Datasheet MC33263NW-28R2, MC33263NW-30R2, MC33263NW-38R2, MC33263NW-40R2, MC33263NW-47R2 Datasheet (MOTOROLA)

MC33263

Ultra Low Noise
150 mA Low Dropout
Voltage Regulator with
ON/OFF Control

Housed in a SOT23–L package, the MC33263 delivers up to
150 mA where it exhibits a typical 180 mV dropout. With an
incredible noise level of 25 mVRMS (over 100 Hz to 100 kHz, with a
10 nF bypass capacitor), the MC33263 represents the ideal choice for
sensitive circuits, especially in portable applications where noise
performance and space are premium. The MC33263 also excels in
response time and reacts in less than 25 ms when receiving an OFF to
ON signal (with no bypass capacitor).

Thanks to a novel concept, the MC33263 accepts output capacitors
without any restrictions regarding their Equivalent Series Resistance
(ESR) thus offering an obvious versatility for immediate implementation.

With a typical DC ripple rejection better than –90 dB (–70 dB @
1 kHz), it naturally shields the downstream electronics against choppy
power lines.

Additionally, thermal shutdown and short–circuit protection
provide the final product with a high degree of ruggedness.

Features:

• Very Low Quiescent Current 170 µA (ON, no load), 100 nA (OFF,

no load)

• Very Low Dropout Voltage, typical value is 137 mV at an output

current of 100 mA

• Very Low Noise with external bypass capacitor (10 nF),

typically 25 µV rms over 100 Hz to 100 kHz

• Internal Thermal Shutdown

• Extremely Tight Line Regulation typically –90 dB

• Ripple Rejection –70 dB @ 1 kHz

• Line Transient Response: 1 mV for

• Extremely Tight Load Regulation, typically 20 mV at

• Multiple Output Voltages Available

• Logic Level ON/OFF Control (TTL–CMOS Compatible)

• ESR can vary from 0 to 3

W

• Functionally and Pin Compatible with TK112xxA/B Series

Applications:

• All Portable Systems, Battery Powered Systems, Cellular

T elephones, Radio Control Systems, Toys and Low Voltage Systems

MC33263 Block Diagram

Bypass

1

ON/OFF

3

Band Gap
Reference

Shutdown

D

Vin = 3 V

Thermal

Shutdown

D

I

out

= 150 mA

6

Input

4

Output

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MARKING

DIAGRAMS

6

SOT–23L

6

1

Device Version Shipping

MC33263NW–28R2 2.8 V 2500 Tape & Reel
MC33263NW–30R2 3.0 V 2500 Tape & Reel
MC33263NW–32R2 3.2 V
MC33263NW–33R2 3.3 V
MC33263NW–38R2 3.8 V 2500 Tape & Reel
MC33263NW–40R2 4.0 V 2500 Tape & Reel
MC33263NW–47R2 4.75 V 2500 Tape & Reel
MC33263NW–50R2 5.0 V 2500 Tape & Reel

All Devices Available in SOT–23L 6 Lead Package

NW SUFFIX

CASE 318J

x = Voltage Option Code
A = Assembly Location
WL, L = Wafer Lot
YY, Y = Year
WW, W= Work Week

PIN CONNECTIONS

ON/OFF

BYPASS

ORDERING INFORMATION

1

GND

3

(Top View)

xAYLW

1

6

V

IN

52

GND

4

V

OUT

2500 Tape & Reel
2500 Tape & Reel

* Current Limit
* Antisaturation

* Protection

2

GND

 Semiconductor Components Industries, LLC, 2000

April, 2000 – Rev. 2

5

GND

1 Publication Order Number:

MC33263/D

MC33263

ÁÁÁ

ÁÁÁ

ÁÁÁ

ÁÁÁ

ÁÁÁ

DEVICE MARKING

XALYW Marking Version

1st Digit

A
B
C
D
E
F
G
H

2nd Digit

3rd Digit

A
L

4th/5th Digits YW Date Code

MAXIMUM RATINGS

Rating Symbol Pin # Value Unit

Power Supply Voltage
Power Dissipation and Thermal Resistance

Maximum Power Dissipation P

NW Suffix, Plastic Package Limited
Thermal Resistance, Junction–to–Air
Thermal Resistance, Junction–to–Case

Operating Ambient Temperature
Maximum Junction Temperature

Storage Temperature Range

2.8 V

3.0 V

3.2 V

3.3 V

3.8 V

4.0 V

4.75 V

5.0 V

Location Code

Wafer Lot Traceability

V

in

D

R

q

JA

R

q

JC

T

A

T

Jmax
T

stg

Pin 1 Ink

Mark Identifier

Solid Pin 1 Dot

or Dimple

6

65 4

or

XALYW

12 3

SOT–23L

12

Internally W

210 °C/W

–40 to +85

150

–60 to +150

V

°C/W

°C
°C

°C

ELECTRICAL CHARACTERISTICS (For typical values T

Characteristics

= 25°C, for min/max values TA = –40°C to +85°C, Max TJ = 150°C)

A

Symbol Pin # Min Typ Max Unit

CONTROL ELECTRICAL CHARACTERISTICS

Input Voltage Range V
ON/OFF Input Current (All versions)

V

ON/OFF

= 2.4 V – 2.5 –

ON/OFF Input Voltages (All versions)

ON/OFF

I

ON/OFF

V

ON/OFF

Logic “0”, i.e. OFF State – – 0.3
Logic “1”, i.e. ON State 2.2 – –

1 0 – V
1

1

CURRENTS PARAMETERS

Current Consumption in OFF State (All versions)

OFF Mode Current: Vin = V

+ 1.0 V, I

out

= 0 mA – 0.1 2.0

out

Current Consumption in ON State (All versions)

ON Mode Sat Current: Vin = V

+ 1.0 V, I

out

= 0 mA – 170 200

out

Current Consumption in Saturation ON State (All versions)

ON Mode Sat Current: Vin = V

Current Limit Vin = V

+ 1.0 V, (All versions)

out

– 0.5 V, I

out

= 0 mA – 900 1400

out

Output Short–circuited (Note 1.) 175 210 –

1. I

(Output Current) is the measured current when the output voltage drops below 0.3 V with respect to V

out

IQ

IQ

IQ

I

MAX

OFF

ON

SAT

out

at I

= 30 mA.

out

in

V

m

A

V

m

A

m

A

m

A

mA

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2

MC33263

ELECTRICAL CHARACTERISTICS (For typical values T

Characteristics

Vin = V

2.8 Suffix 2.74 2.8 2.86

3.0 Suffix 2.94 3.0 3.06

3.2 Suffix 3.13 3.2 3.27

3.3 Suffix 3.23 3.3 3.37

3.8 Suffix 3.72 3.8 3.88

4.0 Suffix 3.92 4.0 4.08

4.75 Suffix 4.66 4.75 4.85

5.0 Suffix 4.90 5.0 5.1

Vin = V

1.0 mA < I

2.8 Suffix 2.7 2.8 2.9

3.0 Suffix 2.9 3.0 3.1

3.2 Suffix 3.09 3.2 3.31

3.3 Suffix 3.18 3.3 3.42

3.8 Suffix 3.67 3.8 3.93

4.0 Suffix 3.86 4.0 4.14

4.75 Suffix 4.58 4.75 4.92

5.0 Suffix 4.83 5.0 5.17

+ 1.0 V, TA = 25°C, 1.0 mA < I

out

+ 1.0 V, –40°C < TA < 80°C, V

out

< 150 mA

out

< 150 mA

out

= 25°C, for min/max values TA = –40°C to +85°C, Max TJ = 150°C)

A

Symbol Pin # Min Typ Max Unit

V

out

out

4

4 V

LINE AND LOAD REGULATION, DROPOUT VOLTAGES

Line Regulation (All versions)

V

+ 1.0 V < Vin < 12 V, I

out

Load Regulation (All versions) Vin = V

Dropout Voltage (All versions)

= 60 mA – 2.0 10

out

I

= 1.0 to 60 mA

out

I

= 1.0 to 100 mA

out

I

= 1.0 to 150 mA

out

I

= 10 mA – 30 90

out

I

= 100 mA – 137 230

out

I

= 150 mA – 180 260

out

out

+ 1.0 V

Reg

Reg

Vin – V

line

load

out

4/6

1

4, 6

–
–
–

8.0
15
20

DYNAMIC PARAMETERS

Ripple Rejection (All versions)

Vin = V

Line Transient Response

Vin = V
d(Vin)/dt = 15 mV/ms

Output Noise Voltage (All versions)

C

out

Output Noise Density

C

out

Output Rise Time (All versions)

C

out

1% of ON/OFF Signal to 99% of Nominal Output Voltage

+ 1.0 V, Vpp = 1.0 V, f = 1.0 kHz, I

out

+ 1.0 V to V

out

= 1.0 µF, I

= 1.0 µF, I

= 1.0 µF, I

out

out

out

+ 4.0 V, I

out

= 60 mA, f = 100 Hz to 100 kHz

= 60 mA, f = 1.0 kHz – 230 –

= 30 mA, V

ON/OFF

= 60 mA 60 70 –

out

= 60 mA, – 1.0 –

out

C
C
C

Without Bypass Capacitor – 40 – µs
With C

= 10 nF – 25 –

bypass

= 1.0 nF – 40 –

bypass

= 0 nF – 65 –

bypass

= 0 to 2.4 V

= 10 nF – 1.1 – ms

bypass

V

RMS

V

N

t

r

4, 6

4, 6

4, 6

4

4

THERMAL SHUTDOWN

Thermal Shutdown (All versions)

–

150

25
35
45

V

mV

mV

mV

dB

mV

µVrms

nV/ √Hz

–

°C

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3

MC33263

DEFINITIONS

Load Regulation – The change in output voltage for a

change in load current at constant chip temperature.

Dropout V oltage – The input/output differential at which

the regulator output no longer maintains regulation against
further reductions in input voltage. Measured when the
output drops 100 mV below its nominal value (which is
measured at 1.0 V differential), dropout voltage is affected
by junction temperature, load current and minimum input
supply requirements.

Output Noise Voltage – The RMS AC voltage at the

output with a constant load and no input ripple, measured
over a specified frequency range.

Maximum Power Dissipation – The maximum total

dissipation for which the regulator will operate within
specifications.

Quiescent Current – Current which is used to operate the

regulator chip and is not delivered to the load.

Line Regulation – The change in input voltage for a

change in the input voltage. The measurement is made under
conditions of low dissipation or by using pulse techniques
such that the average chip temperature is not significantly
affected.

Line Transient Response – Typical over– and

undershoot response when input voltage is excited with a
given slope.

Thermal Protection – Internal thermal shutdown

circuitry is provided to protect the integrated circuit in the
event that the maximum junction temperature is exceeded.
When activated, typically 150°C, the regulator turns off.

This feature is provided to prevent catastrophic failures from
accidental overheating.

Maximum Package Power Dissipation – The maximum

package power dissipation is the power dissipation level at
which the junction temperature reaches its maximum value
i.e. 125°C. The junction temperature is rising while the
difference between the input power (VCC X ICC) and the
output power (V

out

X I

out

) is increasing.

Depending on ambient temperature, it is possible to
calculate the maximum power dissipation, maximum load
current or maximum input voltage (see Application Hints:
Protection).

The maximum power dissipation supported by the device
is a lot increased when using appropriate application design.
Mounting pad configuration on the PCB, the board material
and also the ambient temperature are affected the rate of
temperature rise. It means that when the IC has good thermal
conductivity through PCB, the junction temperature will be
“low” even if the power dissipation is great.

The thermal resistance of the whole circuit can be
evaluated by deliberately activating the thermal shutdown
of the circuit (by increasing the output current or raising the
input voltage for example).

Then you can calculate the power dissipation by
subtracting the output power from the input power. All
variables are then well known: power dissipation, thermal
shutdown temperature (150°C for MC33263) and ambient
temperature.

APPLICATION HINTS

Input Decoupling – As with any regulator, it is necessary

to reduce the dynamic impedance of the supply rail that
feeds the component. A 1 mF capacitor either ceramic or
tantalum is recommended and should be connected close to
the MC33263 package. Higher values will correspondingly
improve the overall line transient response.

Output Decoupling – Thanks to a novel concept, the

MC33263 is a stable component and does not require any
Equivalent Series Resistance (ESR) neither a minimum
output current. Capacitors exhibiting ESRs ranging from a
few mW up to 3W can thus safely be used. The minimum
decoupling value is 1 mF and can be augmented to fulfill
stringent load transient requirements. The regulator accepts
ceramic chip capacitors as well as tantalum devices.

Noise Performances – Unlike other LDOs, the MC33263

is a true low–noise regulator. W ith a 10 nF bypass capacitor ,
it typically reaches the incredible level of 25 mVRMS overall
noise between 100 Hz and 100 kHz. To give maximum
insight on noise specifications, ON Semiconductor includes
spectral density graphics as well as noise dependency versus
bypass capacitor .

The bypass capacitor impacts the start–up phase of the
MC33263 as depicted by the data–sheet curves. A typical
1 ms settling time is achieved with a 10 nF bypass capacitor.
However, thanks to its low–noise architecture, the
MC33263 can operate without bypass and thus offers a
typical 20 ms start–up phase. In that case, the typical output
noise stays lower than 65 mVRMS between 100 Hz –
100 kHz.

Protections – The MC33263 hosts several protections,
conferring natural ruggedness and reliability to the products
implementing the component. The output current is
internally limited to a minimum of 175 mA while
temperature shutdown occurs if the die heats up beyond
150°C. These value lets you assess the maximum
differential voltage the device can sustain at a given output
current before its protections come into play.

The maximum dissipation the package can handle is given
by:

T

P

max

Jmax–TA

+

R

q

JA

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4

MC33263

Inp

Outp

Diff

–

)

If T

is internally limited to 150°C, then the MC33263

Jmax

can dissipate up to 595 mW @ 25°C.

The power dissipated by the MC33263 can be calculated

from the following formula:

Ptot

+ǀVin@

I

gnd

(I

)

ǁ ) ǀ

Vin*

V

ǁ @

out

out

I

out

or

Vin

max

Ptot)V

+

I

gnd

out

)

I

@

out

I

out

If a 150 mA output current is needed, the ground current
is extracted from the data–sheet curves: 6.5 mA @ 150 mA.
For a MC33263NW28R2 (2.8 V), the maximum input
voltage will then be 6.48 V, a rather comfortable margin.

T ypical Application – The following figure portraits the
typical application for the MC33263 where both
input/output decoupling capacitors appear.

ut

654

ut

Figure 2. Printed Circuit Board

erential (V

V

in

out

C3

1.0 mF

On/Off

Figure 1. A T ypical MC33263 Application with

Recommended Capacitor Values

MC33263

123

C1
10 nF

C2

1.0 mF

As for any low noise designs, particular care has to be
taken when tackling Printed Circuit Board (PCB) layout.
The following figure gives an example of a layout where
stray inductances/capacitances are minimized.

MC33263

Input Output

Figure 3. Copper Side Component Layout

C3

++

Rpull–up

ON/OFF

C2

C1

This layout is the basis for an MC33263 performance
evaluation board where the BNC connectors give the user an
easy and quick evaluation mean.

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5

MC33263

MC33263 Wake–up Improvement – In portable

applications, an immediate response to an enable signal is
vital. If noise is not of concern, the MC33263 without a
bypass capacitor settles in nearly 20 ms and typically delivers
65 mVRMS between 100 Hz and 100 kHz.

In ultra low–noise systems, the designer needs a 10 nF
bypass capacitor to decrease the noise down to 25 mVRMS
between 100 Hz and 100 kHz. With the adjunction of the
10 nF capacitor, the wake–up time expands up to 1 ms as
shown on the data–sheet curves. If an immediate response
is wanted, following figure’s circuit gives a solution to
charge the bypass capacitor with the enable signal without
degrading the noise response of the MC33263.

At power–on, C4 is discharged. When the control logic
sends its wake–up signal by going to a high level, the PNP
base is momentarily tight to ground. The PNP switch closes
and immediately charges the bypass capacitor C1 toward its
operating value. After a few ms, the PNP opens and becomes
totally transparent to the regulator.

This circuit improves the response time of the regulator
which drops from 1 ms down to 30 ms. The value of C4 needs
to be tweaked in order to avoid any bypass capacitor
overload during the wake–up transient.

Input Output

654

++

C3

1.0 mF

On/Off

R2
220 k

C4

470 pF

MC33263

123

MMBT2902LT1

Q1

C1
10 nF

C2

1.0 mF

Figure 4. A PNP Transistor Drives the

Bypass Pin when Enable Goes High

MC33263 Without

Wake–up Improvement

(Typical Response)

1 ms

MC33263 With

Wake–up Improvement

(Typical Response)

30 ms

Figure 5. MC33263 Wake–up Improvement with Small PNP Transistor

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6

MC33263

The PNP being wired upon the bypass pin, it shall not
degrade the noise response of the MC33263. Figure 6
confirms the good behavior of the integrated circuit in this

350
300
250
200

C

= 10 nF

150

nV/sqrt (Hz)

100

50

byp

Vin = 26 mVrms C = 10 nF
@ 100 Hz – 100 kHz

0

100 1,000

Figure 6. Noise Density of the MC33263 with a

10 nF Bypass Capacitor and a Wake–up

Improvement Network

area which reaches a typical noise level of 26 mVRMS
(100 Hz to 100 kHz) at I

10,000

Frequency (Hz)

Vin = 3.8 V
V

= 2.8 V

out

Co = 1.0 mF
I

= 60 mA

out

T

amb

100,000

= 25°C

out

1,000,000

= 60 mA.

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7

MC33263

TYPICAL PERFORMANCE CHARACTERISTICS

Ground Current Performances

7.0
Vin = 3.8 V

6.0
V

= 2.8 V

out

CO = 1.0 mF

5.0

T

= 25°C

amb

4.0

3.0

2.0

GROUND CURRENT (mA)

1.0

0

0

20 40 100 –20 0 20 40 60 80

60 80 120 140 200160 180

OUTPUT CURRENT (mA)

Figure 7. Ground Current versus Output Current

Line Transient Response and Output Voltage

200

m

190
180
170
160
150
140
130
120
110

QUIESCENT CURRENT ON MODE ( A)

100

–40

–20

0204060 10080

TEMPERATURE (°C)

GROUND CURRENT (mA)

2.1

2.05

2.0

1.95

1.9

1.85

1.8
–40

AMBIENT TEMPERATURE (°C)

Figure 8. Ground Current versus Ambient

Temperature

Vin = 3.8 to 7.0 V
Y1 = 1.0 mV/div
Y2 = 1.0 V/div
X = 1.0 ms
I

= 60 mA

out

T

= 25°C

amb

dVin = 3.2 V

Vin = 3.8 V
V

= 2.8 V

out

CO = 1.0 mF
I

= 60 mA

out

Y1

Y2

Figure 9. Quiescent Current versus T emperature Figure 10. Line Transient Response

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8

Vin = 3.8 V
Y1 = 100 mV/div
Y2 = 20 mV/div
X = 200 ms/div
T

= 25°C

amb

MC33263

TYPICAL PERFORMANCE CHARACTERISTICS

Load Transient Response versus Load Current Slope

Y2

Vin = 3.8 V
Y1 = 50 mA/div
Y2 = 20 mV/div
X = 20 ms
T

= 25°C

Y1

amb

Y1: OUTPUT CURRENT, Y2: OUTPUT VOLTAGEY1: OUTPUT CURRENT, Y2: OUTPUT VOLTAGE

Y1

Y2

Figure 11. I

Vin = 3.8 V
Y1 = 50 mA/div
Y2 = 20 mV/div
X = 100 ms
T

= 25°C

amb

Figure 13. I

= 3.0 mA to 150 mA

out

= 6.0 mA/ms (Large Scale)

Slope

I

= 3.0 mA to 150 mA

out

Y1

Y2

Figure 12. I

Vin = 3.8 V
Y1 = 50 mA/div
Y2 = 20 mV/div
X = 200 ms
T

= 25°C

amb

Y1: OUTPUT CURRENT, Y2: OUTPUT VOLTAGEY1: OUTPUT CURRENT, Y2: OUTPUT VOLTAGE

Figure 14. I

= 100 mA/ms (Large Scale)

Slope

I

= 3.0 mA to 150 mA

out

= 2.0 mA/ms (Large Scale)

Slope

I

= 3.0 mA to 150 mA

out

Y1

Y2

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9

MC33263

TYPICAL PERFORMANCE CHARACTERISTICS

Noise Performances

350
300
250
200

nV/Hz

150
100

Vn = 65 mVrms @ C
Vn = 30 mVrms @ C

50

Vn = 25 mVrms @ C
over 100 Hz to 100 kHz

0

100

1200

1000

m

800

600

400

SETTLING TIME ( S)

200

0

0

100,000

Vin = 3.8 V
V

= 2.8 V

out

CO = 1.0 mF
I

= 60 mA

out

T

= 23°C

amb

1,000,000

C

= 10 nF

byp

1000 10,000

3.3 nF

= 0

bypass

= 3.3 nF

bypass

= 10 nF

bypass

FREQUENCY (Hz)

0 nF

Figure 15. Noise Density versus Bypass

Capacitor

Settling Time Performances

Vin = 3.8 V
V

= 2.8 V

out

CO = 1.0 mF
I

= 60 mA

out

T

= 25°C

amb

1.0 2.0 3.0 4.0 6.0 10
BYPASS CAPACITOR (nF)

5.0 7.0 9.08.0

70
60
50

m

40
30
20
10

0

Vin = 3.8 V
V

out

CO = 1.0 mF
I

out

T

amb

0

1.0

= 2.8 V

= 60 mA

= 25°C

2.0 3.0 4.0 5.0
BYPASS CAPACITOR (nF)

6.0 7.0 8.0 9.0

RMS NOISE ( V)

Figure 16. RMS Noise versus Bypass Capacitor

(100 Hz – 100 kHz)

200 ms/div
500 mV/div
C

= 10 nF

byp

Vin = 3.8 V
V

= 2.8 V

out

C

= 1.0 mF

out

I

= 50 mA

out

T

= 25°C

amb

10

Figure 17. Output Voltage Settling Time versus

Bypass Capacitor

Vin = 3.8 V
V

= 2.8 V

out

C

100 ms/div
500 mV/div
C

= 3.3 nF

byp

I
T

out

out

amb

= 1.0 mF

= 50 mA

= 25°C

Figure 19. Output Voltage Settling Shape

C

bypass

= 3.3 nF

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10

Figure 18. Output V oltage Settling Shape

C

bypass

= 10 nF

10 ms/div
500 mV/div
C

= 0 nF

byp

Vin = 3.8 V
V

= 2.8 V

out

C

= 1.0 mF

out

I

= 50 mA

out

T

= 25°C

amb

Figure 20. Output Voltage Settling Shape without

Bypass Capacitor

MC33263

TYPICAL PERFORMANCE CHARACTERISTICS

Dropout Voltage

250

200

150

100

DROPOUT (mV)

50

0

10 60

Figure 21. Dropout V oltage versus I

IO (mA)

100

85°C
25°C

–40°C

150

out

250

200

150

100

DROPOUT (mV)

50

0

–40

–20 0 20

TEMPERATURE (°C)

Figure 22. Dropout V oltage versus Temperature

Output Voltage

2.805

2.800

2.795

2.790

2.785

2.780

OUTPUT VOLTAGE (V)

2.775

2.770
–20 0 40 100

–40

20 8060

TEMPERATURE (°C)

1 mA

60 mA

100 mA

150 mA

2.860

2.840

2.820

2.800

2.780

OUTPUT VOLTAGE (V)

2.760

2.740
0

20 40 80 160

60 120100

OUTPUT CURRENT (mA)

Figure 23. Output V oltage versus Temperature Figure 24. Output V oltage versus I

10 mA

60 mA

100 mA

150 mA

40 60 80

25°C

85°C

out

100

–40°C

140

Ripple Rejection Performances

0

–10

Vin = 3.8 V
V

= 2.8 V
CO = 1.0 mF
I
T

100

out

= 60 mA

out

amb

= 25°C

1000 100,000

FREQUENCY (Hz)

10,000

(dB)

–20
–30
–40
–50
–60
–70
–80
–90

–100

Figure 25. Ripple Rejection versus Frequency with

10 nF Bypass Capacitor

0

–20

–40

–60

(dB)

–80

–100
–120

10

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11

Vin = 3.8 V
V

= 2.8 V

out

CO = 1.0 mF
I

= 60 mA

out

T

= 25°C

amb

100

1000 100,000
FREQUENCY (Hz)

10,000

1,000,000

Figure 26. Ripple Rejection versus Frequency

without Bypass Capacitor

PIN 1 IDENTIFIER
IN THIS ZONE

D

A

MC33263

P ACKAGE DIMENSIONS

SOT–23L

NW SUFFIX

CASE 318J–01

ISSUE B

NOTES:

1. DIMENSIONS ARE IN MILLIMETERS.

0.05

E

M

0.20 C

M

B

C

S

B

E1

A

6

e

5

A

4

e1

B

1

2

3

A1

A

S

A

M

b

0.10 C

(b)

q

c1

H

L

c

b1

SECTION A–A

2. INTERPRET DIMENSIONS AND TOLERANCES
PER ASME Y14.5M, 1994.

3. DIMENSION E1 DOES NOT INCLUDE INTERLEAD
FLASH OR PROTRUSION. INTERLEAD FLASH OR
PROTRUSION SHALL NOT EXCEED 0.23 PER
SIDE.

4. DIMENSIONS b AND b2 DO NOT INCLUDE
DAMBAR PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.08 TOTAL IN EXCESS
OF THE b AND b2 DIMENSIONS AT MAXIMUM
MATERIAL CONDITION.

5. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.

6. DIMENSIONS D AND E1 ARE TO BE DETERMINED
AT DATUM PLANE H.

MILLIMETERS

DIM MIN MAX

A 1.25 1.40

A1 0.00 0.10

b 0.35 0.50

b1 0.35 0.45

c 0.10

c1 0.10

D 3.20
E 3.00 3.60

E1 2.00 2.40

e

e1

L 0.25

q

0.25

0.20

3.60

0.95

1.90

0.55

0 10

__

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12

MC33263/D