Datasheet MC33765DTB-030, MC33765DTB-30R2, MC33765DTBR2, MC33765DTB Datasheet (MOTOROLA)

 Semiconductor Components Industries, LLC, 2000

April, 2000 – Rev. 2

1 Publication Order Number:

MC33765/D

MC33765

V ery Low Dropout/
Ultra Low Noise
5 Outputs V oltage Regulator

The MC33765 is an ultra low noise, very low dropout voltage
regulator with five independent outputs which is available in TSSOP
16 surface mount package.

The MC33765 is available in 2.8 V. The output voltage is the same
for all five outputs but each output is capable of supplying different
currents up to 150 mA for output 4. The device features a very low
dropout voltage (0.11 V typical for maximum output current), very
low quiescent current (5.0 mA maximum in OFF mode, 130 mA typical
in ON mode) and one of the output (output 3) exhibits a very low noise
level which allows the driving of noise sensitive circuitry. Internal
current and thermal limiting protections are provided.

Additionally , the MC33765 has an independent Enable input pin for
each output. It includes also a common Enable pin to shutdown the
complete circuit when not used. The Common Enable pin has the

highest priority over the five independent Enable input pins.

The voltage regulators VR1, VR2 and VR3 have a common input
voltage pin VCC1.

The other voltage regulators VR4 and VR5 have a common input
voltage pin VCC2.

• Five Independent Outputs at 2.8V Typical, based upon voltage

version

• Internal Trimmed Voltage Reference

• V

out

Tolerance ±3.0% over the Temperature Range –40°C to +85°C

• Enable Input Pin (Logic–Controlled Shutdown) for Each of the Five

Outputs

• Common Enable Pin to Shutdown the Whole Circuit

• Very Low Dropout Voltage (0.11 V Typical for Output 1, 2, 3 and 5;

0.17 V Typical for Output 4 at Maximum Current)

• Very Low Quiescent Current (Maximum 5.0 µA in OFF Mode,

130 µA Typical in ON Mode)

• Ultra Low Noise for VR3 (30 µV RMS Max, 100 Hz < f < 100 kHz)

• Internal Current and Thermal Limit

• 100 nF for VR1, VR2, VR4 and VR5 and 1.0 µF for VR3 for

Stability

• Supply Voltage Rejection: 60 dB (Typical) @ f = 1.0 kHz

Device Package Shipping

ORDERING INFORMATION

MC33765DTB TSSOP16 96 Units/Rail
MC33765DTBR2 TSSOP16

TSSOP–16

DTB SUFFIX

CASE 948F

1

16

http://onsemi.com

2500 Units/Reel

MARKING

DIAGRAMS

PIN CONNECTIONS

116

15
14
13
12
11
10

9

2
3
4
5
6
7
8

(Top View)

Bypass
Common Enable
On/Off V–Reg. 1

GND

Not Connected

Output V–Reg. 5

MC33765

On/Off V–Reg. 2
On/Off V–Reg. 3
On/Off V–Reg. 4
On/Off V–Reg. 5 VCC2

Output V–Reg. 4

Output V–Reg. 3

Output V–Reg. 2

Output V–Reg. 1

VCC1

MC33

765

ALYW

1

16

A = Assembly Location
WL, L = Wafer Lot
YY, Y = Year
WW, W= Work Week

MC33765

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2

Enable

Current

Limit

Temp.

Shut.

Enable

Current

Limit

Temp.

Shut.

Enable

Current

Limit

Temp.

Shut.

Enable

Current

Limit

Temp.

Shut.

Enable

Current

Limit

Temp.

Shut.

Common

Enable

+

–

+

–

+

–

+

–

+

–

Simplified Block Diagram

330 nF

V

OUT

1

VCC2

(14)

100 nF

V

OUT

2

(13)

100 nF

V

OUT

3

(12)

1.0 mF

V

OUT

4

(11)

100 nF

V

OUT

5

(9)

100 nF

VCC1

VCC1

VCC1

VCC2

VCC2

(8)

GND

(7)

ON/OFF 5

(6)

ON/OFF 4

(5)

ON/OFF 3

VCC1

(4)

ON/OFF 2

BYPASS

(3)

ON/OFF 1

Voltage

Reference

1.25 V

(15) (2)CE

100 nF

(10)

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3

MAXIMUM RATINGS

Rating Symbol Pin # Value Unit

Power Supply Voltage

ÁÁÁÁ

V

CC

5.3

ÁÁÁ

V

Thermal Resistance Junction–to–Air

ÁÁÁÁ

R

q

JA

140

ÁÁÁ

°C/W

Operating Ambient Temperature

ÁÁÁÁ

T

A

–40 to +85

ÁÁÁ

°C

Maximum Operating Junction Temperature

ÁÁÁÁ

T

J

125

ÁÁÁ

°C

Maximum Junction Temperature

ÁÁÁÁ

T

Jmax

150

ÁÁÁ

°C

Storage Temperature Range

ÁÁÁÁ

T

stg

–60 to +150

ÁÁÁ

°C

CONTROL ELECTRICAL CHARACTERISTICS

ELECTRICAL CHARACTERISTICS (For typical values T

A

= 25°C, for min/max values TA = –40°C to +85°C/ Max TJ = 125°C)

Characteristics

Symbol Pin # Min Typ Max Unit

Independent Enable Pins

Input Voltage Range V

ON/OFF(1–5)

0 – V

CC

V

Control Input Impedance

100

–

–

k

W

Logic “0”, i.e. OFF State V

ON/OFF(1–5)

– – 0.5 V

Logic “1”, i.e. ON State 2.0 – –

Common Enable Pin

Input Voltage Range V

CE

2 0 – V

CC

V

Control Input Impedance

2

100

–

–

k

W

Logic “0”, i.e. OFF State V

CE

2 – – 0.3 V

Logic “1”, i.e. ON State 2.0 – –

ELECTRICAL CHARACTERISTICS (For typical values T

A

= 25°C, for min/max values TA = –40°C to +85°C/ Max TJ = 125°C)

Characteristics

Symbol Min Typ Max Unit

CURRENT CONSUMPTION with NO LOAD

Current Consumption at Logic “0” for the complete device,

IQ

OFF

m

A

i.e. Common Enable and All Independent Enable pins at OFF State – – 5.0

Current Consumption at Logic “1” for the complete device,

IQ

ON1

m

A

i.e. Common Enable and All Independents Enable pins at ON State – 470 –

Current Consumption at Logic “1”, Common Enable at ON State

IQ

ON2

m

A

and All Independents Enable pins at OFF State – 130 –

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4

REGULA T OR ELECTRICAL CHARACTERISTICS

ELECTRICAL CHARACTERISTICS (For typical values T

A

= 25°C, for min/max values TA = –40°C to +85°C/ Max TJ = 125°C)

Characteristics Symbol Pin # Min Typ Max Unit

Supply and Output Voltages, Dropout and Load Regulation

Supply Voltage V

CC

MC33765 (2.8V) V

CC1, VCC2

15, 10 3.0 3.6 5.3 V

Regulator Output Voltage for VR1, VR2, VR3, VR4 and VR5 V

OUT(1–5)

14, 13, 12, V

MC33765 (2.8V) 11, 9 2.7 2.8 2.85

Dropout Voltage for VR1, VR2, VR3, VR5 (Note 1.) VCC–V

OUT

14, 13, – 0.11 0.17 V

12, 9

Dropout Voltage for VR4 (Note 1.) VCC–V

OUT4

11 – 0.17 0.30 V

Load Regulation (TA = 25°C) Reg

load(1–5)

9, 11, 12, – – 0.5 mV/

mA

13, 14

Max Power Dissipation and Total DC Output Current (VR1 + VR2 + VR3 + VR4 + VR5) (Note 2.)

Max Power Dissipation at VCC = 5.3 V (TA = 85°C) P

dmax

– – 285 mW

Max. Total RMS Output Current at VCC = 5.3 V (TA = 85°C) I

RMS

– – 130 mA

Max Power Dissipation at VCC = 5.3 V (TA = 25°C) P

dmax

– – 700 mW

Max. Total RMS Output Current at VCC = 5.3 V (TA = 25°C) I

RMS

– – 250 mA

Output Currents (Note 3.)

Regulator VR1 Output Current I

OUT1

14 10 – 30 mA

Regulator VR2 Output Current I

OUT2

13 10 – 40 mA

Regulator VR3 Output Current I

OUT3

12 0 – 50 mA

Regulator VR4 Output Current I

OUT4

11 10 – 150 mA

Regulator VR5 Output Current I

OUT5

9 10 – 60 mA

Current Limit for VR1, VR2, VR3, VR4, VR5 I

MAX

14, 13, 12, – 2 X I

OUT

– mA

[Twice the max Output Current for each output] 11, 9 (1–5)

External Capacitors

External Compensation Capacitors for VR1, VR2, VR4, VR5 C

(1–2, 4–5)

14, 13, 11, 9 0.10 – 1.0

m

F

External Compensation Capacitors for VR3 C

4

12 1.0 – –

m

F

External Compensation Capacitors ESR 0.05 1.0 3.0

W

Ripple Rejections

Ripple Rejection VR1, VR2, VR4, VR5

(DV

OUT

)

14, 13, 50 60 – dB

(at Max. Current, 1.0 kHz, C = 100 nF)

(DVCC)

11, 9

Ripple Rejection VR1, VR2, VR4, VR5

(DV

OUT

)

14, 13, 40 45 – dB

(at Max. Current, f = 10 kHz, C = 100 nF)

(DVCC)

11, 9

Ripple Rejection of VR3

(DV

OUT

)

12 50 60 – dB

(at Max. Current, f = 1.0 kHz, C = 1.0 mF)

(DVCC)

Ripple Rejection of VR3

(DV

OUT

)

12 40 45 – dB

(at Max. Current, f = 10 kHz, C = 1.0 mF)

(DVCC)

Ripple Rejection of VR3

(DV

OUT

)

12 18 22 – dB

(at Max. Current, f = 100 kHz, C = 1.0 mF)

(DVCC)

1. Typical dropout voltages have been measured at currents: Output1: 25 mA, Output2: 35 mA, Output3: 40 mA, Output4: 140 mA, Output5: 40 mA
Maximum value of dropout voltages are measured at maximum specified current.

2. See package power dissipation and thermal protection.

3. Maximum Output Currents are peak values. Total DC current have to be set upon maximum power dissipation specification.
Only Output 3 has been designed to be stable at minimum current of 0 mA.

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5

REGULA T OR ELECTRICAL CHARACTERISTICS

ELECTRICAL CHARACTERISTICS (For typical values T

A

= 25°C, for min/max values TA = –40°C to +85°C/Max TJ = 125°C)

Characteristics

Symbol Min Typ Max Unit

Dynamic Parameters

Rise Time (1% 99%) Common Enable at ON state,

C

bypass

= 10 nF, I

out

at max. current

VR1, VR2, VR4, VR5 with C

OUT

= 100 nF, TA = 25°C t

on

– – 30

m

s

VR3 with C

OUT

= 1.0 mF, TA = 25°C

– – 150

m

s

Fall Time (99% 1%) [C

OUT

= 100 nF, I

OUT

= 30 mA] (Note 4.) t

off

– 100 –

m

s

Overshoot (C

OUT

= 100 nF for VR1, VR2, VR4, VR5

and C

OUT

= 1.0 mF for VR3) at TA = 25°C

– 5 8 %

Common Enable at ON state, independent enable from OFF to ON state
Settling Time (to ±0.1% of nominal) at TA = 25°C

Common Enable at ON state, independent enable from OFF to ON state – 95 –

m

s

Noise and Crosstalks

Noise Voltage (100 Hz < f < 100 kHz) with C

bypass

= 100 nF

m

V RMS

VR1, VR2, VR4, VR5 with C

OUT

= 100 nF – 40 –

VR3 with C

OUT

= 1.0 mF

– 25 30

Static crosstalk (DC shift) between the Regulator Output, TA = 25°C (Note 5.) – 150 200

m

V

Dynamic CrossT alk Attenuation between the Regulator Outputs 30 35 – dB

(f = 10 kHz), TA = 25°C (Note 6.)

Thermal Shutdown

Thermal Shutdown – 160 – °C

4. The Fall time is highly dependent on the load conditions, i.e. load current for a specified value of C

OUT

.

5. Static Crosstalk is a DC shift caused by switching ON one of the outputs through independent enable to all other outputs. This parameter
is highly dependent on overall PCB layout and requires the implementation of low–noise GROUND rules (e.g. Ground plane).

6. Dynamic crosstalk is the ratio between a forced output signal to signal transferred to other outputs. This requires special device
configuration to be measured.

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6

MC33765 TYPICAL OSCILLOSCOPE SHOTS

Figure 1. Crosstalk response of MC33765 showing

extremely weak interaction between outputs

Output 4 is banged from 0 to 150mA

Figure 2. Repetitive Common Enable response time

Figure 3. Single Common Enable response time

(Cbypass discharged)

Figure 4. Output response from seperate Enable

X: 100ms/div
Y1: 1V/div
Y2: 60µV/div
Vin = 4.0V
Ta = 23°C

Enable of

Out4

Vout5

Y2

Y1

X: 5µs/div
Y1: 500mV/div
Y2: 500mV/div
Vin = 3.8V
Ta = 23°C

Out3

Y2

Y1

CE

X: 500µs/div
Y1: 500mV/div
Y2: 500mV/div
Vin = 3.8V
Ta = 23°C

Out3

Y2

Y1

CE

X: 5µs/div
Y1: 500mV/div
Y2: 500mV/div
Vin = 3.8V
Ta = 23°C

Vout5

Y2

Y1

Vout5 Enable

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7

Figure 5. Output 4 is banged from 3mA to 150mA Figure 6. Output 5 is banged from 3mA to 50mA

Figure 7. Typical input voltage rejection (Cout = 100nF) Figure 8. Typical input voltage rejection (Cout = 1µF)

X: 500µs/div
Y1: 10mV/div
Vin = 3.8V
Ta = 23°C

Vout4

Y1

X: 500µs/div
Y1: 10mV/div
Vin = 3.8V
Ta = 23°C

Vout5

Y1

X: 200µs/div
Y1: 2V/div
Y2: 10mV/div
Vin = variable
Ta = 23°C

Vout2 Y2

Y1

Vin

X: 200µs/div
Y1: 2V/div
Y2: 10mV/div
Vin = variable
Ta = 23°C

Vout3

Y2

Y1

Vin

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8

Figure 9. Dropout Voltage versus Output Current

Figure 10. Ground Current versus Individual Output

D

R

OPOUT

V

OLTAG

E

(

mV

)

200 40 100

0

60

OUTPUT CURRENT (mA)

60 80

40

80

20

160

OUT1

100

120

140

120 140 160

OUT3

OUT4

OUT5

OUT2

GROUND CURRENT (mA)

–40–60 –20 40

0

3.0

TEMPERATURE (°C)

020

2.0

4.0

1.0

8.0

OUT1

5.0

6.0

7.0

60 80 100

OUT3

OUT4

OUT5

OUT2

MAX

I

MUM

OUTPUT

C

U

RRE

NT

(

m

A)

–40–60 –20 40

0

150

TEMPERATURE (°C)

020

100

200

50

400

250

300

350

60 80 100

OUT1

OUT3

OUT4

OUT5

OUT2

Figure 11. Maximum Output Current versus Temperature

DROPOUT VOLTAGE (mV)

–40–60 –20 40

0

60

TEMPERATURE (°C)

020

40

80

20

160

100

120

140

60 80 100

10 mA

30 mA
20 mA

Figure 12. Dropout Voltage versus Operating

Temperature: OUT1

D

R

OPOUT

V

OLTAG

E

(

mV

)

–40–60 –20 40

0

60

TEMPERATURE (°C)

020

40

80

20

160

100

120

140

60 80 100

10 mA

30 mA
20 mA

DROPOUT VOLTAGE (mV)

–40–60 –20 40

0

60

TEMPERATURE (°C)

020

40

80

20

160

100

120

140

60 80 100

10 mA

30 mA

50 mA

Figure 13. Dropout Voltage versus Operating

Temperature: OUT2

Figure 14. Dropout Voltage versus Operating

Temperature: OUT3

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9

Figure 15. Dropout Voltage versus Operating

Temperature: OUT4

Figure 16. Dropout Voltage versus Operating

Temperature: OUT5

D

R

OPOUT

V

OLTAG

E

(

mV

)

–40–60 –20 40

0

TEMPERATURE (°C)

020

50

100

200

150

60 80 100

10 mA

60 mA

100 mA

150 mA

DROPOUT VOLTAGE (mV)

–40–60 –20 40

0

60

TEMPERATURE (°C)

020

40

80

20

160

100

120

140

60 80 100

10 mA

35 mA

60 mA

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10

DEFINITIONS

Load Regulation – The change in output voltage for a

change in load current at constant chip temperature.

Dropout V oltage – The input/output differential at which

the regulator output no longer maintains regulation against
further reductions in input voltage. Measured when the
output drops 100 mV below its nominal value (which is
measured at 1.0 V differential input/output), dropout voltage
is affected by junction temperature, load current and
minimum input supply requirements.

Output Noise Voltage – The RMS AC voltage at the

output with a constant load and no input ripple, measured
over a specified frequency range.

nV

/sqr

t

(Hz)

10 100 10000

0

100

Frequency (Hz)

1000

150

50

300

OUT1, 2, 3, 4, 5

200

250

100000 1000000

OUT3

MC33765 Output noise performances

Vin = 3.6V
I

out

= typical

C

byp

= 10nF

Maximum Power Dissipation – The maximum total

dissipation for which the regulator will operate within
specifications.

Quiescent Current – Current which is used to operate the

regulator chip with no load current.

Line Regulation – The change in input voltage for a

change in the input voltage. The measurement is made under
conditions of low dissipation or by using pulse techniques
such that the average chip temperature is not significantly
affected.

Thermal Protection – Internal thermal shutdown

circuitry is provided to protect the integrated circuit in the
event that the maximum junction temperature is exceeded.
When activated, typically 160°C, the regulator turns off.
This feature is provided to prevent catastrophic failures from
accidental overheating.

Maximum Package Power Dissipation and RMS

Current – The maximum package power dissipation is the

power dissipation level at which the junction temperature
reaches its maximum value i.e. 125°C. The junction
temperature is rising while the difference between the input
power (VCC X ICC) and the output power (V

out

X I

out

) is

increasing.

As MC33765 device exhibits five independent outputs

I

out

is specified as the maximum RMS current combination

of the five output currents.

As the device can be switched ON/OFF through
independent Enable (ON/OFF pin) or Common Enable, the
output signal could be, for example, a square wave. Let’s
assume that the device is ON during TON on a signal period
T . The RMS current will be given by:

I

out

RMS

+

IP

D

Ǹ

D

+

T

ON

T

where

T

on

I

p

T , period

Depending on ambient temperature, it is possible to
calculate the maximum power dissipation and so the
maximum RMS current as following:

Pd

+

TJ–T

A

R

q

JA

The maximum operating junction temperature TJ is
specified at 125°C, if TA = 25°C, then PD = 700 mW. By
neglecting the quiescent current, the maximum power
dissipation can be expressed as:

I

out

+

P

D

VCC–V

out

So that in the more drastic conditions:
VCC = 5.3 V , V

out

= 2.7 V then the maximum RMS value of

I

out

is 269 mA.

The maximum power dissipation supported by the device
is a lot increased when using appropriate application design.
Mounting pad configuration on the PCB, the board material
and also the ambient temperature are affected the rate of
temperature rise. It means that when the IC has good thermal
conductivity through PCB, the junction temperature will be
“low” even if the power dissipation is great.

The thermal resistance of the whole circuit can be
evaluated by deliberately activating the thermal shutdown
of the circuit (by increasing the output current or raising the
input voltage for example).

Then you can calculate the power dissipation by subtracting
the output power from the input power. All variables are then
well known: power dissipation, thermal shutdown temperature
(160°C for MC33765) and ambient temperature.

R

q

JA

+

TJ–T

A

P

D

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11

DESIGN HINTS

Reducing the cross–talk between the MC33765 outputs

One of the origin of the DC shift finds its seat in the layout
surrounding the integrated circuit. Particular care has to be
taken when routing the output ground paths. Star grounding

or a ground plane are the absolute conditions to reduce the
noise or shift associated to common impedance situations,
as depicted by Figure 17.

Figure 17. Star Cabling Avoids Coupling by Common Ground Impedance

WRONG CORRECT

116

15
14
13
12

11

10

9

2
3
4
5
6
7
8

MC33765

116

15
14
13
12
11
10

9

2
3
4
5
6
7
8

MC33765

Load1 Load2

Load1 Load2

Star cabling

common impedance shift

Rlayout

The first left cabling will generate a voltage shift which will
superimpose on the output voltages, thus creating an
undesirable offset. By routing the return grounds to a single

low impedance point, you naturally shield the circuit against
common impedance disturbances. Figure 18 portraits the text
fixture implemented to test the response of the MC33765.

Figure 18. DC Shift Text Fixture

116

15
14
13
12

11

10

9

2
3
4
5
6
7
8

MC33765

1µF

470nF

10k

Output 3

Output 4

100nF

10k

10k

10nF

18

56

V

CC

+

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12

DESIGN HINTS (cont.)

Output 4 was banged from 0 to 150mA via its dedicated
control pin, while output 3 fixed at 50mA was monitored. The
circuit has been implemented on a PCB equipped with a

ground plane and routed with short copper traces. The results
are shown hereafter, revealing the excellent behavior of the
MC33765 when crosstalks outputs is at utmost importance.

Figure 19. Vin = 4V, Y1 = 62.5µV/div, F = 200Hz Figure 20. Vin = 5V, Y1 = 1mV/div

Y1, output 3

Y1, output 3

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13

TECHNICAL TERMS

Rise Time – Common Enable being in ON state, the
device is switched on by ON/OFF pin control.

Let’s call t1 the time when ON/OFF signal reaches 1% of its
nominal value.

Let’s call t2 the time when output signal reaches 99% of its
nominal value.

The rise time for this device is specified as:

tON+

t1*

t

2

Fall Time – The fall time is highly dependent on the
output capacitor and so device design is not impacting at all
this parameter.

Overshoot, Settling Time – As regulators are based on

regulation loop through an error amplifier, this type of
device requires a certain time to stabilize and reach its
nominal value.

The overshoot is defined as the voltage difference
between the peak voltage and steady state when switching
ON the regulator.

The settling time is equal to the time required by the
regulator to stabilize to its nominal value (±0.5%) after peak
value when switching ON the regulator.

ON

OFF

Chip Enable is ON
ON/OFF pin signal

Output Voltage

1%

99%

Vnom

Settling Time

Rise Time

Overshoot

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14

P ACKAGE DIMENSIONS

TSSOP–16

DTB SUFFIX

CASE 948F–01

ISSUE O

DIM MIN MAX MIN MAX

INCHESMILLIMETERS

A 4.90 5.10 0.193 0.200
B 4.30 4.50 0.169 0.177
C ––– 1.20 ––– 0.047
D 0.05 0.15 0.002 0.006
F 0.50 0.75 0.020 0.030

G 0.65 BSC 0.026 BSC

H 0.18 0.28 0.007 0.011
J 0.09 0.20 0.004 0.008

J1 0.09 0.16 0.004 0.006

K 0.19 0.30 0.007 0.012

K1 0.19 0.25 0.007 0.010

L 6.40 BSC 0.252 BSC

M 0 8 0 8

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.

2. CONTROLLING DIMENSION: MILLIMETER.

3. DIMENSION A DOES NOT INCLUDE MOLD FLASH.
PROTRUSIONS OR GATE BURRS. MOLD FLASH
OR GATE BURRS SHALL NOT EXCEED 0.15
(0.006) PER SIDE.

4. DIMENSION B DOES NOT INCLUDE INTERLEAD
FLASH OR PROTRUSION. INTERLEAD FLASH OR
PROTRUSION SHALL NOT EXCEED

0.25 (0.010) PER SIDE.

5. DIMENSION K DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN
EXCESS OF THE K DIMENSION AT MAXIMUM
MATERIAL CONDITION.

6. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.

7. DIMENSION A AND B ARE TO BE DETERMINED
AT DATUM PLANE –W–.

____

SECTION N–N

SEATING
PLANE

IDENT.

PIN 1

1

8

16

9

DETAIL E

J

J1

B

C

D

A

K

K1

H

G

DETAIL E

F

M

L

2X L/2

–U–

S

U0.15 (0.006) T

S

U0.15 (0.006) T

S

U

M

0.10 (0.004) V

S

T

0.10 (0.004)

–T–

–V–

–W–

0.25 (0.010)

16X REFK

N

N

MC33765

http://onsemi.com

15

Notes

MC33765

http://onsemi.com

16

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