Datasheet MC14557BCP, MC14557BDW, MC14557BDWR2, MC14557BF, MC14557BFEL Datasheet (MOTOROLA)

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Page 1
Semiconductor Components Industries, LLC, 2000
March, 2000 – Rev. 3
1 Publication Order Number:
MC14557B/D
MC14557B
1-to-64 Bit V ariable Length Shift Register
The MC14557B is a static clocked serial shift register whose length may be programmed to be any number of bits between 1 and 64. The number of bits selected is equal to the sum of the subscripts of the enabled Length Control inputs (L1, L2, L4, L8, L16, and L32) plus one. Serial data may be selected from the A or B data inputs with the A/B select input. This feature is useful for recirculation purposes. A Clock Enable (CE) input is provided to allow gating of the clock or negative edge clocking capability .
The device can be effectively used for variable digital delay lines or simply to implement odd length shift registers.
1–64 Bit Programmable Length
Q and Q Serial Buffered Outputs
Asynchronous Master Reset
All Inputs Buffered
No Limit On Clock Rise and Fall T imes
Supply Voltage Range = 3.0 Vdc to 18 Vdc
Capable of Driving Two Low–power TTL Loads or one Low–power
Schottky TTL Load Over the Rated Temperature Range
MAXIMUM RATINGS (Voltages Referenced to V
SS
) (Note 2.)
Symbol
Parameter Value Unit
V
DD
DC Supply Voltage Range –0.5 to +18.0 V
Vin, V
out
Input or Output Voltage Range
(DC or Transient)
–0.5 to VDD + 0.5 V
Iin, I
out
Input or Output Current
(DC or Transient) per Pin
±10 mA
P
D
Power Dissipation,
per Package (Note 3.)
500 mW
T
A
Ambient Temperature Range –55 to +125 °C
T
stg
Storage Temperature Range –65 to +150 °C
T
L
Lead Temperature
(8–Second Soldering)
260 °C
2. Maximum Ratings are those values beyond which damage to the device
may occur.
3. T emperature Derating:
Plastic “P and D/DW” Packages: – 7.0 mW/_C From 65_C T o 125_C
This device contains protection circuitry to guard against damage due to high static voltages or electric fields. However, precautions must be taken to avoid applications of any voltage higher than maximum rated voltages to this high–impedance circuit. For proper operation, V
in
and V
out
should be constrained
to the range V
SS
v (Vin or V
out
) v VDD.
Unused inputs must always be tied to an appropriate logic voltage level (e.g., either V
SS
or VDD). Unused outputs must be left open.
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A = Assembly Location WL or L = Wafer Lot YY or Y = Year WW or W = Work Week
Device Package Shipping
ORDERING INFORMATION
MC14557BCP PDIP–16 2000/Box MC14557BDW SOIC–16 47/Rail
MARKING
DIAGRAMS
1
16
PDIP–16
P SUFFIX
CASE 648
MC14557BCP
AWLYYWW
SOIC–16 DW SUFFIX CASE 751G
1
16
14557B
AWLYYWW
MC14557BDWR2 SOIC–16 1000/Tape & Reel MC14557BF SOEIAJ–16 See Note 1. MC14557BFEL SOEIAJ–16 See Note 1.
1. For ordering information on the EIAJ version of the SOIC packages, please contact your local ON Semiconductor representative.
SOEIAJ–16
F SUFFIX
CASE 966
1
16
MC14557B
AWLYWW
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MC14557B
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2
PIN ASSIGNMENT
13
14
15
16
9
10
11
125
4
3
2
1
8
7
6
L32
L16
L8
L4
V
DD
A/B SEL
Q
Q
CLOCK
RESET
L1
L2
V
SS
A
B
CE
BLOCK DIAGRAM
TRUTH TABLE
Inputs Output
Rst A/B Clock CE
Q
00 0 B 01 0 A 00 1 B 01 1 A 1X X X 0
Q is the output of the first selected shift
register stage.
X = Don’t Care
12
13
14
1
15
2
9
7
6
5
4
3
11
10
RESET CLOCK CE B A A/B SELECT L1 L2 L4 L8 L16 L32
Q
Q
VDD = PIN 16
V
SS
= PIN 8
LENGTH SELECT TRUTH TABLE
L32 L16 L8 L4 L2 L1 Register Length
0
0
0
0
0
0
1 Bit
0
0
0
0
0
1
2 Bits
0000103 Bit
s
0000114 Bits
0000001100015 Bits
6 Bits
0001016 Bits
1
0
0
0
0
0
33 Bits
10000134 Bit
s
111100
61 Bits 1 1 1 1 1 1 62 Bits 1
1
1
1
1
0
63 Bits
11110164 Bi
ts
NOTE: Length equals the sum of the binary length control
subscripts plus one.
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MC14557B
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3
ELECTRICAL CHARACTERISTICS (Voltages Referenced to V
SS
)
V
– 55_C 25_C 125_C
Characteristic Symbol
V
DD
Vdc
Min Max Min Typ
(4.)
Max Min Max
Unit
Output Voltage “0” Level
V
in
= VDD or 0
V
OL
5.0 10 15
— — —
0.05
0.05
0.05
— — —
0 0 0
0.05
0.05
0.05
— — —
0.05
0.05
0.05
Vdc
“1” Level
V
in
= 0 or V
DD
V
OH
5.0 10 15
4.95
9.95
14.95
— — —
4.95
9.95
14.95
5.0 10 15
— — —
4.95
9.95
14.95
— — —
Vdc
Input Voltage “0” Level
(V
O
= 4.5 or 0.5 Vdc)
(V
O
= 9.0 or 1.0 Vdc)
(V
O
= 13.5 or 1.5 Vdc)
V
IL
5.0 10 15
— — —
1.5
3.0
4.0
— — —
2.25
4.50
6.75
1.5
3.0
4.0
— — —
1.5
3.0
4.0
Vdc
“1” Level
(V
O
= 0.5 or 4.5 Vdc)
(V
O
= 1.0 or 9.0 Vdc)
(V
O
= 1.5 or 13.5 Vdc)
V
IH
5.0 10 15
3.5
7.0 11
— — —
3.5
7.0 11
2.75
5.50
8.25
— — —
3.5
7.0 11
— — —
Vdc
Output Drive Current
(V
OH
= 2.5 Vdc) Source
(V
OH
= 4.6 Vdc)
(V
OH
= 9.5 Vdc)
(V
OH
= 13.5 Vdc)
I
OH
5.0
5.0 10 15
– 3.0
– 0.64
– 1.6 – 4.2
— — — —
– 2.4
– 0.51
– 1.3 – 3.4
– 4.2
– 0.88
– 2.25
– 8.8
— — — —
– 1.7
– 0.36
– 0.9 – 2.4
— — — —
mAdc
(VOL = 0.4 Vdc) Sink (V
OL
= 0.5 Vdc)
(V
OL
= 1.5 Vdc)
I
OL
5.0 10 15
0.64
1.6
4.2
— — —
0.51
1.3
3.4
0.88
2.25
8.8
— — —
0.36
0.9
2.4
— — —
Input Current I
in
15 ±0.1 ±0.00001 ±0.1 ±1.0 µAdc
Input Capacitance
(V
in
= 0)
C
in
5.0 7.5 pF
Quiescent Current
(Per Package)
I
DD
5.0 10 15
— — —
5.0 10 20
— — —
0.010
0.020
0.030
5.0 10 20
— — —
150 300 600
µAdc
Total Supply Current
(5.) (6.)
(Dynamic plus Quiescent, Per Package) (C
L
= 50 pF on all outputs, all
buffers switching)
I
T
5.0 10 15
IT = (1.75 µA/kHz) f + I
DD
IT = (3.50 µA/kHz) f + I
DD
IT = (5.25 µA/kHz) f + I
DD
µAdc
4. Data labelled “T yp” is not to be used for design purposes but is intended as an indication of the IC’s potential performance.
5. The formulas given are for the typical characteristics only at 25_C.
6. To calculate total supply current at loads other than 50 pF: I
T(CL
) = IT(50 pF) + (CL – 50) Vfk
where: I
T
is in µA (per package), CL in pF, V = (VDD – VSS) in volts, f in kHz is input frequency, and k = 0.001.
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MC14557B
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4
SWITCHING CHARACTERISTICS
(7.)
(C
L
= 50 pF, T
A
= 25_C)
Characteristic
Symbol V
DD
Min Typ
(8.)
Max Unit
Rise and Fall Time, Q or Q Output
t
TLH
, t
THL
= (1.5 ns/pF) CL + 25 ns
t
TLH
, t
THL
= (0.75 ns/pF) CL + 12.5 ns
t
TLH
, t
THL
= (0.55 ns/pF) CL + 9.5 ns
t
TLH
,
t
THL
5 10 15
— — —
100
50 40
200 100
80
ns
Propagation Delay, Clock or CE to Q or Q
t
PLH
, t
PHL
= (1.7 ns/pF) CL + 215 ns
t
PLH
, t
PHL
= (0.66 ns/pF) CL + 97 ns
t
PLH
, t
PHL
= (0.5 ns/pF) CL + 65 ns
t
PLH
,
t
PHL
5 10 15
— — —
300 130
90
600 260 180
ns
Propagation Delay, Reset to Q or Q
t
PLH
, t
PHL
= (1.7 ns/pF) CL + 215 ns
t
PLH
, t
PHL
= (0.66 ns/pF) CL + 97 ns
t
PLH
, t
PHL
= (0.5 ns/pF) CL + 70 ns
t
PLH
,
t
PHL
5 10 15
— — —
300 130
95
600 260 190
ns
Pulse Width, Clock t
WH(cl)
5 10 15
200 100
75
95 45 35
— — —
ns
Pulse Width, Reset t
WH(rst)
5 10 15
300 140 100
150
70 50
— — —
ns
Clock Frequency (50% Duty Cycle) f
cl
5 10 15
— — —
3.0
7.5
13.0
1.7
5.0
6.7
MHz
Setup Time, A or B to Clock or CE
Worst case condition: L1 = L2 = L4 = L8 = L16 = L32 = V
SS
(Register Length = 1)
t
su
5 10 15
700 290 145
350 130
85
— — —
ns
Best case condition: L32 = VDD, L1 through L16 = Don’t Care (Any register length from 33 to 64)
5 10 15
400 165
60
45
5 0
— — —
Hold Time, Clock or CE to A or B
Best case condition: L1 = L2 = L4 = L8 = L16 = L32 = V
SS
(Register Length = 1)
t
h
5 10 15
200 100
10
– 150
– 60 – 50
— — —
ns
Worst case condition: L32 = VDD, L1 through L16 = Don’t Care (Any register length from 33 to 64)
5 10 15
400 185
85
50 25 22
— — —
Rise and Fall Time, Clock tr,
t
f
5 10 15
No Limit
Rise and Fall Time, Reset or CE tr,
t
f
5 10 15
— — —
— — —
15
5 4
µs
Removal Time, Reset to Clock or CE t
rem
5 10 15
160
80 70
80 40 35
— — —
ns
7. The formulas given are for the typical characteristics only at 25_C.
8. Data labelled “T yp” is not to be used for design purposes but is intended as an indication of the IC’s potential performance.
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MC14557B
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5
TIMING DIAGRAM
1–bit length:
CE
= 0 A/B = 1 L1 = L2 = L4 = L8 = L16 = L32 = 0
PW
R
50%
t
WH(cl)
t
h
50%
t
su
t
rem
50%
t
TLH
t
THL
t
PHL
t
PHL
t
PLH
90%
50%
10%
A INPUT
CLOCK
RESET
Q
V
DD
V
SS
V
DD
V
SS
V
DD
V
SS
V
OH
V
OL
1/f
cl
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MC14557B
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6
LOGIC DIAGRAM
A/B
SELECT
B
A
RESET
CLOCK
CE
9
6
7
3
4
5
CR
32 BIT
12
L32
CR
2 BIT
1
L2
2
L1
CR
1 BIT
CR
16 BIT
13
L16
14
L8
CR
1 BIT
CR
8 BIT
10
11
Q
Q
15
L4
CR
4 BIT
V
DD
= PIN 16
V
SS
= PIN 8
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MC14557B
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7
P ACKAGE DIMENSIONS
PDIP–16
P SUFFIX
PLASTIC DIP PACKAGE
CASE 648–08
ISSUE R
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS WHEN FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
5. ROUNDED CORNERS OPTIONAL.
–A–
B
F
C
S
H
G
D
J
L
M
16 PL
SEATING
18
916
K
PLANE
–T–
M
A
M
0.25 (0.010) T
DIM MIN MAX MIN MAX
MILLIMETERSINCHES
A 0.740 0.770 18.80 19.55 B 0.250 0.270 6.35 6.85 C 0.145 0.175 3.69 4.44 D 0.015 0.021 0.39 0.53 F 0.040 0.70 1.02 1.77 G 0.100 BSC 2.54 BSC H 0.050 BSC 1.27 BSC J 0.008 0.015 0.21 0.38 K 0.110 0.130 2.80 3.30 L 0.295 0.305 7.50 7.74 M 0 10 0 10 S 0.020 0.040 0.51 1.01
____
SOIC–16
DW SUFFIX
PLASTIC SOIC PACKAGE
CASE 751G–03
ISSUE B
D
14X
B16X
SEATING PLANE
S
A
M
0.25 B
S
T
16 9
81
h X 45
_
M
B
M
0.25
H8X
E
B
A
e
T
A1
A
L
C
q
NOTES:
1. DIMENSIONS ARE IN MILLIMETERS.
2. INTERPRET DIMENSIONS AND TOLERANCES PER ASME Y14.5M, 1994.
3. DIMENSIONS D AND E DO NOT INLCUDE MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE.
5. DIMENSION B DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.13 TOTAL IN EXCESS OF THE B DIMENSION AT MAXIMUM MATERIAL CONDITION.
DIM MIN MAX
MILLIMETERS
A 2.35 2.65
A1 0.10 0.25
B 0.35 0.49 C 0.23 0.32 D 10.15 10.45 E 7.40 7.60
e 1.27 BSC H 10.05 10.55 h 0.25 0.75 L 0.50 0.90
q
0 7
__
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MC14557B
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8
P ACKAGE DIMENSIONS
H
E
A
1
DIM MIN MAX MIN MAX
INCHES
––– 2.05 ––– 0.081
MILLIMETERS
0.05 0.20 0.002 0.008
0.35 0.50 0.014 0.020
0.18 0.27 0.007 0.011
9.90 10.50 0.390 0.413
5.10 5.45 0.201 0.215
1.27 BSC 0.050 BSC
7.40 8.20 0.291 0.323
0.50 0.85 0.020 0.033
1.10 1.50 0.043 0.059 0
0.70 0.90 0.028 0.035
––– 0.78 ––– 0.031
A
1
H
E
Q
1
L
E
_
10
_
0
_
10
_
L
E
Q
1
_
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS AND ARE MEASURED AT THE PARTING LINE. MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.15 (0.006) PER SIDE.
4. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY.
5. THE LEAD WIDTH DIMENSION (b) DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE LEAD WIDTH DIMENSION AT MAXIMUM MATERIAL CONDITION. DAMBAR CANNOT BE LOCATED ON THE LOWER RADIUS OR THE FOOT. MINIMUM SPACE BETWEEN PROTRUSIONS AND ADJACENT LEAD TO BE 0.46 ( 0.018).
M
L
DETAIL P
VIEW P
c
A
b
e
M
0.13 (0.005)
0.10 (0.004)
1
16 9
8
D
Z
E
A
b
c D E
e
L
M
Z
SOEIAJ–16
F SUFFIX
PLASTIC EIAJ SOIC PACKAGE
CASE 966–01
ISSUE O
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