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MC 34064 D-005G
Datasheet
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Datasheet MC 34064 D-005G Datasheet

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Page 1
MC34064, MC33064, NCV33064
Undervoltage Sensing Circuit
Applications include direct monitoring of the 5.0 V MPU/logic power supply used in appliance, automotive, consumer and industrial equipment.
Features
• Trimmed−In−Package Temperature Compensated Reference
• Comparator Threshold of 4.6 V at 25°C
• Precise Comparator Thresholds Guaranteed Over Temperature
• Comparator Hysteresis Prevents Erratic Reset
• Reset Output Capable of Sinking in Excess of 10 mA
• Internal Clamp Diode for Discharging Delay Capacitor
• Guaranteed Reset Operation with 1.0 V Input
• Low Standby Current
• Economical TO−92, TSOP−5, SOIC−8 and Micro8 Surface Mount
Packages
• Pb−Free Packages are Available
• NCV Prefix for Automotive and Other Applications Requiring Site
and Control Changes
Input
Reset
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8
1
8
1
5
1
Pin 1. Ground
Pin 1. Reset
1
2
3
PIN CONNECTIONS
1
Reset
2
Input
3
N.C.
4
Ground
(Top View)
SOIC−8
D SUFFIX
CASE 751
Micro8 DM SUFFIX CASE 846A
TSOP−5
SN SUFFIX
CASE 483
2. Input
3. Reset
4. NC
5. NC
TO−92
P SUFFIX
CASE 29
2. Input
3. Ground
8
N.C.
7
N.C.
6
N.C.
5
N.C.
1.2 V
ref
GND
This device contains 21 active transistors.
Figure 1. Representative Block Diagram
© Semiconductor Components Industries, LLC, 2005
October, 2005 − Rev. 16
Sink Only
=
Positive True Logic
1 Publication Order Number:
ORDERING INFORMATION
See detailed ordering and shipping information in the package dimensions section on page 6 of this data sheet.
DEVICE MARKING INFORMATION
See general marking information in the device marking section on page 7 of this data sheet.
MC34064/D
Page 2
MC34064, MC33064, NCV33064
MAXIMUM RATINGS
Rating Symbol Value Unit
Power Input Supply Voltage V Reset Output Voltage V Reset Output Sink Current (Note 2) I
Clamp Diode Forward Current, Reset to Input Pin (Note 2) I
in O
Sink
F
Power Dissipation and Thermal Characteristics
P Suffix, Plastic Package
Maximum Power Dissipation @ TA = 25°C Thermal Resistance, Junction−to−Air
D Suffix, Plastic Package
Maximum Power Dissipation @ TA = 25°C Thermal Resistance, Junction−to−Air
DM Suffix, Plastic Package
Maximum Power Dissipation @ TA = 25°C
Thermal Resistance, Junction−to−Air Operating Junction Temperature T Operating Ambient Temperature
P
D
R
q
JA
P
D
R
q
JA
P
D
R
q
JA
J
T
A
MC34064 MC33064 NCV33064
Storage Temperature Range T
stg
Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected.
1. ESD data available upon request.
−1.0 to 10 V 10 V
Internally
mA
Limited
100 mA
625 200
625 200
520 240
mW
°C/W
mW
°C/W
mW
°C/W
+150 °C
°C
0 to +70
−40 to +85
−40 to +125
−65 to +150 °C
ELECTRICAL CHARACTERISTICS (For typical values T
= 25°C, for min/max values TA is the operating ambient temperature range
A
that applies [Notes 3 and 4] unless otherwise noted.)
Characteristics Symbol Min Typ Max Unit
COMPARATOR
Threshold Voltage
High State Output (Vin Increasing) Low State Output (Vin Decreasing) Hysteresis
V
IH
V
IL
V
H
4.5
4.5
0.01
4.61
4.59
0.02
0.05
RESET OUTPUT
Output Sink Saturation
(Vin = 4.0 V, I (Vin = 4.0 V, I (Vin = 1.0 V, I
= 8.0 mA)
Sink
= 2.0 mA)
Sink
= 0.1 mA)
Sink
Output Sink Current (Vin, Reset = 4.0 V) I Output Off-State Leakage (Vin, Reset = 5.0 V) I Clamp Diode Forward Voltage, Reset to Input Pin (IF = 10 mA) V
V
Sink
OH
OL
−
−
−
0.46
0.15
−
10 27 60 mA
− 0.02 0.5
F
0.6 0.9 1.2 V
TOTAL DEVICE
Operating Input Voltage Range V Quiescent Input Current (Vin = 5.0 V) I
in
in
1.0 to 6.5 − − V
− 390 500
2. Maximum package power dissipation limits must be observed.
3. Low duty cycle pulse techniques are used during test to maintain junction temperature as close to ambient as possible.
4. T
=0°C for MC34064 T
low
−40°C for MC33064 +85°C for MC33064
= +70°C for MC34064
high
−40°C for NCV33064 +125°C for NCV33064
5. NCV prefix is for automotive and other applications requiring site and change control.
4.7
V
4.7
V
1.0
0.4
0.1
mA
mA
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2
Page 3
MC34064, MC33064, NCV33064
10
RL = 10 k to V TA = 25°C
in
8.0
6.0
4.0
, OUTPUT VOLTAGE (V)
O
2.0
V
0
0 2.0 4.0 6.0 8.0 10
Vin, INPUT VOLTAGE (V)
Figure 2. Reset Output Voltage versus
Input Voltage
4.630
, THRESHOLD VOLTAGE (V) V
th
RL = 10 k to V
4.620
4.610
4.600
4.590
4.580
in
Upper Threshold
High State Output
Lower Threshold
Low State Output
5.0 RL = 10 k to V TA = 25°C
in
4.0
3.0
2.0
, OUTPUT VOLTAGE (V)
O
1.0
V
0
4.560 4.580 4.600 4.620 4.640 Vin, INPUT VOLTAGE (V)
Figure 3. Reset Output Voltage versus
Input Voltage
1.0
TA = +25°C
−40°C
+85°C
−40°C
, INPUT CURRENT (mA)
in
I
0.8
0.6
0.4
0.2
TA = +25°C
+85°C
4.570
−55 −25 0 25 50 75 100 125
TA, AMBIENT TEMPERATURE (°C)
Figure 4. Comparator Threshold Voltage
versus Temperature
2.0
1.5
Vin = 4.0 V
TA = 85°C
TA = 25°C
TA = −40°C
1.0
, OUTPUT SATURATION (V)
0.5
OL
V
0
0102030 40
I
, SINK CURRENT (mA)
Sink
Figure 6. Reset
Output Saturation versus
Sink Current
0
0 2.0 4.0 6.0 8.0 10
Vin, INPUT VOLTAGE (V)
Figure 5. Input Current versus Input Voltage
90%
5.0 V −
4.0 V −
10%
5.0V
4.0V
V
in
Reset
V
in
REF
10k
Reset
200 ns/DIV
Vin = 5.0 V to 4.0 V RL = 10 k TA = 25°C
Figure 7. Reset Delay Time
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3
Page 4
MC34064, MC33064, NCV33064
80
Vin = 0 V TA = 25°C
60
40
20
, FORWARD CURRENT (mA)
F
I
0
0 0.4 0.8 1.2 1.6
VF, FORWARD VOLTAGE (V)
Figure 8. Clamp Diode Forward Current versus Voltage
+
Power
Supply
−
+
Power
Supply
−
I
in
R
H
Input
1.2V
Input
−
1.2 V
+
ref
A time delayed reset can be accomplished with the addition of C power supply rise times (<500 ns) it is recommended that the RC V
GND
Figure 9. Low Voltage Microprocessor Reset
R
L
Reset
−
+
ref
GND
4.6 R R
th(lower)
H
+ 0.02
L
≈ 340 RH x 10
VH ≈
DV
Where:RH ≤ 150 W
Where:RL ≥ 1.5 W, ≤ 10 kW
R
Reset
Microprocessor
Circuit
C
DLY
. For systems with extremely fast
DLY
time constant be greater than 5.0 ms.
DLY
is the microprocessor reset input threshold.
th(MPU)
1
t
= RC
DLY
In
DLY
1 −
V
th(MPU)
V
(mV)
Microprocessor
Circuit
112 100 164
−6
190 327 276 480
20 51 40 81 71
V
in
H
TEST DATA
10 10 16 16 34 34 51 51
R
th
(W)
0
10 20 20 30 30 47
47 100 100 150 150
DV
(mV)
3.4
6.8
6.8
R
H
L
(kW)
0
0
1.5
4.7
1.5
2.7
1.5
2.7
1.5
2.7
1.5
2.7
1.5
Comparator hysteresis can be increased with the addition of resistor RH. The hysteresis equation has been simplified and does not account for the change of input current Iin as VCC crosses the comparator threshold (Figure 4). An increase of the lower threshold DV
4.59V. The equations are accurate to ±10% with RH less than 150 W and RL between 1.5 kW and 10 kW.
will be observed due to Iin which is typically 340 mA at
th(lower)
Figure 10. Low Voltage Microprocessor Reset with Additional Hysteresis
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4
Page 5
MC34064, MC33064, NCV33064
+
Power Supply
−
Vin = 11.5
to 14.5V
+
− Input
Reset
−
+
1.2V
ref
GND
Input
1.2V
1.0k
Reset
−
+
ref
GND
Figure 11. Voltage Monitor Figure 12. Solar Powered Battery Charger
25mH
4.7k
470
Input
+
1.2V
MPSW51A
470
1N5819
1.2k
1N756
330
68022
+
Line Regulation Vin = 11.5 V to 14.5 V, IO = 50 mA 35 mV
Reset
−
+
ref
Load Regulation Vin = 12.6 V, IO = 0 mA to 50 mA 12 mV Output Ripple Vin = 12.6 V, IO = 50 mA 60 mVpp Efficiency Vin = 12.6 V, IO = 50 mA 77%
VO = 5.0 V
IO = 50 mA
+
Test Conditions Results
Solar Cells
GND
Figure 13. Low Power Switching Regulator
V
CC
R
L
MTP3055EL
4.6V
270
Input
Reset
−
+
1.2V
ref
GND
Overheating of the logic level power MOSFET due to insufficient gate voltage can be prevented with the above circuit. When the input signal is below the 4.6 V threshold of the MC34064, its output grounds the gate of the L MOSFET.
Figure 14. MOSFET Low Voltage Gate Drive Protection
2
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5
Page 6
MC34064, MC33064, NCV33064
ORDERING INFORMATION
Device Operating Temperature Range Package Shipping
MC34064D−005 MC34064D−005G SOIC−8
MC34064D−5R2 SOIC−8 MC34064D−5R2G SOIC−8
MC34064DM−5R2 Micro8 MC34064DM−5R2G Micro8
MC34064P−005 TO−92 MC34064P−005G TO−92
MC34064P−5RA TO−92 MC34064P−5RAG TO−92
MC34064P−5RP TO−92 MC34064P−5RPG TO−92
MC34064P−5RM TO−92 MC34064P−5RMG TO−92
MC34064SN−5T1 TSOP−5 MC34064SN−5T1G TSOP−5
MC33064D−005 MC33064D−005G SOIC−8
MC33064D−5R2 SOIC−8 MC33064D−5R2G SOIC−8
MC33064DM−5R2 Micro8 MC33064DM−5R2G Micro8
MC33064P−005 TO−92 MC33064P−005G TO−92
MC33064P−5RA TO−92 MC33064P−5RAG TO−92
MC33064P−5RP TO−92 MC33064P−5RPG TO−92
MC33064SN−5T1 TSOP−5 MC33064SN−5T1G TSOP−5
†For information on tape and reel specifications, including part orientation and tape sizes, pleaserefer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
*NCV33064: T
change control.
= −40°C, T
low
= +125°C. Guaranteed by design. NCV prefix is for automotive and other applications requiring site and
high
TA = 0°C to +70°C
TJ = −40°C to +85°C
SOIC−8
(Pb−Free)
(Pb−Free)
(Pb−Free)
(Pb−Free)
(Pb−Free)
(Pb−Free)
(Pb−Free)
(Pb−Free)
SOIC−8
(Pb−Free)
(Pb−Free)
(Pb−Free)
(Pb−Free)
(Pb−Free)
(Pb−Free)
(Pb−Free)
98 Units / Rail
2500 Units/ Tape & Reel
4000 Units / Tape & Reel
2000 Units / Bag
2000 Units / Tape & Reel
2000 Units / Ammo Pack
3000 Units / Tape & Reel
98 Units / Rail
2500 Units / Tape & Reel
4000 Units / Tape & Reel
2000 Units / Bag
2000 Units / Tape & Reel
2000 Units / Ammo Pack
3000 Units / Tape & Reel
†
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6
Page 7
MC34064, MC33064, NCV33064
ORDERING INFORMATION
Device Shipping
NCV33064D−5R2* NCV33064D−5R2G* SOIC−8
NCV33064P−5RA* TO−92 NCV33064P−5RAG* TO−92
NCV33064P−5RP* TO−92 NCV33064P−5RPG* TO−92
NCV33064DM−5R2* Micro8 NCV33064DM−5R2G* Micro8
†For information on tape and reel specifications, including part orientation and tape sizes, pleaserefer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
*NCV33064: T
change control.
= −40°C, T
low
high
TA = −40°C to +125°C
= +125°C. Guaranteed by design. NCV prefix is for automotive and other applications requiring site and
PackageOperating Temperature Range
SOIC−8
(Pb−Free)
(Pb−Free)
(Pb−Free)
(Pb−Free)
2500 Units / Tape & Reel
2000 Units / Tape & Reel
2000 Units / Ammo Pack
4000 Units / Tape & Reel
MARKING DIAGRAMS
†
8
1
3x064
ALYW5
G
SOIC−8 D SUFFIX CASE 751
8
1
V3064
ALYW5
G
Micro8 DM SUFFIX CASE 846A
8
Ly50
AYW G
G
1
SN SUFFIX
CASE 483
5
SRB AYWG
G
1
MC34064 MC33064
x = 3 or 4 y = C or I A = Assembly Location L = Wafer Lot Y = Year W, WW = Work Week G = Pb−Free Package
(Note: Microdot may be in either location)
8
VI50
AYW G
G
1
TSOP−5
5
SSN AYWG
G
1
MC3x0
64P−5
ALYWW G
G
123
TO−92
P SUFFIX
CASE 29
NCV30
64P−5
ALYWW G
G
123
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7
Page 8
−Y−
−Z−
MC34064, MC33064, NCV33064
PACKAGE DIMENSIONS
SOIC−8
D SUFFIX
PLASTIC PACKAGE
CASE 751−07
ISSUE AG
NOTES:
−X− A
58
B
1
S
0.25 (0.010)
4
M
M
Y
K
G
C
SEATING PLANE
0.10 (0.004)
H
D
0.25 (0.010) Z
M
SXS
Y
N
X 45
_
M
J
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION.
6. 751−01 THRU 751−06 ARE OBSOLETE. NEW STANDARD IS 751−07.
MILLIMETERS
DIMAMIN MAX MIN MAX
4.80 5.00 0.189 0.197
B 3.80 4.00 0.150 0.157 C 1.35 1.75 0.053 0.069 D 0.33 0.51 0.013 0.020 G 1.27 BSC 0.050 BSC H 0.10 0.25 0.004 0.010 J 0.19 0.25 0.007 0.010 K 0.40 1.27 0.016 0.050
M 0 8 0 8
____
N 0.25 0.50 0.010 0.020 S 5.80 6.20 0.228 0.244
INCHES
SOLDERING FOOTPRINT*
1.52
0.060
7.0
0.275
0.6
0.024
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
4.0
0.155
1.270
0.050
SCALE 6:1
ǒ
inches
mm
Ǔ
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8
Page 9
MC34064, MC33064, NCV33064
Micro8
PACKAGE DIMENSIONS
DM SUFFIX
PLASTIC PACKAGE
CASE 846A−02
ISSUE F
SEATING PLANE
−T−
0.038 (0.0015)
PIN 1 ID
−A−
K
G
−B−
D
8 PL
0.08 (0.003) A
M
T
S
B
S
C
H
J
L
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE.
5. 846A−01 OBSOLETE, NEW STANDARD 846A−02.
DIM MIN MAX MIN MAX
A 2.90 3.10 0.114 0.122 B 2.90 3.10 0.114 0.122 C −−− 1.10 −−− 0.043 D 0.25 0.40 0.010 0.016 G 0.65 BSC 0.026 BSC H 0.05 0.15 0.002 0.006 J 0.13 0.23 0.005 0.009 K 4.75 5.05 0.187 0.199 L 0.40 0.70 0.016 0.028
INCHESMILLIMETERS
SOLDERING FOOTPRINT*
8X
1.04
0.041
0.38
0.015
8X
6X
0.0256
3.20
0.126
0.65
0.167
4.24
SCALE 8:1
5.28
0.208
ǒ
inches
mm
Ǔ
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
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9
Page 10
0.05 (0.002)
S
H
D
54
123
L
G
A
MC34064, MC33064, NCV33064
PACKAGE DIMENSIONS
TSOP−5
SN SUFFIX
PLASTIC PACKAGE
CASE 483−02
ISSUE E
NOTES:
1. DIMENSIONING AND TOLERANCING PER
2. CONTROLLING DIMENSION: MILLIMETER.
3. MAXIMUM LEAD THICKNESS INCLUDES
B
J
C
K
M
4. A AND B DIMENSIONS DO NOT INCLUDE
ANSI Y14.5M, 1982.
LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL.
MOLD FLASH, PROTRUSIONS, OR GATE BURRS.
DIM MIN MAX MIN MAX
A 2.90 3.10 0.1142 0.1220 B 1.30 1.70 0.0512 0.0669 C 0.90 1.10 0.0354 0.0433 D 0.25 0.50 0.0098 0.0197 G 0.85 1.05 0.0335 0.0413 H 0.013 0.100 0.0005 0.0040 J 0.10 0.26 0.0040 0.0102 K 0.20 0.60 0.0079 0.0236 L 1.25 1.55 0.0493 0.0610 M 0 10 0 10
____
S 2.50 3.00 0.0985 0.1181
INCHESMILLIMETERS
SOLDERING FOOTPRINT*
1.9
0.95
0.037
1.0
0.039
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
0.074
0.028
0.7
2.4
0.094
SCALE 10:1
ǒ
inches
mm
Ǔ
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10
Page 11
MC34064, MC33064, NCV33064
PACKAGE DIMENSIONS
TO−92
P SUFFIX
PLASTIC PACKAGE
CASE 29−11
ISSUE AL
SEATING PLANE
A
B
R
P
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. CONTOUR OF PACKAGE BEYOND DIMENSION R IS UNCONTROLLED.
4. LEAD DIMENSION IS UNCONTROLLED IN P AND BEYOND DIMENSION K MINIMUM.
L
MILLIMETERSINCHES
XX
V
1
K
D
G
H
J
C
SECTION X−X
N
DIM MIN MAX MIN MAX
A 0.175 0.205 4.45 5.20 B 0.170 0.210 4.32 5.33 C 0.125 0.165 3.18 4.19 D 0.016 0.021 0.407 0.533 G 0.045 0.055 1.15 1.39 H 0.095 0.105 2.42 2.66 J 0.015 0.020 0.39 0.50 K 0.500 −−− 12.70 −−− L 0.250 −−− 6.35 −−− N 0.080 0.105 2.04 2.66 P −−− 0.100 −−− 2.54 R 0.115 −−− 2.93 −−− V 0.135 −−− 3.43 −−−
N
Micro8 is a trademark of International Rectifier.
ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
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MC34064/D
11
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