Datasheet MC14541BCP, MC14541BCL, MC14541BD Datasheet (Motorola)

Page 1
MOTOROLA CMOS LOGIC DATA
1
MC14541B
 
The MC14541B programmable timer consists of a 1 6–stage binary counter, an integrated oscillator for use with an external capacitor and two resistors, an automatic power–on reset circuit, and output control logic.
Timing is initialized by turning on power , whereupon the power–on reset is enabled and initializes the counter, within the specified VDD range. With the power already on, an external reset pulse can be applied. Upon release of the initial reset command, the oscillator will o scillate with a frequency determined by the external RC network. The 16–stage counter divides the oscillator frequency (f
osc
) with the nth stage frequency being f
osc
/2n.
Available Outputs 28, 210, 213 or 2
16
Increments on Positive Edge Clock Transitions
Built–in Low Power RC Oscillator (± 2% accuracy over temperature
range and ± 20% supply and ± 3% over processing at < 10 kHz)
Oscillator May Be Bypassed if External Clock Is Available (Apply
external clock to Pin 3)
External Master Reset Totally Independent of Automatic Reset
Operation
Operates as 2n Frequency Divider or Single Transition Timer
Q/Q
Select Provides Output Logic Level Flexibility
Reset (auto or master) Disables Oscillator During Resetting to Provide
No Active Power Dissipation
Clock Conditioning Circuit Permits Operation with Very Slow Clock Rise
and Fall Times
Automatic Reset Initializes All Counters On Power Up
Supply Voltage Range = 3.0 Vdc to 18 Vdc with Auto Reset
Disabled (Pin 5 = VDD)
= 8.5 Vdc to 18 Vdc with Auto Reset
Enabled (Pin 5 = VSS)
MAXIMUM RATINGS* (Voltages Referenced to V
SS
)
Symbol
Parameter
Value
Unit
V
DD
DC Supply Voltage
– 0.5 to + 18.0
V
Vin, V
out
Input or Output Voltage (DC or Transient)
– 0.5 to VDD + 0.5
V
I
in
Input Current (DC or Transient), per Pin
± 10
mA
I
out
Output Current (DC or Transient), per Pin
± 45
mA
P
D
Power Dissipation, per Package†
500
mW
T
stg
Storage Temperature
– 65 to + 150
_
C
T
L
Lead Temperature (8–Second Soldering)
260
_
C
*Maximum Ratings are those values beyond which damage to the device may occur. †Temperature Derating:
Plastic “P and D/DW” Packages: – 7.0 mW/_C From 65_C To 125_C Ceramic “L” Packages: – 12 mW/_C From 100_C To 125_C

SEMICONDUCTOR TECHNICAL DATA
Motorola, Inc. 1995
REV 3 1/94

L SUFFIX
CERAMIC
CASE 620
ORDERING INFORMATION
MC14XXXBCP Plastic MC14XXXBCL Ceramic MC14XXXBD SOIC
TA = – 55° to 125°C for all packages.
P SUFFIX
PLASTIC
CASE 648
D SUFFIX
SOIC
CASE 751B
PIN ASSIGNMENT
NC = NO CONNECTION
11
12
13
14
8
9
105
4
3
2
1
7
6
MODE
NC
A
B
V
DD
Q
Q/Q
SEL
NC
R
S
C
tc
R
tc
V
SS
MR
AR
Page 2
MOTOROLA CMOS LOGIC DATAMC14541B
2
ELECTRICAL CHARACTERISTICS (Voltages Referenced to V
SS
)
V
DD
– 55_C 25_C 125_C
Characteristic
Symbol
DD
Vdc
Min Max Min Typ # Max Min Max
Unit
Output Voltage “0” Level
Vin = VDD or 0
V
OL
5.0 10 15
— — —
0.05
0.05
0.05
— — —
0 0 0
0.05
0.05
0.05
— — —
0.05
0.05
0.05
Vdc
“1” Level
Vin = 0 or V
DD
V
OH
5.0 10 15
4.95
9.95
14.95
— — —
4.95
9.95
14.95
5.0 10 15
— — —
4.95
9.95
14.95
— — —
Vdc
Input Voltage “0” Level
(VO = 4.5 or 0.5 Vdc) (VO = 9.0 or 1.0 Vdc) (VO = 13.5 or 1.5 Vdc)
V
IL
5.0 10 15
— — —
1.5
3.0
4.0
— — —
2.25
4.50
6.75
1.5
3.0
4.0
— — —
1.5
3.0
4.0
Vdc
“1” Level (VO = 0.5 or 4.5 Vdc) (VO = 1.0 or 9.0 Vdc) (VO = 1.5 or 13.5 Vdc)
V
IH
5.0 10 15
3.5
7.0 11
— — —
3.5
7.0 11
2.75
5.50
8.25
— — —
3.5
7.0 11
— — —
Vdc
Output Drive Current
(VOH = 2.5 Vdc) Source (VOH = 9.5 Vdc) (VOH = 13.5 Vdc)
I
OH
5.0 10 15
– 7.96 – 4.19 – 16.3
— — —
– 6.42 – 3.38 – 13.2
– 12.83
– 6.75
– 26.33
— — —
– 4.49 – 2.37 – 9.24
— — —
mAdc
(VOL = 0.4 Vdc) Sink (VOL = 0.5 Vdc) (VOL = 1.5 Vdc)
I
OL
5.0 10 15
1.93
4.96
19.3
— — —
1.56
4.0
15.6
3.12
8.0
31.2
— — —
1.09
2.8
10.9
— — —
mAdc
Input Current I
in
15 ± 0.1 ±0.00001 ± 0.1 ± 1.0 µAdc
Input Capacitance
(Vin = 0)
C
in
5.0 7.5 pF
Quiescent Current
(Pin 5 is High)
Auto Reset Disabled
I
DD
5.0 10 15
— — —
5.0 10 20
— — —
0.005
0.010
0.015
5.0 10 20
— — —
150 300 600
µAdc
Auto Reset Quiescent Current
(Pin 5 is low)
I
DDR
10 15
— —
250 500
— —
30 82
250 500
— —
1500 2000
µAdc
Supply Current**†
(Dynamic plus Quiescent)
I
D
5.0 10 15
ID = (0.4 µA/kHz) f + I
DD
ID = (0.8 µA/kHz) f + I
DD
ID = (1.2 µA/kHz) f + I
DD
µAdc
#Data labelled “Typ” is not to be used for design purposes but is intended as an indication of the IC’s potential performance. **The formulas given are for the typical characteristics only at 25_C. †When using the on chip oscillator the total supply current (in µAdc) becomes: IT = ID + 2 Ctc VDD f x 10–3 where ID is in µA, Ctc is in pF,
VDD in Volts DC, and f in kHz. (see Fig. 3) Dissipation during power–on with automatic reset enabled is typically 50 µA @ VDD = 10 Vdc.
This device contains protection circuitry to guard against damage due to high static voltages or electric fields. However, precautions must be taken to avoid applications of any voltage higher than maximum rated voltages to this high-impedance circuit. For proper operation, Vin and V
out
should be constrained to the range VSS (Vin or V
out
) VDD.
Unused inputs must always be tied to an appropriate logic voltage level (e.g., either VSS or VDD). Unused outputs must be left open.
Page 3
MOTOROLA CMOS LOGIC DATA
3
MC14541B
SWITCHING CHARACTERISTICS* (C
L
= 50 pF, TA = 25_C)
Characteristic
Symbol V
DD
Min Typ # Max Unit
Output Rise and Fall Time
t
TLH
, t
THL
= (1.5 ns/pF) CL + 25 ns
t
TLH
, t
THL
= (0.75 ns/pF) CL + 12.5 ns
t
TLH
, t
THL
= (0.55 ns/pF) CL + 9.5 ns
t
TLH
,
t
THL
5.0 10 15
— — —
100
50 40
200 100
80
ns
Propagation Delay, Clock to Q (28 Output)
t
PLH
, t
PHL
= (1.7 ns/pF) CL + 3415 ns
t
PLH
, t
PHL
= (0.66 ns/pF) CL + 1217 ns
t
PLH
, t
PHL
= (0.5 ns/pF) CL + 875 ns
t
PLH
t
PHL
5.0 10 15
— — —
3.5
1.25
0.9
10.5
3.8
2.9
µs
Propagation Delay, Clock to Q (216 Output)
t
PHL
, t
PLH
= (1.7 ns/pF) CL + 5915 ns
t
PHL
, t
PLH
= (0.66 ns/pF) CL + 3467 ns
t
PHL
, t
PLH
= (0.5 ns/pF) CL + 2475 ns
t
PHL
t
PLH
5.0 10 15
— — —
6.0
3.5
2.5
18 10
7.5
µs
Clock Pulse Width t
WH(cl)
5.0 10 15
900 300 225
300 100
85
— — —
ns
Clock Pulse Frequency (50% Duty Cycle) f
cl
5.0 10 15
— — —
1.5
4.0
6.0
0.75
2.0
3.0
MHz
MR Pulse Width t
WH(R)
5.0 10 15
900 300 225
300 100
85
— — —
ns
Master Reset Removal Time t
rem
5.0 10 15
420 200 200
210 100 100
— — —
ns
*The formulas given are for the typical characteristics only at 25_C. #Data labelled “Typ” is not to be used for design purposes but is intended as an indication of the IC’s potential performance.
Figure 1. Power Dissipation Test Circuit
and Waveform
Figure 2. Switching Time Test Circuit
and Waveforms
PULSE
GENERATOR
V
DD
C
L
Q
R
S
AR Q/Q
SELECT MODE A B MR
V
SS
20 ns 20 ns
90%
50%
10%
50%
DUTY CYCLE
(Rtc AND Ctc OUTPUTS ARE LEFT OPEN)
PULSE
GENERATOR
V
DD
R
S
AR Q/Q
SELECT MODE A B MR
V
SS
C
L
Q
20 ns
90%
50%
20 ns
10%
R
S
Q
t
PLH
50%
90%
50%
10%
50%
t
TLH
t
THL
t
PHL
Page 4
MOTOROLA CMOS LOGIC DATAMC14541B
4
EXPANDED BLOCK DIAGRAM
A 12 B 13
Rtc1 Ctc2
RS3
5
AUTO RESET
OSC
RESET
C
2
8
8–STAGE
COUNTER
RESET
POWER–ON
RESET
6
MASTER RESET
2102132
16
C
8–STAGE
COUNTER
RESET
1 OF 4
MUX
10
MODE
9
Q/Q
SELECT
8 Q
VDD = PIN 14
VSS = PIN 7
FREQUENCY SELECTION TABLE
A B
Number of
Counter Stages
n
Count
2
n
0 0 13 8192 0 1 10 1024 1 0 8 256 1 1 16 65536
TRUTH TABLE
State
Pin
0 1
Auto Reset, 5 Auto Reset Operating Auto Reset Disabled Master Reset, 6 Timer Operational Master Reset On Q/Q, 9 Output Initially Low
After Reset
Output Initially High After Reset
Mode, 10 Single Cycle Mode Recycle Mode
Figure 3. Oscillator Circuit Using RC Configuration
3
R
S
R
TC
C
tc
2 1
TO CLOCK
CIRCUIT
INTERNAL
RESET
Page 5
MOTOROLA CMOS LOGIC DATA
5
MC14541B
TYPICAL RC OSCILLATOR CHARACTERISTICS
Figure 4. RC Oscillator Stability
Figure 5. RC Oscillator Frequency as a
Function of Rtc and C
tc
8.0
4.0
0
–4.0
–8.0
–12
–16
1251007550250–25–55
TA, AMBIENT TEMPERATURE (
°
C)
FREQUENCY DEVIATION (%)
VDD = 15 V
10 V
5.0 V
RS = 0, f = 10.15 kHz @ VDD = 10 V, TA = 25°C RS = 120 kΩ, f = 7.8 kHz @ VDD = 10 V, TA = 25°C
RTC = 56 k
,
C = 1000 pF
100
0.1
0.2
0.5
1.0
2.0
5.0
10
20
50
1.0 k 10 k 100 k 1.0 m
f, OSCILLATOR FREQUENCY (kHz)
RTC, RESISTANCE (OHMS)
0.0001 0.001 0.01 0.1 C, CAPACITANCE (
µ
F)
VDD = 10 V
f AS A FUNCTION
OF R
TC
(C = 1000 pF)
(RS
2RTC)
f AS A FUNCTION
OF C (RTC = 56 kΩ) (RS = 120 k
)
OPERATING CHARACTERISTICS
With Auto Reset pin set to a “0” the counter circuit is initial­ized by t urning on power. Or with p ower already on, the counter circuit is reset when the Master Reset pin is set to a “1”. Both types of reset will result in synchronously resetting all counter stages independent of counter state. Auto Reset pin when set to a “1” provides a low power operation.
The RC oscillator as shown in Figure 3 will oscillate with a frequency determined by the external RC network i.e.,
if (1 kHz v f v 100 kHz)
2.3 RtcC
tc
1
f =
and RS 2 R
tc
where RS 10 k
The time select inputs (A and B) provide a two–bit address to output any one of four counter stages (28, 210, 213 and
216). The 2n counts as shown in the Frequency Selection Table represents the Q output of the Nth stage of the counter . When A is “1”, 216 is selected for both states of B. However,
when B is “0”, normal counting is interrupted a nd the 9th counter stage receives its clock directly from the oscillator (i.e., effectively outputting 28).
The Q/Q
select output control pin provides for a choice of output level. When the counter is in a reset condition and Q/Q
select pin is set to a “0” the Q output is a “0”, corre-
spondingly when Q/Q
select pin is set to a “1” the Q output is
a “1”.
When the mode control pin is set to a “1”, the selected count is continually transmitted to the output. But, with mode pin “0” and after a reset condition the RS flip–flop (see Ex­panded Block Diagram) resets, counting commences, and after 2
n–1
counts the RS flip–flop sets which causes the out-
put to change state. Hence, after another 2
n–1
counts the output will not change. Thus, a Master Reset pulse must be applied or a change in the mode pin level is required to reset the single cycle operation.
DIGITAL TIMER APPLICATION
R
tc
C
tc
NC
R
S
AR MR
INPUT
t
MR
V
DD B A
N.C.
OUTPUT
V
DD
MODE
Q/Q
t + t
MR
1 2 3 4 5 6 7 8
9
10
11
12
13
14
When Master Reset (MR) receives a positive pulse, the in­ternal counters and latch are reset. The Q output goes high and remains high until the selected (via A and B) number of clock pulses are counted, the Q output then goes low and re­mains low until another input pulse is received.
This “one shot” is fully retriggerable and as accurate as the input frequency. An external clock can be used (pin 3 is the clock input, pins 1 and 2 are outputs) if additional accuracy is needed.
Notice that a setup time equal to the desired pulse width output is required immediately following initial power up, dur­ing which time Q output will be high.
Page 6
MOTOROLA CMOS LOGIC DATAMC14541B
6
OUTLINE DIMENSIONS
P SUFFIX
PLASTIC DIP PACKAGE
CASE 648–08
ISSUE R
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS WHEN FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
5. ROUNDED CORNERS OPTIONAL.
–A–
B
F
C
S
H
G
D
J
L
M
16 PL
SEATING
1 8
916
K
PLANE
–T–
M
A
M
0.25 (0.010) T
DIM MIN MAX MIN MAX
MILLIMETERSINCHES
A 0.740 0.770 18.80 19.55 B 0.250 0.270 6.35 6.85 C 0.145 0.175 3.69 4.44 D 0.015 0.021 0.39 0.53 F 0.040 0.70 1.02 1.77 G 0.100 BSC 2.54 BSC H 0.050 BSC 1.27 BSC J 0.008 0.015 0.21 0.38 K 0.110 0.130 2.80 3.30 L 0.295 0.305 7.50 7.74 M 0 10 0 10 S 0.020 0.040 0.51 1.01
____
L SUFFIX
CERAMIC DIP PACKAGE
CASE 620–10
ISSUE V
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN FORMED PARALLEL.
4. DIMENSION F MAY NARROW TO 0.76 (0.030) WHERE THE LEAD ENTERS THE CERAMIC BODY.
–A–
–B–
–T–
F
E
G
N
K
C
SEATING PLANE
16 PLD
S
A
M
0.25 (0.010) T
16 PLJ
S
B
M
0.25 (0.010) T
M
L
DIM MIN MAX MIN MAX
MILLIMETERSINCHES
A 0.750 0.785 19.05 19.93 B 0.240 0.295 6.10 7.49 C ––– 0.200 ––– 5.08 D 0.015 0.020 0.39 0.50 E 0.050 BSC 1.27 BSC F 0.055 0.065 1.40 1.65 G 0.100 BSC 2.54 BSC H 0.008 0.015 0.21 0.38 K 0.125 0.170 3.18 4.31 L 0.300 BSC 7.62 BSC M 0 15 0 15 N 0.020 0.040 0.51 1.01
_ _ _ _
16 9
1 8
Page 7
MOTOROLA CMOS LOGIC DATA
7
MC14541B
OUTLINE DIMENSIONS
D SUFFIX
PLASTIC SOIC PACKAGE
CASE 751B–05
ISSUE J
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION.
1 8
16 9
SEATING
PLANE
F
J
M
R
X 45
_
G
8 PLP
–B–
–A–
M
0.25 (0.010) B
S
–T–
D
K
C
16 PL
S
B
M
0.25 (0.010) A
S
T
DIM MIN MAX MIN MAX
INCHESMILLIMETERS
A 9.80 10.00 0.386 0.393 B 3.80 4.00 0.150 0.157 C 1.35 1.75 0.054 0.068 D 0.35 0.49 0.014 0.019 F 0.40 1.25 0.016 0.049 G 1.27 BSC 0.050 BSC
J 0.19 0.25 0.008 0.009 K 0.10 0.25 0.004 0.009 M 0 7 0 7 P 5.80 6.20 0.229 0.244 R 0.25 0.50 0.010 0.019
_ _ _ _
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MC14541B/D
*MC14541B/D*
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