Datasheet MC14585BDR2, MC14585BF, MC14585BFR1, MC14585BCP, MC14585BD Datasheet (MOTOROLA)

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Semiconductor Components Industries, LLC, 2000
March, 2000 – Rev. 3
1 Publication Order Number:
MC14585B/D
MC14585B
4-Bit Magnitude Comparator
The MC14585B 4–Bit Magnitude Comparator is constructed with complementary MOS (CMOS) enhancement mode devices. The circuit has eight comparing inputs (A3, B3, A2, B2, A1, B1, A0, B0), three cascading inputs (A < B, A = B, and A > B), and three outputs (A < B, A = B, and A > B). This device compares two 4–bit words (A and B) and determines whether they are “less than”, “equal to”, or “greater than” by a high level on the appropriate output. For words greater than 4–bits, units can be cascaded by connecting outputs (A > B), (A < B), and (A = B) to the corresponding inputs of the next significant comparator. Inputs (A < B), (A = B), and (A > B) on the least significant (first) comparator are connected to a low , a high, and a low , respectively .
Applications include logic in CPU’s, correction and/or detection of instrumentation conditions, comparator in testers, converters, and controls.
Diode Protection on All Inputs
Expandable
Applicable to Binary or 8421–BCD Code
Supply Voltage Range = 3.0 Vdc to 18 Vdc
Capable of Driving Two Low–power TTL Loads or One Low–power
Schottky TTL Load over the Rated Temperature Range
Can be Cascaded – See Fig. 3
MAXIMUM RATINGS (Voltages Referenced to V
SS
) (Note 2.)
Symbol Parameter Value Unit
V
DD
DC Supply Voltage Range –0.5 to +18.0 V
Vin, V
out
Input or Output Voltage Range
(DC or Transient)
–0.5 to VDD + 0.5 V
Iin, I
out
Input or Output Current
(DC or Transient) per Pin
±10 mA
P
D
Power Dissipation,
per Package (Note 3.)
500 mW
T
A
Ambient Temperature Range –55 to +125 °C
T
stg
Storage Temperature Range –65 to +150 °C
T
L
Lead Temperature
(8–Second Soldering)
260 °C
2. Maximum Ratings are those values beyond which damage to the device
may occur.
3. Temperature Derating:
Plastic “P and D/DW” Packages: – 7.0 mW/_C From 65_C T o 125_C
This device contains protection circuitry to guard against damage due to high static voltages or electric fields. However, precautions must be taken to avoid applications of any voltage higher than maximum rated voltages to this high–impedance circuit. For proper operation, V
in
and V
out
should be constrained
to the range V
SS
v (Vin or V
out
) v VDD.
Unused inputs must always be tied to an appropriate logic voltage level (e.g., either V
SS
or VDD). Unused outputs must be left open.
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A = Assembly Location WL or L = Wafer Lot YY or Y = Year WW or W = Work Week
Device Package Shipping
ORDERING INFORMATION
MC14585BCP PDIP–16 2000/Box MC14585BD SOIC–16 48/Rail MC14585BDR2 SOIC–16 2500/Tape & Reel
1. For ordering information on the EIAJ version of the SOIC packages, please contact your local ON Semiconductor representative.
MARKING
DIAGRAMS
1
16
PDIP–16
P SUFFIX
CASE 648
MC14585BCP
AWLYYWW
SOIC–16
D SUFFIX
CASE 751B
1
16
14585B
AWLYWW
SOEIAJ–16
F SUFFIX
CASE 966
1
16
MC14585B
AWLYWW
MC14585BF SOEIAJ–16 See Note 1.
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PIN ASSIGNMENT
13
14
15
16
9
10
11
125
4
3
2
1
8
7
6
(A t B)
out
(A u B)
out
B3
A3
V
DD
B1
A0
B0
(A u B)
in
(A = B)
out
A2
B2
V
SS
A1
(A = B)
in
(A t B)
in
BLOCK DIAGRAM
14
15
1
2
9
7
11
10
5
6
4
13
3
12
V
DD
= PIN 16
V
SS
= PIN 8
(A > B)
in
(A = B)
in
(A < B)
in
A0 B0 A1 B1 A2 B2 A3 B3
(A > B)
out
(A = B)
out
(A < B)
out
TRUTH TABLE (x = Don’t Care)
Inputs
Comparing Cascading
Outputs
A3, B3 A2, B2 A1, B1 A0, B0 A < B A = B A > B A < B A = B A > B
A3 > B3 x x x x x x 0 0 1 A3 = B3 A2 > B2 x x x x x 0 0 1 A3 = B3 A2 = B2 A1 > B1 x x x x 0 0 1 A3 = B3 A2 = B2 A1 = B1 A0 > B0 x x x 0 0 1
A3 = B3 A2 = B2 A1 = B1 A0 = B0 0 0 x 0 0 1 A3 = B3 A2 = B2 A1 = B1 A0 = B0 0 1 x 0 1 0 A3 = B3 A2 = B2 A1 = B1 A0 = B0 1 0 x 1 0 0 A3 = B3 A2 = B2 A1 = B1 A0 = B0 1 1 x 1 1 0
A3 = B3 A2 = B2 A1 = B1 A0 < B0 x x x 1 0 0 A3 = B3 A2 = B2 A1 < B1 x x x x 1 0 0 A3 = B3 A2 < B2 x x x x x 1 0 0
A3 < B3 x x x x x x 1 0 0
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ELECTRICAL CHARACTERISTICS (Voltages Referenced to V
SS
)
V
– 55_C 25_C 125_C
Characteristic Symbol
V
DD
Vdc
Min Max Min Typ
(4.)
Max Min Max
Unit
Output Voltage “0” Level
V
in
= VDD or 0
V
OL
5.0 10 15
— — —
0.05
0.05
0.05
— — —
0 0 0
0.05
0.05
0.05
— — —
0.05
0.05
0.05
Vdc
“1” Level
V
in
= 0 or V
DD
V
OH
5.0 10 15
4.95
9.95
14.95
— — —
4.95
9.95
14.95
5.0 10 15
— — —
4.95
9.95
14.95
— — —
Vdc
Input Voltage “0” Level
(V
O
= 4.5 or 0.5 Vdc)
(V
O
= 9.0 or 1.0 Vdc)
(V
O
= 13.5 or 1.5 Vdc)
V
IL
5.0 10 15
— — —
1.5
3.0
4.0
— — —
2.25
4.50
6.75
1.5
3.0
4.0
— — —
1.5
3.0
4.0
Vdc
“1” Level
(V
O
= 0.5 or 4.5 Vdc)
(V
O
= 1.0 or 9.0 Vdc)
(V
O
= 1.5 or 13.5 Vdc)
V
IH
5.0 10 15
3.5
7.0 11
— — —
3.5
7.0 11
2.75
5.50
8.25
— — —
3.5
7.0 11
— — —
Vdc
Output Drive Current
(V
OH
= 2.5 Vdc) Source
(V
OH
= 4.6 Vdc)
(V
OH
= 9.5 Vdc)
(V
OH
= 13.5 Vdc)
I
OH
5.0
5.0 10 15
– 3.0
– 0.64
– 1.6 – 4.2
— — — —
– 2.4
– 0.51
– 1.3 – 3.4
– 4.2 – 0.88 – 2.25
– 8.8
— — — —
– 1.7
– 0.36
– 0.9 – 2.4
— — — —
mAdc
(VOL = 0.4 Vdc) Sink (V
OL
= 0.5 Vdc)
(V
OL
= 1.5 Vdc)
I
OL
5.0 10 15
0.64
1.6
4.2
— — —
0.51
1.3
3.4
0.88
2.25
8.8
— — —
0.36
0.9
2.4
— — —
mAdc
Input Current I
in
15 ±0.1 ±0.00001 ±0.1 ±1.0 µAdc
Input Capacitance
(V
in
= 0)
C
in
5.0 7.5 pF
Quiescent Current
(Per Package)
I
DD
5.0 10 15
— — —
5.0 10 20
— — —
0.005
0.010
0.015
5.0 10 20
— — —
150 300 600
µAdc
Total Supply Current
(5.) (6.)
(Dynamic plus Quiescent, Per Package) (C
L
= 50 pF on all outputs, all
buffers switching)
I
T
5.0 10 15
IT = (0.6 µA/kHz) f + I
DD
IT = (1.2 µA/kHz) f + I
DD
IT = (1.8 µA/kHz) f + I
DD
µAdc
4. Data labelled “Typ” is not to be used for design purposes but is intended as an indication of the IC’s potential performance.
5. The formulas given are for the typical characteristics only at 25_C.
6. To calculate total supply current at loads other than 50 pF: I
T(CL
) = IT(50 pF) + (CL – 50) Vfk
where: I
T
is in µA (per package), CL in pF, V = (VDD – VSS) in volts, f in kHz is input frequency, and k = 0.001.
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SWITCHING CHARACTERISTICS
(7.)
(C
L
= 50 pF, T
A
= 25_C)
Characteristic
Symbol V
DD
Min Typ
(8.)
Max Unit
Output Rise and Fall Time
t
TLH
, t
THL
= (1.5 ns/pF) CL + 25 ns
t
TLH
, t
THL
= (0.75 ns/pF) CL + 12.5 ns
t
TLH
, t
THL
= (0.55 ns/pF) CL + 9.5 ns
t
TLH
,
t
THL
5.0 10 15
— — —
100
50 40
200 100
80
ns
Turn–On, Turn–Off Delay Time
t
PLH
, t
PHL
= (1.7 ns/pF) CL + 345 ns
t
PLH
, t
PHL
= (0.66 ns/pF) CL + 147 ns
t
PLH
, t
PHL
= (0.5 ns/pF) CL + 105 ns
t
PLH
,
t
PHL
5.0 10 15
— — —
430 180 130
860 360 260
ns
7. The formulas given are for the typical characteristics only at 25_C.
8. Data labelled “Typ” is not to be used for design purposes but is intended as an indication of the IC’s potential performance.
Figure 1. Dynamic Power Dissipation
Signal Waveforms
Figure 2. Dynamic Signal Waveforms
20 ns
20 ns
2f
1
V
DD
V
SS
V
DD
V
SS
V
OH
V
OL
V
OH
V
OL
V
OH
V
OL
(A < B)
out
(A = B)
out
(A > B)
out
B3
A3
20 ns
20 ns
V
DD
V
SS
V
OH
V
OL
90%
50%
10%
t
PLH
t
PHL
t
TLH
t
THL
90%
50%
10%
B0
(A = B)
out
(A < B)
out
Inputs (A>B) and (A=B) high, and inputs B3, A3, B2, A2, B1, A1, A0, and (A<B) low.
Inputs (A>B) and (A=B) high, and inputs B2, A2, B1, A1, B0, A0 and (A<B) low. f in respect to a system clock.
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Figure 3. Cascading Comparators
B11 B10 B9 B8 B7 B6 B5 B4 B3 B2 B1 B0
A11 A10 A9 A8 A7 A6 A5 A4 A3 A2 A1 A0
V
SSVDDVSS
WORD
B = A =
WORD
MC14585B
MC14585B
MC14585B
B3 A3 B2 A2 B1 A1 B0 A0
(A<B)
(A=B)
(A>B)
INPUTS
(A<B)
(A=B)
(A>B)
OUTPUT
(A<B)
(A=B)
(A>B)
OUTPUTS
WORD B = B11, B10,
...
, B0.
WORD A = A11, A10,
...
, A0.
15
14
2
1
7
9
10
11
5
6
4
(A > B)
in
(A = B)
in
(A < B)
in
B0
A0
B1
A1
B2
A2
B3
A3
12
3
13
(A < B)
out
(A = B)
out
(A > B)
out
LOGIC DIAGRAM
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P ACKAGE DIMENSIONS
PDIP–16
P SUFFIX
PLASTIC DIP PACKAGE
CASE 648–08
ISSUE R
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS WHEN FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
5. ROUNDED CORNERS OPTIONAL.
–A–
B
F
C
S
H
G
D
J
L
M
16 PL
SEATING
18
916
K
PLANE
–T–
M
A
M
0.25 (0.010) T
DIM MIN MAX MIN MAX
MILLIMETERSINCHES
A 0.740 0.770 18.80 19.55 B 0.250 0.270 6.35 6.85 C 0.145 0.175 3.69 4.44 D 0.015 0.021 0.39 0.53 F 0.040 0.70 1.02 1.77 G 0.100 BSC 2.54 BSC H 0.050 BSC 1.27 BSC J 0.008 0.015 0.21 0.38 K 0.110 0.130 2.80 3.30 L 0.295 0.305 7.50 7.74 M 0 10 0 10 S 0.020 0.040 0.51 1.01
____
SOIC–16
D SUFFIX
PLASTIC SOIC PACKAGE
CASE 751B–05
ISSUE J
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION.
18
16 9
SEATING
PLANE
F
J
M
R
X 45
_
G
8 PLP
–B–
–A–
M
0.25 (0.010) B
S
–T–
D
K
C
16 PL
S
B
M
0.25 (0.010) A
S
T
DIM MIN MAX MIN MAX
INCHESMILLIMETERS
A 9.80 10.00 0.386 0.393 B 3.80 4.00 0.150 0.157 C 1.35 1.75 0.054 0.068 D 0.35 0.49 0.014 0.019 F 0.40 1.25 0.016 0.049
G 1.27 BSC 0.050 BSC
J 0.19 0.25 0.008 0.009 K 0.10 0.25 0.004 0.009
M 0 7 0 7
P 5.80 6.20 0.229 0.244 R 0.25 0.50 0.010 0.019
____
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P ACKAGE DIMENSIONS
H
E
A
1
DIM MIN MAX MIN MAX
INCHES
––– 2.05 ––– 0.081
MILLIMETERS
0.05 0.20 0.002 0.008
0.35 0.50 0.014 0.020
0.18 0.27 0.007 0.011
9.90 10.50 0.390 0.413
5.10 5.45 0.201 0.215
1.27 BSC 0.050 BSC
7.40 8.20 0.291 0.323
0.50 0.85 0.020 0.033
1.10 1.50 0.043 0.059 0
0.70 0.90 0.028 0.035
––– 0.78 ––– 0.031
A
1
H
E
Q
1
L
E
_
10
_
0
_
10
_
L
E
Q
1
_
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS AND ARE MEASURED AT THE PARTING LINE. MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.15 (0.006) PER SIDE.
4. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY.
5. THE LEAD WIDTH DIMENSION (b) DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE LEAD WIDTH DIMENSION AT MAXIMUM MATERIAL CONDITION. DAMBAR CANNOT BE LOCATED ON THE LOWER RADIUS OR THE FOOT. MINIMUM SPACE BETWEEN PROTRUSIONS AND ADJACENT LEAD TO BE 0.46 ( 0.018).
M
L
DETAIL P
VIEW P
c
A
b
e
M
0.13 (0.005)
0.10 (0.004)
1
16 9
8
D
Z
E
A
b c D E e
L
M
Z
SOEIAJ–16
F SUFFIX
PLASTIC EIAJ SOIC PACKAGE
CASE 966–01
ISSUE O
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without further notice to any products herein. SCILLC makes no warranty , representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability , including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly , any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer .
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MC14585B/D
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