The MC33365 is a monolithic high voltage switching regulator that is
specifically designed to operate from a rectified 240 Vac line source. This
integrated circuit features an on–chip 700 V/1.0 A SenseFET power switch,
450 V active off–line startup FET, duty cycle controlled oscillator, current
limiting comparator with a programmable threshold and leading edge
blanking, latching pulse width modulator for double pulse suppression, high
gain error amplifier, and a trimmed internal bandgap reference. Protective
features include cycle–by–cycle current limiting, input undervoltage lockout
with hysteresis, bulk capacitor voltage sensing, and thermal shutdown. This
device is available in a 16–lead dual–in–line package.
Operating Junction Temperature
Storage Temperature
NOTE: ESD data available upon request.
V
DS
ÁÁ
I
DS
V
in
ÁÁ
ÁÁ
V
CC
V
IR
ÁÁ
ÁÁ
ÁÁ
ÁÁ
R
θJA
R
ÁÁ
θJC
T
J
T
stg
MC33365
700
ÁÁÁ
ÁÁÁ
400
500
ÁÁÁ
–1.0 to V
ÁÁÁ
ÁÁÁ
ÁÁÁ
ÁÁÁ
ÁÁÁ
–25 to +150
–55 to +150
1.0
40
80
15
reg
V
Á
A
V
Á
Á
V
V
Á
Á
Á
°C/W
Á
Á
°C
°C
ELECTRICAL CHARACTERISTICS (V
= 20 V, RT = 10 k, CT = 390 pF, C
CC
= 1.0 µF, for typical values TJ = 25°C,
Pin 8
for min/max values TJ is the operating junction temperature range that applies (Note 2), unless otherwise noted.)
Characteristic
SymbolMinTypMaxUnit
REGULAT OR (Pin 8)
Output Voltage (IO = 0 mA, TJ = 25°C)
Line Regulation (VCC = 20 V to 40 V)
Load Regulation (IO = 0 mA to 10 mA)
Total Output Variation over Line, Load, and Temperature
V
Reg
Reg
V
reg
load
reg
line
5.5
5.3
6.5
–
–
30
44
–
7.5
500
200
8.0
V
mV
mV
V
OSCILLAT OR (Pin 7)
Frequency
CT = 390 pF
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TJ = 25°C (VCC = 20 V)
TJ = T
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CT = 2.0 nF
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TJ = 25°C (VCC = 20 V)
TJ = T
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Frequency Change with Voltage (VCC = 20 V to 40 V)
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ERROR AMPLIFIER (Pins 9, 10)
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Voltage Feedback Input Threshold
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Line Regulation (VCC = 20 V to 40 V, TJ = 25°C)
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Input Bias Current (VFB = 2.6 V, TJ = 0 – 125°C)
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Open Loop Voltage Gain (TJ = 25°C)
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Gain Bandwidth Product (f = 100 kHz, TJ = 25°C)
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Output Voltage Swing
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High State (I
Low State (I
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NOTES: 1. Maximum power dissipation limits must be observed.
low
low
to T
to T
(VCC = 20 V to 40 V)
high
(VCC = 20 V to 40 V)
high
= 100 µA, VFB < 2.0 V)
Source
= 100 µA, V
Sink
> 3.0 V)
FB
2.Tested junction temperature range for the MC33363B:
T
= –25°CT
low
high
= +125°C
f
OSC
ÁÁÁ
ÁÁÁ
ÁÁÁ
ÁÁÁ
∆f
/∆V
OSC
ÁÁÁ
V
FB
ÁÁÁ
Reg
line
ÁÁÁ
I
IB
ÁÁÁ
A
VOL
ÁÁÁ
GBW
ÁÁÁ
ÁÁÁ
V
OH
V
ÁÁÁ
OL
ÁÁ
260
255
ÁÁ
ÁÁ
60
59
ÁÁ
–
ÁÁ
2.52
ÁÁ
ÁÁ–ÁÁ
–
ÁÁ
70
ÁÁ
0.85
ÁÁ
ÁÁ
4.0
–
ÁÁ
ÁÁ
285
–
ÁÁ
ÁÁ
67.5
–
ÁÁ
0.1
ÁÁ
2.6
ÁÁ
0.6
20
ÁÁ
82
ÁÁ
1.0
ÁÁ
ÁÁ
5.3
0.2
ÁÁ
ÁÁ
310
315
ÁÁ
ÁÁ
75
76
ÁÁ
2.0
ÁÁ
2.68
ÁÁ
5.0
ÁÁ
500
ÁÁ
94
ÁÁ
1.15
ÁÁ
ÁÁ
–
0.35
ÁÁ
kHz
ÁÁ
ÁÁ
ÁÁ
ÁÁ
kHz
ÁÁ
V
ÁÁ
mV
ÁÁ
nA
ÁÁ
dB
ÁÁ
MHz
ÁÁ
V
ÁÁ
ÁÁ
2
MOTOROLA ANALOG IC DEVICE DATA
Page 3
MC33365
ÁÁÁ
ÁÁÁÁÁÁ
Á
Á
Á
Á
Á
ÁÁÁ
Á
Á
Á
Á
Á
Á
ÁÁÁ
Á
Á
Á
Á
Á
Á
ÁÁÁ
ÁÁÁÁ
ÁÁÁ
ÁÁÁ
Á
Á
Á
Á
Á
ÁÁÁ
ÁÁÁÁ
ÁÁÁÁÁÁ
Á
Á
Á
Á
Á
ÁÁÁ
Á
ELECTRICAL CHARACTERISTICS (continued) (V
= 20 V, RT = 10 k, CT = 390 pF, C
CC
= 1.0 µF, for typical values TJ = 25°C,
Pin 8
for min/max values TJ is the operating junction temperature range that applies (Note 2), unless otherwise noted.)
CharacteristicUnitMaxTypMinSymbol
BULK OK (Pin 11)
Input Threshold Voltage
Input Bias Current (VBK < Vth, TJ = 0 – 125°C)
Source Current (Turn on after VBK > Vth, TJ = 25°C – 125°C)
Startup Threshold (VCC Increasing)
Minimum Operating Voltage After Turn–On
V
th(on)
V
CC(min)
11
7.5
15.2
TOTAL DEVICE (Pin 3)
Power Supply Current
Startup (V
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Operating
NOTES: 3. The device can only guarantee to start up at high temperature below +115°C.
= 10 V, Pin 1 Open)
CC
I
CC
ÁÁÁ
–
ÁÁ
–
0.25
ÁÁ
50
15
0.2
50
50
2.0
2.0
40
9.5
3.2
1.32
500
–
53
V
nA
µA
%
52
0
ÁÁ
ÁÁ
0
Ω
17
–
ÁÁ
39
ÁÁ
µA
ÁÁ
100
–
–
0.9
ÁÁ
ns
ns
A
mA
4.0
ÁÁ
11.5
4.0
200
18
ÁÁ
µA
V
V
mA
0.5
ÁÁ
5.0
ÁÁ
Figure 1. Oscillator Frequency
versus Timing Resistor
1.0 M
CT = 100 pF
500 k
CT = 200 pF
CT = 500 pF
200 k
CT = 1.0 nF
100 k
CT = 2.0 nF
50 k
, OSCILLAT OR FREQUENCY (Hz)
CT = 5.0 nF
20 k
OSC
f
CT = 10 nF
10 k
7.0
1015203050
RT, TIMING RESISTOR (kΩ)
MOTOROLA ANALOG IC DEVICE DATA
VCC = 20 V
°
C
TA = 25
70
Figure 2. Power Switch Peak Drain Current
versus Timing Resistor
1.0
0.8
0.6
0.4
0.3
0.2
0.15
Inductor supply voltage and inductance value are
adjusted so that Ipk turn–off is achieved at 5.0
, POWER SWITCH PEAK DRAIN CURRENT (A)
0.1
PK
7.010152030407050
I
RT, TIMING RESISTOR (kΩ)
µ
s.
VCC = 20 V
µ
CT = 1.0
TA = 25
F
°
C
3
Page 4
0.8
0.5
Figure 3. Oscillator Charge/Discharge
Current versus Timing Resistor
VCC = 20 V
TA = 25
MC33365
°
C
Figure 4. Maximum Output Duty Cycle
versus Timing Resistor Ratio
70
60
RD/RT Ratio
Discharge Resistor
Pin 6 to Gnd
VCC = 20 V
CT = 2.0 nF
°
C
TA = 25
0.3
, OSCILLAT OR
0.2
dscg
/I
0.15
chg
I
0.1
CHARGE/DISCHARGE CURRENT (mA)
0.08
7.0
100
80
60
40
20
, OPEN LOOP VOL TAGE GAIN (dB)
0
VOL
A
–20
10
50
40
, MAXIMUM OUTPUT DUTY CYCLE (%)
max
D
, OUTPUT SA TURATION VOLTAGE (V)
V
sat
30
–1.0
– 2.0
2.0
1.0
1.0
TIMING RESISTOR RA TIO
Figure 6. Error Amp Output Saturation
V oltage versus Load Current
0
Source Saturation
(Load to Ground)
Sink Saturation
(Load to V
0
0
IO, OUTPUT LOAD CURRENT (mA)
ref
)
10152030702.03.05.07.010
RT, TIMING RESISTOR (kΩ)
50
Figure 5. Error Amp Open Loop Gain and
Phase versus Frequency
VCC = 20 V
VO = 1.0 to 4.0 V
Gain
Phase
1001.0 k10 k100 k1.0 M10 M0.20.40.60.81.0
f, FREQUENCY (Hz)
RL = 5.0 M
CL = 2.0 pF
TA = 25
Ω
°
C
0
30
60
90
120
, EXCESS PHASE (DEGREES)
θ
150
180
RC/RT Ratio
Charge Resistor
Pin 6 to V
V
ref
VCC = 20 V
TA = 25
Gnd
°
reg
C
1.80 V
1.75 V
1.70 V
4
Figure 7. Error Amplifier Small Signal
Transient Response
VCC = 20 V
AV = –1.0
CL = 10 pF
TA = 25
1.0 µs/DIV
Figure 8. Error Amplifier Large Signal
Transient Response
VCC = 20 V
AV = –1.0
°
C
20 mV/DIV
3.00 V
1.75 V
0.50 V
1.0 µs/DIV
CL = 10 pF
°
C
TA = 25
0.5 V/DIV
MOTOROLA ANALOG IC DEVICE DATA
Page 5
–20
MC33365
Figure 9. Regulator Output Voltage
Change versus Source Current
0
VCC = 20 V
RT = 10 k
C
= 1.0
Pin 8
°
C
TA = 25
µ
F
2.0
Figure 10. Peak Startup Current
versus Power Supply V oltage
V
Pin 1
TA = 25
= 400 V
°
C
–40
–60
, REGULAT OR VOLTAGE CHANGE (mV)
reg
V
–80
∆
0
4.08.01216202.04.06.08.0101214
I
reg
Figure 11. Power Switch Drain–Source
Ω
32
24
16
8.0
, DRAIN–SOURCE ON–RESISTANCE ( )
0
DS(on)
R
–50
On–Resistance versus T emperature
ID = 200 mA
–250255075150100101001000
, REGULAT OR SOURCE CURRENT (mA)
Pulse tested at 5.0 ms with < 1.0% duty cycle
so that TJ is as close to TA as possible.
125
TA, AMBIENT TEMPERATURE (°C)
1.0
Pulse tested with an on–time of 20 µs to 300 µs
, PEAK STARTUP CURRENT (mA)
at < 1.0% duty cycle. The on–time is adjusted at
pk
Pin 1 for a maximum peak current out of Pin 3.
I
0
0
VCC, POWER SUPPLY VOLTAGE (V)
Figure 12. Power Switch
Drain–Source Capacitance versus V oltage
160
120
80
40
, DRAIN–SOURCE CAPACITANCE (pF)
C
OSS
C
0
1.0
measured at 1.0 MHz with 50 mVpp.
OSS
VDS, DRAIN–SOURCE VOLTAGE (V)
VCC = 20 V
°
C
TA = 25
Figure 13. Supply Current versus Supply V oltage
3.2
2.4
1.6
, SUPPLY CURRENT (mA)
0.8
CC
I
0
0
10203040
VCC, SUPPLY VOLTAGE (V)
CT = 390 pF
CT = 2.0 nF
RT = 10 k
Pin 1 = Open
Pin 4, 5, 10, 11,
12, 13 = Gnd
TA = 25
MOTOROLA ANALOG IC DEVICE DATA
Figure 14. DW and P Suffix Transient
Thermal Resistance
100
L = 12.7 mm of 2.0 oz. copper.
Refer to Figure 15.
°
10
, THERMAL RESISTANCE
JA
JUNCTION–TO–AIR ( C/W)
θ
R
°
C
1.0
0.01
0.11.010100
t, TIME (s)
5
Page 6
MC33365
Á
Á
Á
Á
Á
Á
Á
Á
Á
Á
Á
Á
Á
Á
Á
Á
Á
Á
Á
Á
Á
Á
Á
Á
Á
Á
Á
Á
Á
Á
Á
Á
Á
Á
Á
Á
Á
Á
Á
Figure 15. P Suffix (DIP–16) Thermal Resistance and
Maximum Power Dissipation versus P.C.B. Copper Length
100
Printed circuit board heatsink example
5.0
80
°
60
R
θ
JA
2.0 oz
L
Copper
L
Graphs represent symmetrical layout
40
JA
20
θ
JUNCTION–TO–AIR ( C/W)
R, THERMAL RESISTANCE
0
0
P
for TA = 70°C
D(max)
1020304050
L, LENGTH OF COPPER (mm)
PIN FUNCTION DESCRIPTION
PinFunctionDescription
1
ÁÁÁ
ÁÁÁ
2
ÁÁÁ
3
ÁÁÁ
ÁÁÁ
4, 5, 12, 13
ÁÁÁ
6
ÁÁÁ
7
ÁÁÁ
8
ÁÁÁ
9
10
ÁÁÁ
ÁÁÁ
11
14, 15
ÁÁÁ
16
ÁÁÁ
Startup Input
ÁÁÁÁ
ÁÁÁÁ
–
ÁÁÁÁ
V
CC
ÁÁÁÁ
ÁÁÁÁ
Ground
ÁÁÁÁ
R
T
ÁÁÁÁ
C
T
ÁÁÁÁ
Regulator Output
ÁÁÁÁ
Compensation
Voltage Feedback
ÁÁÁÁ
Input
ÁÁÁÁ
Bulk OK Input
–
ÁÁÁÁ
Power Switch
Drain
ÁÁÁÁ
This pin connects directly to the rectified ac line voltage source. Internally Pin 1 is tied to the drain
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of a high voltage startup MOSFET. During startup, the MOSFET supplies internal bias, and charges
an external capacitor that connects from the V
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This pin has been omitted for increased spacing between the rectified ac line voltage on Pin 1 and
the V
potential on Pin 3.
CC
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This is the positive supply voltage input. During startup, power is supplied to this input from Pin 1.
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When VCC reaches the UVLO upper threshold, the startup MOSFET turns off and power is supplied
from an auxiliary transformer winding.
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These pins are the control circuit grounds. They are part of the IC lead frame and provide a thermal
path from the die to the printed circuit board.
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Resistor RT connects from this pin to ground. The value selected will program the Current Limit
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Comparator threshold and affect the Oscillator frequency.
Capacitor C
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programs the Oscillator frequency.
connects from this pin to ground. The value selected, in conjunction with resistor R
T
This 6.5 V output is available for biasing external circuitry. It requires an external bypass capacitor
of at least 1.0 µF for stability.
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This pin is the Error Amplifier output and is made available for loop compensation. It can be used as
an input to directly control the PWM Comparator.
This is the inverting input of the Error Amplifier. It has a 2.6 V threshold and normally connects
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through a resistor divider to the converter output, or to a voltage that represents the converter
output.
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This is the non–inverting input of the bulk capacitor voltage comparator. It has an input threshold
voltage of 1.25V. This pin is connected through a resistor divider to the bulk capacitor line voltage.
These pins have been omitted for increased spacing between the high voltages present on the
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Power Switch Drain, and the ground potential on Pins 12 and 13.
This pin is designed to directly drive the converter transformer and is capable of switching a
maximum of 700 V and 1.0 A.
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3.0 mm
pin to ground.
CC
4.0
3.0
2.0
1.0
0
, MAXIMUM POWER DISSIPATION (W)
D
P
,
T
6
MOTOROLA ANALOG IC DEVICE DATA
Page 7
AC Input
MC33365
Figure 16. Representative Block Diagram
Regulator Output
6.5 V
8
6
R
T
C
7
T
I
Current
Mirror
4 I
Oscillator
PWM
Comparator
Thermal
Shutdown
2.25 I
Band Gap
Regulator
PWM Latch
Current Limit
Comparator
4, 5, 12, 13Gnd
S
Q
R
405
270µA
Startup Input
Startup
Control
UVLO
Driver
Leading Edge
Blanking
Error
Amplifier
1
14.5 V/
9.5 V
1.25 V
2.6 V
V
CC
3
BOK
11
16
Power Switch
Drain
8.1
Compensation
9
10
Voltage
Feedback Input
DC Output
Capacitor C
Compensation
Oscillator Output
Power Switch
Leading Edge
Blanking Input
(Power Switch
Drain Current)
T
PWM
Comparator
Output
PWM Latch
Q Output
Gate Drive
Figure 17. Timing Diagram
2.6 V
0.6 V
Current Limit
Propagation
Delay
Current
Limit
Threshold
Normal PWM Operating RangeOutput Overload
MOTOROLA ANALOG IC DEVICE DATA
7
Page 8
MC33365
OPERA TING DESCRIPTION
Introduction
The MC33365 represents a new higher level of integration
by providing all the active high voltage power, control, and
protection circuitry required for implementation of a flyback or
forward converter on a single monolithic chip. This device is
designed for direct operation from a rectified 240 Vac line
source and requires a minimum number of external
components to implement a complete converter. A
description of each of the functional blocks is given below,
and the representative block and timing diagrams are shown
in Figures 16 and 17.
Oscillator and Current Mirror
The oscillator frequency is controlled by the values
selected for the timing components R
programs the oscillator charge/discharge current via the
Current Mirror 4 I output, Figure 3. Capacitor CT is charged
and discharged by an equal magnitude internal current
source and sink. This generates a symmetrical 50 percent
duty cycle waveform at Pin 7, with a peak and valley
threshold of 2.6 V and 0.6 V respectively. During the
discharge of C
pulse that holds the inverting input of the AND gate Driver
high. This causes the Power Switch gate drive to be held in a
low state, thus producing a well controlled amount of output
deadtime. The amount of deadtime is relatively constant with
respect to the oscillator frequency when operating below
1.0 MHz. The maximum Power Switch duty cycle at Pin 16
can be modified from the internal 50% limit by providing an
additional charge or discharge current path to CT, Figure 18.
In order to increase the maximum duty cycle, a discharge
current resistor R
decrease the maximum duty cycle, a charge current resistor
RC is connected from Pin 7 to the Regulator Output. Figure 4
shows an obtainable range of maximum output duty cycle
versus the ratio of either R
Figure 18. Maximum Duty Cycle Modification
R
R
, the oscillator generates an internal blanking
T
is connected from Pin 7 to ground. To
D
or R
C
Current
Regulator Output
1.0
C
R
T
C
D
T
8
6
7
Mirror
I
and C
T
with respect to RT.
D
4 I
Oscillator
2.25 I
Current
Limit
Reference
. Resistor R
T
Blanking
Pulse
The formula for the charge/discharge current along with
the oscillator frequency are given below. The frequency
formula is a first order approximation and is accurate for C
values greater than 500 pF . For smaller values of CT, refer to
Figure 1. Note that resistor RT also programs the Current
Limit Comparator threshold.
I
chgńdscg
PWM Comparator and Latch
The pulse width modulator consists of a comparator with
the oscillator ramp voltage applied to the non–inverting input,
T
while the error amplifier output is applied into the inverting
input. The Oscillator applies a set pulse to the PWM Latch
while CT is discharging, and upon reaching the valley
voltage, Power Switch conduction is initiated. When C
charges to a voltage that exceeds the error amplifier output,
the PWM Latch is reset, thus terminating Power Switch
conduction for the duration of the oscillator ramp–up period.
This PWM Comparator/Latch combination prevents multiple
output pulses during a given oscillator clock cycle. The timing
diagram shown in Figure 17 illustrates the Power Switch duty
cycle behavior versus the Compensation voltage.
Current Limit Comparator and Power Switch
The MC33365 uses cycle–by–cycle current limiting as a
means of protecting the output switch transistor from
overstress. Each on–cycle is treated as a separate situation.
Current limiting is implemented by monitoring the output
switch current buildup during conduction, and upon sensing
an overcurrent condition, immediately turning off the switch
for the duration of the oscillator ramp–up period.
The Power Switch is constructed as a SenseFET allowing
a virtually lossless method of monitoring the drain current. It
consists of a total of 1462 cells, of which 36 are connected to
a 8.1 Ω ground–referenced sense resistor. The Current
Sense Comparator detects if the voltage across the sense
resistor exceeds the reference level that is present at the
inverting input. If exceeded, the comparator quickly resets
the PWM Latch, thus protecting the Power Switch. The
current limit reference level is generated by the 2.25 I output
of the Current Mirror. This current causes a reference voltage
to appear across the 405 Ω resistor. This voltage level, as
well as the Oscillator charge/discharge current are both set
by resistor RT. Therefore when selecting the values for R
and CT, RT must be chosen first to set the Power Switch peak
drain current, while CT is chosen second to set the desired
Oscillator frequency . A graph of the Power Switch peak drain
current versus RT is shown in Figure 2 with the related
formula below.
+
5.4
R
T
f
I
[
chgńdscg
4C
T
T
T
T
R
– 1.077
PWM
Comparator
8
Ipk+
8.8
MOTOROLA ANALOG IC DEVICE DATA
ǒ
T
1000
Ǔ
Page 9
MC33365
The Power Switch is designed to directly drive the converter
transformer and is capable of switching a maximum of 700 V
and 1.0 A. Proper device voltage snubbing and heatsinking
are required for reliable operation.
A Leading Edge Blanking circuit was placed in the current
sensing signal path. This circuit prevents a premature reset
of the PWM Latch. The premature reset is generated each
time the Power Switch is driven into conduction. It appears as
a narrow voltage spike across the current sense resistor, and
is due to the MOSFET gate to source capacitance,
transformer interwinding capacitance, and output rectifier
recovery time. The Leading Edge Blanking circuit has a
dynamic behavior in that it masks the current signal until the
Power Switch turn–on transition is completed. The current
limit propagation delay time is typically 262 ns. This time is
measured from when an overcurrent appears at the Power
Switch drain, to the beginning of turn–off.
Error Amplifier
An fully compensated Error Amplifier with access to the
inverting input and output is provided for primary side voltage
sensing, Figure 16. It features a typical dc voltage gain of 82
dB, and a unity gain bandwidth of 1.0 MHz with 78 degrees of
phase margin, Figure 5. The noninverting input is internally
biased at 2.6 V ±3.1% and is not pinned out. The Error
Amplifier output is pinned out for external loop compensation
and as a means for directly driving the PWM Comparator.
The output was designed with a limited sink current capability
of 270 µA, allowing it to be easily overridden with a pull–up
resistor. This is desirable in applications that require
secondary side voltage sensing.
Bulk Capacitor Voltage Comparator
The Bulk Capacitor Voltage Comparator is included to
sense the brown–out condition of the bulk capacitor line
voltage. The non–inverting input, Pin 11, is connected to the
voltage divider to sense the line voltage. The inverting input is
connected internally to a threshold voltage of 1.25V. As the
line voltage drops below 120V (Pin 11 drops below 1.25V),
the reset signal is activiated from the PWM Latch to turn off
the Power Switch. To prevent erratic switching as the
threshold is crossed, hysteresis at Pin 11 is provided.
Undervoltage Lockout
An Undervoltage Lockout comparator has been
incorporated to guarantee that the integrated circuit has
sufficient voltage to be fully functional before the output stage
is enabled. The UVLO comparator monitors the VCC voltage
at Pin 3 and when it exceeds 14.5 V, the reset signal is
removed from the PWM Latch allowing operation of the
Power Switch. T o prevent erratic switching as the threshold is
crossed, 5.0 V of hysteresis is provided.
Startup Control
An internal Startup Control circuit with a high voltage
enhancement mode MOSFET is included within the
MC33365. This circuitry allows for increased converter
efficiency by eliminating the external startup resistor, and its
associated power dissipation, commonly used in most
off–line converters that utilize a UC3842 type of controller.
Rectified ac line voltage is applied to the Startup Input, Pin 1.
This causes the MOSFET to enhance and supply internal
bias as well as charge current to the VCC bypass capacitor
that connects from Pin 3 to ground. When VCC reaches the
UVLO upper threshold of 15.2 V, the IC commences
operation and the startup MOSFET is turned off. Operating
bias is now derived from the auxiliary transformer winding,
and all of the device power is efficiently converted down from
the rectified ac line.
The startup MOSFET will provide a steady current of
1.7 mA, Figure 10, as VCC increases or shorted to ground.
The startup MOSFET is rated at a maximum of 400 V with
VCC shorted to ground, and 500 V when charging a V
capacitor of 1000 µF or less.
Regulator
A low current 6.5 V regulated output is available for
biasing the Error Amplifier and any additional control system
circuitry. It is capable of up to 10 mA and has short–circuit
protection. This output requires an external bypass capacitor
of at least 1.0 µF for stability.
Thermal Shutdown and Package
Internal thermal circuitry is provided to protect the Power
Switch in the event that the maximum junction temperature is
exceeded. When activated, typically at 150°C, the Latch is
forced into a ‘reset’ state, disabling the Power Switch. The
Latch is allowed to ‘set’ when the Power Switch temperature
falls below 140°C. This feature is provided to prevent
catastrophic failures from accidental device overheating. It is
not intended to be used as a substitute for proper
heatsinking.
The MC33365 is contained in a heatsinkable plastic
dual–in–line package in which the die is mounted on a
special heat tab copper alloy lead frame. This tab consists of
the four center ground pins that are specifically designed to
improve thermal conduction from the die to the circuit board.
Figure 15 shows a simple and effective method of utilizing the
printed circuit board medium as a heat dissipater by
soldering these pins to an adequate area of copper foil. This
permits the use of standard layout and mounting practices
while having the ability to halve the junction to air thermal
resistance. The examples are for a symmetrical layout on a
single–sided board with two ounce per square foot of copper.
CC
MOTOROLA ANALOG IC DEVICE DATA
9
Page 10
MC33365
OUTLINE DIMENSIONS
P SUFFIX
–A–
R
169
–B–
18
P
F
C
S
H
K
G
D
13 PL
M
0.25 (0.010)T
B
PLASTIC PACKAGE
CASE 648E–01
(DIP–16)
ISSUE O
L
–T–
SEATING
PLANE
S
S
A
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
4. DIMENSION A AND B DOES NOT INCLUDE MOLD
PROTRUSION.
5. MOLD FLASH OR PROTRUSIONS SHALL NOT
EXCEED 0.25 (0.010).
Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty , representation or guarantee regarding
the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and
specifically disclaims any and all liability, including without limitation consequential or incidental damages. “T ypical” parameters which may be provided in Motorola
data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals”
must be validated for each customer application by customer’s technical experts. Motorola does not convey any license under its patent rights nor the rights of
others. Motorola products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other
applications intended to support or sustain life, or for any other application in which the failure of the Motorola product could create a situation where personal injury
or death may occur. Should Buyer purchase or use Motorola products for any such unintended or unauthorized application, Buyer shall indemnify and hold Motorola
and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees
arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that
Motorola was negligent regarding the design or manufacture of the part. Motorola and are registered trademarks of Motorola, Inc. Motorola, Inc. is an Equal
Opportunity/Affirmative Action Employer.
MOTOROLA ANALOG IC DEVICE DATA
11
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MC33365
How to reach us:
USA/EUROPE/Locations Not Listed: Motorola Literature Distribution;JAPAN: Motorola Japan Ltd.; SPD, Strategic Planning Office, 141,
P.O. Box 5405, Denver, Colorado 80217. 1–303–675–2140 or 1–800–441–2447 4–32–1 Nishi–Gotanda, Shinagawa–ku, Tokyo, Japan. 81–3–5487–8488