Datasheet MC145408P, MC145403DW, MC145403P, MC145404P, MC145405DW Datasheet (Motorola)

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Page 1
MOTOROLA
SEMICONDUCTOR TECHNICAL DATA
Order this document
by MC145403/D
MC145403
Drivers/Receivers
EIA–232–E and CCITT V.28
These devices are silicon gate CMOS ICs that combine both the transmitter and receiver to fulfill the electrical specifications of EIA Standard 232–E and CCITT V.28. The drivers feature true TTL input compatibility, slew rate limiting outputs, 300 power–off source impedance, and output typically switching to within 25% of the supply rails. The receivers can handle up to ± 25 V while presenting 3 to 7 k impedance. Hysteresis in the receivers aid in the reception of noisy signals. By combining both drivers and receivers in a single CMOS chip, these devices provide efficient, low–power solutions for both EIA–232–E and V.28 applications.
These devices offer the following performance features:
Drivers
•± 5 to ± 12 V Supply Range
300 Power–Off Source Impedance
Output Current Limiting
TTL and CMOS Compatible Inputs
Driver Slew Rate Range Limited to 30 V/µs Maximum
Receivers
•± 25 V Input Range
3 to 7 k Input Impedance
0.8 V of Hysteresis for Enhanced Noise Immunity
TTL and CMOS Compatible Outputs
Available Driver/Receiver Combinations
Device Drivers Receivers Figure No. of Pins
MC145403 3 5 1 20 MC145404 4 4 2 20 MC145405 5 3 3 20 MC145408 5 5 4 24
Alternative EIA–232 devices to consider are:
Three Supply Single Supply
MC145406 (3 x 3) MC145407 (3 x 3)
MC145705 (2 x 3) with Power Down MC145706 (3 x 2) with Power Down MC145707 (3 x 3) with Power Down
MC145404 MC145405 MC145408
PLASTIC DIP
20
1
PLASTIC DIP
24
1
DW SUFFIX
20
1
24
1
20
1
ORDERING INFORMATION
MC145403P Plastic DIP MC145404P Plastic DIP MC145405P Plastic DIP MC145408P Plastic DIP
MC145403DW SOG Package MC145404DW SOG Package MC145405DW SOG Package MC145408DW SOG Package
MC145405SD SSOP
SOG PACKAGE
CASE 751D
DW SUFFIX
SOG PACKAGE
CASE 751E
SD SUFFIX
CASE 940B
P SUFFIX
CASE 738
P SUFFIX
CASE 724
SSOP
REV 2 1/97 TN97010600
Motorola, Inc. 1997
MC145403MC145404MC145405MC145408MOTOROLA
1
Page 2
PIN ASSIGNMENTS
(DIP, SOG, AND SSOP)
MC145403
3 DRIVERS/5 RECEIVERS
V
Rx1
Tx1
Rx2
Rx3
Tx2
Rx4
Rx5
Tx3
V
DD
SS
1
2
3
4
5
6
7
8
9
10
20
V
CC
19
R
R
R
R
R
DO1
18
D
DI1
17
DO2
16
DO3
15
D
DI2
14
DO4
13
DO5
12
D
DI3
11
GND
MC145404
4 DRIVERS/4 RECEIVERS
V
Rx1
Tx1
Rx2
Tx2
Rx3
Tx3
Rx4
Tx4
V
DD
SS
1
2
3
4
5
6
7
8
9
10
20
V
CC
19
R
R
R
R
DO1
18
D
DI1
17
DO2
16
D
DI3
15
DO3
14
D
DI3
13
DO4
12
D
DI4
11
GND
MC145405
5 DRIVERS/3 RECEIVERS
V
Rx1
Tx1
Tx2
Rx2
Tx3
Tx4
Rx3
Tx5
V
DD
SS
1
2
3
4
5
6
7
8
9
10
20
V
CC
19
R
R
R
DO1
18
D
DI1
17
D
DI2
16
DO2
15
D
DI3
14
D
DI4
13
DO3
12
D
DI5
11
GND
MC145408
5 DRIVERS/5 RECEIVERS
V
Rx1
Tx1
Rx2
Tx2
Rx3
Tx3
Rx4
Tx4
Rx5
Tx5
DD
1
2
3
4
5
6
7
8
9
10
11
24
V
CC
23
R
R
R
R
R
DO1
22
D
DI1
21
DO2
20
DI2
D
19
DO3
18
D
DI3
17
DO4
16
D
DI4
15
DO5
14
D
DI5
ESD
PROTECTION
Rx
5.4 k
15 k
FUNCTIONAL DIAGRAM
RECEIVER DRIVER
V
DD
V
V
+ –
SS
CC
1.0 V
1.8 V
DO
Tx
300
CC
13
GND
V
CC
+
+
DI
1.4 V
12
V
SS
V
DD
LEVEL
SHIFT
V
SS
V
MC145403MC145404MC145405MC145408 MOTOROLA 2
Page 3
ABSOLUTE MAXIMUM RATINGS
(Voltages referenced to GND, except where noted)
Rating
DC Supply Voltage (VDD VCC) V
Input Voltage Range
Rx1 – Rx
DI1 – DI DC Current Drain per Pin I ± 00 mA Power Dissipation P Operating Temperature Range T Storage Temperature Range T
Symbol V alue Unit
DD
V
SS
V
CC
V
IR
n n
D A
stg
– 0.5 to + 13.5 + 0.5 to – 13.5
– 0.5 to + 6.0
VSS – 15 to VDD+ 15
0.5 to VCC+ 15
1 W
– 40 to + 85 °C
– 85 to + 150 °C
This device contains circuitry to protect the
V
V
inputs and outputs against damage due to high static voltages or electric fields; however, it is advised that normal precautions be taken to avoid applications of any voltage higher than maximum rated voltages to this high imped­ance circuit.
For proper operation it is recommended that
V
and Vin be constrained to the ranges
out
described as follows:
Digital I/O: Driver Inputs (DI):
(GND VDI VCC).
Receiver Outputs (DO):
(GND VDO VCC).
EIA–232 I/O: Driver Outputs (Tx):
(VSS V
Receiver Inputs (Rx):
VSS – 15 V V
Reliability of operation is enhanced if unused outputs are tied off to an appropriate logic voltage level (e.g., either GND or VCC for DI, and GND for Rx).
Tx1 – Tx
+ 15 V).
VDD).
n
Rx1 – Rx
n
V
DD
DC ELECTRICAL CHARACTERISTICS (All polarities referenced to GND = 0 V , T
Parameter
DC Supply Voltage V
Quiescent Supply Current (Outputs Unloaded, Inputs Low) VDD = + 12 V
VSS = – 12 V
VCC = + 5 V
= – 40 to + 85°C)
A
Symbol Min Typ Max Unit
DD
V
SS
V
CC
I
DD
I
SS
I
CC
4.5
– 4.5
4.5 —
— —
5 to 12
– 5 to – 12
5
425
– 400
110
RECEIVER ELECTRICAL SPECIFICATIONS
(Voltage polarities referenced to GND = 0 V, VDD = + 12 V, VSS = – 12 V, TA = – 40 to + 85°C, VCC = + 5 V, ± 10%)
Characteristic
Input Turn–On Threshold Rx1 – Rx
VDO = V
Input Turn–Off Threshold Rx1 – Rx
VDO = V
Input Threshold Hysteresis
= Von – V
Input Resistance
(VSS – 15 V) V Rx1 – Rx
High Level Output Voltage I
VRx = – 3 to – 25 V* (DO1 – DO
Low Level Output Voltage I
VRx = + 3 to + 25 V* (DO1 – DO
*This is the range of input voltages as specified by EIA–232–E to cause a receiver to be in the high or low.
OL
OH
off
n
(VDD + 15 V)
= – 20 µA
n
)I
n
)I
out
= – 1.0 mA
out
= + 2 mA
out
= + 4 mA
out
Symbol Min Typ Max Unit
n
V
on
n
V
off
V
hys
R
in
V
OH
V
OL
1.35 1.8 2.35 V
0.75 1 1.25 V
0.6 0.8 V
3 5.4 7 k
4.9
3.8 —
4.9
4.3
0.02
0.5
13.2
– 13.2
5.5
635
– 600
200
— —
0.5
0.7
V
µA
V
V
MC145403MC145404MC145405MC145408MOTOROLA
3
Page 4
DRIVER ELECTRICAL SPECIFICATIONS
(Voltage Polarities Referenced to GND = 0 V, VDD = + 12 V, VSS = – 12 V, TA = – 40 to + 85°C, VCC = + 5 V, ± 10%)
Characteristic
Digital Input Voltage DI1 – DI
Logic 0 Logic 1
Input Current DI1 – DI
VDI = GND VDI = V
CC
Output High Voltage Tx1 – Tx
VDI = Logic 0, RL = 3 k
VDD = + 5.0 V, VSS = – 5.0 V VDD = + 6.0 V, VSS = – 6.0 V VDD = + 12.0 V, VSS = – 12.0 V
Output Low Voltage* Tx1 – Tx
VDI = Logic 1, RL = 3 k
VDD = + 5.0 V, VSS = – 5.0 V VDD = + 6.0 V, VSS = – 6.0 V VDD = + 12.0 V, VSS = – 12.0 V
Input Current Tx1 – Tx
(Figure 5)
Output Short Circuit Current Tx1 – Tx
VDD = + 12 V, VSS = – 12 V
Tx Shorted to GND** Tx Shorted to ± 15 V***
*Voltage specifications are in terms of absolute values.
**Specification is for one Tx output pin to be shorted at a time. Should all three driver outputs be shorted simultaneously, device power dissipation
limits will be exceeded.
***This condition could exceed package limitations.
Symbol Min Typ Max Unit
n
V
IL
V
IH
2
— —
n
I
IL
I
IH
n
n
n
n
V
OH
V
OL
Z
off
I
SC
— —
3.5
4.3
9.2
– 4
– 4.5
– 10
300
— —
7
3.9
4.7
9.5
– 4.3 – 5.2
– 10.3
± 22 ± 60
0.8
V
µA
± 1.0
V
— — —
V
— — —
mA
± 60
± 100
SWITCHING CHARACTERISTICS (V
Characteristic Symbol Min Typ Max Unit
= + 5 V, ± 10%, VDD = + 12 V, VSS = – 12 V, TA = – 40 to + 85°C; See Figures 2 and 3)
CC
Drivers
Propagation Delay Time Tx
Low–to–High
RL = 3 k, CL = 50 pF
High–to–Low
RL = 3 k, CL = 50 pF
Output Slew Rate
Minimum Load
RL = 7 k, CL = 0 pF (VDD = 6 to 12 V, VSS = – 6 to – 12 V)
Maximum Load
RL = 3 k, CL = 2500 pF (VDD = 12 V, VSS = – 12 V, VCC = 5 V)
Receivers (C
Propagation Delay Time
Low–to–High
High–to–Low t Output Rise Time t Output Fall Time t
= 50 pF)
L
t
PLH
t
PHL
SR
t
PLH
PHL
ns
500 1000
700 1000
V/µs
± 6 ± 30
4
360 610 — 130 610
r f
250 400 ns — 40 100 ns
ns
MC145403MC145404MC145405MC145408 MOTOROLA 4
Page 5
124
VDDV
CC
22 20 18 16 14
DI1 DI2 DI3 DI4 DI5
V
DD
Tx1 Tx2 Tx3 Tx4 Tx5
GND
1312
3 5 7 9 11
R
out
Vin =
+
±
2 V
V
in
I
Figure 1. Power–Off Source Resistance
Illustrated for MC145408
DRIVERS
DI
Tx
t
PHL
RECEIVERS
Rx
DO
50%
90%
50%
10%
t
PHL
90%
10%
t
PLH
t
r
t
r
t
f
t
PLH
t
f
Figure 2. Switching Characteristics
PIN DESCRIPTIONS
V
CC
Digital Power Supply
The digital supply pin, which is connected to the logic
power supply (+ 5.5 V maximum).
GND Ground
Ground return pin is typically connected to the signal ground pin of the EIA–232–E connector (Pin 7) as well as to the logic power supply ground.
V
DD
Most Positive Device Pin
The most positive power supply pin, which is typically + 5 to + 12 V.
+ 3 V
0 V V
OH
V
OL
+ 3 V
0 V V
OH
V
OL
DRIVERS
SHL
+ 3 V
3 V– 3 V t
SLH
Tx
+ 3 V
t
SHL
Slew Rate =
t
SLH
6 V or t
Figure 3. Slew Rate Characteristics
V
SS
Most Negative Device Pin
The most negative power supply pin, which is typically – 5
to – 12 V.
Rx1 – Rx
n
Receive Data Input Pins
These are the EIA–232–E receive signal inputs. A voltage between + 3 and + 25 V is decoded as a space, and causes the corresponding DO pin to swing to ground (0 V). A voltage between – 3 and – 25 V is decoded as a mark, and causes the corresponding DO pin to swing to VCC.
DO1 – DO
n
Data Output Pins
These are the receiver digital output pins which swing from VCC to GND. Each output pin is capable of driving one LSTTL input load.
MC145403MC145404MC145405MC145408MOTOROLA
5
Page 6
DI1 – DI
n
Data Input Pins
These are the high impedance digital input pins to the driv­ers. Input voltage levels on these pins are LSTTL compatible and must be between VCC and GND. A weak pull–up on each input sets all unused DI pins to VCC, causing the corre­sponding unused driver outputs to be at VSS.
Tx1 – TX
n
Transmit Data Output Pins
These are the EIA–232–E transmit signal output pins, which swing from VDD to VSS. A logic 1 at the DI input causes the corresponding Tx output to swing to VSS. A logic 0 at the DI input causes the corresponding Tx out to swing to VDD. The actual levels and slew rate achieved will depend on the output loading (RLø
CL).
APPLICATION INFORMATION
POWER SUPPLY CONSIDERATIONS
Figure 4 shows a technique to guard against excessive de­vice current.
The diode D1 prevents excessive current from flowing through an internal diode from the VCC pin to the VDD pin when VDD < VCC by approximately 0.6 V or greater. This high current condition can exist for a short period of time during power up/down. Additionally, if the + 12 V supply is switched
off while the + 5 V is on and the off supply is a low impedance to ground, the diode D1 will prevent current flow through the internal diode.
The diode D2 is used as a voltage clamp, to prevent V
SS
from drifting positive to VCC, in the event that power is re­moved from VSS (Pin 12). If VSS power is removed, and the impedance from the VSS pin to ground is greater than approximately 3 k, this pin will be pulled to VCC by internal circuitry causing excessive current in the VCC pin.
If by design, neither of the above conditions are allowed to
exist, then the diodes D1 and D2 are not required.
ESD PROTECTION
ESD protection on IC devices that have their pins accessi­ble to the outside world is essential. High static voltages ap­plied to the pins when someone touches them either directly or indirectly can cause damage to gate oxides and transistor junctions by coupling a portion of the energy from the I/O pin to the power supply buses of the IC. This coupling will usually occur through the internal ESD protection diodes. The key to protecting the IC is to shunt as much of the energy to ground as possible before it enters the IC. Figure 4 shows a tech­nique which will clamp the ESD voltage at approximately ± 15 V using the MMBZ15VDLT1. Any residual voltage which appears on the supply pins is shunted to ground through the capacitors C1 – C3. This scheme has provided protection to the interface part up to ± 10 kV , using the human body model test.
MMBZ15VDLT1 x 10
C3
D1
C1
1N4001
+ 12 V
1N4001
V
DD
Rx1
Tx1
Rx2
Tx2
Rx3
Tx3
Rx4
Tx4
Rx5
Tx5
V
SS
10
12
+ 5 V
V
CC
1
2
3
4 5
6
7
8
9
11
24
23
R
R
R
R
R
DO1
22
DI1
D
21
DO2
20
DI2
D
19
DO3
18
DI3
D
17
DO4
16
DI4
D
15
DO5
14
DI5
D
13
GND
C2
D2
– 12 V
1N5818
Figure 4.
MC145403MC145404MC145405MC145408 MOTOROLA 6
Page 7
P ACKAGE DIMENSIONS
P SUFFIX PLASTIC DIP CASE 738–03
-T-
SEATING PLANE
–T–
SEATING PLANE
-A-
1120
B
110
C
K
E
N
GF
D
20 PL
0.25 (0.010) T A
M M
P SUFFIX PLASTIC DIP CASE 724–03
–A–
24 13
1
–B–
12
C
L
K
E
G
F
D
N
24 PL
0.25 (0.010) T
24 PLJ
0.25 (0.010) T
M
M
A
L
J 20 PL
0.25 (0.010) T B
NOTE 1
M
M
B
M
M M
M
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
INCHES MILLIMETERS
MIN MINMAX MAX
DIM
A B C D E F G J K L M N
NOTES:
1. CHAMFERED CONTOUR OPTIONAL.
2. DIMENSION L TO CENTER OF LEADS WHEN FORMED PARALLEL.
3. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
4. CONTROLLING DIMENSION: INCH.
DIM MIN MAX MIN MAX
A 1.230 1.265 31.25 32.13 B 0.250 0.270 6.35 6.85 C 0.145 0.175 3.69 4.44 D 0.015 0.020 0.38 0.51 E 0.050 BSC 1.27 BSC F 0.040 0.060 1.02 1.52 G 0.100 BSC 2.54 BSC J 0.007 0.012 0.18 0.30 K 0.110 0.140 2.80 3.55 L 0.300 BSC 7.62 BSC M 0 15 0 15 N 0.020 0.040 0.51 1.01
1.070
1.010
0.240
0.150
0.015
0.050 BSC
0.050
0.100 BSC
0.008
0.110
0.300 BSC
°
0
0.020
0.260
0.180
0.022
0.070
0.015
0.140 15°
0.040
MILLIMETERSINCHES
25.66
6.10
3.81
0.39
1.27 BSC
1.27
2.54 BSC
0.21
2.80
7.62 BSC
°
0
0.51
27.17
6.60
4.57
0.55
1.77
0.38
3.55 15
1.01
____
°
MC145403MC145404MC145405MC145408MOTOROLA
7
Page 8
DW SUFFIX
SOG PACKAGE
CASE 751D–04
–A–
20
1
D20X
0.010 (0.25) B
11
S
P10X
0.010 (0.25)
M
M
B
J
–B–
10
S
M
A
T
F
R
X 45
_
C
SEATING
–T–
18X
G
K
PLANE
M
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.150 (0.006) PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.13 (0.005) TOTAL IN EXCESS OF D DIMENSION AT MAXIMUM MATERIAL CONDITION.
DIM MIN MAX MIN MAX
A 12.65 12.95 0.499 0.510 B 7.40 7.60 0.292 0.299 C 2.35 2.65 0.093 0.104 D 0.35 0.49 0.014 0.019 F 0.50 0.90 0.020 0.035 G 1.27 BSC 0.050 BSC J 0.25 0.32 0.010 0.012 K 0.10 0.25 0.004 0.009 M 0 7 0 7
__
P 10.05 10.55 0.395 0.415 R 0.25 0.75 0.010 0.029
INCHESMILLIMETERS
__
–T–
SEATING PLANE
DW SUFFIX
SOG PACKAGE
CASE 751E–04
–A–
1324
–B– P12X
M
0.010 (0.25) B
1
D24X
0.010 (0.25) B
M
T
12
J
S
A
S
M
F
R
C
M
22X
G
K
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.13 (0.005) TOTAL IN EXCESS OF D DIMENSION AT MAXIMUM MATERIAL CONDITION.
DIM MIN MAX MIN MAX
A 15.25 15.54 0.601 0.612 B 7.40 7.60 0.292 0.299 C 2.35 2.65 0.093 0.104
X 45
D 0.35 0.49 0.014 0.019
_
F 0.41 0.90 0.016 0.035
G 1.27 BSC 0.050 BSC
J 0.23 0.32 0.009 0.013 K 0.13 0.29 0.005 0.011 M 0 8 0 8
P 10.05 10.55 0.395 0.415 R 0.25 0.75 0.010 0.029
INCHESMILLIMETERS
____
MC145403MC145404MC145405MC145408 MOTOROLA 8
Page 9
SD SUFFIX
SSOP
CASE 940B–03
0.076 (0.003)
SEATING
–T–
PLANE
L/2
L
PIN 1 IDENT
0.20 (0.008) T
C
D
K16X REF
0.12 (0.005) V
16 9
A
–V–
M
S
U
G
H
M
S
U
T
S
0.25 (0.010)
N
M
B
N
F
81
–U–
J
DETAIL E
K
J1
K1
SECTION N–N
–W–
DETAIL E
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. MOLD FLASH OR GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.15 (0.006) PER SIDE.
5. DIMENSION K DOES NOT INCLUDE DAMBAR PROTRUSION/INTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.13 (0.005) TOTAL IN EXCESS OF K DIMENSION AT MAXIMUM MATERIAL CONDITION. DAMBAR INTRUSION SHALL NOT REDUCE DIMENSION K BY MORE THAN 0.07 (0.002) AT LEAST MATERIAL CONDITION.
6. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY.
7. DIMENSION A AND B ARE TO BE DETERMINED AT DATUM PLANE –W–.
MILLIMETERS
DIMAMIN MAX MIN MAX
6.07 6.33 0.238 0.249
B 5.20 5.38 0.205 0.212 C 1.73 1.99 0.068 0.078 D 0.05 0.21 0.002 0.008 F 0.63 0.95 0.024 0.037 G 0.65 BSC 0.026 BSC H 0.73 0.90 0.028 0.035 J 0.09 0.20 0.003 0.008
J1 0.09 0.16 0.003 0.006
K 0.25 0.38 0.010 0.015
K1 0.25 0.33 0.010 0.013
L 7.65 7.90 0.301 0.311
M 0 8 0 8
____
INCHES
Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty , representation or guarantee regarding the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. “T ypical” parameters which may be provided in Motorola data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. Motorola does not convey any license under its patent rights nor the rights of others. Motorola products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the Motorola product could create a situation where personal injury or death may occur. Should Buyer purchase or use Motorola products for any such unintended or unauthorized application, Buyer shall indemnify and hold Motorola and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that Motorola was negligent regarding the design or manufacture of the part. Motorola and are registered trademarks of Motorola, Inc. Motorola, Inc. is an Equal Opportunity/Affirmative Action Employer.
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