Page 1
8
1
P SUFFIX
PLASTIC PACKAGE
CASE 626
Device
Operating
Temperature Range
Package
SEMICONDUCTOR
TECHNICAL DATA
ISO SERIAL LINK
INTERFACE
ORDERING INFORMATION
MC33290D
MC33290P
TA = –40° to +125°C
SO–8
DIP–8
PIN CONNECTIONS
Order this document by MC33290/D
18
7
6
5
2
3
4
V
BB
N/C
Gnd
Tx
(Top View)
ISO
(K Line I/O)
Rx
V
DD
CEN
D SUFFIX
PLASTIC PACKAGE
CASE 751
(SO–8)
8
1
1
MOTOROLA ANALOG IC DEVICE DATA
The MC33290 is a serial link bus interface device designed to provide
bi–directional half–duplex communication interfacing in automotive
diagnostic applications. It is designed to interface between the vehicle’s
on–board microcontroller and systems off–board the vehicle via the special
ISO K line. The MC33290 is designed to meet the “Diagnostic Systems
ISO9141” specification. The device’s K line bus driver’s output is fully
protected against bus shorts and over temperature conditions.
The MC33290 derives it’s robustness to temperature and voltage
extremes from being built on a SMARTMOS
process, incorporating CMOS
logic, bipolar/MOS analog circuitry, and DMOS power FETs. Though the
MC33290 was principally designed for automotive applications, it is suited for
other serial communication applications. It is parametrically specified over an
ambient temperature range of –40°C ≤ TA ≤ 125°C and 8.0 V ≤ V
Bat
≤ 18 V
supply. The economical 8 pin DIP and SO–8 surface mount plastic packages
make the MC33290 very cost effective.
• Designed to Operate Over Wide Supply Voltage of 8.0 to 18 V
• Ambient Operating Temperature of –40°C to 125°C
• Interfaces Directly to Standard CMOS Microprocessors
• ISO K Line Pin Protected Against Shorts to Ground
• Thermal Shutdown with Hysteresis
• Maximum Transmission Speeds in Excess of 50 k Baud
• ISO K Line Pin Capable of High Currents
• ISO K Line can be Driven with up to 10 nF of Parasitic Capacitance
• 8.0 kV ESD Protection Attainable with Few Additional Components
• Standby Mode: No V
Bat
Current Drain with VDD at 5.0 V
• Low Current Drain during Operation with V
DD
at 5.0 V
Typical Application Schematic
This device contains 85 active transistors.
Components Necessary for: Reverse Battery (1), Overvoltage Transient (2), and
8.0 kV ESD Protection (3) in a metal module case.
V
CC
D
x
SCIRxD
SCITxD
MCU
V
DD
CEN
Rx
Tx
V
BB
ISO
Gnd
5.0 nF(3)
27 V(3)
1.0 nF
5.0 V
10 nF(3)
500
Ω
(2)
D(1)
45 V(2)
+V
Bat
+V
DD
ISO
K Line
510
Ω
Service Scan Tool
or
End of Production Line
Programming
or
System Checking
On–Board Diagnostic Link
MC33290
TxD
RxD
6
5
7
8
3
4
1
This document contains information on a new product. Specifications and information herein
are subject to change without notice.
Motorola, Inc. 1997 Rev 0
Page 2
MC33290
2
MOTOROLA ANALOG IC DEVICE DATA
Figure 1. Simplified Block Diagram
V
BB
CEN
V
DD
Tx
Rx
ISO
Gnd
40 V
Thermal
Shutdown
R
Hys
Master
Bias
6
4
3
1
8
7
5
MAXIMUM RATINGS (All voltages are with respect to ground, unless otherwise noted.)
Rating Symbol Value Unit
VDD DC Supply Voltage
V
DD
–0.3 to 7.0
V
VBB Load Dump Peak Voltage
V
BB(LD)
45
V
ISO Pin Load Dump Peak Voltage
V
ISO
40
V
ISO Short Circuit Current Limit
I
ISO(LIM)
1.0
A
ESD Voltage (Note 1)
V
Human Body Model (Note 2) V
ESD1
2000
Machine Model (Note 3) V
ESD2
200
ISO Clamp Energy (Note 4)
E
clamp
10
mJ
Storage Temperature
T
stg
–55 to +150
°C
Operating Case Temperature
T
C
–40 to +125
°C
Operating Junction Temperature
T
J
–40 to +150
°C
Power Dissipation (TA = 25°C)
P
D
0.8
W
Soldering Temperature (for 10 seconds)
T
solder
260
°C
Thermal Resistance (Junction–to–Ambient)
R
θJA
150
°C/W
NOTES: 1. ESD data available upon request.
2.Testing in accordance with Human Body Model (C
Zap
= 100 pF, R
Zap
= 1500 Ω).
3.Testing in accordance with Machine Model (C
Zap
= 100 pF, R
Zap
= 0Ω).
4.Non–repetitive clamping capability at 25°C.
ELECTRICAL CHARACTERISTICS (Characteristics noted under conditions of 4.75 V ≤ V
DD
≤ 5.25 V, 8.0 V ≤ VBB,
HSIP ≤ 18.0 V, –40°C ≤ TC ≤ 125°C, unless otherwise noted.)
Characteristic
Symbol Min Typ Max Unit
POWER AND CONTROL
ББББББББББББББББББ
Á
VDD Sleep State Current (HSIM = HSIP, LSIM = LSIP = 0 V,
VRSM = VRSP = 0 V, Tx = 0.8 VDD, CEN = 0.3 VDD)
ÁÁÁÁ
ÁÁÁ
Á
I
DD(SS)
ÁÁ
Á
–
Á
Á
–
ÁÁÁ
Á
0.1
Á
Á
mA
ББББББББББББББББББ
VDD Quiescent Operating Current (HSIM = HSIP – 0.3 V, LSIM = 0 V,
LSIP = 0.3 V, VRSM = 0 V, VRSP = –0.5 V, Tx = 0.2 VDD, CEN = 0.7 VDD)
ÁÁÁÁ
ÁÁÁ
I
DD(Q)
ÁÁ–Á–ÁÁÁ
1.0
Á
mA
ББББББББББББББББББ
Á
VBB Sleep State Current (VBB = 16 V, HSIM = HSIP, LSIM = LSIP = 0 V,
VRSM = VRSP = 0 V, Tx = 0.8 VDD, CEN = 0.3 VDD)
ÁÁÁÁ
ÁÁÁ
Á
I
BB(SS)
ÁÁ
Á
–
Á
Á
–
ÁÁÁ
Á
50
Á
Á
µA
ББББББББББББББББББ
Á
VBB Quiescent Operating Current (HSIM = HSIP – 0.3 V, LSIM = 0 V,
LSIP = 0.3 V, VRSM = 0 V, VRSP = –0.5 V, Tx = 0.2 VDD, CEN = 0.7 VDD)
ÁÁÁÁ
ÁÁÁ
Á
I
BB(Q)
ÁÁ
Á
–
Á
Á
–
ÁÁÁ
Á
1.0
Á
Á
mA
Chip Enable
ÁÁÁÁ
V
Input High Voltage Threshold (Note 1) V
IH(CEN)
0.7 V
DD
– –
Input Low Voltage Threshold (Note 2) V
IL(CEN)
– – 0.3 V
DD
NOTES: 1. When IBB transitions to >100 µA.
2.When IBB transitions to <100 µA.
Page 3
MC33290
3
MOTOROLA ANALOG IC DEVICE DATA
ELECTRICAL CHARACTERISTICS (continued) (Characteristics noted under conditions of 4.75 V ≤ V
DD
≤ 5.25 V, 8.0 V ≤ VBB,
HSIP ≤ 18.0 V, –40°C ≤ TC ≤ 125°C, unless otherwise noted.)
Characteristic UnitMaxTypMinSymbol
POWER AND CONTROL
Chip Enable Pull–Down Current (Note 3)
ÁÁÁÁ
I
PD(CEN)
2.0
–
40
µA
Tx Input Low Voltage Threshold (R
ISO
= 510 Ω) (Note 4)
ÁÁÁÁ
V
LTP(Tx
)
–
–
0.3 x V
DD
V
Tx Input High Voltage Threshold (R
ISO
= 510 Ω) (Note 5)
ÁÁÁÁ
V
UTP(Tx)
0.7 x V
DD
–
–
V
Tx Pull–Up Current (Note 6)
ÁÁÁÁ
I
PU(Tx)
–40
–
–2.0
µA
Rx Output Low Voltage Threshold (R
ISO
= 510 Ω, Tx = 0.2 VDD,
Rx Sinking 1.0 mA)
ÁÁÁÁ
V
L(Rx)
–
–
0.2 V
DD
V
ББББББББББББББББББ
Á
Rx Output High Voltage Threshold (R
ISO
= 510 Ω, Tx = 0.8 VDD,
Rx Sourcing 250 µA)
ÁÁÁÁ
ÁÁÁ
Á
V
H(Rx)
ÁÁ
Á
0.8 V
DD
Á
Á
–
ÁÁÁ
Á
–
Á
Á
V
Thermal Shutdown (Note 7)
ÁÁÁÁ
T
LIM
150
170
–
°C
NOTES 3.Enable pin has an internal current pull–down equivalent to greater than 50 kΩ.
4.Measured by ramping Tx down from 0.7 VDD to 0.3 VDD and noting Tx value at which ISO falls below 0.2 VBB.
5. Measured by ramping Tx up from 0.3 VDD to 0.7 VDD and noting the value at which ISO rises above 0.9 VBB.
6.Tx pin has internal current pull–up equivalent to greater than 50 kΩ. Pull–Up current measure with Tx pin at 0.7 VDD.
7.Thermal Shutdown performance (T
LIM
) is guaranteed by design but not production tested.
ELECTRICAL CHARACTERISTICS (Characteristics noted under conditions of 4.75 V ≤ V
DD
≤ 5.25 V, 8.0 V ≤ VBB, HSIP ≤ 18.0 V,
–40°C ≤ TC ≤ 125°C, unless otherwise noted.)
Characteristic
Symbol Min Typ Max Unit
ISO I/O
Input Low Voltage Threshold (R
ISO
= 0 Ω, Tx = 0.8 VDD) (Note 1)
ÁÁÁÁ
V
LTP(ISO)
–
–
0.4 x V
BB
V
Input High Voltage Threshold (R
ISO
= 0 Ω, Tx = 0.8 VDD) (Note 2)
ÁÁÁÁ
V
UTP(ISO)
0.8 x V
BB
–
–
V
Input Hysteresis (Note 3)
ÁÁÁÁ
V
Hys(ISO)
0.01 x V
BB
–
0.1 x V
BB
V
Internal Pull–Up Current (Note 4)
ÁÁÁÁ
I
PU(ISO)
–5.0
–
–90
µA
(R
ISO
= ∞ Ω, Tx = 0.8 VDD, V
ISO
= 0.5 VBB)
ББББББББББББББББББ
Short Circuit Current Limit (Note 5) (R
ISO
= 0 Ω, Tx = 0.4 VDD, V
ISO
= VBB)
ÁÁÁÁ
ÁÁÁ
I
SC(ISO)
ÁÁ50Á–ÁÁÁ
1000
Á
mA
ББББББББББББББББББ
Output Low Voltage Threshold (R
ISO
= 510 Ω, Tx = 0.2 VDD)
ÁÁÁÁ
ÁÁÁ
V
L(ISO)
ÁÁ–Á–ÁÁÁ
0.125 x V
BB
Á
V
ББББББББББББББББББ
Output High Voltage Threshold (R
ISO
= ∞ Ω, Tx = 0.8 VDD)
ÁÁÁÁ
ÁÁÁ
V
H(ISO)
ÁÁ
0.95 x V
BB
Á–ÁÁÁ–Á
V
ББББББББББББББББББ
Fall Time (Note 6) (R
ISO
= 510 Ω to VBB, C
ISO
= 10 nF to Ground)
ÁÁÁÁ
ÁÁÁ
t
fall(ISO)
ÁÁ–Á–ÁÁÁ
2.0
Á
µs
ISO Propagation Delay (Note 7)
ÁÁÁÁ
t
PD(ISO)
µs
High to Low; (R
ISO
= 510 Ω, C
ISO
= 500 pF) (Note 8) – – 2.0
Low to High; (R
ISO
= 510 Ω, C
ISO
= 500 pF) (Note 9) – – 2.0
NOTES: 1. ISO ramped from 0.8 VBB to 0.4 VBB, Monitor Rx, Value of ISO voltage at which Rx transitions to 0.3 VDD.
2.ISO ramped from 0.4 VBB to 0.8 VBB, Monitor Rx, Value of ISO voltage at which Rx transitions to 0.7 VDD.
3.Input Hysteresis, V
Hys(ISO)
= V
UTP(ISO)
– V
LTP(ISO)
.
4.ISO Pull–Up has >100 kΩ internal pull–up to VBB.
5.ISO has internal current limit.
6.Time required ISO voltage to transition from 0.8 VBB to 0.2 VBB.
7.Changes in the value of C
ISO
affect the rise and fall time but have minimal effect on Propagation Delay.
8.Step Tx voltage from 0.2 VDD to 0.8 VDD; Time measured from V
UTP(ISO)
until V
ISO
reaches 0.3 VBB.
9.Step Tx voltage from 0.8 VDD to 0.2 VDD; Time measured from V
LTP(ISO)
until V
ISO
reaches 0.7 VBB.
Page 4
MC33290
4
MOTOROLA ANALOG IC DEVICE DATA
D SUFFIX
PLASTIC PACKAGE
CASE 751–05
ISSUE R
(SO–8)
P SUFFIX
PLASTIC PACKAGE
CASE 626–05
ISSUE K
OUTLINE DIMENSIONS
SEATING
PLANE
1
4
58
A0.25MCB
SS
0.25MB
M
h
q
C
X 45
_
L
DIM MIN MAX
MILLIMETERS
A 1.35 1.75
A1 0.10 0.25
B 0.35 0.49
C 0.18 0.25
D 4.80 5.00
E
1.27 BSCe
3.80 4.00
H 5.80 6.20
h
0 7
L 0.40 1.25
q
0.25 0.50
__
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. DIMENSIONS ARE IN MILLIMETERS.
3. DIMENSION D AND E DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE.
5. DIMENSION B DOES NOT INCLUDE MOLD
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 TOTAL IN EXCESS
OF THE B DIMENSION AT MAXIMUM MATERIAL
CONDITION.
D
E
H
A
B
e
B
A1
C
A
0.10
NOTES:
1. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
2. PACKAGE CONTOUR OPTIONAL (ROUND OR
SQUARE CORNERS).
3. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
14
58
F
NOTE 2
–A–
–B–
–T–
SEATING
PLANE
H
J
G
D
K
N
C
L
M
M
A
M
0.13 (0.005) B
M
T
DIM MIN MAX MIN MAX
INCHESMILLIMETERS
A 9.40 10.16 0.370 0.400
B 6.10 6.60 0.240 0.260
C 3.94 4.45 0.155 0.175
D 0.38 0.51 0.015 0.020
F 1.02 1.78 0.040 0.070
G 2.54 BSC 0.100 BSC
H 0.76 1.27 0.030 0.050
J 0.20 0.30 0.008 0.012
K 2.92 3.43 0.115 0.135
L 7.62 BSC 0.300 BSC
M ––– 10 ––– 10
N 0.76 1.01 0.030 0.040
__
Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty , representation or guarantee regarding
the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and
specifically disclaims any and all liability, including without limitation consequential or incidental damages. “T ypical” parameters which may be provided in Motorola
data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals”
must be validated for each customer application by customer’s technical experts. Motorola does not convey any license under its patent rights nor the rights of
others. Motorola products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other
applications intended to support or sustain life, or for any other application in which the failure of the Motorola product could create a situation where personal injury
or death may occur. Should Buyer purchase or use Motorola products for any such unintended or unauthorized application, Buyer shall indemnify and hold Motorola
and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees
arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that
Motorola was negligent regarding the design or manufacture of the part. Motorola and are registered trademarks of Motorola, Inc. Motorola, Inc. is an Equal
Opportunity/Affirmative Action Employer.
Mfax is a trademark of Motorola, Inc.
How to reach us:
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MC33290/D
◊
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