These devices are silicon gate CMOS ICs that combine both the transmitter
and receiver to fulfill the electrical specifications of EIA Standard 232–E and
CCITT V.28. The drivers feature true TTL input compatibility, slew rate limiting
outputs, 300 Ω power–off source impedance, and output typically switching to
within 25% of the supply rails. The receivers can handle up to ± 25 V while
presenting 3 to 7 kΩ impedance. Hysteresis in the receivers aid in the reception
of noisy signals. By combining both drivers and receivers in a single CMOS
chip, these devices provide efficient, low–power solutions for both EIA–232–E
and V.28 applications.
These devices offer the following performance features:
Drivers
•± 5 to ± 12 V Supply Range
• 300 Ω Power–Off Source Impedance
• Output Current Limiting
• TTL and CMOS Compatible Inputs
• Driver Slew Rate Range Limited to 30 V/µs Maximum
DI1 – DI
DC Current Drain per PinI± 00mA
Power DissipationP
Operating Temperature RangeT
Storage Temperature RangeT
SymbolV alueUnit
DD
V
SS
V
CC
V
IR
n
n
D
A
stg
– 0.5 to + 13.5
+ 0.5 to – 13.5
– 0.5 to + 6.0
VSS – 15 to VDD+ 15
0.5 to VCC+ 15
1W
– 40 to + 85°C
– 85 to + 150°C
This device contains circuitry to protect the
V
V
inputs and outputs against damage due to high
static voltages or electric fields; however, it is
advised that normal precautions be taken to
avoid applications of any voltage higher than
maximum rated voltages to this high impedance circuit.
For proper operation it is recommended that
V
and Vin be constrained to the ranges
out
described as follows:
Digital I/O: Driver Inputs (DI):
(GND ≤ VDI ≤ VCC).
Receiver Outputs (DO):
(GND ≤ VDO ≤ VCC).
EIA–232 I/O: Driver Outputs (Tx):
(VSS ≤ V
Receiver Inputs (Rx):
VSS – 15 V ≤ V
Reliability of operation is enhanced if unused
outputs are tied off to an appropriate logic
voltage level (e.g., either GND or VCC for DI,
and GND for Rx).
Tx1 – Tx
+ 15 V).
≤ VDD).
n
Rx1 – Rx
n
≤ V
DD
DC ELECTRICAL CHARACTERISTICS (All polarities referenced to GND = 0 V , T
Parameter
DC Supply VoltageV
Quiescent Supply Current (Outputs Unloaded, Inputs Low)VDD = + 12 V
The digital supply pin, which is connected to the logic
power supply (+ 5.5 V maximum).
GND
Ground
Ground return pin is typically connected to the signal
ground pin of the EIA–232–E connector (Pin 7) as well as to
the logic power supply ground.
V
DD
Most Positive Device Pin
The most positive power supply pin, which is typically + 5
to + 12 V.
+ 3 V
0 V
V
OH
V
OL
+ 3 V
0 V
V
OH
V
OL
DRIVERS
SHL
+ 3 V
–
3 V– 3 V
t
SLH
Tx
+ 3 V
t
SHL
Slew Rate =
t
SLH
6 V
or t
Figure 3. Slew Rate Characteristics
V
SS
Most Negative Device Pin
The most negative power supply pin, which is typically – 5
to – 12 V.
Rx1 – Rx
n
Receive Data Input Pins
These are the EIA–232–E receive signal inputs. A voltage
between + 3 and + 25 V is decoded as a space, and causes
the corresponding DO pin to swing to ground (0 V). A voltage
between – 3 and – 25 V is decoded as a mark, and causes
the corresponding DO pin to swing to VCC.
DO1 – DO
n
Data Output Pins
These are the receiver digital output pins which swing from
VCC to GND. Each output pin is capable of driving one
LSTTL input load.
MC145403•MC145404•MC145405•MC145408MOTOROLA
5
Page 6
DI1 – DI
n
Data Input Pins
These are the high impedance digital input pins to the drivers. Input voltage levels on these pins are LSTTL compatible
and must be between VCC and GND. A weak pull–up on
each input sets all unused DI pins to VCC, causing the corresponding unused driver outputs to be at VSS.
Tx1 – TX
n
Transmit Data Output Pins
These are the EIA–232–E transmit signal output pins,
which swing from VDD to VSS. A logic 1 at the DI input causes
the corresponding Tx output to swing to VSS. A logic 0 at the
DI input causes the corresponding Tx out to swing to VDD.
The actual levels and slew rate achieved will depend on the
output loading (RLø
CL).
APPLICATION INFORMATION
POWER SUPPLY CONSIDERATIONS
Figure 4 shows a technique to guard against excessive device current.
The diode D1 prevents excessive current from flowing
through an internal diode from the VCC pin to the VDD pin
when VDD < VCC by approximately 0.6 V or greater. This high
current condition can exist for a short period of time during
power up/down. Additionally, if the + 12 V supply is switched
off while the + 5 V is on and the off supply is a low impedance
to ground, the diode D1 will prevent current flow through the
internal diode.
The diode D2 is used as a voltage clamp, to prevent V
SS
from drifting positive to VCC, in the event that power is removed from VSS (Pin 12). If VSS power is removed, and the
impedance from the VSS pin to ground is greater than
approximately 3 kΩ, this pin will be pulled to VCC by internal
circuitry causing excessive current in the VCC pin.
If by design, neither of the above conditions are allowed to
exist, then the diodes D1 and D2 are not required.
ESD PROTECTION
ESD protection on IC devices that have their pins accessible to the outside world is essential. High static voltages applied to the pins when someone touches them either directly
or indirectly can cause damage to gate oxides and transistor
junctions by coupling a portion of the energy from the I/O pin
to the power supply buses of the IC. This coupling will usually
occur through the internal ESD protection diodes. The key to
protecting the IC is to shunt as much of the energy to ground
as possible before it enters the IC. Figure 4 shows a technique which will clamp the ESD voltage at approximately
± 15 V using the MMBZ15VDLT1. Any residual voltage which
appears on the supply pins is shunted to ground through the
capacitors C1 – C3. This scheme has provided protection to
the interface part up to ± 10 kV , using the human body model
test.
MMBZ15VDLT1 x 10
C3
D1
C1
1N4001
+ 12 V
1N4001
V
DD
Rx1
Tx1
Rx2
Tx2
Rx3
Tx3
Rx4
Tx4
Rx5
Tx5
V
SS
10
12
+ 5 V
V
CC
1
2
3
4
5
6
7
8
9
11
24
23
R
R
R
R
R
DO1
22
DI1
D
21
DO2
20
DI2
D
19
DO3
18
DI3
D
17
DO4
16
DI4
D
15
DO5
14
DI5
D
13
GND
C2
D2
– 12 V
1N5818
Figure 4.
MC145403•MC145404•MC145405•MC145408MOTOROLA
6
Page 7
P ACKAGE DIMENSIONS
P SUFFIX
PLASTIC DIP
CASE 738–03
-T-
SEATING
PLANE
–T–
SEATING
PLANE
-A-
1120
B
110
C
K
E
N
GF
D
20 PL
0.25 (0.010)T A
MM
P SUFFIX
PLASTIC DIP
CASE 724–03
–A–
2413
1
–B–
12
C
L
K
E
G
F
D
N
24 PL
0.25 (0.010)T
24 PLJ
0.25 (0.010)T
M
M
A
L
J 20 PL
0.25 (0.010)T B
NOTE 1
M
M
B
M
MM
M
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE MOLD
FLASH.
INCHESMILLIMETERS
MINMINMAXMAX
DIM
A
B
C
D
E
F
G
J
K
L
M
N
NOTES:
1. CHAMFERED CONTOUR OPTIONAL.
2. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
3. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.150
(0.006) PER SIDE.
5. DIMENSION D DOES NOT INCLUDE
DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.13
(0.005) TOTAL IN EXCESS OF D DIMENSION
AT MAXIMUM MATERIAL CONDITION.
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.13 (0.005) TOTAL IN
EXCESS OF D DIMENSION AT MAXIMUM
MATERIAL CONDITION.
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD FLASH,
PROTRUSIONS OR GATE BURRS. MOLD FLASH
OR GATE BURRS SHALL NOT EXCEED 0.15
(0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE INTERLEAD
FLASH OR PROTRUSION. INTERLEAD FLASH OR
PROTRUSION SHALL NOT EXCEED 0.15 (0.006)
PER SIDE.
5. DIMENSION K DOES NOT INCLUDE DAMBAR
PROTRUSION/INTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.13 (0.005) TOTAL IN
EXCESS OF K DIMENSION AT MAXIMUM
MATERIAL CONDITION. DAMBAR INTRUSION
SHALL NOT REDUCE DIMENSION K BY MORE
THAN 0.07 (0.002) AT LEAST MATERIAL
CONDITION.
6. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
7. DIMENSION A AND B ARE TO BE DETERMINED
AT DATUM PLANE –W–.
Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty , representation or guarantee regarding
the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and
specifically disclaims any and all liability, including without limitation consequential or incidental damages. “T ypical” parameters which may be provided in Motorola
data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals”
must be validated for each customer application by customer’s technical experts. Motorola does not convey any license under its patent rights nor the rights of
others. Motorola products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other
applications intended to support or sustain life, or for any other application in which the failure of the Motorola product could create a situation where personal injury
or death may occur. Should Buyer purchase or use Motorola products for any such unintended or unauthorized application, Buyer shall indemnify and hold Motorola
and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees
arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that
Motorola was negligent regarding the design or manufacture of the part. Motorola and are registered trademarks of Motorola, Inc. Motorola, Inc. is an Equal
Opportunity/Affirmative Action Employer.
Mfax is a trademark of Motorola, Inc.
How to reach us:
USA/EUROPE/ Locations Not Listed: Motorola Literature Distribution;JAP AN: Nippon Motorola Ltd.; Tatsumi–SPD–JLDC, 6F Seibu–Butsuryu–Center,
P.O. Box 5405, Denver, Colorado 80217. 303–675–2140 or 1–800–441–24473–14–2 Tatsumi Koto–Ku, To kyo 135, Japan. 81–3–3521–8315
Mfax: RMFAX0@email.sps.mot.com – TOUCHTONE 602–244–6609ASIA/PACIFIC: Motorola Semiconductors H.K. Ltd.; 8B Tai Ping Industrial Park,
INTERNET: http://Design–NET.com51 Ting Kok Road, Tai Po, N.T., Hong Kong. 852–26629298
◊
MC145403•MC145404•MC145405•MC145408MOTOROLA
MC145403/D
9
Loading...
+ hidden pages
You need points to download manuals.
1 point = 1 manual.
You can buy points or you can get point for every manual you upload.