MC145583MOTOROLA
1
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EIA–232–E and CCITT V.28
The MC145583 is a CMOS transceiver composed of three drivers and five
receivers that fulfills the electrical specifications of EIA–232–E, EIA–562, and
CCITT V.28 while operating from a single + 3.3 or + 5.0 V power supply. This
transceiver is a high–performance, low–power consumption device that is
equipped with a standby function.
A voltage tripler and inverter converts the + 3.3 V to ± 8.8 V, or a voltage
doubler and inverter converts the + 5.0 V to ± 8.8 V. This is accomplished
through an on–chip 40 kHz oscillator and five inexpensive external capacitors.
Drivers:
• ± 5 V Minimum Output Swing at 3.3 or 5.0 V Power Supply
• 300 Ω Power–Off Impedance
• Output Current Limiting
• Three–State Outputs During Standby Mode
Receivers:
• ± 25 V Input Range
• 3 to 7 kΩ Input Impedance
• 0.8 V Hysteresis for Enhanced Noise Immunity
• Three–State Outputs During Standby Mode
Ring Monitor Circuit:
• Invert the Input Level on Rx1 to Logic Output Level on RIMON at Standby
Mode
This document contains information on a product under development. Motorola reserves the right to change or discontinue this product without notice.
Order this document
by MC145583/D
SEMICONDUCTOR TECHNICAL DATA
ORDERING INFORMATION
MC145583DW SOG Package
MC145583VF SSOP
VF SUFFIX
SSOP
CASE 940J
PIN ASSIGNMENT
C5+ 1 C2+28
GND 2 V
CC
27
C5– 3 C2–26
RIMON
4
C1+25
V
SS
5
C1–
24
STB
6
V
DD
23
Rx1
7
DO1
22
Rx2
8
DO2
21
Rx3
9
DO3
20
Tx1
10
DI1
19
Rx4
11
DO4
18
Tx2
12
DI2
17
Rx5
13
DO5
16
Tx3
14
DI3
15
RING
MONITOR
CIRCUIT
(INVERTING)
28
1
28
1
DW SUFFIX
SOG PACKAGE
CASE 751F
Motorola, Inc. 1996
REV 3
1/96
MC145583 MOTOROLA
2
FUNCTION DIAGRAM
RECEIVER
DRIVER
CHARGE PUMPS
OSC
VOLTAGE
TRIPLER
VOLTAGE
INVERTER
V
SS
V
DD
V
CC
GND
C1
C3 C4
C5
C1– C1+
C5+ C5–
+
+
+
C2
C2– C2+
+
**
–
+
V
DD
V
CC
STB
DO
1.0 V
TURN OFF
1.8 V
TURN ON
15 k
Ω
5.4 k
Ω
*
*Protection Circuit.
**Capacitors C1 and C2 are replaced by a 1 µF capacitor at
VCC = 5.0 V supply.
LEVEL
SHIFTER
STB
DI
1.4 V
–
+
V
CC
300
Ω
Tx
V
DD
V
SS
MC145583MOTOROLA
3
MAXIMUM RATINGS (Voltage polarities referenced to GND)
Rating
Symbol Value Unit
DC Supply Voltage V
CC
– 0.5 to + 6.0 V
Input Voltage Rx1 – Rx5 Inputs
DI1 – DI3 Inputs
V
IR
VSS – 15 to VDD+ 15
– 0.5 to VCC+ 0.5
V
DC Current per Pin I ± 100 mA
Power Dissipation P
D
1 W
Operating Temperature Range T
A
– 40 to + 85 °C
Storage Temperature Range T
stg
– 85 to + 150 °C
RECOMMENDED OPERATING LIMITS
Parameter Symbol Min Typ Max Unit
Power Supply V
CC
VCC*
3.0
4.5
3.3
5.0
3.6
5.5
V
Operating Temperature Range T
A
– 40 — 85 °C
*Capacitors C1 and C2 are replaced by a 1 µF capacitor at VCC = 5 V.
DC ELECTRICAL CHARACTERISTICS (Voltage polarities referenced to GND = 0 V; C1 – C5 = 1 µF; T
A
= 25°C)
Parameter
Symbol Min Typ Max Unit
DC Power Supply V
CC
3.0 3.3 3.6 V
Quiescent Supply Current (Output Unloaded, Input Low) I
CC
— 2.8 6.0 mA
Quiescent Supply Current (Standby Mode; STB = 1, Output Unloaded) I
CC(STB)
— < 5 10 µA
Control Signal Input Voltage (STB) V
IL
V
IH
—
VCC – 0.5
—
—
0.5
—
V
Control Signal Input Current (STB) I
IL
I
IH
—
—
—
—
10
10
µA
Charge Pumps Output Voltage (VCC = 3 V; C1, C2, C3, C4, C5 = 1 µF)
Output Voltage (VDD) I
load
= 0 mA
I
load
= 6 mA
V
DD
8.5
7.5
8.8
7.9
—
—
V
Output Voltage (VSS) I
load
= 0 mA
I
load
= 6 mA
V
SS
—
—
– 8.8
– 7.8
– 8.5
– 7.0
RECEIVER ELECTRICAL SPECIFICATIONS
(Voltage polarities referenced to GND = 0 V; VCC = + 3.3 V ± 10%; C1 – C5 = 1 µF; TA = 25°C)
Parameter
Symbol Min Typ Max Unit
Input Turn–On Threshold (V
DO1 – DO5
= VOL; Rx1 – Rx5) 3.3 V
5.0 V
V
on
1.35
2.00
1.8
2.5
2.35
3.10
V
Input Turn–Off Threshold (V
DO1 – DO5
= VOH; Rx1 – Rx5) 3.3 V
5.0 V
V
off
0.75
1.20
1.0
1.5
1.25
1.80
V
Input Resistance R
in
3 5.4 7 kΩ
High–Level Output Voltage (DO1 – DO5) I
out
= – 20 µA
V
Rx1 – Rx5
= – 3 to – 25 V I
out
= – 1 mA
V
OH
VCC – 0.1
VCC – 0.6
—
2.7
—
—
V
Low–Level Output Voltage (DO1 – DO5) I
out
= + 20 µA
V
Rx1 – Rx5
= + 3 to + 25 V I
out
= + 1.6 mA
V
OL
—
—
0.01
0.5
0.1
0.7
V
Ring Monitor Circuit (Input Threshold) V
TH
— 1.1 — V
High–Level Output Voltage (RIMON) I
out
= – 20 µA
I
out
= – 1 mA
V
OH
VCC – 0.1
VCC – 0.6
—
2.7
—
—
V
Low–Level Output Voltage (RIMON) I
out
= + 20 µA
I
out
= + 1.6 mA
V
OL
—
—
0.01
0.5
0.1
0.7
V
This device contains protection circuitry to
guard against damage due to high static
voltages or electric fields. However, precautions must be taken to avoid applications of
any voltage higher than maximum rated voltages to this high–impedance circuit. For proper
operation, it is recommended that the voltage
at the DI and DO pins be constrained to the
range GND ≤ VDI ≤ VCC and GND ≤ V
DO
≤ VCC. Also, the voltage at the Rx pin should
be constrained to (VSS – 15 V) ≤ V
Rx1 – Rx5
≤ (VDD + 15 V), and Tx should be constrained
to VSS ≤ V
Tx1 – Tx3
≤ VDD.
Unused inputs must always be tied to an
appropriate logic voltage level (e.g., GND or
VCC for DI, and GND for Rx).
MC145583 MOTOROLA
4
DRIVER ELECTRICAL SPECIFICATIONS
(Voltage polarities referenced to GND = 0 V; VCC = + 3.3 V or + 5.0 V ± 10%; C1 – C5 = 1 µF; TA = 25°C)
Parameter
Symbol Min Typ Max Unit
Digital Input Voltage DI1 – DI3
Logic Low
Logic High
V
IL
V
IH
—
1.8
—
—
0.7
—
V
Digital Input Current DI1 – DI3
VDI = GND
VDI = V
CC
I
IL
I
IH
—
—
7
—
—
± 1.0
µA
Output High Voltage
Load on All Tx1 – Tx3, RL = 3 kΩ; CP = 2500 pF, V
DI1 – DI3
= Logic Low
No Load
V
OH
5.0
8.5
7.0
8.8
—
—
V
Output Low Voltage
Load on All Tx1 – Tx3, RL = 3 kΩ; CP = 2500 pF, V
DI1 – DI3
= Logic High
No Load
V
OL
—
—
– 7.0
– 8.8
– 5.0
– 8.5
V
Ripple (Refer to VDD – VSS Value) *** V
RF
— — ± 5%
Off Source Impedance Tx1 – Tx3 Z
off
300 — — Ω
Output Short Circuit Current (VCC = 3.3 V or 5.5 V)
Tx1 – Tx3 Shorted to GND*
Tx1 – Tx3 Shorted to ± 15 V**
I
SC
—
—
—
—
± 60
± 100
mA
*Specification is for one Tx output to be shorted at a time. Should all three driver outputs be shorted simultaneously, device power dissipation
limits could be exceeded.
**This condition could exceed package limitations.
***Ripple VRF would not exceed ± 5% of (VDD – VSS).
SWITCHING CHARACTERISTICS (V
CC
= + 3.3 V or + 5 V, ± 10%; C1 – C5 = 1 µF; TA = 25°C)
Parameter
Symbol Min Typ Max Unit
Drivers
Propagation Delay Time Tx1 – Tx3
Low–to–High
(RL = 3 kΩ, CL = 50 pF or 2500 pF)
t
DPLH
— 0.5 1
µs
High–to–Low
(RL = 3 kΩ, CL = 50 pF or 2500 pF)
t
DPHL
— 0.5 1
Output Slew Rate (Source R = 300 Ω) Tx1 – Tx3
Loading: RL = 3 – 7 kΩ; CL = 2500 pF
SR ± 4 — ± 30 V/µs
Output Disable Time* t
DAZ
— 4 10 µs
Output Enable Time* t
DZA
— 25 50 ms
Receivers
Propagation Delay Time DO1 – DO5
Low–to–High
t
RPLH
— — 1
µs
High–to–Low t
RPHL
— — 1
Output Rise Time DO1 – DO5 t
r
— 120 200 ns
Output Fall Time DO1 – DO5 t
f
— 40 100 ns
Output Disable Time* t
RAZ
— 4 10 µs
Output Enable Time* t
RZA
— 25 50 ms
*Including the charge pump setup time.
TRUTH TABLES
Drivers
DI STB Tx
X H Z*
H L L
L L H
*VSS ≤ VTx ≤ V
DD
X = Don’t Care
Receivers
Rx STB DO
X H Z*
H L L
L L H
*GND ≤ VDO ≤ V
CC
X = Don’t Care
MC145583MOTOROLA
5
PIN DESCRIPTIONS
V
CC
Digital Power Supply (Pin 27)
This digital supply pin is connected to the logic power supply. This pin should have a not less than 0.33 µF capacitor
GND.
GND
Ground (Pin 2)
Ground return p in is typically connected to t he signal
ground pin of the EIA–232–E connector (Pin 7) as well as to
the logic power supply ground.
V
DD
Positive Power Supply (Pin 23)
This is the positive output of the on–chip voltage tripler and
the positive power supply input of the driver/receiver sections
of the device. This pin requires an external storage capacitor
to filter the 50% duty cycle voltage generated by the charge
pump.
V
SS
Negative Power Supply (Pin 5)
This is the negative output of the on–chip voltage tripler/inverter and the negative power supply input of the driver/ receiver sections of the device. This pin requires an external
storage capacitor to filter the 50% duty cycle voltage generated by the charge pump.
RIMON
Ring Monitor Circuit (Pin 4)
The Ring Monitor Circuit will convert the input level on Rx1
pin at standby mode and output on the RIMON pin.
STB
Standby Mode (Pin 6)
The device enters the standby mode while this pin is connected to the logic high level. During the standby mode,
driver and receiver output pins become high–impedance
state. In this condition, supply current ICC is below 5 µA (typ).
C5+, C5–, C2+, C2–, C1+, C1–
Voltage Tripler and Inverter (Pins 1, 3, 28, 26, 25, 24)
These are the connections to the internal voltage tripler
and inverter, which generate the VDD and VSS voltages.
Rx1, Rx2, Rx3, Rx4, Rx5
Receive Data Inputs (Pins 7, 8, 9, 11, 13)
These are the EIA–232–E receive signal inputs. A voltage
between + 3 and + 25 V is decoded as a space, and causes
the corresponding DO pin to swing to GND (0 V). A voltage
between – 3 and – 25 V is decoded as a mark, and causes
the DO pin to swing up to VCC.
DO1, DO2, DO3, DO4, DO5
Data Outputs (Pins 22, 21, 20, 18, 16)
These are the receiver digital output pins, which swing
from VCC to GND. Output level of these pins is high impedance while in standby mode.
DI1, DI2, DI3
Data Inputs (Pins 19, 17, 15)
These are the high impedance digital input pins to the
drivers. Input voltage levels on these pins must be between
VCC and GND.
Tx1, Tx2, Tx3
Transmit Data Output (Pins 10, 12, 14)
These are the EIA–232–E transmit signal output pins,
which swing toward VDD and VSS. A logic 1 at a DI input
causes the corresponding Tx output to swing toward VSS.
The actual levels and slew rate achieved will depend on the
output loading (RL/CL).
The minimum output impedance is 300 Ω when turned off.
SWITCHING CHARACTERISTICS
50%
DI1 – DI3
(INPUT)
+ 3 V
0 V
t
f
10%
90%
t
r
t
DPHL
t
DPLH
V
OL
V
OH
Tx1 – Tx3
(OUTPUT
)
50%
Rx1 – Rx5
(INPUT)
+ 3 V
0 V
t
f
10%
90%
t
r
t
RPHL
t
RPLH
V
OL
V
OH
DO1 – DO5
(OUTPUT)
STB (INPUT)
Tx1 – Tx3
(OUTPUT)
+ 3.3 V
0 V
V
OL
V
OH
+ 1.5 V + 1.5 V
+ 5 V
+ 5 V
– 5 V– 5 V
t
DAZ
t
DZA
HIGH Z
STB (INPUT)
DO1 – DO5
(OUTPUT)
+ 3.3 V
0 V
V
OL
V
OH
+ 1.5 V + 1.5 V
90%
90%
10%10%
t
RAZ
t
RZA
HIGH Z
RECEIVER
DRIVER
RECEIVER
DRIVER
MC145583 MOTOROLA
6
ESD PROTECTION
ESD protection on IC devices that have their pins accessible to the outside world is essential. High static voltages
applied to the pins when someone touches them either
directly or indirectly can cause damage to gate oxides and
transistor junctions by coupling a portion of the energy from
the I/O pin to the power supply buses of the IC. This coupling
will usually occur through the internal ESD protection diodes
which are designed to do just that. The key to protecting the
IC is to shunt as much of the energy to ground as possible
before it enters the IC. Figure 1 shows a technique which will
clamp the ESD voltage at approximately ± 15 V using the
MMBZ15VDLT1. Any residual voltage which appears on the
supply pins is shunted to ground through the capacitors C1
and C2.
V
SS
STB
Rx1
Rx2
Rx3
Tx1
Rx4
Tx2
Rx5
Tx3
C5–
RIMON
C5+
GND
MMBZ15VDLT1 x 8
C1–
V
DD
C2–
C1+
C2+
V
CC
DO4
DI2
DO3
DI1
DO1
DO2
DO5
DI3
0.1 µF
C2
C1
0.1
µ
F
Figure 1. ESD Protection Scheme
MC145583MOTOROLA
7
PACKAGE DIMENSIONS
DW SUFFIX
SOG PACKAGE
CASE 751F–04
MIN MINMAX MAX
MILLIMETERS INCHES
DIM
A
B
C
D
F
G
J
K
M
P
R
17.80
7.40
2.35
0.35
0.41
0.23
0.13
0
°
10.05
0.25
18.05
7.60
2.65
0.49
0.90
0.32
0.29
8
°
10.55
0.75
0.701
0.292
0.093
0.014
0.016
0.009
0.005
0
°
0.395
0.010
0.711
0.299
0.104
0.019
0.035
0.013
0.011
8
°
0.415
0.029
1.27 BSC 0.050 BSC
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A AND B DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15
(0.006) PER SIDE.
5. DIMENSION D DOES NOT INCLUDE
DAMBAR PROTRUSION.
ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.13
(0.005) TOTAL IN EXCESS OF D
DIMENSION AT MAXIMUM MATERIAL
CONDITION.
-A-
-B-
1 14
1528
-T-
C
SEATING
PLANE
0.010 (0.25)
B
M M
M
J
-T-
K
26X G
28X D
14X P
R
X 45°
F
0.010 (0.25) T A B
M
S S
VF SUFFIX
SSOP
CASE 940J–01
28
15
14
1
B
A
L
J
D
C
E
F
M
–P–
–R–
DIMAMIN MAX MIN MAX
INCHES
10.10 10.20 0.398 0.402
MILLIMETERS
B 5.20 5.30 0.205 0.209
C ––– 2.00 ––– 0.079
D 0.20 0.40 0.008 0.016
E 1.75 1.85 0.069 0.073
F 0.45 0.75 0.018 0.030
G 0.65 BSC 0.0256 BSC
H 0.00 0.15 0.000 0.006
J 0.10 0.20 0.004 0.008
K 0.325 BSC 0.0128 BSC
L 7.50 7.90 0.295 0.311
M 1 7 1 7
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROSTRUSION. MOLD PROTRUSION IS
0.15 (0.006) MAX PER SIDE.
K
G
–T–
0.12 (0.005)MT P
S
SEATING
PLANE
H
–T–
0.10 (0.004) T
0.25 (0.010)MT R
S
_ _ _ _
MC145583 MOTOROLA
8
Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty , representation or guarantee regarding
the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit,
and specifically disclaims any and all liability, including without limitation consequential or incidental damages. “T ypical” parameters can and do vary in different
applications. All operating parameters, including “T ypicals” must be validated for each customer application by customer’s technical experts. Motorola does
not convey any license under its patent rights nor the rights of others. Motorola products are not designed, intended, or authorized for use as components in
systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of
the Motorola product could create a situation where personal injury or death may occur. Should Buyer purchase or use Motorola products for any such
unintended or unauthorized application, Buyer shall indemnify and hold Motorola and its officers, employees, subsidiaries, affiliates, and distributors harmless
against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that Motorola was negligent regarding the design or manufacture of the part.
Motorola and are registered trademarks of Motorola, Inc. Motorola, Inc. is an Equal Opportunity/Affirmative Action Employer.
How to reach us:
USA/EUROPE: Motorola Literature Distribution; JAPAN: Nippon Motorola Ltd.; Tatsumi–SPD–JLDC, Toshikatsu Otsuki,
P.O. Box 20912; Phoenix, Arizona 85036. 1–800–441–2447 6F Seibu–Butsuryu–Center, 3–14–2 Tatsumi Koto–Ku, Tokyo 135, Japan. 03–3521–8315
MFAX: RMFAX0@email.sps.mot.com – TOUCHTONE (602) 244–6609 HONG KONG: Motorola Semiconductors H.K. Ltd.; 8B Tai Ping Industrial Park,
INTERNET: http://Design–NET.com 51 Ting Kok Road, Tai Po, N.T., Hong Kong. 852–26629298
MC145583/D
*MC145583/D*
◊
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