Datasheet MC3399DW, MC3399T Datasheet (Motorola)

Device

Operating

Temperature Range

Package



SEMICONDUCTOR

TECHNICAL DATA

AUTOMOTIVE

HALF–AMP HIGH–SIDE

SWITCH

ORDERING INFORMATION

MC3399DW
MC3399T

TA = – 40° to +125°C

SOP(8+8)L

Plastic Power

DW SUFFIX

PLASTIC PACKAGE

CASE 751G

SOP(8+8)L

16

1

Order this document by MC3399/D

Pin 1. Ignition

2. N.C.

3. N.C.

4. N.C.

5. Ground

6. N.C.

7. Input

8. N.C.

9. Output

10.Output

11.Output

12.Output

13.Output

14.Output

15.Output

16.Output

T SUFFIX

PLASTIC PACKAGE

CASE 314D

1

5

Pin 1. Ignition

2. Output

3. Output

4. Ground

5. Input

Pins 2 and 3 connected to package tab.

1

MOTOROLA ANALOG IC DEVICE DATA

 
 

The MC3399 is a High–Side Switch designed to drive loads from the
positive side of the power supply. The output is controlled by a TTL
compatible input Enable pin. In the “on” state, the device exhibits very low
saturation voltages for load currents in excess of 750 mA. The device
isolates the load from positive or negative going high voltage transients by
abruptly “opening” thus protecting the load from the transient voltage for the
duration of the transient. The device automatically re–establishes its original
operating state following the transient condition.

The MC3399 is fabricated on a power BIMOS process which combines
the best features of Bipolar and MOS technologies. The mixed technology
provides higher gain PNP output devices and results in Power Integrated
Circuits having substantially reduced quiescent currents.

The device operates over a wide power supply voltage range and can
withstand voltage transients (positive or negative) of ±100 V. A rugged PNP
output stage along with active clamp circuitry, output current limit and
thermal shutdown permit the driving of all types of loads, including inductive.
The MC3399 is offered in 5–lead TO–220 and 16–lead SOIC plastic
packages to facilitate either “thru–hole” or surface mount use. In addition, it
is specified over a wide ambient operating temperature of –40°C to +125°C
and is ideally suited for industrial and automotive applications where harsh
environments exist.

• Low Switch Voltage Drop

• Load Currents in Excess of 750 mA

• Low Quiescent Current

• Transient Protection Up to ±100 V

• TTL Compatible Enable Input

• On–Chip Current Limit and Thermal Shutdown Circuitry

Representative Block Diagram

Ignition Output

Input

Gnd

L
O
A
D

Power

Supply

MC3399T

This device contains 52 active transistors.

 Motorola, Inc. 1997 Rev 1

MC3399

2

MOTOROLA ANALOG IC DEVICE DATA

MAXIMUM RATINGS

Rating Symbol Value Unit

Ignition Input Voltage (Continuous) V

IGN

Vdc
Forward 25
Reverse –16

Ignition Input Voltage (T ransient) V

IGN

V

±60

±100

Input Voltage V

in

–0.3 to +7.0 V

Output Current I

O

Internally

Limited

A

Thermal Resistance °C/W

Plastic Power Package (Case 314D)

Junction–to–Ambient R

θJA1

65

Junction–to–Tab R

θJT

5.0

SOP(8+8)L Plastic Package (Case 751G)

Junction–to–Ambient R

θJA2

138

Junction–to–Lead 12 R

θJL

52

Soldering Temperature (for 10 Seconds) T

solder

260 °C

Junction Temperature T

J

–40 to +150 °C

Storage Temperature T

stg

–65 to +150 °C

ELECTRICAL CHARACTERISTICS (V

IGN

= 12 V, IL = 150 mA, –40°C ≤ TA = +125°C, V Input = “1”, unless otherwise noted.)

(1)

Characteristic

Symbol Min Typ Max Unit

Operating Voltage V

IGN(min)

4.5 – – V

Switch Voltage Drop (Saturation)

V

IGN

= 4.5 V IO = 150 mA, TA = 25°C

IO = 200 mA, TA = –40°C
IO = 125 mA, TA = 125°C

V

IGN

= 12 V IO = 425 mA, TA = 25°C

IO = 550 mA, TA = –40°C

V

IGN

= 16 V IO = 375 mA, TA = 125°C

V

IGN–VO

–
–
–
–
–
–

0.2

0.3

0.3

0.3

0.3

0.4

0.5

0.5

0.5

0.7

0.7

0.7

V

Quiescent Current

V

IGN

= 12 V IO = 150 mA, TA = 25°C

IO = 550 mA, TA = –40°C
IO = 300 mA, TA = 125°C

I

GND

–
–
–

12
25
10

50

100

50

mA

Output Current Limit (VO = 0 V) I

SC

– 1.6 2.5 A

Output Leakage Current (V

IGN

= 12 V , Input = “0”) I

Leak

– 10 150 µA

Input Voltage

High Logic State
Low Logic State

V

IH

V

IL

2.0
–

–
–

–

0.8

V

Input Current

High Logic State (VIH = 5.5 V)
Low Logic State (VIL = 0.4 V)

I

IH

I

IL

–
–

120

20

–
–

µA

Output Turn–On Delay Time

Input = ‘‘0’’ ³ ‘‘1’’, TA = +25°C (Figures 1 and 3)

t

DLY(on)

– 50 – µs

Output Turn–Off Delay Time

Input = ‘‘1’’ ³ ‘‘0’’, TA = +25°C (Figures 1 and 3)

t

DLY(off)

– 5.0 – µs

Overvoltage Shutdown Threshold V

in(OV)

26 31 36 V

Output Turn–Off Delay Time (TA = + 25°C) to Overvoltage Condition,

Vin stepped from 12 V to 40 V , V ≤ 0.9 VO (Figures 1 and 3)

t

DLY

– 2.0 – µs

Output Recovery Delay Time (TA = + 25°C)

V

IGN

stepped from 40 V to 12 V , V ≥ 0.9 VO (Figures 1 and 3)

t

RCVY

– 5.0 – µs

NOTES: 1. Typical values represent characteristics of operation at TA = 25°C.

MC3399

3

MOTOROLA ANALOG IC DEVICE DATA

NOTE: * Depending on load current and transient duration, an output capacitor

(CO) of sufficient value may be used to hold up output voltage during the
transient, and absorb turn–off delay voltage overshoot.

Transient
Generator

+

12 V

Input

Thermal

Sense

Control

Circuit

Current
Limit

35 V

35 V

I

L

R

L

50

Ω

Ground

Ignition Output*

–

40 V

Ignition

12 V

Input

5.0 V
0 V

31 V

Output

V

O

12 V

0 V

0.9 V

O

t

DLY(OV)

t

RCVY

t

DLT(off)tDLY(on)

0.9 V

O

0

200

400

600

800

0 200 400 600 800 1000

0

20

40

60

80

0 200 400 600 800 1000

IL, LOAD CURRENT (mA) IL, LOAD CURRENT (mA)

VOLTAGE DIFFERENTIAL (mV)

I , QUIESCENT CURRENT (mA)

Q

V

IGN

= 24 V

TA = 25

°

C

Vin = “1”

V

IGN

= 24 V

TA = 25

°

C

Vin = “1”

V –V , IGNITION TO OUTPUT

OIGN

Line Transient

1.0 ms

Ignition

1.0 ms

100 V

31 V
12 V

0 V

–100 V

5.0 V
0 V

31 V
12 V

0 V

Input

Output

(Load Voltage)

Figure 1. Transient Response Test Circuit

Figure 2. Timing Diagram Figure 3. Response Time Diagram

Figure 4. Switch Voltage Drop

versus Load Current

Figure 5. Quiescent Current

versus Load Current

MC3399

4

MOTOROLA ANALOG IC DEVICE DATA

T SUFFIX

PLASTIC PACKAGE

CASE 314D–03

ISSUE D

DW SUFFIX

PLASTIC PACKAGE

CASE 751G–03

(SOP(8+8)L)

ISSUE B

OUTLINE DIMENSIONS

–Q–

12345

U

K

D

G

S

A

B

5 PL

J
H

L

E

C

M

Q

M

0.356 (0.014) T

SEATING
PLANE

–T–

DIM MIN MAX MIN MAX

MILLIMETERSINCHES

A 0.572 0.613 14.529 15.570
B 0.390 0.415 9.906 10.541
C 0.170 0.180 4.318 4.572
D 0.025 0.038 0.635 0.965
E 0.048 0.055 1.219 1.397
G 0.067 BSC 1.702 BSC
H 0.087 0.112 2.210 2.845
J 0.015 0.025 0.381 0.635
K 1.020 1.065 25.908 27.051
L 0.320 0.365 8.128 9.271
Q 0.140 0.153 3.556 3.886
U 0.105 0.117 2.667 2.972
S 0.543 0.582 13.792 14.783

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.

2. CONTROLLING DIMENSION: INCH.

3. DIMENSION D DOES NOT INCLUDE
INTERCONNECT BAR (DAMBAR) PROTRUSION.
DIMENSION D INCLUDING PROTRUSION SHALL
NOT EXCEED 10.92 (0.043) MAXIMUM.

D

14X

B16X

SEATING
PLANE

S

A

M

0.25 B

S

T

16 9

81

h X 45

_

M

B

M

0.25

H8X

E

B

A

e

T

A1

A

L

C

q

NOTES:

1. DIMENSIONS ARE IN MILLIMETERS.

2. INTERPRET DIMENSIONS AND TOLERANCES
PER ASME Y14.5M, 1994.

3. DIMENSIONS D AND E DO NOT INLCUDE MOLD
PROTRUSION.

4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE.

5. DIMENSION B DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.13 TOTAL IN EXCESS
OF THE B DIMENSION AT MAXIMUM MATERIAL
CONDITION.

DIM MIN MAX

MILLIMETERS

A 2.35 2.65

A1 0.10 0.25

B 0.35 0.49
C 0.23 0.32
D 10.15 10.45
E 7.40 7.60
e 1.27 BSC
H 10.05 10.55
h 0.25 0.75
L 0.50 0.90

q

0 7

__

MC3399

5

MOTOROLA ANALOG IC DEVICE DATA

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the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and
specifically disclaims any and all liability, including without limitation consequential or incidental damages. “T ypical” parameters which may be provided in Motorola
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Opportunity/Affirmative Action Employer.

MC3399

6

MOTOROLA ANALOG IC DEVICE DATA

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MC3399/D

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