Datasheet MC74HC164AF, MC74HC164AFEL, MC74HC164AFL1, MC74HC164AFL2, MC74HC164AFR1 Datasheet (MOTOROLA)

 Semiconductor Components Industries, LLC, 2000

March, 2000 – Rev. 1

1 Publication Order Number:

MC74HC164A/D

MC74HC164A

8-Bit Serial-Input/
Parallel-Output Shift
Register

High–Performance Silicon–Gate CMOS

The MC74HC164A is identical in pinout to the LS164. The device
inputs are compatible with standard CMOS outputs; with pullup
resistors, they are compatible with LSTTL outputs.

The MC74HC164A is an 8–bit, serial–input to parallel–output shift
register. Two serial data inputs, A1 and A2, are provided so that one
input may be used as a data enable. Data is entered on each rising edge
of the clock. The active–low asynchronous Reset overrides the Clock
and Serial Data inputs.

• Output Drive Capability: 10 LSTTL Loads

• Outputs Directly Interface to CMOS, NMOS, and TTL

• Operating Voltage Range: 2 to 6 V

• Low Input Current: 1 µA

• High Noise Immunity Characteristic of CMOS Devices

• In Compliance with the Requirements Defined by JEDEC Standard

No. 7A

• Chip Complexity: 244 FETs or 61 Equivalent Gates

LOGIC DIAGRAM

PIN 14 = V

CC

PIN 7 = GND

3

Q

A

4

5
6

10

11

12

13

Q

B

Q

C

Q

D

Q

E

Q

F

Q

G

Q

H

PARALLEL
DATA
OUTPUTS

9

RESET

CLOCK

8

SERIAL

DATA

INPUTS

A1
A2

1
2

DATA

FUNCTION TABLE

Inputs Outputs

Reset Clock A1 A2 QAQB… Q

H

LXXXLL… L
H X X No Change
HHDDQ

An

… Q

Gn

HDHDQ

An

… Q

Gn

D = data input
QAn – QGn = data shifted from the preceding
stage on a rising edge at the clock input.

Device Package Shipping

ORDERING INFORMATION

MC74HC164AN PDIP–14 2000 / Box
MC74HC164AD SOIC–14

http://onsemi.com

55 / Rail

MC74HC164ADR2 SOIC–14 2500 / Reel

MARKING

DIAGRAMS

A = Assembly Location
WL or L = Wafer Lot
YY or Y = Year
WW or W = Work Week

MC74HC164ADT TSSOP–14 96 / Rail
MC74HC164ADTR2 TSSOP–14

2500 / Reel

TSSOP–14
DT SUFFIX

CASE 948G

HC

164A

ALYW

1

14

1

14

PDIP–14

N SUFFIX

CASE 646

MC74HC164AN

AWLYYWW

SOIC–14

D SUFFIX

CASE 751A

1

14

HC164A

AWLYWW

PIN ASSIGNMENT

11

12

13

14

8

9

105

4

3

2

1

7

6

Q

E

Q

F

Q

G

Q

H

V

CC

CLOCK

RESET

Q

B

Q

A

A2

A1

GND

Q

D

Q

C

MC74HC164A

http://onsemi.com

2

MAXIMUM RATINGS*

Symbol

Parameter

Value

Unit

V

CC

DC Supply Voltage (Referenced to GND)

– 0.5 to + 7.0

V

V

in

DC Input Voltage (Referenced to GND)

– 0.5 to VCC + 0.5

V

V

out

DC Output Voltage (Referenced to GND)

– 0.5 to VCC + 0.5

V

I

in

DC Input Current, per Pin

± 20

mA

I

out

DC Output Current, per Pin

± 25

mA

I

CC

DC Supply Current, VCC and GND Pins

± 50

mA

ÎÎ

Î

P

D

ОООООООООООО

Î

Power Dissipation in Still Air, Plastic DIP†

SOIC Package†

TSSOP Package†

ÎÎÎ

Î

750
500
450

Î

Î

mW

T

stg

Storage Temperature

– 65 to + 150

_

C

ÎÎ

Î

T

L

ОООООООООООО

Î

Lead Temperature, 1 mm from Case for 10 Seconds

(Plastic DIP, SOIC or TSSOP Package)

ÎÎÎ

Î

260

Î

Î

_

C

*Maximum Ratings are those values beyond which damage to the device may occur.

Functional operation should be restricted to the Recommended Operating Conditions.

†Derating — Plastic DIP: – 10 mW/_C from 65_ to 125_C

SOIC Package: – 7 mW/_C from 65_ to 125_C
TSSOP Package: – 6.1 mW/_C from 65_ to 125_C

For high frequency or heavy load considerations, see Chapter 2 of the ON Semiconductor High–Speed CMOS Data Book (DL129/D).

RECOMMENDED OPERATING CONDITIONS

Symbol

Parameter

Min

ÎÎ

Max

Unit

V

CC

DC Supply Voltage (Referenced to GND)

2.0

ÎÎ

6.0

V

Vin, V

out

DC Input Voltage, Output Voltage (Referenced to GND)

0

ÎÎ

V

CC

V

T

A

Operating Temperature, All Package Types

– 55

ÎÎ

+ 125

_

C

ÎÎ

Î

tr, t

f

ООООООООООООО

Î

Input Rise and Fall Time VCC = 2.0 V

(Figure 1) VCC = 4.5 V

VCC = 6.0 V

Î

Î

0
0
0

ÎÎ

ÎÎ

1000

500
400

Î

Î

ns

DC ELECTRICAL CHARACTERISTICS (Voltages Referenced to GND)

Guaranteed Limit

ÎÎ

Î

Symbol

ООООООО

Î

Parameter

ООООООО

Î

Test Conditions

ÎÎ

Î

V

CC
V

ÎÎ

Î

–55_C to

25_C

ÎÎÎ

Î

Î

Î

v

85_C

ÎÎ

Î

v

125_C

Î

Î

Unit

ÎÎ

Î

ÎÎ

Î

V

IH

ООООООО

Î

ООООООО

Î

Minimum High–Level Input
Voltage

ООООООО

Î

ООООООО

Î

V

out

= 0.1 V or VCC – 0.1 V

|I

out

| v 20 µA

ÎÎ

Î

ÎÎ

Î

2.0

3.0

4.5

6.0

ÎÎ

Î

ÎÎ

Î

1.5

2.1

3.15

4.2

ÎÎÎ

Î

Î

Î

Î

Î

Î

1.5

2.1

3.15

4.2

ÎÎ

Î

ÎÎ

Î

1.5

2.1

3.15

4.2

Î

Î

Î

Î

V

ÎÎ

Î

ÎÎ

Î

V

IL

ООООООО

Î

ООООООО

Î

Maximum Low–Level Input
Voltage

ООООООО

Î

ООООООО

Î

V

out

= 0.1 V or VCC – 0.1 V

|I

out

| v 20 µA

ÎÎ

Î

ÎÎ

Î

2.0

3.0

4.5

6.0

ÎÎ

Î

ÎÎ

Î

0.5

0.9

1.35

1.8

ÎÎÎ

Î

Î

Î

Î

Î

Î

0.5

0.9

1.35

1.8

ÎÎ

Î

ÎÎ

Î

0.5

0.9

1.35

1.8

Î

Î

Î

Î

V

ÎÎ

Î

V

OH

ООООООО

Î

Minimum High–Level Output
Voltage

ООООООО

Î

Vin = VIH or V

IL

|I

out

| v 20 µA

ÎÎ

Î

2.0

4.5

6.0

ÎÎ

Î

1.9

4.4

5.9

ÎÎÎ

Î

Î

Î

1.9

4.4

5.9

ÎÎ

Î

1.9

4.4

5.9

Î

Î

V

ÎÎÎОООООООÎООООООО

Î

Vin = VIH or VIL|I

out

| v 2.4 mA

|I

out

| v 4.0 mA

|I

out

| v 5.2 mA

ÎÎ

Î

3.0

4.5

6.0

ÎÎ

Î

2.48

3.98

5.48

ÎÎÎ

Î

Î

Î

2.34

3.84

5.34

ÎÎ

Î

2.20

3.70

5.20

Î

Î

This device contains protection
circuitry to guard against damage
due to high static voltages or electric
fields. However, precautions must
be taken to avoid applications of any
voltage higher than maximum rated
voltages to this high–impedance cir­cuit. For proper operation, Vin and
V

out

should be constrained to the

range GND v (Vin or V

out

) v VCC.

Unused inputs must always be
tied to an appropriate logic voltage
level (e.g., either GND or VCC).
Unused outputs must be left open.

MC74HC164A

http://onsemi.com

3

DC ELECTRICAL CHARACTERISTICS (Voltages Referenced to GND)

Unit

Guaranteed Limit

V

CC

V

Test Conditions

Parameter

Symbol

Unit

v

125_C

ÎÎÎ

v

85_C

–55_C to

25_C

V

CC

V

Test Conditions

Parameter

Symbol

ÎÎ

Î

ÎÎ

Î

V

OL

ООООООО

Î

ООООООО

Î

Maximum Low–Level Output
Voltage

ООООООО

Î

ООООООО

Î

Vin = VIH or V

IL

|I

out

| v 20 µA

ÎÎ

Î

ÎÎ

Î

2.0

4.5

6.0

ÎÎ

Î

ÎÎ

Î

0.1

0.1

0.1

ÎÎÎ

Î

Î

Î

Î

Î

Î

0.1

0.1

0.1

ÎÎ

Î

ÎÎ

Î

0.1

0.1

0.1

Î

Î

Î

Î

V

ÎÎÎОООООООÎООООООО

Î

Vin = VIH or VIL|I

out

| v 2.4 mA

|I

out

| v 4.0 mA

|I

out

| v 5.2 mA

ÎÎ

Î

3.0

4.5

6.0

ÎÎ

Î

0.26

0.26

0.26

ÎÎÎ

Î

Î

Î

0.33

0.33

0.33

ÎÎ

Î

0.40

0.40

0.40

Î

Î

ÎÎ

Î

I

in

ООООООО

Î

Maximum Input Leakage
Current

ООООООО

Î

Vin = VCC or GND

ÎÎ

Î

6.0

ÎÎ

Î

± 0.1

ÎÎÎ

Î

Î

Î

± 1.0

ÎÎ

Î

± 1.0

Î

Î

µA

I

CC

Maximum Quiescent Supply
Current (per Package)

Vin = VCC or GND
I

out

= 0 µA

6.0

4

ÎÎÎ

40

160

µA

NOTE: Information on typical parametric values can be found in Chapter 2 of the ON Semiconductor High–Speed CMOS Data Book

(DL129/D).

AC ELECTRICAL CHARACTERISTICS (C

L

= 50 pF, Input tr = tf = 6 ns)

Guaranteed Limit

ÎÎÎ

Î

Symbol

ОООООООООООООО

Î

Parameter

ÎÎ

Î

V

CC
V

ÎÎ

Î

–55_C to

25_C

ÎÎÎ

Î

Î

Î

v

85_C

ÎÎ

Î

v

125_C

Î

Î

Unit

ÎÎÎ

Î

ÎÎÎ

Î

f

max

ОООООООООООООО

Î

ОООООООООООООО

Î

Maximum Clock Frequency (50% Duty Cycle)

(Figures 1 and 4)

ÎÎ

Î

ÎÎ

Î

2.0

3.0

4.5

6.0

ÎÎ

Î

ÎÎ

Î

10
20
40
50

ÎÎÎ

Î

Î

Î

Î

Î

Î

10
20
35
45

ÎÎ

Î

ÎÎ

Î

10
20
30
40

Î

Î

Î

Î

MHz

ÎÎÎ

Î

ÎÎÎ

Î

t

PLH

,

t

PHL

ОООООООООООООО

Î

ОООООООООООООО

Î

Maximum Propagation Delay, Clock to Q

(Figures 1 and 4)

ÎÎ

Î

ÎÎ

Î

2.0

3.0

4.5

6.0

ÎÎ

Î

ÎÎ

Î

160
100

32
27

ÎÎÎ

Î

Î

Î

Î

Î

Î

200
150

40
34

ÎÎ

Î

ÎÎ

Î

250
200

48
42

Î

Î

Î

Î

ns

ÎÎÎ

Î

ÎÎÎ

Î

t

PHL

ОООООООООООООО

Î

ОООООООООООООО

Î

Maximum Propagation Delay, Reset to Q

(Figures 2 and 4)

ÎÎ

Î

ÎÎ

Î

2.0

3.0

4.5

6.0

ÎÎ

Î

ÎÎ

Î

175
100

35
30

ÎÎÎ

Î

Î

Î

Î

Î

Î

220
150

44
37

ÎÎ

Î

ÎÎ

Î

260
200

53
45

Î

Î

Î

Î

ns

ÎÎÎ

Î

ÎÎÎ

Î

t

TLH

,

t

THL

ОООООООООООООО

Î

ОООООООООООООО

Î

Maximum Output Transition Time, Any Output

(Figures 1 and 4)

ÎÎ

Î

ÎÎ

Î

2.0

3.0

4.5

6.0

ÎÎ

Î

ÎÎ

Î

75
27
15
13

ÎÎÎ

Î

Î

Î

Î

Î

Î

95
32
19
16

ÎÎ

Î

ÎÎ

Î

110

36
22
19

Î

Î

Î

Î

ns

C

in

Maximum Input Capacitance

—

10

ÎÎÎ

10

10

pF

NOTES:

1. For propagation delays with loads other than 50 pF, see Chapter 2 of the ON Semiconductor High–Speed CMOS Data Book (DL129/D).

2. Information on typical parametric values can be found in Chapter 2 of the ON Semiconductor High–Speed CMOS Data Book (DL129/D).

Typical @ 25°C, VCC = 5.0 V

C

PD

Power Dissipation Capacitance (Per Package)*

180

pF

*Used to determine the no–load dynamic power consumption: PD = CPD V

CC

2

f + ICC VCC. For load considerations, see Chapter 2 of the

ON Semiconductor High–Speed CMOS Data Book (DL129/D).

MC74HC164A

http://onsemi.com

4

TIMING REQUIREMENTS (Input t

r

= tf = 6 ns)

Guaranteed Limit

ÎÎÎ

Î

Symbol

ОООООООООООООО

Î

Parameter

ÎÎ

Î

V

CC
V

ÎÎ

Î

–55_C to

25_C

ÎÎÎ

Î

Î

Î

v

85_C

ÎÎ

Î

v

125_C

Î

Î

Unit

ÎÎÎ

Î

t

su

ОООООООООООООО

Î

Minimum Setup Time, A1 or A2 to Clock

(Figure 3)

ÎÎ

Î

2.0

3.0

4.5

6.0

ÎÎ

Î

25
15

7
5

ÎÎÎ

Î

Î

Î

35
20

8
6

ÎÎ

Î

40
25

9
6

Î

Î

ns

ÎÎÎ

Î

ÎÎÎ

Î

t

h

ОООООООООООООО

Î

ОООООООООООООО

Î

Minimum Hold Time, Clock to A1 or A2

(Figure 3)

ÎÎ

Î

ÎÎ

Î

2.0

3.0

4.5

6.0

ÎÎ

Î

ÎÎ

Î

3
3
3
3

ÎÎÎ

Î

Î

Î

Î

Î

Î

3
3
3
3

ÎÎ

Î

ÎÎ

Î

3
3
3
3

Î

Î

Î

Î

ns

ÎÎÎ

Î

ÎÎÎ

Î

t

rec

ОООООООООООООО

Î

ОООООООООООООО

Î

Minimum Recovery Time, Reset Inactive to Clock

(Figure 2)

ÎÎ

Î

ÎÎ

Î

2.0

3.0

4.5

6.0

ÎÎ

Î

ÎÎ

Î

3
3
3
3

ÎÎÎ

Î

Î

Î

Î

Î

Î

3
3
3
3

ÎÎ

Î

ÎÎ

Î

3
3
3
3

Î

Î

Î

Î

ns

ÎÎÎ

Î

ÎÎÎ

Î

t

w

ОООООООООООООО

Î

ОООООООООООООО

Î

Minimum Pulse Width, Clock

(Figure 1)

ÎÎ

Î

ÎÎ

Î

2.0

3.0

4.5

6.0

ÎÎ

Î

ÎÎ

Î

50
26
12
10

ÎÎÎ

Î

Î

Î

Î

Î

Î

60
35
15
12

ÎÎ

Î

ÎÎ

Î

75
45
20
15

Î

Î

Î

Î

ns

ÎÎÎ

Î

ÎÎÎ

Î

t

w

ОООООООООООООО

Î

ОООООООООООООО

Î

Minimum Pulse Width, Reset

(Figure 2)

ÎÎ

Î

ÎÎ

Î

2.0

3.0

4.5

6.0

ÎÎ

Î

ÎÎ

Î

50
26
12
10

ÎÎÎ

Î

Î

Î

Î

Î

Î

60
35
15
12

ÎÎ

Î

ÎÎ

Î

75
45
20
15

Î

Î

Î

Î

ns

ÎÎÎ

Î

ÎÎÎ

Î

tr, t

f

ОООООООООООООО

Î

ОООООООООООООО

Î

Maximum Input Rise and Fall Times

(Figure 1)

ÎÎ

Î

ÎÎ

Î

2.0

3.0

4.5

6.0

ÎÎ

Î

ÎÎ

Î

1000

800
500
400

ÎÎÎ

Î

Î

Î

Î

Î

Î

1000

800
500
400

ÎÎ

Î

ÎÎ

Î

1000

800
500
400

Î

Î

Î

Î

ns

NOTE: Information on typical parametric values can be found in Chapter 2 of the ON Semiconductor High–Speed CMOS Data Book

(DL129/D).

MC74HC164A

http://onsemi.com

5

PIN DESCRIPTIONS

INPUTS
A1, A2 (Pins 1, 2)

Serial Data Inputs. Data at these inputs determine the data
to be entered into the first stage of the shift register. For a
high level to be entered into the shift register, both A1 and
A2 inputs must be high, thereby allowing one input to be
used as a data–enable input. When only one serial input is
used, the other must be connected to VCC.

Clock (Pin 8)

Shift Register Clock. A positive–going transition on this
pin shifts the data at each stage to the next stage. The shift

register is completely static, allowing clock rates down to
DC in a continuous or intermittent mode.

OUTPUTS
QA – QH (Pins 3, 4, 5, 6, 10, 11, 12, 13)

Parallel Shift Register Outputs. The shifted data is

presented at these outputs in true, or noninverted, form.

CONTROL INPUT
Reset (Pin 9)

Active–Low, Asynchronous Reset Input. A low voltage
applied to this input resets all internal flip–flops and sets
Outputs QA – QH to the low level state.

SWITCHING W AVEFORMS

t

f

V

CC

GND

90%

50%

10%

t

w

t

PLH

t

PHL

CLOCK

Q

t

TLH

t

THL

Figure 1.

RESET

t

rec

Figure 2.

t

r

1/f

max

90%

50%

10%

V

CC

GND

V

CC

GND

Q

CLOCK 50%

50%

50%

t

PHL

t

w

A1 OR A2

Figure 3.

V

CC
GND
V

CC
GND

50%

50%

CLOCK

t

su

t

h

VALID

*Includes all probe and jig capacitance

CL*

TEST POINT

DEVICE
UNDER

TEST

OUTPUT

Figure 4. Test Circuit

MC74HC164A

http://onsemi.com

6

TIMING DIAGRAM

A1
A2

CLOCK

RESET

8

1
2

9

DRQ

3 4 5 6 10 11 12 13

Q

A

Q

B

Q

C

Q

D

Q

E

Q

F

Q

G

Q

H

EXPANDED LOGIC DIAGRAM

DRQDRQDRQDRQDRQDRQDRQ

CLOCK

RESET

A1
A2

Q

A

Q

B

Q

C

Q

D

Q

E

Q

F

Q

G

Q

H

MC74HC164A

http://onsemi.com

7

P ACKAGE DIMENSIONS

PDIP–14

N SUFFIX

CASE 646–06

ISSUE L

NOTES:

1. LEADS WITHIN 0.13 (0.005) RADIUS OF TRUE
POSITION AT SEATING PLANE AT MAXIMUM
MATERIAL CONDITION.

2. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.

3. DIMENSION B DOES NOT INCLUDE MOLD
FLASH.

4. ROUNDED CORNERS OPTIONAL.

17

14 8

B

A
F

HG D

K

C

N

L

J

M

SEATING
PLANE

DIM MIN MAX MIN MAX

MILLIMETERSINCHES

A 0.715 0.770 18.16 19.56
B 0.240 0.260 6.10 6.60
C 0.145 0.185 3.69 4.69
D 0.015 0.021 0.38 0.53
F 0.040 0.070 1.02 1.78

G 0.100 BSC 2.54 BSC

H 0.052 0.095 1.32 2.41
J 0.008 0.015 0.20 0.38
K 0.115 0.135 2.92 3.43
L 0.300 BSC 7.62 BSC

M 0 10 0 10

N 0.015 0.039 0.39 1.01

____

SOIC–14

D SUFFIX

CASE 751A–03

ISSUE F

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.

2. CONTROLLING DIMENSION: MILLIMETER.

3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.

4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.

5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.

–A–

–B–

G

P

7 PL

14 8

71

M

0.25 (0.010) B

M

S

B

M

0.25 (0.010) A

S

T

–T–

F

R

X 45

SEATING
PLANE

D 14 PL

K

C

J

M

_

DIM MIN MAX MIN MAX

INCHESMILLIMETERS

A 8.55 8.75 0.337 0.344
B 3.80 4.00 0.150 0.157
C 1.35 1.75 0.054 0.068
D 0.35 0.49 0.014 0.019
F 0.40 1.25 0.016 0.049
G 1.27 BSC 0.050 BSC
J 0.19 0.25 0.008 0.009
K 0.10 0.25 0.004 0.009
M 0 7 0 7
P 5.80 6.20 0.228 0.244
R 0.25 0.50 0.010 0.019

____

MC74HC164A

http://onsemi.com

8

P ACKAGE DIMENSIONS

TSSOP–14
DT SUFFIX

CASE 948G–01

ISSUE O

DIM MIN MAX MIN MAX

INCHESMILLIMETERS

A 4.90 5.10 0.193 0.200
B 4.30 4.50 0.169 0.177
C ––– 1.20 ––– 0.047
D 0.05 0.15 0.002 0.006
F 0.50 0.75 0.020 0.030
G 0.65 BSC 0.026 BSC
H 0.50 0.60 0.020 0.024
J 0.09 0.20 0.004 0.008

J1 0.09 0.16 0.004 0.006

K 0.19 0.30 0.007 0.012

K1 0.19 0.25 0.007 0.010

L 6.40 BSC 0.252 BSC
M 0 8 0 8

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.

2. CONTROLLING DIMENSION: MILLIMETER.

3. DIMENSION A DOES NOT INCLUDE MOLD FLASH,
PROTRUSIONS OR GATE BURRS. MOLD FLASH
OR GATE BURRS SHALL NOT EXCEED 0.15
(0.006) PER SIDE.

4. DIMENSION B DOES NOT INCLUDE INTERLEAD
FLASH OR PROTRUSION. INTERLEAD FLASH OR
PROTRUSION SHALL NOT EXCEED

0.25 (0.010) PER SIDE.

5. DIMENSION K DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN
EXCESS OF THE K DIMENSION AT MAXIMUM
MATERIAL CONDITION.

6. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.

7. DIMENSION A AND B ARE TO BE DETERMINED
AT DATUM PLANE –W–.

____

S

U0.15 (0.006) T

2X L/2

S

U

M

0.10 (0.004) V

S

T

L

–U–

SEATING
PLANE

0.10 (0.004)

–T–

SECTION N–N

DETAIL E

J

J1

K

K1

DETAIL E

F

M

–W–

0.25 (0.010)

8

14

7

1

PIN 1
IDENT.

H

G

A

D

C

B

S

U0.15 (0.006) T

–V–

14X REFK

N

N

ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes

without further notice to any products herein. SCILLC makes no warranty , representation or guarantee regarding the suitability of its products for any particular
purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability ,
including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or
specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be
validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others.
SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or
death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold
SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable
attorney fees arising out of, directly or indirectly , any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim
alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer .

PUBLICATION ORDERING INFORMATION

CENTRAL/SOUTH AMERICA:

Spanish Phone: [phone] (Mon–Fri 8:00am to 5:00pm MST)

Email: ONlit–[e-mail]

ASIA/PACIFIC : LDC for ON Semiconductor – Asia Support

Phone: [phone] (Tue–Fri 9:00am to 1:00pm, Hong Kong Time)

T oll Free from Hong Kong & Singapore:

001–800–4422–3781

Email: ONlit–[e-mail]

JAPAN: ON Semiconductor, Japan Customer Focus Center

4–32–1 Nishi–Gotanda, Shinagawa–ku, T okyo, Japan 141–8549

Phone: [phone]
Email: [e-mail]

ON Semiconductor Website: http://onsemi.com

For additional information, please contact your local
Sales Representative.

MC74HC164A/D

NORTH AMERICA Literature Fulfillment:

Literature Distribution Center for ON Semiconductor
P.O. Box 5163, Denver, Colorado 80217 USA

Phone: [phone] or 800–344–3860 T oll Free USA/Canada
Fax: [phone] or 800–344–3867 Toll Free USA/Canada
Email: [e-mail]

Fax Response Line: 303–675–2167 or 800–344–3810 T oll Free USA/Canada

N. American Technical Support: 800–282–9855 Toll Free USA/Canada
EUROPE: LDC for ON Semiconductor – European Support

German Phone: [phone] (M–F 1:00pm to 5:00pm Munich Time)

Email: ONlit–[e-mail]

French Phone: [phone] (M–F 1:00pm to 5:00pm Toulouse T ime)

Email: ONlit–[e-mail]

English Phone: [phone] (M–F 12:00pm to 5:00pm UK Time)

Email: [e-mail]

EUROPEAN TOLL–FREE ACCESS*: 00–800–4422–3781

*Available from Germany, France, Italy , England, Ireland