Page 1
SEMICONDUCTOR TECHNICAL DATA
3–1
REV 7
Motorola, Inc. 1997
3/97
# ##
%!# &#
# $#"
High–Performance Silicon–Gate CMOS
The MC54/74HCT574A is identical in pinout to the LS574. This device
may be used as a level converter for interfacing TTL or NMOS outputs to
High Speed CMOS inputs.
Data meeting the setup time is clocked to the outputs with the rising
edge of the Clock. The Output Enable input does not affect the states of
the flip–flops, but when Output Enable is high, all device outputs are
forced to the high–impedance state. Thus, data may be stored even when
the outputs are not enabled.
The HCT574A is identical in function to the HCT374A but has the
flip–flop inputs on the opposite side of the package from the outputs to
facilitate PC board layout.
• Output Drive Capability: 15 LSTTL Loads
• TTL NMOS Compatible Input Levels
• Outputs Directly Interface to CMOS, NMOS and TTL
• Operating Voltage Range: 4.5 to 5.5 V
• Low Input Current: 1.0 µA
• In Compliance with the Requirements Defined by JEDEC Standard
No. 7A
• Chip Complexity: 286 FETs or 71.5 Equivalent Gates
LOGIC DIAGRAM
DATA
INPUTS
D0
219
Q0
D1
D2
D3
D4
D5
D6
D7
CLOCK
OUTPUT ENABLE
3
4
5
6
7
8
9
11
1
18
17
16
15
14
13
12
Q1
Q2
Q3
Q4
Q5
Q6
Q7
NON–
INVERTING
OUTPUTS
PIN 20 = V
CC
PIN 10 = GND
Design Criteria
Value
ÎÎÎ
Units
ОООООООО
Î
Internal Gate Count*
ÎÎ
Î
71.5
ÎÎÎ
ÎÎ
Î
ea
ОООООООО
Î
Internal Gate Propagation Delay
ÎÎ
Î
1.5
ÎÎÎ
ÎÎ
Î
ns
Internal Gate Power Dissipation
5.0
ÎÎÎ
µW
Speed Power Product
0.0075
ÎÎÎ
pJ
*Equivalent to a two–input NAND gate.
PIN ASSIGNMENT
D4
D2
D1
D0
OUTPUT
ENABLE
GND
D7
D6
D5
D3 5
4
3
2
1
10
9
8
7
6
14
15
16
17
18
19
20
11
12
13
Q3
Q2
Q1
Q0
V
CC
CLOCK
Q7
Q6
Q5
Q4
FUNCTION TABLE
Inputs Output
OE Clock D Q
LHH
LLL
L L,H, X No Change
HXXZ
X = don’t care
Z = high impedance
DW SUFFIX
SOIC PACKAGE
CASE 751D–04
N SUFFIX
PLASTIC PACKAGE
CASE 738–03
ORDERING INFORMATION
MC54HCTXXXAJ
MC74HCTXXXAN
MC74HCTXXXADW
Ceramic
Plastic
SOIC
J SUFFIX
CERAMIC PACKAGE
CASE 732–03
1
20
1
20
1
20
Page 2
MC54/74HCT574A
MOTOROLA High–Speed CMOS Logic Data
DL129 — Rev 6
3–2
MAXIMUM RATINGS*
Symbol
Parameter
Value
Unit
V
CC
DC Supply Voltage (Referenced to GND)
– 0.5 to + 7.0
V
V
in
DC Input Voltage (Referenced to GND)
– 0.5 to VCC + 0.5
V
V
out
DC Output Voltage (Referenced to GND)
– 0.5 to VCC + 0.5
V
I
in
DC Input Current, per Pin
± 20
mA
I
out
DC Output Current, per Pin
± 35
mA
I
CC
DC Supply Current, VCC and GND Pins
± 75
mA
Î
Î
P
D
ОООООООООООО
Î
Power Dissipation in Still Air,Plastic or Ceramic DIP†
SOIC Package†
ÎÎÎÎ
Î
750
500
Î
Î
mW
T
stg
Storage Temperature
– 65 to + 150
_
C
Î
Î
T
L
ОООООООООООО
Î
Lead Temperature, 1 mm from Case for 10 Seconds
(Plastic DIP or SOIC Package)
(Ceramic DIP)
ÎÎÎÎ
Î
260
300
Î
Î
_
C
*Maximum Ratings are those values beyond which damage to the device may occur.
Functional operation should be restricted to the Recommended Operating Conditions.
†Derating — Plastic DIP: –10 mW/_C from 65_ to 125_C
Ceramic DIP: –10 mW/_C from 100_ to 125_C
SOIC Package: –7 mW/_C from 65_ to 125_C
For high frequency or heavy load considerations, see Chapter 2 of the Motorola High–Speed CMOS Data Book (DL129/D).
RECOMMENDED OPERATING CONDITIONS
Symbol
Parameter
Min
Max
Unit
V
CC
DC Supply Voltage (Referenced to GND)
4.5
5.5
V
Vin, V
out
DC Input Voltage, Output Voltage (Referenced to GND)
0
V
CC
V
T
A
Operating Temperature, All Package Types
– 55
+ 125
_
C
tr, t
f
Input Rise and Fall Time (Figure 1)
0
500
ns
DC ELECTRICAL CHARACTERISTICS (Voltages Referenced to GND)
ÎÎ
ООООООО
ООООООО
ÎÎ
ООООООО
Guaranteed Limit
Î
ÎÎ
Î
Symbol
ООООООО
Î
Parameter
ООООООО
Î
Test Conditions
ÎÎ
Î
V
CC
V
ÎÎ
– 55 to
25_C
ÎÎ
Î
v
85_C
ÎÎ
Î
v
125_C
Î
Î
Unit
ÎÎ
Î
V
IH
ООООООО
Î
Minimum High–Level Input
Voltage
ООООООО
Î
V
out
= 0.1 V or VCC – 0.1 V
|I
out
| v 20 µA
ÎÎ
Î
4.5
5.5
ÎÎ
2.0
2.0
ÎÎ
Î
2.0
2.0
ÎÎ
Î
2.0
2.0
Î
Î
V
ÎÎ
Î
V
IL
ООООООО
Î
Maximum Low–Level Input
Voltage
ООООООО
Î
V
out
= 0.1 V or VCC – 0.1 V
|I
out
| v 20 µA
ÎÎ
Î
4.5
5.5
ÎÎ
0.8
0.8
ÎÎ
Î
0.8
0.8
ÎÎ
Î
0.8
0.8
Î
Î
V
ÎÎ
Î
V
OH
ООООООО
Î
Minimum High–Level Output
Voltage
ООООООО
Î
Vin = VIH or V
IL
|I
out
| v 20 µA
ÎÎ
Î
4.5
5.5
ÎÎ
4.4
5.4
ÎÎ
Î
4.4
5.4
ÎÎ
Î
4.4
5.4
Î
Î
ÎÎÎОООООООÎООООООО
Î
Vin = VIH or V
IL
|I
out
| v 6.0 mA
ÎÎ
Î
4.5
ÎÎ
3.98
ÎÎ
Î
3.84
ÎÎ
Î
3.7
Î
Î
V
ÎÎ
Î
V
OL
ООООООО
Î
Maximum Low–Level Output
Voltage
ООООООО
Î
Vin = VIH or V
IL
|I
out
| v 20 µA
ÎÎ
Î
4.5
5.5
ÎÎ
0.1
0.1
ÎÎ
Î
0.1
0.1
ÎÎ
Î
0.1
0.1
Î
Î
Vin = VIH or V
IL
|I
out
| v 6.0 mA
4.5
0.26
0.33
0.4
I
in
Maximum Input Leakage Current
Vin = VCC or GND
5.5
± 0.1
± 1.0
± 1.0
µA
ÎÎ
Î
I
CC
ООООООО
Î
Maximum Quiescent Supply
Current (per Package)
ООООООО
Î
Vin = VCC or GND
I
out
= 0 µA
ÎÎ
Î
5.5
ÎÎ
4.0
ÎÎ
Î
40
ÎÎ
Î
160
Î
Î
µA
1. Output in high–impedance state.
NOTE:Information on typical parametric values can be found in Chapter 2 of the Motorola High–Speed CMOS Data Book (DL129/D).
This device contains protection
circuitry to guard against damage
due to high static voltages or electric
fields. However, precautions must
be taken to avoid applications of any
voltage higher than maximum rated
voltages to this high–impedance circuit. For proper operation, Vin and
V
out
should be constrained to the
range GND v (Vin or V
out
) v VCC.
Unused inputs must always be
tied to an appropriate logic voltage
level (e.g., either GND or VCC).
Unused outputs must be left open.
Page 3
MC54/74HCT574A
High–Speed CMOS Logic Data
DL129 — Rev 6
3–3 MOTOROLA
DC ELECTRICAL CHARACTERISTICS (Voltages Referenced to GND)
Guaranteed Limit
ÎÎ
Î
Symbol
ООООООО
Î
Parameter
ООООООО
Î
Test Conditions
ÎÎ
Î
V
CC
V
ÎÎ
– 55 to
25_C
ÎÎ
Î
v
85_C
ÎÎ
Î
v
125_C
Î
Î
Unit
ÎÎ
I
OZ
ООООООО
Maximum Three–State Leakage
Current
ООООООО
Vin = VIL or VIH (Note 1)
V
out
= VCC or GND
ÎÎ
5.5
ÎÎ
– 0.5
ÎÎ
– 5.0
ÎÎ
– 10
Î
µA
∆I
CC
Additional Quiescent Supply
Vin = 2.4 V, Any One Input
=
≥ – 55_C
25_C to 125_C
Current
V
i
n
=
V
CC
or
GND, Other Inputs
l
out
= 0 µA
5.5
2.9
2.4
mA
1. Output in high–impedance state.
AC ELECTRICAL CHARACTERISTICS (V
CC
= 5.0 V ± 10%, CL = 50 pF, Input tr = tf = 6.0 ns)
ÎÎÎОООООООООООООООООÎОООООООО
Î
Guaranteed Limit
Î
Î
ÎÎ
Î
Symbol
ООООООООООООООООО
Î
Parameter
ÎÎ
Î
– 55 to
25_C
ÎÎ
Î
v
85_C
ÎÎ
Î
v
125_C
Î
Î
Unit
f
MAX
Maximum Clock Frequency (50% Duty Cycle) (Figures 1 and 4)
30
24
20
MHz
ÎÎ
Î
t
PLH
,
t
PHL
ООООООООООООООООО
Î
Maximum Propagation Delay, Clock to Q
(Figures 1 and 4)
ÎÎ
Î
30
ÎÎ
Î
38
ÎÎ
Î
45
Î
Î
ns
t
PLZ
,
t
PHZ
Maximum Propagation Delay, Output Enable to Q
(Figures 2 and 5)
28
35
42
ns
ÎÎ
Î
t
PZH
,
t
PZL
ООООООООООООООООО
Î
Maximum Propagation Delay Time, Output Enable to Q
(Figures 2 and 5)
ÎÎ
Î
28
ÎÎ
Î
35
ÎÎ
Î
42
Î
Î
ns
ÎÎ
Î
t
TLH
,
t
THL
ООООООООООООООООО
Î
Maximum Output Transition Time, Any Output
(Figures 1, 2 and 4)
ÎÎ
Î
12
ÎÎ
Î
15
ÎÎ
Î
18
Î
Î
ns
C
in
Maximum Input Capacitance
10
10
10
pF
NOTE:For propagation delays with loads other than 50 pF , and information on typical parametric values, see Chapter 2 of the Motorola High–
Speed CMOS Data Book (DL129/D).
Typical @ 25°C, VCC = 5.0 V
C
PD
Power Dissipation Capacitance (Per Flip–Flop)*
58
pF
*Used to determine the no–load dynamic power consumption: PD = CPD V
CC
2
f + ICC VCC. For load considerations, see Chapter 2 of the
Motorola High–Speed CMOS Data Book (DL129/D).
TIMING REQUIREMENTS (V
CC
= 5.0 V ± 10%, CL = 50 pF, Input tr = tf = 6.0 ns)
Guaranteed Limit
– 55 to 25_C
v
85_C
v
125_C
Symbol
Parameter
Fig.
Min
Max
Min
Max
Min
ÎÎ
Max
Unit
t
su
Minimum Setup Time, Data to Clock
3
10
13
15
ÎÎ
ns
t
h
Minimum Hold Time, Clock to Data
3
5.0
5.0
5.0
ÎÎ
ns
t
w
Minimum Pulse Width, Clock
1
15
19
22
ÎÎ
ns
tr, If
Maximum Input Rise and Fall Times
1
500
500
ÎÎ
500
ns
Page 4
MC54/74HCT574A
MOTOROLA High–Speed CMOS Logic Data
DL129 — Rev 6
3–4
EXPANDED LOGIC DIAGRAM
CLOCK
ENABLE
OUTPUT
11
1
D0
2
C
19
D
Q
Q0
D1
3
C
18
D
Q
Q1
D2
4
C
17
D
Q
Q2
D3
5
C
16
D
Q
Q3
D4
6
C
15
D
Q
Q4
D5
7
C
14
D
Q
Q5
D6
8
C
13
D
Q
Q6
D7
9
C
12
D
Q
Q7
SWITCHING W AVEFORMS
Figure 1. Figure 2.
CLOCK
Q
t
r
t
f
3.0 V
GND
2.7 V
1.3 V
0.3 V
90%
1.3 V
10%
t
PLH
t
PHL
t
TLH
t
THL
t
w
1/f
max
Q
Q
1.3 V
1.3 V
90%
10%
t
PZL
t
PLZ
t
PZHtPHZ
3.0 V
GND
HIGH
IMPEDANCE
V
OL
V
OH
HIGH
IMPEDANCE
OUTPUT
ENABLE
1.3 V
Figure 3. Figure 4. Test Circuit
Figure 5. Test Circuit
1.3 V
CLOCK
3.0 V
VALID
GND
3.0 V
GND
t
su
t
h
1.3 V
DATA
*Includes all probe and jig capacitance
CL*
TEST POINT
DEVICE
UNDER
TEST
OUTPUT
*Includes all probe and jig capacitance
CL*
TEST POINT
DEVICE
UNDER
TEST
OUTPUT
CONNECT TO VCC WHEN
TESTING t
PLZ
AND t
PZL
.
CONNECT TO GND WHEN
TESTING t
PHZ
AND t
PZH
.
1 k
Ω
Page 5
MC54/74HCT574A
High–Speed CMOS Logic Data
DL129 — Rev 6
3–5 MOTOROLA
OUTLINE DIMENSIONS
J SUFFIX
CERAMIC PACKAGE
CASE 732–03
ISSUE E
N SUFFIX
PLASTIC PACKAGE
CASE 738–03
ISSUE E
DW SUFFIX
PLASTIC SOIC PACKAGE
CASE 751D–04
ISSUE E
NOTES:
1. LEADS WITHIN 0.25 (0.010) DIAMETER, TRUE
POSITION AT SEATING PLANE, AT MAXIMUM
MATERIAL CONDITION.
2. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
3. DIMENSIONS A AND B INCLUDE MENISCUS.
DIM MIN MAX MIN MAX
INCHESMILLIMETERS
A 23.88 25.15 0.940 0.990
B 6.60 7.49 0.260 0.295
C 3.81 5.08 0.150 0.200
D 0.38 0.56 0.015 0.022
F 1.40 1.65 0.055 0.065
G 2.54 BSC 0.100 BSC
H 0.51 1.27 0.020 0.050
J 0.20 0.30 0.008 0.012
K 3.18 4.06 0.125 0.160
L 7.62 BSC 0.300 BSC
M 0 15 0 15
N 0.25 1.02 0.010 0.040
____
A
20
110
11
B
F
C
SEATING
PLANE
D
H
G
K
N
J
M
L
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE MOLD
FLASH.
M
L
J
20 PL
M
B
M
0.25 (0.010) T
DIM MIN MAX MIN MAX
MILLIMETERSINCHES
A 25.66 27.171.010 1.070
B 6.10 6.600.240 0.260
C 3.81 4.570.150 0.180
D 0.39 0.550.015 0.022
G 2.54 BSC0.100 BSC
J 0.21 0.380.008 0.015
K 2.80 3.550.110 0.140
L 7.62 BSC0.300 BSC
M 0 15 0 15
N 0.51 1.010.020 0.040
____
E
1.27 1.770.050 0.070
1
11
10
20
–A–
SEATING
PLANE
K
N
FG
D
20 PL
–T–
M
A
M
0.25 (0.010) T
E
B
C
F
1.27 BSC0.050 BSC
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.150
(0.006) PER SIDE.
5. DIMENSION D DOES NOT INCLUDE
DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.13
(0.005) TOTAL IN EXCESS OF D DIMENSION
AT MAXIMUM MATERIAL CONDITION.
–A–
–B–
20
1
11
10
S
A
M
0.010 (0.25) B
S
T
D20X
M
B
M
0.010 (0.25)
P10X
J
F
G
18X
K
C
–T–
SEATING
PLANE
M
R
X 45
_
DIM MIN MAX MIN MAX
INCHESMILLIMETERS
A 12.65 12.95 0.499 0.510
B 7.40 7.60 0.292 0.299
C 2.35 2.65 0.093 0.104
D 0.35 0.49 0.014 0.019
F 0.50 0.90 0.020 0.035
G 1.27 BSC 0.050 BSC
J 0.25 0.32 0.010 0.012
K 0.10 0.25 0.004 0.009
M 0 7 0 7
P 10.05 10.55 0.395 0.415
R 0.25 0.75 0.010 0.029
__
__
Page 6
MC54/74HCT574A
MOTOROLA High–Speed CMOS Logic Data
DL129 — Rev 6
3–6
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