Datasheet MC145707DW, MC145705DW, MC145705P, MC145706DW, MC145706P Datasheet (Motorola)

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Page 1
MC145705MC145706MC145707MOTOROLA
1
Product Preview
 # !! "       # 
EIA–232–E and CCITT V.28
The MC145705/06/07 are a series of silicon–gate CMOS transceiver ICs that fulfill the electrical specifications of EIA–232–E and CCITT V .28 while operating from a s ingle + 5 V power supply. T hese t ransceiver series a re h igh performance and low power consumption devices that are equipped with standby and output enable function.
A voltage doubler and inverter c onvert t he + 5 V to ± 10 V. This i s accomplished through an on–board 20 kHz oscillator and four inexpensive external electrolytic capacitors.
The MC145705 is composed of t wo drivers and three r eceivers, t he MC145706 has three drivers and two receivers, and the MC145707 has three drivers and three receivers. These drivers and receivers are virtually identical to those of the MC145407.
Available Driver/Receiver Combinations
Device Drivers Receivers No. of Pins
MC145705 2 3 20 MC145706 3 2 20 MC145707 3 3 24
Drivers:
• ± 7.5 Output Swing
300 Power–Off Impedance
Output Current Limiting
TTL and CMOS Compatible Inputs
Three–State Outputs During Standby Mode
Hold Output OFF (MARK) State by TxEN Pin
Receivers:
• ± 25 V Input Range
3 to 7 k Input Impedance
0.8 V Hysteresis for Enhanced Noise Immunity
Three–State Outputs During Standby Mode
Charge Pumps:
+ 5 to ± 10 V Dual Charge Pump Architecture
Supply Outputs Capable of Driving Three Drivers on the MC145403/06
Simultaneously
Requires Four Inexpensive Electrolytic Capacitors
On–Chip 20 kHz Oscillators
This document contains information on a product under development. Motorola reserves the right to change or discontinue this product without notice.
Order this document
by MC145705/D

SEMICONDUCTOR TECHNICAL DATA
  
P SUFFIX
PLASTIC DIP
CASE 738
ORDERING INFORMATION
MC145705P Plastic DIP MC145706P Plastic DIP MC145707P Plastic DIP
MC145705DW SOG Package MC145706DW SOG Package MC145707DW SOG Package
P SUFFIX
PLASTIC DIP
CASE 724
DW SUFFIX
SOG PACKAGE
CASE 751E
DW SUFFIX
SOG PACKAGE
CASE 751D
20
1
24
1
20
1
24
1
Motorola, Inc. 1995
REV 1 8/95
Page 2
MC145705MC145706MC145707 MOTOROLA 2
PIN ASSIGNMENTS
MC145706
3 DRIVERS/2 RECEIVERS
MC145705
2 DRIVERS/3 RECEIVERS
MC145707
3 DRIVERS/3 RECEIVERS
C2+
GND
C2–
V
SS
STB
Tx1
Rx1
Tx2
Rx2
Tx3
1
2
3 4
5 6
7 8
9 10
C1+
V
CC
C1–
V
DD
TxEN
DI1
DO1
DI2
DO2
DI3
20
19
18 17
16
15
14
13
12
11
1
2
3 4
5 6
7
8
9 10
20
19
18 17
16
15
14
13
12
11
C1+
V
CC
C1–
V
DD
TxEN
DO1
DO2
DI1
DO3
DI2
C2+
GND
C2–
V
SS
STB
Rx1
Rx2
Tx1
Rx3
Tx2
1
2
3 4
5
6 7
8
9 10
11 12
24
23
22
21 20
19 18
17
16
15
14 13
C2+
GND
C2–
V
SS
STB
NC
Rx1
Tx1
Rx2
Tx2
Rx3
Tx3
C1+
V
CC
C1–
V
DD
TxEN
NC
DO1
DI1
DO2
DI2
DO3
DI3
NC = NO CONNECTION
Page 3
MC145705MC145706MC145707MOTOROLA
3
FUNCTION DIAGRAM
RECEIVER
DRIVER
TxEN
CHARGE PUMPS
OSC
VOLTAGE
DOUBLER
VOLTAGE
INVERTER
V
SS
V
DD
V
CC
GND
C1
C3 C4
C2
C1– C1+ C2+ C2–
+
+ +
+
+
V
DD
V
DD
V
SS
V
CC
STB
DO
1.0 V
1.8 V
15 k
5.4 k
*
*Protection Circuit
LEVEL
SHIFT
STB
V
CC
DI
1.4 V
+
V
CC
300
Tx
V
DD
V
SS
Page 4
MC145705MC145706MC145707 MOTOROLA 4
MAXIMUM RATINGS (Voltage Polarities Referenced to GND)
Rating
Symbol Value Unit
DC Supply Voltage V
CC
– 0.5 to + 6.0 V
Input Voltage Rx1 – Rx3 Inputs
DI1 – DI3 Inputs
V
IR
VSS – 15 to VDD+ 15
0.5 to VCC+ 15
V
DC Current per Pin I ± 100 mA Power Dissipation P
D
1 W
Operating Temperature Range T
A
– 40 to + 85 °C
Storage Temperature Range T
stg
– 85 to + 150 °C
RECOMMENDED OPERATING LIMITS
Parameter Symbol Min Typ Max Unit
Power Supply V
CC
4.5 5 5.5 V
Operating Temperature Range T
A
– 40 85 °C
DC ELECTRICAL CHARACTERISTICS (Voltage polarities referenced to GND = 0 V; C1 – C4 = 10 µF; T
A
= – 40 to + 85°C)
Parameter
Symbol Min Typ Max Unit
DC Power Supply V
CC
4.5 5 5.5 V
Quiescent Supply Current (Output Unloaded, Input Low) I
CC
1.7 3.5 mA
Quiescent Supply Current (Standby Mode) (Output Unloaded, Input Open) I
CC(STB)
< 10 20 µA
Control Signal Input Voltage (STB, TxEN) Logic Low
Logic High
V
IL
V
IH
VCC – 0.5
— —
0.5 —
V
Control Signal Input Current Logic Low (TxEN)
Logic High (STB)
I
IL
I
IH
— —
— —
– 10
10
µA
Charge Pumps Output Voltage (C1, C2, C3, C4 = 10 µF)
Output Voltage (VDD) I
load
= 0 mA
I
load
= 5 mA
I
load
= 10 mA
V
DD
8.5
7.5
6.0
10.0
9.5
9.0
11 — —
V
Output Voltage (VSS) I
load
= 0 mA
I
load
= 5 mA
I
load
= 10 mA
V
SS
– 8.5 – 7.5 – 6.0
– 10.0
– 9.2 – 8.6
– 11
— —
RECEIVER ELECTRICAL SPECIFICATIONS
(Voltage polarities referenced to GND = 0 V; VCC = + 5 V ± 10%; C1 – C4 = 10 µF; TA = – 40 to + 85°C)
Parameter
Symbol Min Typ Max Unit
Input Turn–On Threshold (V
DO1 – DO3
= VOL) Rx1 – Rx3 V
on
1.35 1.8 2.35 V
Input Turn–Off Threshold (V
DO1 – DO3
= VOH) Rx1 – Rx3 V
off
0.75 1 1.25 V
Input Threshold Hysteresis (Von = V
off
) Rx1 – Rx3 V
hys
0.6 0.8 V
Input Resistance R
in
3 5.4 7 k
High–Level Output Voltage (DO1 – DO3) I
out
= – 20 µA
V
Rx1 – Rx3
= – 3 to – 25 V I
out
= – 1 mA
V
OH
VCC – 0.1 VCC – 0.7
4.3
— —
V
Low–Level Output Voltage (DO1 – DO3) I
out
= + 20 µA
V
Rx1 – Rx3
= + 3 to + 25 V I
out
= + 1.6 mA
V
OL
— —
0.01
0.5
0.1
0.7
V
This device contains protection circuitry to guard against damage due to high static voltages or electric fields. However, precau­tions must be taken to avoid applications of any voltage higher than maximum rated voltages to this high–impedance circuit. For proper opera­tion, it is recommended that the voltage at the DI and DO pins be constrained to the range GND VDI VDD and GND ≤ VDO VCC. Also, the voltage at the Rx pin should be constrained to (VSS – 15 V) ≤ V
Rx1 – Rx3
(VDD + 15 V), and Tx should be constrained to VSS V
Tx1 – Tx3
VDD.
Unused inputs must always be tied to an appropriate logic voltage level (e.g., GND or VCC for DI, and GND for Rx).
Page 5
MC145705MC145706MC145707MOTOROLA
5
DRIVER ELECTRICAL SPECIFICATIONS
(Voltage polarities referenced to GND = 0 V; VCC = + 5 V ± 10%; C1 – C4 = 10 µF; TA = – 40 to + 85°C)
Parameter
Symbol Min Typ Max Unit
Digital Input Voltage DI1 – DI3
Logic Low Logic High
V
IL
V
IH
2
— —
0.8 —
V
Input Current DI1 – DI3
VDI = GND VDI = V
CC
I
IL
I
IH
— —
7
± 1.0
µA
Output High Voltage Tx1 – Tx3
(V
DI1 – DI3
= Logic Low, RL = 3 k) Tx1 – Tx6*
V
OH
6 5
7.5
6.5
— —
V
Output Low Voltage Tx1 – Tx3
(V
DI1 – DI3
= Logic High, RL = 3 k) Tx1 – Tx6*
V
OL
– 6 – 5
– 7.5 – 6.5
— —
V
Off Source Impedance Tx1 – Tx3 Z
off
300
Output Short Circuit Current (VCC = 5.5 V)
Tx1 – Tx3 Shorted to GND** Tx1 – Tx3 Shorted to ± 15 V***
I
SC
— —
— —
± 60
± 100
mA
*Specifications for a MC14570X powering a MC145406 or MC145403 with three additional drivers/receivers.
**Specification is for one Tx output to be shorted at a time. Should all three driver outputs be shorted simultaneously , device power dissipation
limits could be exceeded.
***This condition could exceed package limitations.
SWITCHING CHARACTERISTICS (V
CC
= + 5 V, ± 10%; C1 – C4 = 10 µF; TA = – 40 to + 85°C)
Parameter
Symbol Min Typ Max Unit
Drivers
Propagation Delay Time Tx1 – Tx3
Low–to–High
(RL = 3 k, CL = 50 pF or 2500 pF)
t
PLH
0.5 1
µs
High–to–Low
(RL = 3 k, CL = 50 pF or 2500 pF)
t
PHL
0.5 1
Output Slew Rate Tx1 – Tx3
Minimum Load (RL = 7 k, CL = 0 pF)
SR
± 6 ± 30
V/µs
Maximum Load (RL = 3 k, CL = 2500 pF) ± 5
Output Disable Time t
DAZ
4 10 µs
Output Enable Time t
DZA
25 50 ms
Receivers
Propagation Delay Time DO1 – DO3
Low–to–High
t
PLH
1
µs
High–to–Low t
PHL
1
Output Rise Time DO1 – DO3 t
r
250 400 ns
Output Fall Time DO1 – DO3 t
f
40 100 ns
Output Disable Time t
RAZ
4 10 µs
Output Enable Time t
RZA
25 50 ms
TRUTH TABLE Drivers
DI TxEN STB Tx
X X H Z* X L L L H H L L L H L H
*VSS VTx V
DD
X = Don’t Care
Receivers
Rx STB DO
X H Z* H L L L L H
*GND VDO V
CC
X = Don’t Care
Page 6
MC145705MC145706MC145707 MOTOROLA 6
PIN DESCRIPTIONS
V
CC
Digital Power Supply
This digital supply pin is connected to the logic power sup-
ply. This pin should have a 0.33 µF capacitor to ground.
GND Ground
Ground return pin is typically connected t o the signal ground pin of the EIA–232–D connector (Pin 7) as well as to the logic power supply ground.
V
DD
Positive Power Supply
This is the positive output of the on–chip voltage doubler and the positive power supply input of the driver/receiver sections of the device. This pin requires an external storage capacitor to filter the 50% duty cycle voltage generated by the charge pump.
V
SS
Negative Power Supply
This is the negative output of the on–chip voltage doubler/ inverter and the negative power supply input of the driver/ receiver sections of the device. This pin requires an external storage capacitor to filter the 50% duty cycle voltage gener­ated by the charge pump.
TxEN Output Enable
This is the driver output enable pin. When this pin is in logic low level, the condition of the driver outputs (Tx1 – Tx3) are in keep OFF (mark
) state.
STB Standby
The device enters the standby mode while this pin is con­nected to the logic high level. During the standby mode, driver and receiver output pins become high impedance
state. In this condition, supply current ICC is below 10 µA (Typ) and can be operated with low current consumption.
C2+, C2–, C1+, C1– Voltage Doubler and Inverter
These are the connections to the internal voltage doubler
and inverter, which generate the VDD and VSS voltages.
Rx1, Rx2 (Rx3) Receive Data Input
These are the EIA–232–E receive signal inputs. A voltage between + 3 and + 25 V is decoded as a space, and causes the corresponding DO pin to swing to ground (0 V). A voltage between – 3 and – 25 V is decoded as a mark, and causes the DO pin to swing up to VCC.
DO1, DO2 (DO3) Data Output
These are the receiver digital output pins, which swing from VCC to GND. Each output pin is capable of driving one LSTTL input load.
Output level of these p ins is high impedance while in standby mode.
DI1, DI2 (DI3) Data Input
These are t he high impedance digital input pins to the drivers. Input voltage levels on these pins must be between VCC and GND.
The level of these input pins are TTL/CMOS compatible.
Tx1, Tx2 (Tx3) Transmit Data Output
These are the EIA–232–E transmit signal output pins, which swing toward VDD and VSS. A logic 1 at a DI input causes the corresponding Tx output to swing toward VSS. The actual levels and slew rate achieved will depend on the output loading (RL/CL).
The minimum output impedance is 300 when turned off.
SWITCHING CHARACTERISTICS
RECEIVER
DRIVER
50%
DI1 – DI3
(INPUT)
+ 3 V
0 V
t
f
10%
90%
t
r
t
PHL
t
PLH
V
OL
V
OH
Tx1 – Tx3
(OUTPUT
)
50%
Rx1 – Rx3
(INPUT)
+ 3 V
0 V
t
f
10%
90%
t
r
t
PHL
t
PLH
V
OL
V
OH
DO1 – DO3
(OUTPUT)
STB (INPUT)
Tx1 – Rx3
(OUTPUT)
RECEIVER
DRIVER
+ 5 V
0 V
V
OL
V
OH
+ 1.5 V + 1.5 V
+ 5 V
+ 5 V
– 5 V– 5 V
t
DAZ
t
DZA
STB (INPUT)
DO1 – DO3
(OUTPUT)
+ 5 V
0 V
V
OL
V
OH
+ 1.5 V + 1.5 V
90% 90%
10%10%
t
RAZ
t
RZA
HIGH Z
HIGH Z
Page 7
MC145705MC145706MC145707MOTOROLA
7
ESD PROTECTION
ESD protection on IC devices that have their pins accessi­ble to the outside world is essential. High static voltages ap­plied to the pins when someone touches them either directly or indirectly can cause damage to gate oxides and transistor junctions by coupling a portion of the energy from the I/O pin to the power supply buses of the IC. This coupling will usually
occur through the internal ESD protection diodes which are designed to do just that. The key to protecting the IC is to shunt as much of the energy to ground as possible before it enters the IC. The figure below shows a technique which will clamp the ESD voltage at approximately ± 15 V using the MMBZ15VDLT1. Any residual voltage which appears on the supply pins is shunted to ground through the capacitors C1 and C2.
1
2
3 4
5
6 7
8
9 10
11 12
24
23
22
21 20
19 18
17
16
15
14 13
C2+
GND
C2–
V
SS
STB
NC
Rx1
Tx1
Rx2
Tx2
Rx3
Tx3
C1+
MMBZ15VDLT1
0.1 µF
C1–
V
DD
TxEN
NC
DO1
DI1
DO2
DI2
DO3
DI3
V
CC
Page 8
MC145705MC145706MC145707 MOTOROLA 8
PACKAGE DIMENSIONS
P SUFFIX PLASTIC DIP CASE 738–03
1.070
0.260
0.180
0.022
0.070
0.015
0.140 15
°
0.040
1.010
0.240
0.150
0.015
0.050
0.008
0.110 0°
0.020
25.66
6.10
3.81
0.39
1.27
0.21
2.80 0°
0.51
27.17
6.60
4.57
0.55
1.77
0.38
3.55 15
°
1.01
0.050 BSC
0.100 BSC
0.300 BSC
1.27 BSC
2.54 BSC
7.62 BSC
MIN MINMAX MAX
INCHES MILLIMETERS
DIM
A B C D E F G
J K L M N
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
-A-
C
K
N
E
G F
D
20 PL
J 20 PL
L
M
-T-
SEATING PLANE
1 10
1120
0.25 (0.010) T A
M M
0.25 (0.010) T B
M M
B
DW SUFFIX
SOG PACKAGE
CASE 751D–04
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.150 (0.006) PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.13 (0.005) TOTAL IN EXCESS OF D DIMENSION AT MAXIMUM MATERIAL CONDITION.
–A–
–B–
20
1
11
10
S
A
M
0.010 (0.25) B
S
T
D20X
M
B
M
0.010 (0.25)
P10X
J
F
G
18X
K
C
–T–
SEATING PLANE
M
R
X 45
_
DIM MIN MAX MIN MAX
INCHESMILLIMETERS
A 12.65 12.95 0.499 0.510 B 7.40 7.60 0.292 0.299 C 2.35 2.65 0.093 0.104 D 0.35 0.49 0.014 0.019 F 0.50 0.90 0.020 0.035 G 1.27 BSC 0.050 BSC J 0.25 0.32 0.010 0.012 K 0.10 0.25 0.004 0.009 M 0 7 0 7 P 10.05 10.55 0.395 0.415 R 0.25 0.75 0.010 0.029
_ _
_ _
Page 9
MC145705MC145706MC145707MOTOROLA
9
P SUFFIX
PLASTIC DIP
CASE 724–03
NOTES:
1. CHAMFERED CONTOUR OPTIONAL.
2. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
3. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
4. CONTROLLING DIMENSION: INCH.
–A–
–B–
24 13
12
1
–T–
SEATING PLANE
24 PL
K
E
F
N
C
D
G
M
A
M
0.25 (0.010) T
24 PLJ
M
B
M
0.25 (0.010) T
L
M
NOTE 1
DIM MIN MAX MIN MAX
MILLIMETERSINCHES
A 1.230 1.265 31.25 32.13 B 0.250 0.270 6.35 6.85 C 0.145 0.175 3.69 4.44 D 0.015 0.020 0.38 0.51 E 0.050 BSC 1.27 BSC F 0.040 0.060 1.02 1.52 G 0.100 BSC 2.54 BSC J 0.007 0.012 0.18 0.30 K 0.110 0.140 2.80 3.55
L 0.300 BSC 7.62 BSC M 0 15 0 15 N 0.020 0.040 0.51 1.01
_ _ _ _
DW SUFFIX
SOG PACKAGE
CASE 751E–04
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.13 (0.005) TOTAL IN EXCESS OF D DIMENSION AT MAXIMUM MATERIAL CONDITION.
–A–
–B– P12X
D24X
12
1324
1
M
0.010 (0.25) B
M
S
A
M
0.010 (0.25) B
S
T
–T–
G
22X
SEATING PLANE
K
C
R
X 45
_
M
F
J
DIM MIN MAX MIN MAX
INCHESMILLIMETERS
A 15.25 15.54 0.601 0.612 B 7.40 7.60 0.292 0.299 C 2.35 2.65 0.093 0.104 D 0.35 0.49 0.014 0.019 F 0.41 0.90 0.016 0.035 G 1.27 BSC 0.050 BSC J 0.23 0.32 0.009 0.013 K 0.13 0.29 0.005 0.011 M 0 8 0 8 P 10.05 10.55 0.395 0.415 R 0.25 0.75 0.010 0.029
____
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MC145705MC145706MC145707 MOTOROLA 10
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MC145705MC145706MC145707MOTOROLA
11
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MC145705MC145706MC145707 MOTOROLA 12
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MC145705/D
*MC145705/D*
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