Datasheet MC68HC705C8ACP Specification

13.4 Operating Temperature Range

Electrical Specifications

Operating Temperature Range

Operating temperature range

MC68HC705C8ACB
MC68HC705C8ACFB
MC68HC705C8ACFS
MC68HC705C8ACP
MC68HC705C8ACFN
MC68HC705C8ACFS

1. Voltages referenced to V

2. C = Extended temperature range (– 40°C to + 85°C)
P = Plastic dual in-lin e package (PDIP)
B = Plastic shrink dual in- li ne package (SDIP)
S = Ceramic dual in-lin e package (cerdip)
FN = Plastic-leaded chi p carrier (PLCC)
FB = Quad flat pack (QFP)
FS = Ceramic-leaded chip carrier (CLCC)

13.5 Thermal Charact er ist ics

Thermal resistance

Plastic dual in-line package (DIP)
Ceramic dual in-line package (cerdip)
Plastic leaded chip carrier (PLCC)
Quad flat pack (QFP)
Plastic shrink DIP (SDIP)

Rating

(1)

SS

(2)

Symbol Value Unit

T

A

TL to T

– 40 to + 85

H

°C

Characteristic Symbol Value Unit

60

θ

JA

50
70

°C/W

95
60

VDD = 4.5 V

V

TEST
POINT

DD

R2
(SEE TABLE)

C
(SEE TABLE) (SEE TABLE)

R1

Pins R1 R2 C

PA7–PA0
PB7–PB0
PC7–PC0
PD4–PD1

VDD = 3.0 V

3.26 kΩ 2.38 k Ω 50 pF

Pins R1 R2 C

PA7–PA0
PB7–PB0
PC7–PC0
PD4–PD1

PD7, PD5, PD0 6 kΩ 6 kΩ 200 pF

10.91 kΩ 6.32 k Ω 50 pF

Figure 13-1. Equivalent Test Load

MC68HC705C8A — Rev . 3 T echnical Data

MOTOROLA Electrical Specifications 173