Datasheet MC14555BCP, MC14556BCL, MC14556BCP, MC14556BD, MC14555BD Datasheet (Motorola)

MOTOROLA CMOS LOGIC DATA

1

MC14555B MC14556B

   


The MC14555B and MC14556B are constructed with complementary
MOS (CMOS) enhancement mode devices. Each Decoder/Demultiplexer
has two select inputs (A and B), an active low Enable input (E), and four
mutually exclusive outputs (Q0, Q1, Q2, Q3). The MC14555B has the
selected output go to the “high” state, and the MC14556B has the selected
output go to the “low” state. Expanded decoding such as binary–to–hexade­cimal ( 1–of–16), e tc., can be achieved by using other MC14555B or
MC14556B devices.

Applications include code conversion, address decoding, memory selec­tion control, and demultiplexing (using the Enable input as a data input) in
digital data transmission systems.

• Diode Protection on All Inputs

• Active High or Active Low Outputs

• Expandable

• Supply Voltage Range = 3.0 Vdc to 18 Vdc

• All Outputs Buffered

• Capable of Driving Two Low–Power TTL Loads or One Low–Power

Schottky TTL Load Over the Rated Temperature Range

MAXIMUM RATINGS* (Voltages Referenced to V

SS

)

Symbol

Parameter Value Unit

V

DD

DC Supply Voltage – 0.5 to + 18.0 V

Vin, V

out

Input or Output Voltage (DC or Transient) – 0.5 to VDD + 0.5 V

Iin, I

out

Input or Output Current (DC or Transient),
per Pin

± 10 mA

P

D

Power Dissipation, per Package† 500 mW

T

stg

Storage Temperature – 65 to + 150

_

C

T

L

Lead Temperature (8–Second Soldering) 260

_

C

*Maximum Ratings are those values beyond which damage to the device may occur.
†Temperature Derating:

“P and D/DW” Packages: – 7.0 mW/C From 65_C To 125_C Ceramic
“L” Packages: – 12 mW/_C From 100_C To 125_C

BLOCK DIAGRAM

2

4

MC14555B MC14556B

3
1

14
13
15

5
6
7

12
11
10
9

2

4

3
1

14
13
15

5
6
7

12
11
10
9

VDD = PIN 16

VSS = PIN 8

A
B
E

Q0
Q1
Q2
Q3

A
B
E

Q

0

Q

1

Q

2

Q

3

A
B
E

Q0
Q1
Q2
Q3

A
B
E

Q

0

Q

1

Q

2

Q3



SEMICONDUCTOR TECHNICAL DATA

 Motorola, Inc. 1995

REV 3
1/94




L SUFFIX

CERAMIC

CASE 620

ORDERING INFORMATION

MC14XXXBCP Plastic
MC14XXXBCL Ceramic
MC14XXXBD SOIC

TA = – 55° to 125°C for all packages.

P SUFFIX

PLASTIC

CASE 648

D SUFFIX

SOIC

CASE 751B

This device contains protection circuitry to
guard against damage due to high static
voltages or electric fields. However, pre­cautions must be taken to avoid applications of
any voltage higher than maximum rated volt­ages to this high–impedance circuit. For proper
operation, Vin and V

out

should be constrained

to the range VSS v (Vin or V

out

) v VDD.

Unused inputs must always be tied to an
appropriate logic voltage level (e.g., either V

SS

or VDD). Unused outputs must be left open.

TRUTH TABLE

Inputs Outputs

Enable Select MC14555B MC14556B

E

B A Q3 Q2 Q1 Q0 Q3 Q2 Q1 Q0

0 0 0 0 0 0 1 1 1 1 0
0 0 1 0 0 1 0 1 1 0 1
0 1 0 0 1 0 0 1 0 1 1
0 1 1 1 0 0 0 0 1 1 1

1 X X 0 0 0 0 1 1 1 1

X = Don’t Care

MOTOROLA CMOS LOGIC DATAMC14555B MC14556B

2

ELECTRICAL CHARACTERISTICS (Voltages Referenced to V

SS

)

V

– 55_C 25_C 125_C

Characteristic

Symbol

V

DD

Vdc

Min Max Min Typ # Max Min Max

Unit

Output Voltage “0” Level

Vin = VDD or 0

V

OL

5.0
10
15

—
—
—

0.05

0.05

0.05

—
—
—

0
0
0

0.05

0.05

0.05

—
—
—

0.05

0.05

0.05

Vdc

“1” Level

Vin = 0 or V

DD

V

OH

5.0
10
15

4.95

9.95

14.95

—
—
—

4.95

9.95

14.95

5.0
10
15

—
—
—

4.95

9.95

14.95

—
—
—

Vdc

Input Voltage “0” Level

(VO = 4.5 or 0.5 Vdc)
(VO = 9.0 or 1.0 Vdc)
(VO = 13.5 or 1.5 Vdc)

V

IL

5.0
10
15

—
—
—

1.5

3.0

4.0

—
—
—

2.25

4.50

6.75

1.5

3.0

4.0

—
—
—

1.5

3.0

4.0

Vdc

“1” Level
(VO = 0.5 or 4.5 Vdc)
(VO = 1.0 or 9.0 Vdc)
(VO = 1.5 or 13.5 Vdc)

V

IH

5.0
10
15

3.5

7.0
11

—
—
—

3.5

7.0
11

2.75

5.50

8.25

—
—
—

3.5

7.0
11

—
—
—

Vdc

Output Drive Current

(VOH = 2.5 Vdc) Source
(VOH = 4.6 Vdc)
(VOH = 9.5 Vdc)
(VOH = 13.5 Vdc)

I

OH

5.0

5.0
10
15

– 3.0

– 0.64

– 1.6
– 4.2

—
—
—
—

– 2.4

– 0.51

– 1.3
– 3.4

– 4.2

– 0.88

– 2.25

– 8.8

—
—
—
—

– 1.7

– 0.36

– 0.9
– 2.4

—
—
—
—

mAdc

(VOL = 0.4 Vdc) Sink
(VOL = 0.5 Vdc)
(VOL = 1.5 Vdc)

I

OL

5.0
10
15

0.64

1.6

4.2

—
—
—

0.51

1.3

3.4

0.88

2.25

8.8

—
—
—

0.36

0.9

2.4

—
—
—

mAdc

Input Current I

in

15 — ±0.1 — ±0.00001 ±0.1 — ±1.0 µAdc

Input Capacitance

(Vin = 0)

C

in

— — — — 5.0 7.5 — — pF

Quiescent Current

(Per Package)

I

DD

5.0
10
15

—
—
—

5.0
10
20

—
—
—

0.005

0.010

0.015

5.0
10
20

—
—
—

150
300
600

µAdc

Total Supply Current**†

(Dynamic plus Quiescent,
Per Package)
(CL = 50 pF on all outputs, all
buffers switching)

I

T

5.0
10
15

IT = (0.85 µA/kHz) f + I

DD

IT = (1.70 µA/kHz) f + I

DD

IT = (2.60 µA/kHz) f + I

DD

µAdc

#Data labelled “Typ” is not to be used for design purposes but is intended as an indication of the IC’s potential performance.
**The formulas given are for the typical characteristics only at 25_C.
†To calculate total supply current at loads other than 50 pF:

IT(CL) = IT(50 pF) + (CL – 50) Vfk

where: IT is in µA (per package), CL in pF, V = (VDD – VSS) in volts, f in kHz is input frequency, and k = 0.002.

PIN ASSIGNMENTS

13

14

15

16

9

10

11

125

4

3

2

1

8

7

6

Q0

B

B

B

A

B

E

B

V

DD

Q3

B

Q2

B

Q1

B

Q0

A

B

A

A

A

E

A

V

SS

Q3

A

Q2

A

Q1

A

13

14

15

16

9

10

11

125

4

3

2

1

8

7

6

Q

0

B

B

B

A

B

E

B

V

DD

Q

3

B

Q

2

B

Q

1

B

Q

0

A

B

A

A

A

E

A

V

SS

Q

3

A

Q

2

A

Q

1

A

MC14555B MC14556B

MOTOROLA CMOS LOGIC DATA

3

MC14555B MC14556B

SWITCHING CHARACTERISTICS* (C

L

= 50 pF, TA = 25_C)

Characteristic

Symbol V

DD

Min Typ # Max Unit

Output Rise and Fall Time

t

TLH

, t

THL

= (1.5 ns/pF) CL + 25 ns

t

TLH

, t

THL

= (0.75 ns/pF) CL + 12.5 ns

t

TLH

, t

THL

= (0.55 ns/pF) CL + 9.5 ns

t

TLH

,

t

THL

5.0
10
15

—
—
—

100

50
40

200
100

80

ns

Propagation Delay Time — A, B to Output

t

PLH

, t

PHL

= (1.7 ns/pF) CL + 135 ns

t

PLH

, t

PHL

= (0.66 ns/pF) CL + 62 ns

t

PLH

, t

PHL

= (0.5 ns/pF) CL + 45 ns

t

PLH

,

t

PHL

5.0
10
15

—
—
—

220

95
70

440
190
140

ns

Propagation Delay Time — E to Output

t

PLH

, t

PHL

= (1.7 ns/pF) CL + 115 ns

t

PLH

, t

PHL

= (0.66 ns/pF) CL + 52 ns

t

PLH

, t

PHL

= (0.5 ns/pF) CL + 40 ns

t

PLH

,

t

PHL

5.0
10
15

—
—
—

200

85
65

400
170
130

ns

*The formulas given are for the typical characteristics only at 25_C.
#Data labelled “Typ” is not to be used for design purposes but is intended as an indication of the IC’s potential performance.

Figure 1. Dynamic Power Dissipation Signal Waveforms Figure 2. Dynamic Signal Waveforms

All 8 outputs connect to respective CL loads.
f in respect to a system clock.

INPUT E LOW

20 ns 20 ns

90%

50%

10%

2f

1

V

DD

V

SS

V

DD

V

SS

V

OH

V

OL

A INPUTS

(50% DUTY CYCLE)

B INPUTS

(50% DUTY CYCLE)

OUTPUT Q1

20 ns 20 ns

V

DD

V

SS

V

OH

V

OL

V

OH

V

OL

90%
50%
10%

90%
50%
10%

90%
50%
10%

t

PLH

t

TLH

t

PHL

t

PHL

t

THL

t

PLH

t

TLH

t

THL

INPUT A HIGH, INPUT E

LOW

INPUT B

OUTPUT Q3

MC14556B

OUTPUT Q3

MC14555B

LOGIC DIAGRAM

(1/2 of Dual)

*Eliminated for MC14555B

*

*

*

*

Q0

Q1

Q2

Q3

E

B

A

MOTOROLA CMOS LOGIC DATAMC14555B MC14556B

4

OUTLINE DIMENSIONS

P SUFFIX

PLASTIC DIP PACKAGE

CASE 648–08

ISSUE R

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.

2. CONTROLLING DIMENSION: INCH.

3. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.

4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.

5. ROUNDED CORNERS OPTIONAL.

–A–

B

F

C

S

H

G

D

J

L

M

16 PL

SEATING

1 8

916

K

PLANE

–T–

M

A

M

0.25 (0.010) T

DIM MIN MAX MIN MAX

MILLIMETERSINCHES

A 0.740 0.770 18.80 19.55
B 0.250 0.270 6.35 6.85
C 0.145 0.175 3.69 4.44
D 0.015 0.021 0.39 0.53
F 0.040 0.70 1.02 1.77
G 0.100 BSC 2.54 BSC
H 0.050 BSC 1.27 BSC
J 0.008 0.015 0.21 0.38
K 0.110 0.130 2.80 3.30
L 0.295 0.305 7.50 7.74
M 0 10 0 10
S 0.020 0.040 0.51 1.01

____

L SUFFIX

CERAMIC DIP PACKAGE

CASE 620–10

ISSUE V

NOTES:

1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.

2. CONTROLLING DIMENSION: INCH.

3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.

4. DIMENSION F MAY NARROW TO 0.76 (0.030)
WHERE THE LEAD ENTERS THE CERAMIC
BODY.

–A–

–B–

–T–

F

E

G

N

K

C

SEATING
PLANE

16 PLD

S

A

M

0.25 (0.010) T

16 PLJ

S

B

M

0.25 (0.010) T

M

L

DIM MIN MAX MIN MAX

MILLIMETERSINCHES

A 0.750 0.785 19.05 19.93
B 0.240 0.295 6.10 7.49
C ––– 0.200 ––– 5.08
D 0.015 0.020 0.39 0.50
E 0.050 BSC 1.27 BSC
F 0.055 0.065 1.40 1.65
G 0.100 BSC 2.54 BSC
H 0.008 0.015 0.21 0.38
K 0.125 0.170 3.18 4.31
L 0.300 BSC 7.62 BSC
M 0 15 0 15
N 0.020 0.040 0.51 1.01

_ _ _ _

16 9

1 8

MOTOROLA CMOS LOGIC DATA

5

MC14555B MC14556B

OUTLINE DIMENSIONS

D SUFFIX

PLASTIC SOIC PACKAGE

CASE 751B–05

ISSUE J

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.

2. CONTROLLING DIMENSION: MILLIMETER.

3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.

4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.

5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.

1 8

16 9

SEATING

PLANE

F

J

M

R

X 45

_

G

8 PLP

–B–

–A–

M

0.25 (0.010) B

S

–T–

D

K

C

16 PL

S

B

M

0.25 (0.010) A

S

T

DIM MIN MAX MIN MAX

INCHESMILLIMETERS

A 9.80 10.00 0.386 0.393
B 3.80 4.00 0.150 0.157
C 1.35 1.75 0.054 0.068
D 0.35 0.49 0.014 0.019

F 0.40 1.25 0.016 0.049

G 1.27 BSC 0.050 BSC

J 0.19 0.25 0.008 0.009
K 0.10 0.25 0.004 0.009
M 0 7 0 7

P 5.80 6.20 0.229 0.244
R 0.25 0.50 0.010 0.019

_ _ _ _

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the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit,
and specifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters which may be provided
in Motorola data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters,
including “Typicals” must be validated for each customer application by customer’s technical experts. Motorola does not convey any license under its patent
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MC14555B/D

*MC14555B/D*

◊