Page 1
SEMICONDUCTOR TECHNICAL DATA
3–1
REV 6
Motorola, Inc. 1995
10/95
! "
High–Performance Silicon–Gate CMOS
The MC54/74HC646 is identical in pinout to the LS646. The device inputs
are compatible with standard CMOS outputs; with pullup resistors, they are
compatible with LSTTL outputs.
These devices are bus transceivers with D flip–flops. Depending on the
status of the Data–Source Selection pins, data may be routed to the outputs
either from the flip–flops or transmitted real–time from the inputs (see
Function Table and Application Information).
The Output Enable and t he Direction pins control the transceiver’s
function. Bus A and Bus B cannot be routed as outputs to e ach other
simultaneously, but can be routed as inputs to the A and B flip–flops. Also,
the A and B flip–flops can be routed a s outputs to Bus A a nd Bus B.
Additionally, when either or both of the ports are in the high–impedance
state, these I/O pins may be used as inputs to t he D flip–flops for data
storage.
The user should note that because the clocks are not gated with the
Direction and Output Enable pins, data at the A and B ports may be clocked
into the storage flip–flops at any time.
• Output Drive Capability: 15 LSTTL Loads
• Outputs Directly Interface to CMOS, NMOS, and TTL
• Operating Voltage Range: 2 to 6 V
• Low Input Current: 1 µA
• High Noise Immunity Characteristic of CMOS Devices
• In Compliance with the Requirements Defined by JEDEC Standard
No. 7A
• Chip Complexity: 780 FETs or 195 Equivalent Gates
LOGIC DIAGRAM
A
DATA
PORT
B
DATA
PORT
A0
A1
A2
A3
A4
A5
A6
A7
11
10
9
8
7
6
5
4 20
B0
19
18
17
16
15
14
13
B1
B2
B3
B4
B5
B6
B7
21
3
1
23
2
22
A–TO–B SOURCE
B–TO–A SOURCE
B–TO–A CLOCK
A–TO–B CLOCK
DIRECTION
OUTPUT ENABLE
FLIP–FLOP
CLOCKS
DATA SOURCE
SELECTION
INPUTS
PIN 24 = V
CC
PIN 12 = GND
PIN ASSIGNMENT
A2
A0
DIRECTION
A–TO–B
SOURCE
A–TO–B
CLOCK
A4
A3
A1 B0
OUTPUT ENABLE
B–TO–A
SOURCE
B–TO–A
CLOCK
V
CC
B5
B4
B3
5
4
3
2
1
10
9
8
7
6
14
15
16
17
18
19
20
13
11
12
21
22
23
24
B7
B6
B2
B1
A7
GND
A6
A5
N SUFFIX
PLASTIC PACKAGE
CASE 724–03
ORDERING INFORMATION
MC54HCXXXJ
MC74HCXXXN
MC74HCXXXDW
Ceramic
Plastic
SOIC
1
24
J SUFFIX
CERAMIC PACKAGE
CASE 758–02
DW SUFFIX
SOIC PACKAGE
CASE 751E–04
1
24
1
24
Page 2
MC54/74HC646
MOTOROLA High–Speed CMOS Logic Data
DL129 — Rev 6
3–2
MAXIMUM RATINGS*
Symbol
Parameter
Value
Unit
V
CC
DC Supply Voltage (Referenced to GND)
– 0.5 to + 7.0
V
V
in
DC Input Voltage (Referenced to GND)
– 1.5 to VCC + 1.5
V
V
I/O
DC I/O Voltage (Referenced to GND)
– 0.5 to VCC + 0.5
V
I
in
DC Input Current, per Pin
± 20
mA
I
I/O
DC I/O Current, per Pin
± 35
mA
I
CC
DC Supply Current, VCC and GND Pins
± 75
mA
P
D
Power Dissipation in Still Air,Plastic or Ceramic DIP†
SOIC Package†
750
500
mW
T
stg
Storage Temperature
– 65 to + 150
_
C
T
L
Lead Temperature, 1 mm from Case for 10 Seconds
(Plastic DIP or SOIC Package)
(Ceramic DIP)
260
300
_
C
*Maximum Ratings are those values beyond which damage to the device may occur.
Functional operation should be restricted to the Recommended Operating Conditions.
†Derating — Plastic DIP: –10 mW/_C from 65_ to 125_C
Ceramic DIP: –10 mW/_C from 100_ to 125_C
SOIC Package: – 7 mW/_C from 65_ to 125_C
For high frequency or heavy load considerations, see Chapter 2 of the Motorola High–Speed CMOS Data Book (DL129/D).
RECOMMENDED OPERATING CONDITIONS
Symbol
Parameter
Min
Max
Unit
V
CC
DC Supply Voltage (Referenced to GND)
2.0
6.0
V
Vin, V
out
DC Input Voltage, Output Voltage (Referenced to GND)
0
V
CC
V
T
A
Operating Temperature, All Package Types
– 55
+ 125
_
C
tr, t
f
Input Rise and Fall Time VCC = 2.0 V
(Figure 1) VCC = 4.5 V
VCC = 6.0 V
0
0
0
1000
500
400
ns
DC ELECTRICAL CHARACTERISTICS (Voltages Referenced to GND)
Guaranteed Limit
Symbol
Parameter
Test Conditions
V
CC
V
– 55 to
25_C
v
85_Cv 125_C
Unit
V
IH
Minimum High–Level Input
Voltage
V
out
= 0.1 V or VCC – 0.1 V
|I
out
| v 20 µA
2.0
4.5
6.0
1.5
3.15
4.2
1.5
3.15
4.2
1.5
3.15
4.2
V
V
IL
Maximum Low–Level Input
Voltage
V
out
= 0.1 V or VCC – 0.1 V
|I
out
| v 20 µA
2.0
4.5
6.0
0.3
0.9
1.2
0.3
0.9
1.2
0.3
0.9
1.2
V
V
OH
Minimum High–Level Output
Voltage
Vin = VIH or V
IL
|I
out
| v 20 µA
2.0
4.5
6.0
1.9
4.4
5.9
1.9
4.4
5.9
1.9
4.4
5.9
V
Vin = VIH or VIL|I
out
| v 6.0 mA
|I
out
| v 7.8 mA
4.5
6.0
3.98
5.48
3.84
5.34
3.70
5.20
V
OL
Maximum Low–Level Output
Voltage
Vin = VIH or V
IL
|I
out
| v 20 µA
2.0
4.5
6.0
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
V
Vin = VIH or VIL|I
out
| v 6.0 mA
|I
out
| v 7.8 mA
4.5
6.0
0.26
0.26
0.33
0.33
0.40
0.40
I
in
Maximum Input Leakage Current
Vin = VCC or GND
(Pins 1, 2, 3, 21, 22, and 23)
6.0
± 0.1
± 1.0
± 1.0
µA
This device contains protection
circuitry to guard against damage
due to high static voltages or electric
fields. However, precautions must
be taken to avoid applications of any
voltage higher than maximum rated
voltages to this high–impedance circuit. For proper operation, Vin and
V
out
should be constrained to the
range GND v (Vin or V
out
) v VCC.
Unused inputs must always be
tied to an appropriate logic voltage
level (e.g., either GND or VCC).
Unused outputs must be left open.
I/O pins must be connected to a
properly terminated line or bus.
Page 3
MC54/74HC646
High–Speed CMOS Logic Data
DL129 — Rev 6
3–3 MOTOROLA
DC ELECTRICAL CHARACTERISTICS (Voltages Referenced to GND)
Unit
v
125_C
v
85_C
– 55 to
25_C
V
CC
V
Test Conditions
Parameter
Symbol
I
OZ
Maximum Three–State Leakage
Current
Output in High–Impedance State
Vin = VIL or V
IH
V
out = VCC
or GND, I/O Pins
6.0
± 0.5
± 5.0
± 10
µA
I
CC
Maximum Quiescent Supply
Current (per Package)
Vin = VCC or GND
I
out
= 0 µA
6.0
8
80
160
µA
NOTE: Information on typical parametric values can be found in Chapter 2 of the Motorola High–Speed CMOS Data Book (DL129/D).
Page 4
MC54/74HC646
MOTOROLA High–Speed CMOS Logic Data
DL129 — Rev 6
3–4
AC ELECTRICAL CHARACTERISTICS (C
L
= 50 pF, Input tr = tf = 6 ns)
Guaranteed Limit
Symbol
Parameter
V
CC
V
– 55 to
25_C
v
85_Cv 125_C
Unit
f
max
Maximum Clock Frequency (50% Duty Cycle)
(Figures 3, 4 and 9)
2.0
4.5
6.0
6.0
30
35
4.8
24
28
4.0
20
24
MHz
t
PLH
,
t
PHL
Maximum Propagation Delay, Input A to Output B
(or Input B to Output A)
(Figures 1, 2 and 9)
2.0
4.5
6.0
170
34
29
215
43
37
255
51
43
ns
t
PLH
,
t
PHL
Maximum Propagation Delay, A–to–B Clock to Output B
(or B–to–A Clock to Output A)
(Figures 3, 4 and 9)
2.0
4.5
6.0
220
44
37
275
55
47
330
66
56
ns
t
PLH
,
t
PHL
Maximum Propagation Delay, A–to–B Source to Output B
(or B–to–A Source to Output A)
(Figures 5, 6 and 9)
2.0
4.5
6.0
170
34
29
215
43
37
255
51
43
ns
t
PLZ
,
t
PHZ
Maximum Propagation Delay, Output Enable to Output A or B
(Figures 7, 8 and 10)
2.0
4.5
6.0
175
35
30
220
44
37
265
53
45
ns
t
PZL
,
t
PZH
Maximum Propagation Delay, Direction or Output Enable to
Output A or B
(Figures 7, 8 and 10)
2.0
4.5
6.0
175
35
30
220
44
37
265
53
45
ns
t
TLH
,
t
THL
Maximum Output Transition Time, Any Output
(Figures 1 and 9)
2.0
4.5
6.0
60
12
10
75
15
13
90
18
15
ns
C
in
Maximum Input Capacitance
—
10
10
10
pF
C
out
Maximum Three–State Output Capacitance
(Output in High–Impedance State)
—
15
15
15
pF
NOTES:
1. For propagation delays with loads other than 50 pF, see Chapter 2 of the Motorola High–Speed CMOS Data Book (DL129/D).
2. Information on typical parametric values can be found in Chapter 2 of the Motorola High–Speed CMOS Data Book (DL129/D).
Typical @ 25°C, VCC = 5.0 V
C
PD
Power Dissipation Capacitance (Per Channel)*
60
pF
*Used to determine the no–load dynamic power consumption: PD = CPD V
CC
2
f + ICC VCC. For load considerations, see Chapter 2 of the
Motorola High–Speed CMOS Data Book (DL129/D).
TIMING REQUIREMENTS (Input t
r
= tf = 6 ns)
Guaranteed Limit
Symbol
Parameter
V
CC
V
– 55 to
25_C
v
85_Cv 125_C
Unit
t
su
Minimum Setup Time, Input A to A–to–B Clock
(or Input B to B–to–A Clock)
(Figures 3 and 4)
2.0
4.5
6.0
100
20
17
125
25
21
150
30
26
ns
t
h
Minimum Hold Time, A–to–B Clock to Input A
(or B–to–A Clock to Input B)
(Figures 3 and 4)
2.0
4.5
6.0
5
5
5
5
5
5
5
5
5
ns
t
w
Minimum Pulse Width, A–to–B Clock (or B–to–A Clock)
(Figures 3 and 4)
2.0
4.5
6.0
80
16
14
100
20
17
120
24
20
ns
tr, t
f
Maximum Input Rise and Fall Times
(Figure 1)
2.0
4.5
6.0
1000
500
400
1000
500
400
1000
500
400
ns
NOTE: Information on typical parametric values can be found in Chapter 2 of the Motorola High–Speed CMOS Data Book (DL129/D).
Page 5
MC54/74HC646
High–Speed CMOS Logic Data
DL129 — Rev 6
3–5 MOTOROLA
FUNCTION TABLE — HC646
Control Inputs Data Port Status
Storage Flip–
Flop States
Output
Enable
Direc–
tion
A–to–B
Clock
B–to–A
Clock
A–to–B
Source
B–to–A
Source
A B Q
A
Q
B
Description of Operation
H X
H, L, H, L, X X
Input:XInput:
X
no change no change
The output functions of the A and B
ports are disabled
X X
L
H
X
X
X
X
L
H
L
H
X
X
X
X
L
H
The ports may be used as inputs to
the storage flip–flops. Data at the inputs are clocked into the flip–flops
with the rising edge of the Clocks.
L H
Input: Output:
The output mode of the B data port is
enabled and behaves according to
the following logic equation:
B = [A • (A–to–B Source
)]
+ [Q
A
• (A–to–B Source)]
H, L, X* L X L
H
L
H
no change
no change
no change
no change
1.) When A–to–B Source is low, the
data at the A data port are displayed at the B data port. The
states of the storage flip–flops are
not affected.
H X X Q
A
no change no change 2.) When A–to–B Source is high, the
states of the A storage flip–flops are
displayed at the B data port.
X* L X L
H
L
H
L
H
no change
no change
3.) When A–to–B Source is low, the
data at the A data port are clocked
into the A storage flip–flops by a rising–edge signal on the A–to–B
Clock.
H X L
H
Q
A
Q
A
L
H
no change
no change
4.) When A–to–B Source is high, the
data at the A data port are clocked
into the A storage flip–flops by a rising–edge signal on the A–to–B
Clock. The states, QA, of the storage flip–flops propagate directly to
the B data port.
L L
Output: Input:
The output mode of the A data port is
enabled and behaves according to
the following logic equation:
A = [B • (B–to–A Source
)]
+ [Q
B
• (B–to–A Source)]
X* H, L, X L L
H
L
H
no change
no change
no change
no change
1.) When B–to–A Source is low, the
data at the B data port are displayed at the A data port. The
states of the storage flip–flops are
not affected.
X H Q
B
X no change no change 2.) When B–to–A Source is high, the
states of the B storage flip–flops are
displayed at the A data port.
X* X L L
H
L
H
no change
no change
L
H
3.) When B–to–A Source is low, the
data at the B data port are clocked
into the B storage flip–flops by a rising–edge signal on the B–to–A
Clock.
X H Q
B
Q
B
L
H
no change
no change
L
H
4.) When B–to–A Source is high, the
data at the B data port are clocked
into the B storage flip–flops by a rising–edge signal on the B–to–A
Clock. The states, QB, of the storage flip–flops propagate directly to
the A data port.
*The clocks are not internally gated with either the Output Enables or the Source inputs. Therefore, data at the A and B ports may be clocked into
the storage flip–flops at any time.
Page 6
MC54/74HC646
MOTOROLA High–Speed CMOS Logic Data
DL129 — Rev 6
3–6
BUS
A
A
FLIP–
FLOPS
B
FLIP–
FLOPS
CONTROL
LOGIC
CONTROL
LOGIC
(3) (21) (1) (23) (2) (22)
DIRECTION OUTPUT
ENABLE
A–TO–B
CLOCK
B–TO–A
CLOCK
A–TO–B
SOURCE
B–TO–A
SOURCE
X H X X
CONTROL
PINS
(3) (21) (1) (23) (2) (22)
DIRECTION OUTPUT
ENABLE
A–TO–B
CLOCK
B–TO–A
CLOCK
A–TO–B
SOURCE
B–TO–A
SOURCE
H L L X
CONTROL
PINS
Data Storage From A and/or B Bus Real–Time Transfer From Bus A to Bus B
CONTROL
LOGIC
X X
TYPICAL APPLICATIONS
(3) (21) (1) (23) (2) (22)
DIRECTION OUTPUT
ENABLE
A–TO–B
CLOCK
B–TO–A
CLOCK
A–TO–B
SOURCE
B–TO–A
SOURCE
L L X L
CONTROL
PINS
Real–Time Transfer From Bus B to Bus A
X X
BUS
B
BUS
A
BUS
B
A
FLIP–
FLOPS
B
FLIP–
FLOPS
BUS
A
A
FLIP–
FLOPS
B
FLIP–
FLOPS
BUS
B
Page 7
MC54/74HC646
High–Speed CMOS Logic Data
DL129 — Rev 6
3–7 MOTOROLA
TIMING DIAGRAMS AND SWITCHING DIAGRAMS — HC646
90%
Figure 1. A Data Port = Input, B Data Port = Output
t
r
t
f
V
CC
GND
Figure 2. A Data Port = Output, B Data Port = Input
NOTE: = Don’t Care State
OUTPUT ENABLE
DIRECTION
A–TO–B SOURCE
B–TO–A SOURCE
A DATA PORT
B DATA PORT
OUTPUT ENABLE
DIRECTION
B–TO–A SOURCE
A–TO–B SOURCE
B DATA PORT
A DATA PORT
V
CC
GND
V
CC
GND
V
CC
GND
V
CC
GND
V
CC
GND
V
CC
GND
V
CC
GND
V
CC
GND
V
CC
GND
50%
10%
10%
50%
90%
t
TLH
t
THL
t
PLH
t
PHL
90%
50%
10%
50%
t
r
t
f
t
PLH
t
PHL
Page 8
MC54/74HC646
MOTOROLA High–Speed CMOS Logic Data
DL129 — Rev 6
3–8
Figure 3. A Data Port = Input, B Data Port = Output
Figure 4. B Data Port = Input, A Data Port = Output
OUTPUT ENABLE
DIRECTION
B–TO–A SOURCE
A–TO–B SOURCE
B–TO–A CLOCK
B DATA PORT
OUTPUT ENABLE
DIRECTION
B–TO–A SOURCE
A–TO–B SOURCE
B DATA PORT
A DATA PORT
A DATA PORT
A–TO–B CLOCK
B–TO–A CLOCK
A–TO–B CLOCK
V
CC
GND
V
CC
GND
V
CC
GND
V
CC
GND
V
CC
GND
V
CC
GND
V
CC
GND
V
CC
GND
V
CC
GND
V
CC
GND
V
CC
GND
V
CC
GND
V
CC
GND
V
CC
GND
50%
50%
50%
50%
50%
50%
t
h
t
h
t
w
t
w
1/f
max
1/f
max
t
PHL
t
PLH
t
PHL
t
PLH
t
su
t
su
Page 9
MC54/74HC646
High–Speed CMOS Logic Data
DL129 — Rev 6
3–9 MOTOROLA
B DATA PORT
A DATA PORT
OUTPUT ENABLE
DIRECTION
INTERNAL Q
A
(FLIP–FLOP A)
INTERNAL Q
B
(FLIP–FLOP B)
B–TO–A
SOURCE
A–TO–B
SOURCE
V
CC
GND
NOTES:
1. B Data Port (output) changes from the level of the storage flip–flop, QA, to the level of A Data Port (input).
2. B Data Port (output) changes from the level of the A Data Port (input) to the level of the storage flip–flop, Q
A.
3. The A storage flip–flop, A–to–B Source, and A Data Port (input) have simultaneously changed states.
Figure 5. A Data Port = Input, B Data Port = Output
1 2
3
V
CC
GND
V
CC
GND
V
CC
GND
V
CC
GND
V
CC
GND
V
CC
GND
50%
t
PLH
t
PHL
50%
t
PLH
t
PHL
Page 10
MC54/74HC646
MOTOROLA High–Speed CMOS Logic Data
DL129 — Rev 6
3–10
NOTES:
1. A Data Port (output) changes from the level of the storage flip–flop, QB, to the level of B Data Port (input).
2. A Data Port (output) changes from the level of the B Data Port (input) to the level of the storage flip–flop, Q
B.
3. The B storage flip–flop, B–to–A Source, and B Data Port (input) have simultaneously changed states for the purpose of this
3. example. A Data Port (output) is now displaying the voltage level of B Data Port (input).
Figure 6. A Data Port = Output, B Data Port = Input
1 2
3
B DATA PORT
A DATA PORT
OUTPUT ENABLE
DIRECTION
INTERNAL Q
A
(FLIP–FLOP A)
INTERNAL Q
B
(FLIP–FLOP B)
B–TO–A
SOURCE
A–TO–B
SOURCE
V
CC
GND
V
CC
GND
V
CC
GND
V
CC
GND
V
CC
GND
V
CC
GND
V
CC
GND
50%
t
PLH
t
PHLtPLH
t
PHL
50%
PIN DESCRIPTIONS
INPUTS/OUTPUTS
A0–A7 (Pins 4–11) and B0–B7 (Pins 20–13)
A and B data ports. These pins may function either as in-
puts to or outputs from the transceivers.
CONTROL INPUTS
Output Enable (Pin 21)
Active–low output enable. When this pin is low, the outputs
are enabled and function normally . When this pin is high, the
A and B data ports are in high–impedance states. See the
Function Table.
Direction (Pin 3)
Data direction control. When the Output Enable pin is low,
this control pin determines the direction of data flow. When
Direction is high, the A data ports are inputs and the B data
ports are outputs. When Direction is low, the A data ports are
outputs and the B data ports are inputs.
A–to–B Clock, B–to–A Clock (Pins 1, 23)
Clocks f or the internal D flip–flops. With a low–to–high
transition on the appropriate Clock pin, data on the A (or B)
inputs are clocked into the internal A (or B) flip–flops. These
clocks are not internally gated with the Output Enable or the
Direction pins, therefore data at the A and B pins may be
clocked into the storage flip–flops at any time.
A–to–B Source, B–to–A Source (Pins 2, 22)
Data–source selection pins. Depending upon the states of
these pins (see the Function Table), data at the outputs may
come either from the inputs or from the D flip–flops.
Page 11
MC54/74HC646
High–Speed CMOS Logic Data
DL129 — Rev 6
3–11 MOTOROLA
V
CC
GND
HIGH IMPEDANCE
OUTPUT ENABLE
DIRECTION
DATA PORT A
DATA PORT A
DATA PORT B
DATA PORT B
DATA PORT A = INPUT
DATA PORT B = OUTPUT
DATA PORT A = OUTPUT
DATA PORT B = INPUT
*Includes all probe and jig capacitance
CL*
TEST POINT
DEVICE
UNDER
TEST
OUTPUT
*Includes all probe and jig capacitance
CL*
TEST POINT
DEVICE
UNDER
TEST
OUTPUT
CONNECT TO VCC WHEN
TESTING t
PLZ
AND t
PZL
.
CONNECT TO GND WHEN
TESTING t
PHZ
AND t
PZH
.
1 k
Ω
OUTPUT ENABLE
OUTPUT A OR B
OUTPUT A OR B
50%
50%
50%
90%
10%
t
PZL
t
PLZ
t
PZHtPHZ
V
CC
GND
HIGH
IMPEDANCE
V
OL
V
OH
HIGH
IMPEDANCE
V
CC
GND
V
OH
HIGH IMPEDANCE
V
OL
V
OH
HIGH IMPEDANCE
HIGH IMPEDANCE
V
OL
Figure 7.
50%
90%
10%
50%
50%
10%
90%
50%
50%
t
PHZ
t
PLZ
t
PZH
t
PZL
t
PZH
t
PZL
t
PHZ
t
PLZ
Figure 8.
Figure 9. Test Circuit Figure 10. Test Circuit
Page 12
MC54/74HC646
MOTOROLA High–Speed CMOS Logic Data
DL129 — Rev 6
3–12
LOGIC DETAIL
4
20
A0
B0
A1
A2
A3
A4
A5
A6
A7
5
6
7
8
9
10
11
19
B1
18
B2
17
B3
16
B4
15
B5
14
B6
13
B7
D
C
CQQ
HC648
HC646
HC646
HC648
V
CC
V
CC
HC648
HC646
HC646
HC648
DQ
Q
C
C
A
B
CAB
CAB
SAB
TAB
TAB
TBA
TBA
SBA
CBA
CBA
OUTPUT ENABLE
DIRECTION
21
3
T
BA
TBA
TAB
TAB
SBA
SAB
CBA
CBA
CAB
CAB
22
2
23
1
B–TO–A SOURCE
A–TO–B SOURCE
B–TO–A CLOCK
A–TO–B CLOCK
Page 13
MC54/74HC646
High–Speed CMOS Logic Data
DL129 — Rev 6
3–13 MOTOROLA
OUTLINE DIMENSIONS
J SUFFIX
CERAMIC PACKAGE
CASE 758–02
ISSUE A
NOTES:
1. CHAMFERED CONTOUR OPTIONAL.
2. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
3. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
4. CONTROLLING DIMENSION: INCH.
–A–
–B–
24 13
12
1
–T–
SEATING
PLANE
24 PL
K
E
F
N
C
D
G
M
A
M
0.25 (0.010) T
24 PLJ
M
B
M
0.25 (0.010) T
L
M
NOTE 1
DIM MIN MAX MIN MAX
MILLIMETERSINCHES
A 1.230 1.265 31.25 32.13
B 0.250 0.270 6.35 6.85
C 0.145 0.175 3.69 4.44
D 0.015 0.020 0.38 0.51
E 0.050 BSC 1.27 BSC
F 0.040 0.060 1.02 1.52
G 0.100 BSC 2.54 BSC
J 0.007 0.012 0.18 0.30
K 0.110 0.140 2.80 3.55
L 0.300 BSC 7.62 BSC
M 0 15 0 15
N 0.020 0.040 0.51 1.01
_ _ _ _
N SUFFIX
PLASTIC PACKAGE
CASE 724–03
ISSUE D
C
N
K
F
G
B
1
24
12
13
L P
J
SEATING
PLANE
DIMAMIN MAX MIN MAX
MILLIMETERS
1.240 1.285 31.50 32.64
INCHES
B 0.285 0.305 7.24 7.75
C 0.160 0.200 4.07 5.08
D 0.015 0.021 0.38 0.53
F 0.045 0.062 1.14 1.57
G 0.100 BSC 2.54 BSC
J 0.008 0.013 0.20 0.33
K 0.100 0.165 2.54 4.19
L 0.300 0.310 7.62 7.87
N 0.020 0.050 0.51 1.27
P 0.360 0.400 9.14 10.16
NOTES:
3. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
4. CONTROLLING DIMENSION: INCH.
5. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
0.25 (0.010)MT A
M
D 24 PL
–T–
–A–
Page 14
MC54/74HC646
MOTOROLA High–Speed CMOS Logic Data
DL129 — Rev 6
3–14
OUTLINE DIMENSIONS
DW SUFFIX
PLASTIC SOIC PACKAGE
CASE 751E–04
ISSUE E
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.13 (0.005) TOTAL IN
EXCESS OF D DIMENSION AT MAXIMUM
MATERIAL CONDITION.
–A–
–B–
P
12X
D24X
12
1324
1
M
0.010 (0.25) B
M
S
A
M
0.010 (0.25) B
S
T
–T–
G
22X
SEATING
PLANE
K
C
R
X 45
_
M
F
J
DIM MIN MAX MIN MAX
INCHESMILLIMETERS
A 15.25 15.54 0.601 0.612
B 7.40 7.60 0.292 0.299
C 2.35 2.65 0.093 0.104
D 0.35 0.49 0.014 0.019
F 0.41 0.90 0.016 0.035
G 1.27 BSC 0.050 BSC
J 0.23 0.32 0.009 0.013
K 0.13 0.29 0.005 0.011
M 0 8 0 8
P 10.05 10.55 0.395 0.415
R 0.25 0.75 0.010 0.029
____
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