESMILLIMETERS
A 8.55 8.75 0.337 0.344 B 3.80 4.00 0.150 0.157 C 1.35 1.75 0.054 0.068 D 0.35 0.49 0.014 0.019 F 0.40 1.25 0.016 0.049 G 1.27 BSC 0.050 BSC J 0.19 0.25 0.008 0.009 K 0.10 0.25 0.004 0.009 M 0 7 0 7 P 5.80 6.20 0.228 0.244 R 0.25 0.50 0.010 0.019
____
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10
P ACKAGE DIMENSIONS
TSSOP–14
DT SUFFIX
CASE 948G–01
ISSUE O
DIM MIN MAX MIN MAX
INCHESMILLIMETERS
A 4.90 5.10 0.193 0.200 B 4.30 4.50 0.169 0.177 C ––– 1.20 ––– 0.047 D 0.05 0.15 0.002 0.006 F 0.50 0.75 0.020 0.030 G 0.65 BSC 0.026 BSC H 0.50 0.60 0.020 0.024 J 0.09 0.20 0.004 0.008
J1 0.09 0.16 0.004 0.006
K 0.19 0.30 0.007 0.012
K1 0.19 0.25 0.007 0.010
L 6.40 BSC 0.252 BSC M 0 8 0 8
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. MOLD FLASH OR GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED
0.25 (0.010) PER SIDE.
5. DIMENSION K DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE K DIMENSION AT MAXIMUM MATERIAL CONDITION.
6. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY.
7. DIMENSION A AND B ARE TO BE DETERMINED AT DATUM PLANE –W–.
____
S
U0.15 (0.006) T
2X L/2
S
U
M
0.10 (0.004) V
S
T
L
–U–
SEATING PLANE
0.10 (0.004)
–T–
SECTION N–N
DETAIL E
J
J1
K
K1
DETAIL E
F
M
–W–
0.25 (0.010)
8
14
7
1
PIN 1 IDENT.
H
G
A
D
C
B
S
U0.15 (0.006) T
–V–
14X REFK
N
N
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Notes
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12
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