Datasheet MC33207P, MC33206DR2, MC33206DTB, MC33206DTBR2, MC33207DR2 Datasheet (MOTOROLA)

Page 1
 
SEMICONDUCTOR
TECHNICAL DATA
LOW VOLTAGE
RAIL–TO–RAIL
OPERATIONAL AMPLIFIERS
Order this document by MC33206/D
P SUFFIX
CASE 646
14
1
D SUFFIX
CASE 751A
(SO–14)
14
1
P SUFFIX
CASE 648
16
1
D SUFFIX
CASE 751B
(SO–16)
16
1
(Dual, Top View)
N.C.
Inputs 1
N.C.
12
13
14
11
3
2
1
4
105
96
V
EE
8
7
1
2
Inputs 2
N.C.
N.C.
Output 1
Enable 1
V
CC
Output 2
Enable 2
(Quad, Top View)
Output 1
Inputs 1
V
CC
Enable 1, 4
Inputs 4
1
14
15
16
13
3
2
1
4
125 116 107
Inputs 2 2
4
3
V
EE
Inputs 3
Enable 2, 3
9
8
Output 3
Output 2
Output 4
MC33207
MC33206
1
MOTOROLA ANALOG IC DEVICE DATA
     
The MC33206/7 family of operational amplifiers provide rail–to–rail operation on both the input and output. The inputs can be driven as high as 200 mV beyond the supply rails without phase reversal on the outputs and the output can swing within 50 mV of each rail. This rail–to–rail operation enables the user to make full use of the supply voltage range available. It is designed to work at very low supply voltages (±0.9 V) yet can operate with a single supply of up to 12 V and ground. Output current boosting techniques provide a high output current capability while keeping the drain current of the amplifier to a minimum.
The MC33206/7 has an enable mode that can be controlled externally. The typical supply current in the standby mode is <1.0 µA (V
Enable
= Gnd). The addition of an enable function makes this amplifier an ideal choice for power sensitive applications, battery powered equipment (ins trumentation and monitoring), portable telecommunication, and sample–and–hold applications.
Standby Mode (I
D
1.0 µA, Typ)
Low V oltage, Single Supply Operation
(1.8 V and Ground to 12 V and Ground)
Rail–to–Rail Input Common Mode Voltage Range
Output Voltage Swings within 50 mV of both Rails
No Phase Reversal on the Output for Over–Driven Input Signals
High Output Current (I
SC
= 80 mA, Typ)
Low Supply Current (I
D
= 0.9 mA, Typ)
600 Output Drive Capability
Typical Gain Bandwidth Product = 2.2 MHz
ORDERING INFORMATION
Operational
Amplifier Function
Device
Operating
Temperature Range
Package
MC33206D
SO–14
Dual
MC33206P
°
°
Plastic DIP
MC33207D
T
A
= –40 ° to +
105°C
SO–16
Quad
MC33207P Plastic DIP
Motorola, Inc. 1999 Rev 1
Page 2
MC33206 MC33207
2
MOTOROLA ANALOG IC DEVICE DATA
MAXIMUM RATINGS
Rating Symbol Value Unit
Supply Voltage (VCC to VEE) V
S
13 V
ESD Protection Voltage at any Pin
Human Body Model
V
ESD
2,000 V
Voltage at any Device Pin V
DP
VS ± 0.5 V
Input Differential Voltage Range V
IDR
(Note 1) V
Common Mode Input Voltage Range (Note 2) V
CM
VCC + 0.5 to
VEE – 0.5
V
Output Short Circuit Duration (Note 3) t
s
(Note 3) sec
Maximum Junction Temperature T
J
+150 °C
Storage Temperature Range T
stg
–65 to +150 °C
Maximum Power Dissipation P
D
(Note 3) mW
NOTES: 1. The dif ferential input voltage of each amplifier is limited by two internal parallel back–to–back
diodes. For additional differential input voltage range, use current limiting resistors in series with the input pins.
2.The common–mode input voltage range of each amplifier is limited by diodes connected from the inputs to both power supply rails. Therefore, the voltage on either input must not exceed either supply rail by more than 500 mV.
3.Power dissipation must be considered to ensure maximum junction temperature (TJ) is not exceeded.
4.ESD data available upon request.
DC ELECTRICAL CHARACTERISTICS (V
CC
= 5.0 V , VEE = 0 V, V
Enable
= 5.0 V , TA = 25°C, unless otherwise noted.)
Characteristic Figure Symbol Min Typ Max Unit
Input Offset Voltage (VCM 0 to 0.5 V, VCM 1.0 to 5.0 V)
MC33206: TA = 25°C
MC33201: TA = –40° to +105°C
MC33207: TA = 25°C
MC33202: TA = –40° to +105°C
V
IO
– – – –
0.5
1.0
0.5
1.0
8.0 11
10 13
mV
Input Offset Voltage Temperature Coefficient (RS = 50 )
TA = –40° to +105°C
VIO/T 2.0 µV/°C
Input Bias Current (VCM = 0 to 0.5 V, VCM = 1.0 to 5.0 V)
TA = 25°C TA = –40° to +105°C
IIB
– –
80
100
200 250
nA
Input Offset Current (VCM = 0 to 0.5 V, VCM = 1.0 to 5.0 V)
TA = 25°C TA = –40° to +105°C
IIO
– –
5.0 10
50
100
nA
Common Mode Input Voltage Range V
ICR
V
EE
VCC + 0.2 VEE – 0.2
V
CC
V
Large Signal Voltage Gain (VCC = 5.0 V , VEE = –5.0 V)
RL = 10 k RL = 600
A
VOL
50 25
300 250
– –
kV/V
Output Voltage Swing (VID = ±0.2 V)
RL = 10 k RL = 10 k RL = 600 RL = 600
V
OH
V
OL
V
OH
V
OL
4.85 –
4.75 –
4.95
0.05
4.85
0.15
0.15 –
0.25
V
Common Mode Rejection (Vin = 0 to 5.0 V) CMR 60 90 dB Power Supply Rejection Ratio
VCC/VEE = 5.0 V/Gnd to 3.0 V/Gnd
PSRR
PSR
66
25 92
500
µV/V
dB
Output Short Circuit Current (Source and Sink) I
SC
50 80 mA
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MC33206 MC33207
3
MOTOROLA ANALOG IC DEVICE DATA
DC ELECTRICAL CHARACTERISTICS (continued) (V
CC
= 5.0 V , VEE = 0 V, V
Enable
= 5.0 V , TA = 25°C, unless otherwise noted.)
Characteristic UnitMaxTypMinSymbolFigure
Power Supply Current (VO = 2.5 V , TA = –40° to +105°C,
per Amplifier)
MC33206: V
Enable
= 5.0 Vdc
MC33206: V
Enable
= Gnd (Standby)
MC33207: V
Enable
= 5.0 Vdc
MC33207: V
Enable
= Gnd (Standby)
I
D
– – – –
0.8
0.5
1.5
0.5
1.125
6.0
2.25
6.0
mA
µA
mA
µA
Enable Input Voltage (per Amplifier)
Enabled – Amplifier “On” Disabled – Amplifier “Off” (Standby)
V
Enable
– –
VEE + 1.8 VEE + 0.3
– –
V
Enable Input Current (Note 5) (per Amplifier)
V
Enable
= 12 V
V
Enable
= 5.0 V
V
Enable
= 1.8 V
V
Enable
= Gnd
I
Enable
– – – –
2.5
2.2
0.8 0
– – – –
µA
NOTE: 5. External control circuitry must provide for an initial turn–off transient of <10 µA.
AC ELECTRICAL CHARACTERISTICS (V
CC
= 5.0 V , VEE = 0 V, V
Enable
= 5.0 V , TA = 25°C, unless otherwise noted.)
Characteristic Figure Symbol Min Typ Max Unit
Slew Rate (VS = ±2.5 V , VO = –2.0 to +2.0 V ,
RL = 2.0 k, AV = 1.0)
SR 0.5 1.0 V/µs
Gain Bandwidth Product (f = 100 kHz) GBW 2.2 MHz Phase Margin (RL = 600 , CL = 0 pF)
O
M
65 Deg
Gain Margin (RL = 600 , CL = 0 pF) A
M
12 dB Channel Separation (f = 1.0 Hz to 20 kHz, AV = 100) CS 90 dB Power Bandwidth (VO = 4.0 Vpp, RL = 600 , THD 1%) BW
P
28 kHz Total Harmonic Distortion (RL = 600 , VO = 1.0 Vpp, AV = 1.0)
f = 1.0 kHz f = 10 kHz
THD
0.002
0.008
– –
%
Open Loop Output Impedance
(VO = 0 V, f = 2.0 MHz, AV = 10)
ZO 100
Differential Input Resistance (VCM = 0 V) R
in
200 k Differential Input Capacitance (VCM = 0 V) C
in
8.0 pF Equivalent Input Noise Voltage (RS = 100 )
f = 10 Hz f = 1.0 kHz
e
n
25 20
– –
Hz
nV/
Equivalent Input Noise Current
f = 10 Hz f = 1.0 kHz
i
n
0.8
0.2
– –
pA/
Hz
Time Delay for Device to Turn On t
on
10 µs Time Delay for Device to Turn Off t
off
2.0 µs
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MC33206 MC33207
4
MOTOROLA ANALOG IC DEVICE DATA
Figure 1. Circuit Schematic
(Each Amplifier)
This device contains 96 active transistors (each amplifier).
V
CC
Enable
V
EE
V
CC
V
CC
V
CC
Vin –
Vin +
Figure 2. Maximum Power Dissipation
versus Temperature
Figure 3. Input Offset Voltage Distribution
PERCENTAGE OF AMPLIFIERS (%)
40 35
VIO, INPUT OFFSET VOLTAGE (mV)
30 25
15
0
20
TA, AMBIENT TEMPERATURE (
°
C)
P
D(max)
, MAXIMUM POWER DISSIPATION (mW)
5.0
10
–10 0 4.0 8.0 10–2.0 2.0 6.0–6.0–8.0 –4.0
360 amplifiers tested from 3 wafer lots
VCC = 5.0 V VEE = Gnd TA = 25
°
C
DIP Package
–60 –30
4000 3500 3000 2500 2000 1500 1000
500
0
0 30 60 90 120 150
16 Pin DIP
SO–14/SO–1
6
14 Pin DIP
Page 5
MC33206 MC33207
5
MOTOROLA ANALOG IC DEVICE DATA
300
260
220
180
TA, AMBIENT TEMPERATURE (
°
C)
100
140
PERCENTAGE OF AMPLIFIERS (%)
TC
V
IO
, INPUT OFFSET VOLTAGE TEMPERATURE COEFFICIENT (µV/°C)
50
30
0
40
10
20
A
VOL
, OPEN LOOP VOL TAGE GAIN (kV/V)
Figure 4. Input Offset Voltage
Temperature Coefficient Distribution
Figure 5. Input Bias Current
versus Temperature
Figure 6. Input Bias Current
versus Common Mode Voltage
Figure 7. Open Loop Voltage Gain
versus Temperature
150
50
0
–50
VCM, INPUT COMMON MODE VOLTAGE (V)
200
160
120
80
TA, AMBIENT TEMPERATURE (
°
C)
0
I
IB
, INPUT BIAS CURRENT (nA)
40
VCC = 5.0 V VEE = Gnd
VCM > 1.0 V
VCM = 0 V to 0.5 V
I
IB
, INPUT BIAS CURRENT (nA)
100
–100 –150 –200 –250
–55 –40 –25 0 25 70 85 125
–50 0 20 40 50–10 10 30–30–40 –20
2.0 4.0
–55 –40 –25 0 25 70 85 125
0 6.0 8.0 10 12 105
360 amplifiers tested from 3 wafer lots
VCC = 5.0 V VEE = Gnd TA = 25
°
C
DIP Package
VCC = 5.0 V VEE = Gnd RL = 600
VO = 0.5 V to 4.5 V
VCC = 12 V VEE = Gnd TA = 25
°
C
V
O
,OUTPUT VOLTAGE (Vpp)
Figure 8. Output Voltage Swing
versus Supply Voltage
Figure 9. Output Saturation Voltage
versus Load Current
V
IL, LOAD CURRENT (mA)
V
EE
12
10
6.0
2.0
0
VCC,
VEE
SUPPLY VOLTAGE (V)
8.0
4.0
SAT
, OUTPUT SA TURATION VOLTAGE (V)
TA = 25°C
TA = –55°C
TA = 125°C
TA = –55°C
TA = 25°C
01520
±
1.0
±
2.0 105.0
±
3.0
±
4.0
±
5.0
±
6.0
RL = 600
TA = 25°C
V
CC
VCC
VCC
VEE
+
VEE
+
VCC = 5.0 V VEE = –5.0 V
TA = 125°C
Page 6
MC33206 MC33207
6
MOTOROLA ANALOG IC DEVICE DATA
V
O
, OUTPUT VOLTAGE (Vpp)
40
20
100
80
60
V
out
, OUTPUT VOLTAGE (V)
0
f, FREQUENCY (Hz)
12
0
9.0
3.0
6.0 VCC = 6.0 V
VEE = –6.0 V RL = 600
AV = 1.0 TA = 25
°
C
Figure 10. Output Voltage
versus Frequency
Figure 11. Common Mode Rejection
versus Frequency
Figure 12. Power Supply Rejection
versus Frequency
Figure 13. Output Short Circuit Current
versus Output Voltage
120
80
60
f, FREQUENCY (Hz)
100
80
60
40
f, FREQUENCY (Hz)
0
CMR, COMMON MODE REJECTION (dB)
20
VCC = 6.0 V VEE = –6.0 V TA = –55
°
to +125°C
PSR, POWER SUPPLY REJECTION (dB)
100
40
20
0
VCC = 6.0 V VEE = –6.0 V TA = –55
°
to +125°C
VCC = 6.0 V VEE = –6.0 V TA = 25
°
C
PSR+
PSR–
I
SC
, OUTPUT SHORT CIRCUIT CURRENT (mA)
Source
Sink
10
100 1.0 k 10 k 100 k 1.0 M
0 1.0 2.0 3.0 4.0 5.0 6.0
1.0 k 100 k 1.0 M10 k
10
100 1.0 k 10 k 100 k 1.0 M
VCC, VEE
, SUPPLY VOLTAGE (V)
Figure 14. Output Short Circuit Current
versus Temperature
Figure 15. Supply Current per Amplifier
versus Supply Voltage with No Load
I
TA, AMBIENT TEMPERATURE (°C)
VCC = 5.0 V VEE = Gnd
CC
, SUPPLY CURRENT PER AMPLIFIER (mA)
TA = 125°C
TA = –55°C
Source
Sink
TA = 25°C
2.0
1.6
0
150
125
75
25
0
100
50
1.2
0.8
0.4
±
1.0
±
2.0
±
3.0
±
4.0
±
5.0
±
.0–55 –40 –25 25 70 1250 85 105
±
0
I
SC
, OUTPUT SHORT CIRCUIT CURRENT (mA)
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MC33206 MC33207
7
MOTOROLA ANALOG IC DEVICE DATA
SR, SLEW RATE (V/ s)
µ
TA, AMBIENT TEMPERATURE (°C)
VCC = 2.5 V VEE = –2.5 V VO =
±
2.0 V
Figure 16. Slew Rate
versus Temperature
Figure 17. Gain Bandwidth Product
versus Temperature
Figure 18. Voltage Gain and Phase
versus Frequency
Figure 19. Voltage Gain and Phase
versus Frequency
f, FREQUENCY (Hz)
GBW, GAIN BANDWIDTH PRODUCT (MHz)
A , OPEN LOOP VOLTAGE GAIN (dB)
+Slew Rate
–Slew Rate
TA, AMBIENT TEMPERATURE (
°
C)
VCC = 2.5 V VEE = –2.5 V f = 100 kHz
VOL
, EXCESS PHASE (DEGREES)
f, FREQUENCY (Hz)
O
70
50
30
10
–10
–30
2.0
0
1.5
0.5
1.0
70
50
30
4.0
3.0
2.0
0
1.0
10
–10
–30
10 k 100 k 1.0 M 10 M
–55 –40 –25 25 70 1250 85 105 –55 –40 –25 25 70 1250 85 105
10 k 100 k 1.0 M 10 M
240
40
80
120
160
200
40
80
120
160
200
240
A , OPEN LOOP VOLTAGE GAIN (dB)
VOL
1A – Phase, CL = 0 pF 1B – Gain, CL = 0 pF 2A – Phase, CL = 300 pF 2B – Gain, CL = 300 pF
1A – Phase, VS = ±6.0 V 1B – Gain, VS =
±
6.0 V
2A – Phase, VS =
±
1.0 V
2B – Gain, VS =
±
1.0 V
VS = ±6.0 V TA = 25
°
C
RL = 600
CL = 0 pF TA = 25
°
C
RL = 600
1A
2A
2B
1B
1A
2A
2B
1B
M
, PHASE MARGIN (DEGREES)
RT, DIFFERENTIAL SOURCE RESISTANCE (Ω)
Figure 20. Gain and Phase Margin
versus Temperature
Figure 21. Gain and Phase Margin
versus Differential Source Resistance
75
60
0
70 60
40
10
0
TA, AMBIENT TEMPERATURE (
°
C)
50
20
45
30
15
Phase Margin
Gain Margin
M
, PHASE MARGIN (DEGREES)
30
A
M
, GAIN MARGIN (dB)
O
O
100 1.0 k 10 k 100 k–55 –40 –25 25 70 1250 85 105 10
70 60
40
10 0
50
20
30
75
60
0
45
30
15
VCC = 6.0 V VEE = –6.0 V RL = 600
CL = 100 pF
VCC = 6.0 V VEE = –6.0 V TA = 25
°
C
Phase Margin
Gain Margin
Page 8
MC33206 MC33207
8
MOTOROLA ANALOG IC DEVICE DATA
CL, CAPACITIVE LOAD (pF)
80
0
70
40
Figure 22. Gain and Phase Margin
versus Capacitive Load
60
10
20
30
50
A
M
, GAIN MARGIN (dB)
M
, PHASE MARGIN (DEGREES)
O
10 100 1.0 k
16
0
14
8.0
12
2.0
4.0
6.0
10
Phase Margin
Gain Margin
VCC = 6.0 V VEE = –6.0 V RL = 600
AV = 100 TA = 25
°
C
RL, LOAD RESISTANCE
Figure 23. Output Voltage
versus Load Resistance
V
O
, OUTPUT VOL TAGE (Vpp)
5.0
4.0
0
3.0
2.0
1.0
100 1.0 k 10 k 100 k10
Figure 24. Channel Separation
versus Frequency
150
90
60
0
CS, CHANNEL SEPARATION (dB)
30
f, FREQUENCY (Hz)
AV = 10
120
AV = 100
100 1.0 k 10 k
VCC = 6.0 V VEE = –6.0 V VO = 8.0 Vpp TA = 25
°
C
i , INPUT REFERRED NOISE CURRENT (pA/ Hz)
n
50
40
30
e , EQUIVALENT INPUT NOISE VOLTAGE (nV/ Hz)
20
10
0
n
Figure 25. Total Harmonic Distortion
versus Frequency
Figure 26. Equivalent Input Noise Voltage
and Current versus Frequency
10
1.0
0.1
f, FREQUENCY (Hz)
THD, TOT AL HARMONIC DISTORTION (%)
0.01
0.001
f, FREQUENCY (Hz)
AV = 100
AV = 10
AV = 1.0
10 100 1.0 k 100 k
10
100 10 k 100 k
10 k
1.0 k
5.0
4.0
3.0
2.0
1.0
0
VCC = 5.0 V TA = 25
°
C
VO = 2.0 Vpp
VEE = –5.0 V RL = 600
VCC = 6.0 V VEE = –6.0 V TA = 25
°
C
Noise Voltage
Noise Current
AV = 1000
VEE = Gnd CL = 0 pF AV = 1.0 TA = 25
°
C
VCC = 2.0 Vdc
VCC = 5.0 Vdc
Page 9
MC33206 MC33207
9
MOTOROLA ANALOG IC DEVICE DATA
GENERAL INFORMATION
The MC33206/7 family of operational amplifiers are unique in their ability to swing rail–to–rail on both the input and the output with a completely bipolar design. This offers low noise, high output current capability and a wide common mode input voltage range even with low supply voltages. Operation is guaranteed over an extended temperature range and at supply voltages of 2.0 V, 3.3 V and 5.0 V and ground.
Since the common mode input voltage range extends from VCC to VEE, it can be operated with either single or split voltage supplies. The MC33206/7 are guaranteed not to latch or phase reverse over the entire common mode range, however, the inputs should not be allowed to exceed maximum ratings.
CIRCUIT INFORMATION
Rail–to–rail performance is achieved at the input of the amplifiers by using parallel NPN–PNP differential input stages. When the inputs are within 800 mV of the negative rail, the PNP stage is on. When the inputs are more than 800 mV greater than VEE, the NPN stage is on. This switching of input pairs will cause a reversal of input bias currents (see Figure 6). Also, slight differences in offset voltage may be noted between the NPN and PNP pairs. Cross–coupling techniques have been used to keep this change to a minimum.
In addition to its rail–to–rail performance, the output stage is current boosted to provide 80 mA of output current, enabling the op amp to drive 600 loads. Because of this high output current capability, care should be taken not to exceed the 150°C maximum junction temperature.
Enable Function
The MC33206/07 enable pins allow the user to externally control the device. (Refer to the Pin Diagram on the first page of this data sheet for enable pin connections.) If the enable pins are pulled low (Gnd) each amplifier (MC33206) and amplifier pair (MC33207) will be disabled. When the enable pins are at a logic high (V
Enable
VEE = 1.8 V) the amplifiers will turn “on”. Refer to the data sheet characteristics for the required levels needed to change logical state.
The time to change states (from device “on” to “off” and “off” to “on”) is defined as the time delay. The Circuit in Figure 27 is used to measure ton and t
off
. Typical ton and t
off
measurements are shown in Figures 28 and 29. When the device is turned off (V
Enable
= Gnd) an internal regulator is
shut off disabling the amplifier.
MC33206
V
Enable
V
out
2.0 k
V
CC
ton t
off
ton t
off
2.0 V
Figure 27. Test Circuit for ton and t
off
Figure 28. ton Response
V
O
(1.0 V/DIV), V
in
(2.0 V/DIV)
ton, TIME (2.0 µs/DIV)
Figure 29. t
off
Response
V
O
(1.0 V/DIV), V
in
(2.0 V/DIV)
t
off
, TIME (2.0 µs/DIV)
Low Voltage Operation
The MC33206/07 will operate at supply voltages down to
1.8 V and ground. Since this device is a rail–to–rail on both the input and output, one can be assured of continued operation in battery applications when battery voltages drop to low voltage levels. This is called End of Discharge (see Figure 30). Now, the user can select a minimum quantity of batteries best suited for the particular design depending on the type of battery chosen. This will minimize part count in many designs.
Figure 30. Typical Battery Characteristics
Type Operating Voltage End of Discharge
Alkaline 1.5 V 0.9 V
NiCd 1.2 V 1.0 V NiMh 1.2 V 1.0 V
Silver Oxide 1.6 V 1.3 V
Lithium Ion 3.6 V 2.5 V
Compensating for Output Capacitance
The combination of device output impedance and increasing capacitive loading will cause phase delay (reducing the phase margin) in any amplifier (Figure 22). If the loading is excessive, the resulting response can be circuit oscillation. In other words, an amplifier can become unstable when the phase becomes greater than 180 degrees before the open loop gain drops to unity gain. Figures 18 and 19 show this situation as frequency increases for a given load. The MC33206/7 can typically drive up to 300 pF loads at unity gain without oscillating.
Page 10
MC33206 MC33207
10
MOTOROLA ANALOG IC DEVICE DATA
Figure 31. Capacitive Loads Compensation
C
L
R
f
V
in
C
X
R
O
R
L
There are several ways to compensate for this phenomena. Adding series resistance to the output is one way, but not an ideal solution. A dc voltage error will occur at the output. A better design solution to compensate for higher capacitive loads would be to use the circuit in Figure 31. This design helps to counteract the loss of phase margin by taking the high frequency output signal and feeding it back into the amplifier inverting input. This technique helps to overcome oscillation due to a highly capacitive load. Keep in mind that compensation will have the affect of lowering the Gain Bandwidth Product (GPW). The values of CX and R0, are determined experimentally. Typical CX and CL will be the same value.
SPICE Model
If a SPICE Macromodel is desired for the MC33206/07, the user can define the characteristics from the following information. Obtain the SPICE Macromodel for the MC33204 Rail–to–Rail Operational Amplifier (device is the same as the MC33207). For the Enable feature of the MC33207, simulate it as a bipolar switch. The Macromodel does not include an input capacitance between the inverting and noninverting inputs. This capacitor is called Cin. Add 3.0 to 5.0 pF if stability analysis is required.
O
, OUTPUT VOLTAGE (50 mV/DIV)V
t, TIME (10 µs/DIV)
Figure 32. Noninverting Amplifier Slew Rate Figure 33. Small Signal Transient Response
t, TIME (5.0 µs/DIV)
Figure 34. Large Signal Transient Response
VCC = 6.0 V VEE = –6.0 V RL = 600
CL = 100 pF TA = 25
°
C
O
, OUTPUT VOLTAGE (2.0 mV/DIV)
VCC = 6.0 V VEE = –6.0 V RL = 600
CL = 100 pF AV = 1.0 TA = 25
°
C
V
VCC = 6.0 V VEE = –6.0 V RL = 600
CL = 100 pF TA = 25
°
C
t, TIME (10
µ
s/DIV)
O
, OUTPUT VOLTAGE (2.0 V/DIV)V
Page 11
MC33206 MC33207
11
MOTOROLA ANALOG IC DEVICE DATA
P SUFFIX
CASE 646–06
ISSUE L
D SUFFIX
CASE 751A–03
(SO–14)
ISSUE F
OUTLINE DIMENSIONS
NOTES:
1. LEADS WITHIN 0.13 (0.005) RADIUS OF TRUE POSITION AT SEATING PLANE AT MAXIMUM MATERIAL CONDITION.
2. DIMENSION L TO CENTER OF LEADS WHEN FORMED PARALLEL.
3. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
4. ROUNDED CORNERS OPTIONAL.
17
14 8
B
A
F
HG D
K
C
N
L
J
M
SEATING PLANE
DIM MIN MAX MIN MAX
MILLIMETERSINCHES
A 0.715 0.770 18.16 19.56 B 0.240 0.260 6.10 6.60 C 0.145 0.185 3.69 4.69 D 0.015 0.021 0.38 0.53
F 0.040 0.070 1.02 1.78 G 0.100 BSC 2.54 BSC H 0.052 0.095 1.32 2.41
J 0.008 0.015 0.20 0.38 K 0.115 0.135 2.92 3.43
L 0.300 BSC 7.62 BSC M 0 10 0 10 N 0.015 0.039 0.39 1.01
____
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION.
–A–
–B–
G
P 7 PL
14 8
71
M
0.25 (0.010) B
M
S
B
M
0.25 (0.010) A
S
T
–T–
F
R
X 45
SEATING PLANE
D 14 PL
K
C
J
M
_
DIM MIN MAX MIN MAX
INCHESMILLIMETERS
A 8.55 8.75 0.337 0.344 B 3.80 4.00 0.150 0.157 C 1.35 1.75 0.054 0.068 D 0.35 0.49 0.014 0.019 F 0.40 1.25 0.016 0.049 G 1.27 BSC 0.050 BSC J 0.19 0.25 0.008 0.009 K 0.10 0.25 0.004 0.009 M 0 7 0 7 P 5.80 6.20 0.228 0.244 R 0.25 0.50 0.010 0.019
____
P SUFFIX
CASE 648–08
ISSUE R
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS WHEN FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
5. ROUNDED CORNERS OPTIONAL.
–A–
B
F
C
S
H
G
D
J
L
M
16 PL
SEATING
18
916
K
PLANE
–T–
M
A
M
0.25 (0.010) T
DIM MIN MAX MIN MAX
MILLIMETERSINCHES
A 0.740 0.770 18.80 19.55 B 0.250 0.270 6.35 6.85 C 0.145 0.175 3.69 4.44 D 0.015 0.021 0.39 0.53 F 0.040 0.70 1.02 1.77 G 0.100 BSC 2.54 BSC H 0.050 BSC 1.27 BSC J 0.008 0.015 0.21 0.38 K 0.110 0.130 2.80 3.30 L 0.295 0.305 7.50 7.74 M 0 10 0 10 S 0.020 0.040 0.51 1.01
____
Page 12
MC33206 MC33207
12
MOTOROLA ANALOG IC DEVICE DATA
OUTLINE DIMENSIONS
D SUFFIX
CASE 751B–05
(SO–16) ISSUE J
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION.
18
16 9
SEATING
PLANE
F
J
M
R
X 45
_
G
8 PLP
–B–
–A–
M
0.25 (0.010) B
S
–T–
D
K
C
16 PL
S
B
M
0.25 (0.010) A
S
T
DIM MIN MAX MIN MAX
INCHESMILLIMETERS
A 9.80 10.00 0.386 0.393 B 3.80 4.00 0.150 0.157 C 1.35 1.75 0.054 0.068 D 0.35 0.49 0.014 0.019 F 0.40 1.25 0.016 0.049 G 1.27 BSC 0.050 BSC J 0.19 0.25 0.008 0.009 K 0.10 0.25 0.004 0.009
M 0 7 0 7
P 5.80 6.20 0.229 0.244 R 0.25 0.50 0.010 0.019
____
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MC33206/D
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