Datasheet MC145407 Specification

Page 1
MC145407MOTOROLA
1
Advance Information
  
EIA–232–E and CCITT V.28
The MC145407 is a silicon–gate CMOS IC that combines three drivers and three receivers to fulfill the electrical specifications of EIA–232–E and CCITT V.28 while operating from a single + 5 V power supply. A voltage doubler and inverter convert the + 5 V to ± 10 V. This is accomplished through an on–board 20 kHz oscillator and four inexpensive external electrolytic capacitors. The three drivers and three receivers of the MC145407 are virtually identical to those of the MC145406. Therefore, for applications requiring more than three drivers and/or three receivers, an M C145406 can be powered from an MC145407, since the MC145407 charge pumps have been designed to guarantee ± 5 V at the output of up to six drivers. Thus, the MC145407 provides a high–performance, low–power, stand–alone solution or, with the MC145406, a + 5 V only, high–performance two–chip solution.
Drivers
• ± 7.5 V Output Swing
300 Power–Off Impedance
Output Current Limiting
TTL and CMOS Compatible Inputs
Slew Rate Range Limited from 4 V/µs to 30 V/µs
Receivers
+ 25 V Input Range
3 to 7 k Input Impedance
0.8 V Hysteresis for Enhanced Noise Immunity
Charge Pumps
+ 5 V to ± 10 V Dual Charge Pump Architecture
Supply Outputs Capable of Driving Three On–Chip Drivers and Three
Drivers on the MC145406 Simultaneously
Requires Four Inexpensive Electrolytic Capacitors
On–Chip 20 kHz Oscillator
This document contains information on a new product. Specifications and information herein are subject to change without notice.
Order this document
by MC145407/D

SEMICONDUCTOR TECHNICAL DATA

P SUFFIX
PLASTIC DIP
CASE 738
ORDERING INFORMATION
MC145407P Plastic DIP MC145407DW SOG Package
DW SUFFIX
SOG PACKAGE
CASE 751D
20
1
20
1
R
R
D
R
D
D
C2+
GND
C2–
V
SS
Rx1
Tx1
Rx2
Tx2
Rx3
Tx3
C1+
V
CC
C1–
V
DD
DO1
DI1
DO2
DI2
DO3
DI3
20
19
18
17
16
15
14
13
12
11
1
2
3
4
5
6
7
8
9
10
PIN ASSIGNMENT
D = DRIVER
R = RECEIVER
Motorola, Inc. 1995
REV 1 10/95
Page 2
MC145407 MOTOROLA 2
Tx
FUNCTION DIAGRAM
V
DD
V
CC
DI
1.4 V
V
SS
300
LEVEL
SHIFT
DRIVER
*
V
CC
OSC
VOLTAGE
DOUBLER
VOLTAGE
INVERTER
C3
V
DD
C1
C1 – C1 +
C2
C2 + C2 –
V
SS
GND
C4
+
+
+
+
V
CC
DO
1.0 V
1.8 V
V
SS
Rx
V
DD
5.4 k
15 k
V
DD
*Proctection circuit
RECEIVER
CHARGE PUMPS
+ –
+ –
Page 3
MC145407MOTOROLA
3
MAXIMUM RATINGS (Voltage polarities referenced to GND)
Rating
Symbol Value Unit
DC Supply Voltages V
CC
– 0.5 to + 6.0 V
Input Voltage Range
Rx1 – Rx3 Inputs
DI1 – DI3 Inputs
V
IR
VSS – 15 to VDD+ 15
– 0.5 to (VCC+ 0.5)
V
DC Current per Pin I ± 100 mA Power Dissipation P
D
1 W
Operating Temperature Range T
A
– 40 to + 85 °C
Storage Temperature Range T
stg
– 85 to + 150 °C
DC ELECTRICAL CHARACTERISTICS (All polarities referenced to GND = 0 V; C1, C2, C3, C4 = 10 µF; T
A
= – 40 to + 85°C)
Parameter
Symbol Min Typ Max Unit
DC Supply Voltage V
CC
4.5 5 5.5 V
Quiescent Supply Current (Outputs unloaded, inputs low)
I
CC
1.2 3.0 mA
Output Voltage I
load
= 0 mA
I
load
= 5 mA
I
load
= 10 mA
V
DD
8.5
7.5 6
10
9.5 9
11 — —
V
I
load
= 0 mA
I
load
= 5 mA
I
load
= 10 mA
V
SS
– 8.5 – 7.5
– 6
– 10 – 9.2 – 8.6
–11
— —
RECEIVER ELECTRICAL SPECIFICATIONS
(Voltage polarities referenced to GND = 0 V; VCC = + 5 V ± 10%; C1, C2, C3, C4 = 10 µF; TA = – 40 to + 85°C)
Characteristic
Symbol Min Typ Max Unit
Input Turn–on Threshold Rx1 – Rx3
V
DO1 – DO3
= V
OL
V
on
1.35 1.8 2.35 V
Input Turn–off Threshold Rx1 – Rx3
V
DO1 – DO3
= V
OH
V
off
0.75 1.0 1.25 V
Input Threshold Hysteresis (Von – V
off
) Rx1 – Rx3 V
hys
0.6 0.8 V
Input Resistance Rx1 – Rx3 R
in
3.0 5.4 7.0 k
High–Level Output Voltage DO1 – DO3
V
Rx1 – Rx3
= – 3 V to – 25 V IOH = – 20 µA IOH = – 1 mA
V
OH
VCC – 0.1 VCC – 0.7
4.3
— —
V
Low–Level Output Voltage DO1 – DO3
V
Rx1 – Rx3
= + 3 V to + 25 V IOL = + 20 µA IOL = + 1.6 mA
V
OL
— —
0.01
0.5
0.1
0.7
V
This device contains protection circuitry to protect the inputs against damage due to high static voltages or electric fields; however, it is advised that normal precautions be taken to avoid application of any voltage higher than maximum rated voltages to this high imped­ance circuit. For proper operation, it is recom­mended that the voltages at the DI and DO pins be constrained to the range GND VDI ≤ V
CC
and GND VDO VCC. Also, the voltage at the Rx pin should be constrained to (V
SS
– 15 V) V
Rx1 – Rx3
(VDD + 15 V), and Tx
should be constrained to VSS V
Tx1 – Tx3
VDD.
Unused inputs must always be tied to appropriate logic voltage level (e.g., GND or VCC for DI, and GND for Rx).
Page 4
MC145407 MOTOROLA 4
DRIVER ELECTRICAL SPECIFICATIONS
(Voltage polarities referenced to GND = 0 V: VCC = +5 V ±10%; C1, C2, C3, C4 = 10 µF; TA = –40 to +85°C)
Characteristic
Symbol Min Typ Max Unit
Digital Input Voltage DI1 – DI3
Logic 0 Logic 1
V
IL
V
IH
2.0
— —
0.8 —
V
Input Current DI1 – DI3
GND V
DI1 – DI3
V
CC
I
in
± 1.0 µA
Output High Voltage Tx1 – Tx3
V
DI1 – DI3
= Logic 0, RL = 3.0 k Tx1 – Tx6*
V
OH
6 5
7.5
6.5
— —
V
Output Low Voltage Tx1 – Tx3
V
DI1 – DI3
= Logic 1, RL = 3.0 k Tx1 – Tx6*
V
OL
– 6 – 5
– 7.5 – 6.5
— —
V
Off Source Impedance (Figure 1) Tx1 – Tx3 Z
off
300
Output Short–Circuit Current Tx1 – Tx3
VCC = + 5.5 V Tx1 – Tx3 shorted to GND**
Tx1 – Tx3 shorted to ± 15 V***
I
SC
— —
— —
± 60
± 100
mA
*Specifications for an MC145407 powering an MC145406 with three additional drivers/receivers.
**Specification is for one Tx output pin to be shorted at a time. Should all three driver outputs be shorted simultaneously, device power dissipation
limits could be exceeded.
***This condition could exceed package limitations.
SWITCHING CHARACTERISTICS (V
CC
= + 5 V ± 10%; C1, C2, C3, C4 = 10 µF; TA = – 40 to + 85°C; See Figures 2 and 3)
Characteristic
Symbol Min Typ Max Unit
Drivers
Propagation Delay Time Tx1 – Tx3
Low–to–High
RL = 3 k, CL = 50 pF or 2500 pF
t
PLH
0.5 1
µs
High–to–Low
RL = 3 k, CL = 50 pF or 2500 pF
t
PHL
0.5 1
Output Slew Rate Tx1 – Tx3
Minimum Load: RL = 7 k, CL = 0 pF
SR
9.0 ± 30
V/µs
Maximum Load: RL = 3 k, CL = 2500 pF 4.0
Receivers (C
L
= 50 pF)
Propagation Delay Time DO1 – DO3
Low–to–High
t
PLH
1
µs
High–to–Low t
PHL
1
Output Rise Time DO1 – DO3 t
r
250 400 ns
Output Fall Time DO1 – DO3 t
f
40 100 ns
Page 5
MC145407MOTOROLA
5
Vin = ± 2
V
6
8
10
15
13
11
4 2
17 19
VDDV
CC
DI1
DI2
DI3
V
SS
GND
Tx3
Tx2
Tx1
R
out
=
V
in
I
Figure 1. Power–Off Source Resistance
Figure 2. Switching Characteristics
Figure 3. Slew Rate Characterization
DRIVERS
DI1 – DI3
3 V
0 V
V
OH
V
OL
Tx1 – Tx3
t
PLH
t
PHL
50%
t
f
t
r
10%
90%
RECEIVERS
Rx1 – Rx3
DO1 – DO3
+ 3 V
0 V
V
OH
V
OL
t
PLH
t
PHL
t
f
t
r
50%
DRIVERS
Tx1 – Tx3
90%
50%
3 V
– 3 V
3 V
– 3 V
t
SHL
t
SLH
SLEW RATE (SR) =
3 V – (3 V)OR3 V – ( – 3 V)
t
SLH
t
SHL
10%
PIN DESCRIPTIONS
V
CC
Digital Power Supply (Pin 19)
The digital supply pin, which is connected to the logic pow­er supply. This pin should h ave a 0.33 µF capacitor to ground.
GND Ground (Pin 2)
Ground return p in is typically connected to t he signal ground pin of the EIA–232–E connector (Pin 7) as well as to the logic power supply ground.
V
DD
Positive Power Supply (Pin 17)
This is the positive output of the on–chip voltage doubler and the positive power supply input of the driver/receiver sections of the device. This pin requires an external storage capacitor to filter the 50% duty cycle voltage generated by the charge pump.
V
SS
Negative Power Supply (Pin 4)
This is the negative output of the on–chip voltage doubler/ inverter and the negative power supply input of the driver/re­ceiver sections of the device. This pin requires an external storage capacitor to filter the 50% duty cycle voltage gener­ated by the charge pump.
C2+, C2–, C1–, C1+ Voltage Doubler and Inverter (Pins 1, 3, 18, 20)
These are the connections to the internal voltage doubler and inverter, which generate the VDD and VSS voltages.
Rx1, Rx2, Rx3 Receive Data Input (Pins 5, 7, 9)
These are the EIA–232–E receive signal inputs. A voltage between + 3 and + 25 V is decoded as a space and causes the corresponding DO pin to swing to ground (0 V). A voltage between – 3 and – 25 V is decoded as a mark, and causes the DO pin to swing up to VCC.
DO1, DO2, DO3 Data Output (Pins 16, 14, 12)
These are the receiver digital output pins, which swing from VCC to GND. Each output pin is capable of driving one LSTTL input load.
DI1, DI2, DI3 Data Input (Pins 15, 13, 11)
These are the high impedance digital input pins to the driv­ers. Input voltage levels on these pins must be between V
CC
and GND.
Tx1, Tx2, Tx3 Transmit Data Output (Pins 6, 8, 10)
These are the EIA–232–E transmit signal output pins, which swing toward VDD and V
SS.
A logic 1 at a DI input causes the corresponding Tx output to swing toward VSS. A logic 0 causes the output to swing toward VDD. The actual levels and slew rate achieved will depend on the output load­ing (RLø
CL).
Page 6
MC145407 MOTOROLA 6
APPLICATIONS INFORMATION
ESD CONSIDERATIONS
ESD protection on IC devices that have their pins acces­sible to the outside world is essential. High static voltages applied to the pins when someone touches them either di­rectly or indirectly can cause damage to gate oxides and transistor junctions by coupling a portion of the energy from the I/O pin to the power supply busses of the IC. This cou­pling will usually occur through the internal ESD protection diodes. The key to protecting the IC is to shunt as much of the energy to ground as possible before it enters the IC. Fig­ure 7 shows a technique which will clamp the ESD voltage at approximately + 15 V using the MMBZ15VDLT1. Any resid­ual voltage which appears on the supply pins is shunted to ground through the 0.1 µF capacitors.
OPERATION WITH SMALLER VALUE CHARGE PUMP CAPS
The MC145407 is characterized in the e lectrical tables
using 10 µF charge pump caps to illustrate its capability in driving a companion MC145406 or MC145403. If there is no requirement to support a second interface device and/or the charge pump is not being used to power any other com­ponents, t he MC145407 is c apable o f complying w ith EIA–232–E and V.28 with smaller value charge pump caps. Table 1 summarizes driver performance with both 2.2 µF and
1.0 µF charge pump caps.
Table 1. Typical Performance
Parameter 2.2 µF 1.0 µF
Tx VOH @ 25°C 7.3 7.2 Tx VOH @ 85°C 7.2 7.1 Tx VOL @ 25°C – 6.5 – 6.4 Tx VOL @ 85°C – 6.1 – 6.0 Tx Slew Rate @ 25°C 8.0 V/µs 8.0 V/µs Tx Slew Rate @ 85°C 7.0 V/µs 7.0 V/µs
14
600
16
TIP
13
BYPASS
DTMF
INPUT
R
DSI
20 k
C
DSI
RTLA
+ 5 V
20
6
9
8 3
11
5
TLA
DSI
TxA RxA2
1
17 15
V
DD
X
in
X
out CD
TxD RxD
SQT
LB
MODE
CDA
V
SS
CDT
V
AG
FB
ExI
RxA1
R
Tx
18 10 19
4
600:600
C
FB
+
10 k
RING
V
DD
V
DD
BYPASS
V
SS
C
CDT
12
7
2
10 k
10 k
10 k
0.1 µF
0.1
µ
F
0.1
µ
F
0.1
µ
F
0.1
µ
F
0.1
µ
F
10
µ
F
1.0
µ
F
3.579 MHz
C
CDA
3
1
15
16 13
17 19
6
5
8
7
9
8
2
3
7
24
V
SS
GND
DI3
DI2
DO1
DI1
C2 +
C2 –
V
DD
V
CC
C1 –
C1 +
Tx1
Rx1
Tx2
Rx2
Rx3
*Line protection circuit
MC145442
OR
MC145443
MC145407
1.0
µ
F
1.0 µF
1.0
µ
F
+
EIA–232–E
DB–25
CONNECTOR
0.1 µF
0.1 µF
0.1 µF
*
Figure 4. 5 V, 300 Baud Modem with EIA–232–E Interface
Page 7
MC145407MOTOROLA
7
1
V
DD
V
CC
C1+
20
C2+
1
10 µF
MC145407
MC145406
2 3 4
5 6 7 8 9
10
11
12
13
14
15
16
2 3
4 5 6 7 8
11
12
13
14
15
16
9
10
17
18
19
Rx1 Tx1 Rx2
Tx2 Rx3 Tx3 V
SS
DO1
DI1
DO2
DI2
DO3
DI3
GND
GND C2– V
SS Rx1 Tx1 Rx2 Tx2 Rx3
Tx3 DI3
DO3
DI2
DO2
DI1
DO1
V
DD
C1–
V
CC
+ 5 V
10
µ
F
10
µ
F
10
µ
F
Figure 5. MC145406/MC145407 5 V Only Solution for up to Six EIA–232–E Drivers and Receivers
C1+
C1–
V
CC
0.1 µF
1 20 2 19 3 18 4 17 5 16 6 15 7 14 8 13 9 12 10 11
C4
C2
C2+
GND
C2–
V
SS
V
DD
0.1 µF
+10 V
+5 V
Figure 6. Two Supply Configuration (MC145407 Generates VSS Only)
C1+
C1–
DO1 DI1 DO2 DI2 DO3 DI3
V
CC
0.1 µF
1 20 2 19 3 18 4 17 5 16 6 15 7 14 8 13
TO
CONNECTOR
MMBZ15VDLT
×
6
9 12 10 11
C4
C2
C2+
GND
C2–
Rx1 Tx1 Rx2 Tx2 Rx3 Tx3
V
SS
V
DD
0.1 µF
C3
C1
+5 V
Figure 7. ESD Protection Scheme
Page 8
MC145407 MOTOROLA 8
PACKAGE DIMENSIONS
P SUFFIX PLASTIC DIP CASE 738–03
1.070
0.260
0.180
0.022
0.070
0.015
0.140 15
°
0.040
1.010
0.240
0.150
0.015
0.050
0.008
0.110 0
°
0.020
25.66
6.10
3.81
0.39
1.27
0.21
2.80 0
°
0.51
27.17
6.60
4.57
0.55
1.77
0.38
3.55 15
°
1.01
0.050 BSC
0.100 BSC
0.300 BSC
1.27 BSC
2.54 BSC
7.62 BSC
MIN MINMAX MAX
INCHES MILLIMETERS
DIM
A B C D E F G J K L M N
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
-A-
C
K
N
E
G F
D
20 PL
J 20 PL
L
M
-T-
SEATING PLANE
1 10
1120
0.25 (0.010) T A
M M
0.25 (0.010) T B
M M
B
DW SUFFIX
SOG PACKAGE
CASE 751D–04
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.150 (0.006) PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.13 (0.005) TOTAL IN EXCESS OF D DIMENSION AT MAXIMUM MATERIAL CONDITION.
–A–
–B–
20
1
11
10
S
A
M
0.010 (0.25) B
S
T
D20X
M
B
M
0.010 (0.25)
P10X
J
F
G
18X
K
C
–T–
SEATING PLANE
M
R
X 45
_
DIM MIN MAX MIN MAX
INCHESMILLIMETERS
A 12.65 12.95 0.499 0.510 B 7.40 7.60 0.292 0.299 C 2.35 2.65 0.093 0.104 D 0.35 0.49 0.014 0.019 F 0.50 0.90 0.020 0.035 G 1.27 BSC 0.050 BSC J 0.25 0.32 0.010 0.012 K 0.10 0.25 0.004 0.009 M 0 7 0 7 P 10.05 10.55 0.395 0.415 R 0.25 0.75 0.010 0.029
_ _
_ _
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MC145407/D
*MC145407/D*
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