Datasheet MC14538BCP, MC14538BDW, MC14538BCL Datasheet (Motorola)

Page 1
MOTOROLA CMOS LOGIC DATA
1
MC14538B
    
The MC14538B is a dual, retriggerable, resettable monostable multivibra­tor. It may be triggered from either edge of an input pulse, and produces an accurate output pulse over a wide range of widths, the duration and accuracy of which are determined by the external timing components, CX and RX.
Unlimited Rise and Fall Time Allowed on the A Trigger Input
Pulse Width Range = 10 µs to 10 s
Latched Trigger Inputs
Separate Latched Reset Inputs
3.0 Vdc to 18 Vdc Operational Limits
Triggerable from Positive (A Input) or Negative–Going Edge (B–Input)
Capable of Driving Two Low–power TTL Loads or One Low–power
Schottky TTL Load Over the Rated Temperature Range
Pin–for–pin Compatible with MC14528B and CD4528B (CD4098)
Use the MC54/74HC4538A for Pulse Widths Less Than 10 µs with
Supplies Up to 6 V.
MAXIMUM RATINGS* (Voltages Referenced to V
SS
)
Symbol
Parameter
Value
Unit
V
DD
DC Supply Voltage
– 0.5 to + 18.0
V
Vin, V
out
Input or Output Voltage (DC or Transient)
– 0.5 to VDD + 0.5
V
Iin, I
out
Input or Output Current (DC or Transient), per Pin
± 10
mA
P
D
Power Dissipation, per Package†
500
mW
T
stg
Storage Temperature
– 65 to + 150
_
C
T
L
Lead Temperature (8–Second Soldering)
260
_
C
*Maximum Ratings are those values beyond which damage to the device may occur. †Temperature Derating:
Plastic “P and D/DW” Packages: – 7.0 mW/_C From 65_C To 125_C Ceramic “L” Packages: – 12 mW/_C From 100_C To 125_C
ONE–SHOT SELECTION GUIDE
100 ns
MC14528B MC14536B MC14538B
MC14541B MC4538A*
1 µs 10 µs 100 µs 1 ms 10 ms 100 ms 1 s 10 s
*LIMITED OPERATING VOLTAGE (2 – 6 V)
TOTAL OUTPUT PULSE WIDTH RANGE
RECOMMENDED PULSE WIDTH RANGE
23 HR
5 MIN.

SEMICONDUCTOR TECHNICAL DATA
Motorola, Inc. 1995
REV 3 1/94

L SUFFIX
CERAMIC CASE 620
ORDERING INFORMATION
MC14XXXBCP Plastic MC14XXXBCL Ceramic *MC14XXXBDW SOIC
TA = – 55° to 125°C for all packages.
P SUFFIX
PLASTIC
CASE 648
DW SUFFIX
SOIC
CASE 751G
BLOCK DIAGRAM
*Consult factory for possible “D” suffix SOIC
Case 751B.
V
DD
V
DD
6 7
10 9
12
11
5
4
A
B
C
X
R
X
1 2
Q1 Q1
RESET
3
C
X
R
X
15 14
Q2 Q2
RESET
13
A
B
RX AND CX ARE EXTERNAL COMPONENTS.
VDD = PIN 16 VSS = PIN 8, PIN 1, PIN 15
Page 2
MOTOROLA CMOS LOGIC DATAMC14538B
2
ELECTRICAL CHARACTERISTICS (Voltages Referenced to V
SS
)
V
DD
– 55_C 25_C 125_C
Characteristic
Symbol
DD
Vdc
Min Max Min Typ # Max Min Max
Unit
Output Voltage “0” Level
Vin = VDD or 0
V
OL
5.0 10 15
— — —
0.05
0.05
0.05
— — —
0 0 0
0.05
0.05
0.05
— — —
0.05
0.05
0.05
Vdc
“1” Level
Vin = 0 or V
DD
V
OH
5.0 10 15
4.95
9.95
14.95
— — —
4.95
9.95
14.95
5.0 10 15
— — —
4.95
9.95
14.95
— — —
Vdc
Input Voltage “0” Level
(VO = 4.5 or 0.5 Vdc) (VO = 9.0 or 1.0 Vdc) (VO = 13.5 or 1.5 Vdc)
V
IL
5.0 10 15
— — —
1.5
3.0
4.0
— — —
2.25
4.50
6.75
1.5
3.0
4.0
— — —
1.5
3.0
4.0
Vdc
“1” Level (VO = 0.5 or 4.5 Vdc) (VO = 1.0 or 9.0 Vdc) (VO = 1.5 or 13.5 Vdc)
V
IH
5.0 10 15
3.5
7.0 11
— — —
3.5
7.0 11
2.75
5.50
8.25
— — —
3.5
7.0 11
— — —
Vdc
Output Drive Current
(VOH = 2.5 Vdc) Source (VOH = 4.6 Vdc) (VOH = 9.5 Vdc) (VOH = 13.5 Vdc)
I
OH
5.0
5.0 10 15
– 3.0
– 0.64
– 1.6 – 4.2
— — — —
– 2.4
– 0.51
– 1.3 – 3.4
– 4.2 – 0.88 – 2.25
– 8.8
— — — —
– 1.7
– 0.36
– 0.9 – 2.4
— — — —
mAdc
(VOL = 0.4 Vdc) Sink (VOL = 0.5 Vdc) (VOL = 1.5 Vdc)
I
OL
5.0 10 15
0.64
1.6
4.2
— — —
0.51
1.3
3.4
0.88
2.25
8.8
— — —
0.36
0.9
2.4
— — —
mAdc
Input Current, Pin 2 or 14 I
in
15 ±0.05 ±0.00001 ±0.05 ±0.5 µAdc
Input Current, Other Inputs I
in
15 ±0.1 ±0.00001 ±0.1 ±1.0 µAdc
Input Capacitance, Pin 2 or 14 C
in
25 pF
Input Capacitance, Other Inputs
(Vin = 0)
C
in
5.0 7.5 pF
Quiescent Current
(Per Package) Q = Low, Q = High
I
DD
5.0 10 15
— — —
5.0 10 20
— — —
0.005
0.010
0.015
5.0 10 20
— — —
150 300 600
µAdc
Quiescent Current, Active State
(Both) (Per Package) Q = High, Q = Low
I
DD
5.0 10 15
— — —
2.0
2.0
2.0
— — —
0.04
0.08
0.13
0.20
0.45
0.70
— — —
2.0
2.0
2.0
mAdc
**Total Supply Current at an external load capacitance (CL) and at external timing network (RX, CX)
I
T
5.0 10
IT = (3.5 x 10–2) RXCXf + 4CXf + 1 x 10–5 CLf IT = (8.0 x 10–2) RXCXf + 9CXf + 2 x 10–5 CLf IT = (1.25 x 10–1) RXCXf + 12CXf + 3 x 10–5 CLf
where: IT in µA (one monostable switching only),
where: CX in µF, CL in pF, RX in k ohms, and where: f in Hz is the input frequency.
µAdc
#Data labelled “Typ” is not to be used for design purposes but is intended as an indication of the IC’s potential performance. **The formulas given are for the typical characteristics only at 25_C.
This device contains protection circuitry to guard against damage due to high static voltages or electric fields. However, precautions must be taken to avoid applications of any voltage higher than maximum rated voltages to this high-impedance circuit. For proper operation, Vin and V
out
should be constrained to the range VSS (Vin or V
out
) VDD.
Unused inputs must always be tied to an appropriate logic voltage level (e.g., either VSS or VDD). Unused outputs must be left open.
Page 3
MOTOROLA CMOS LOGIC DATA
3
MC14538B
SWITCHING CHARACTERISTICS* (C
L
= 50 pF, TA = 25_C)
V
All Types
Characteristic
Symbol
V
DD
Vdc
Min Typ # Max
Unit
Output Rise Time
t
TLH
= (1.35 ns/pF) CL + 33 ns
t
TLH
= (0.60 ns/pF) CL + 20 ns
t
TLH
= (0.40 ns/pF) CL + 20 ns
t
TLH
5.0 10 15
— — —
100
50 40
200 100
80
ns
Output Fall Time
t
THL
= (1.35 ns/pF) CL + 33 ns
t
THL
= (0.60 ns/pF) CL + 20 ns
t
THL
= (0.40 ns/pF) CL + 20 ns
t
THL
5.0 10 15
— — —
100
50 40
200 100
80
ns
Propagation Delay Time
A or B to Q or Q
t
PLH
, t
PHL
= (0.90 ns/pF) CL + 255 ns
t
PLH
, t
PHL
= (0.36 ns/pF) CL + 132 ns
t
PLH
, t
PHL
= (0.26 ns/pF) CL + 87 ns
5.0 10 15
— — —
300 150 100
600 300 220
ns
Reset to Q or Q
t
PLH
, t
PHL
= (0.90 ns/pF) CL + 205 ns
t
PLH
, t
PHL
= (0.36 ns/pF) CL + 107 ns
t
PLH
, t
PHL
= (0.26 ns/pF) CL + 82 ns
5.0 10 15
— — —
250 125
95
500 250 190
ns
Input Rise and Fall Times
Reset
5 10 15
— — —
— — —
15
5 4
µs
B Input 5
10 15
— — —
300
1.2
0.4
1.0
0.1
0.05
ms
A Input 5
10 15
No Limit
Input Pulse Width
A, B, or Reset
tWH,
t
WL
5.0 10 15
170
90 80
85 45 40
— — —
ns
Retrigger Time t
rr
5.0 10 15
0 0 0
— — —
— — —
ns
Output Pulse Width — Q or Q Refer to Figures 8 and 9
CX = 0.002 µF, RX = 100 k
5.0 10 15
198 200 202
210 212 214
230 232 234
µs
CX = 0.1 µF, RX = 100 k 5.0
10 15
9.3
9.4
9.5
9.86 10
10.14
10.5
10.6
10.7
ms
CX = 10 µF, RX = 100 k 5.0
10 15
0.91
0.92
0.93
0.965
0.98
0.99
1.03
1.04
1.06
s
Pulse Width Match between circuits in
the same package. CX = 0.1 µF, RX = 100 k
100
[(T1 – T2)/T1]
5.0 10 15
— — —
± 1.0 ± 1.0 ± 1.0
± 5.0 ± 5.0 ± 5.0
%
*The formulas given are for the typical characteristics only at 25_C. #Data labelled “Typ” is not to be used for design purposes but is intended as an indication of the IC’s potential performance.
OPERATING CONDITIONS
External Timing Resistance R
X
5.0 k
External Timing Capacitance C
X
0 No
Limit†
µF
*The maximum usable resistance RX is a function of the leakage of the capacitor CX, leakage of the MC14538B, and leakage due to board layout
and surface resistance. Susceptibility to externally induced noise signals may occur for RX > 1 M..
†If CX > 15 µF, use discharge protection diode per Fig. 11.
t
,
PLH
t
PHL
tr, t
f
T
Page 4
MOTOROLA CMOS LOGIC DATAMC14538B
4
Figure 1. Logic Diagram
(1/2 of DevIce Shown)
NOTE: Pins 1, 8 and 15 must
be externally grounded
+
+
V
DD
V
DD
P1
R
X
C
X
21(14)
(15)
4 (12) 5 (11)
3 (13)
A B
RESET
V
SS
N1
V
ref1
C1 C2
ENABLE
V
ref2
ENABLE
CONTROL
S
RESET LATCH
Q
R
Q
R RS
RSQ
Q
6 (10)
7 (9)
OUTPUT
LATCH
Figure 2. Power Dissipation Test Circuit and Waveforms
500 pF
V
DD
0.1
µ
F
CERAMIC
R
X
RX′
CX′
V
SS
C
X
V
SS
V
in
CX/R
X
A B RESET A
B
RESET
Q Q
Q
Q
V
SS
C
L
C
L
C
L
C
L
20 ns 20 ns
V
DD
0 V
90%
10%
V
in
I
D
INPUT CONNECTIONS
Characteristics Reset A B
t
PLH
, t
PHL
, t
TLH
, t
THL
,
T, tWH, t
WL
V
DD
PG1 V
DD
t
PLH
, t
PHL
, t
TLH
, t
THL
,
T, tWH, t
WL
V
DD
V
SS
PG2
t
PLH(R)
, t
PHL(R)
,
tWH, t
WL
PG3 PG1 PG2
Figure 3. Switching Test Circuit
*Includes capacitance of probes,
wiring, and fixture parasitic.
NOTE: Switching test waveforms
for PG1, PG2, PG3 are shown In Figure 4.
V
DD
R
X
R
X
V
SS
C
X
CX/R
X
A
B RESET A
B
RESET
Q Q
Q
Q
C
L
C
X
C
L
C
L
C
L
V
SS
PULSE
GENERATOR
PULSE
GENERATOR
PULSE
GENERATOR
V
SS
*CL = 50 pF
PG1 =
PG2 =
PG3 =
Page 5
MOTOROLA CMOS LOGIC DATA
5
MC14538B
Figure 4. Switching Test Waveforms
RESET
A
B
t
PLH
Q
Q
50%
t
WH
90%
10%
t
TLH
t
THL
t
WL
t
THL
t
PHL
t
THL
90%
10%
50%
T
50% 50% 50%
90%
10%
t
PLH
t
THL
t
TLH
t
PHL
t
WL
50%
90%
10%
t
PHL
t
PHL
t
TLH
t
THL
t
PLH
50% 50%
90%
10%
50%
50%
50%
t
rr
50% V
DD
V
DD
V
DD
t
TLH
Figure 5. Typical Normalized Distribution
of Units for Output Pulse Width
Figure 6. Typical Pulse Width Variation as
a Function of Supply Voltage V
DD
0
0.2
0.4
0.6
0.8
1.0
–4 –2 0 2 4
T, OUTPUT PULSE WIDTH (%)
RELATIVE FREQUENCY OF OCCURRENCE
2 1 0 1 2
15141312111098765
VDD, SUPPLY VOLTAGE (VOLTS)
NORMALIZED PULSE WIDTH CHANGE
WITH RESPECT TO VALUE AT V
DD
= 10 V (%)
TA = 25°C RX = 100 k
CX = 0.1 µF
0% POINT PULSE WIDTH VDD = 5.0 V, T = 9.8 ms VDD = 10 V, T = 10 ms VDD = 15 V, T = 10.2 ms
RX = 100 k
CX = 0.1 µF
Figure 7. Typical Total Supply Current
versus Output Duty Cycle
TOTAL SUPPLY CURRENT ( A)
µ
1000
100
10
1.0
0.1
0.001 0.1 1.0 10 100 OUTPUT DUTY CYCLE (%)
RX = 100 kΩ, CL = 50 pF ONE MONOSTABLE SWITCHING ONLY
VDD = 15 V
10 V
5.0 V
FUNCTION TABLE
Inputs Outputs
Reset A B Q Q
H H H L
H L Not Triggered H H Not Triggered
H L, H, H Not Triggered H L L, H, Not Triggered
L X X L H
X X Not Triggered
Page 6
MOTOROLA CMOS LOGIC DATAMC14538B
6
Figure 8. Typical Error of Pulse Width
Equation versus Temperature
Figure 9. Typical Error of Pulse Width
Equation versus Temperature
–2
–1
0
1
2
–60 –40 –20 0 20 40 60 80 100 120 140
TA, AMBIENT TEMPERATURE (
°
C)
TYPICAL NORMALIZED ERROR
WITH RESPECT TO 25
DD
= 10 V (%)
°
C VALUE AT V
RX = 100 k
CX = 0.1 µF
VDD = 15 V
VDD = 10 V
VDD = 5 V
–2.0
–1.0
0
1.0
2.0
3.0
–3.0
–60 –40 –20 0 20 40 60 80 100 120 140
TA, AMBIENT TEMPERATURE (
°
C)
RX = 100 k
CX = .002 µF
VDD = 15 V
VDD = 10 V
VDD = 5.0 V
TYPICAL NORMALIZED ERROR
WITH RESPECT TO 25
DD
= 10 V (%)
°
C VALUE AT V
THEORY OF OPERATION
2
Figure 10. Timing Operation
Positive edge re–trigger (pulse lengthening)Positive edge trigger
1
2
3 4
5
1
3
4
5
RESET
A
B
CX/R
X
Q
V
ref 1
V
ref 1
V
ref 1
V
ref 1
V
ref 2
V
ref 2
V
ref 2
V
ref 2
T T
T
Negative edge trigger Positive edge trigger
Positive edge re–trigger (pulse lengthening)
TRIGGER OPERATION
The block diagram of the MC14538B is shown in Figure 1,
with circuit operation following.
As shown i n Figure 1 and 1 0, before an input t rigger occurs, the monostable is in the quiescent state with the Q output low, and the timing capacitor CX completely charged to VDD. When the trigger input A goes from VSS to V
DD
(while inputs B and Reset
are held to VDD) a valid trigger is recognized, which turns on comparator C1 and N–channel transistor N1 ➀. At the same time the output latch is set. With transistor N1 on, the capacitor CX rapidly discharges toward VSS until V
ref1
is reached. A t this p oint the o utput of comparator C1 changes state and transistor N1 turns off. Comparator C1 t hen t urns o ff while a t the same time
comparator C2 turns on. With transistor N1 off, the capacitor CX begins to charge through the timing resistor, RX, toward VDD. When the voltage across CX equals V
ref 2
, comparator C2 changes state, causing the output latch to reset (Q goes low) while at the same time disabling comparator C2 . This ends at the timing cycle with the monostable in the quiescent state, waiting for the next trigger.
In the quiescent state, CX is fully charged to VDD causing the current through resistor RX to be zero. Both comparators are “off” with total device current due only to reverse junction leakages. An added feature of the MC14538B is that the out­put latch is set via the input trigger without regard to the capacitor voltage. Thus, propagation delay from trigger to Q is independent of the value of CX, RX, or the duty cycle of the input waveform.
Page 7
MOTOROLA CMOS LOGIC DATA
7
MC14538B
RETRIGGER OPERATION
The MC14538B is retriggered if a valid trigger occurs fol­lowed by another valid trigger before the Q output has returned to the quiescent (zero) state. Any retrigger, after the timing node voltage at pin 2 or 14 has begun to rise from V
ref 1
, but has not yet reached V
ref 2
, will cause an increase in output pulse width T. When a valid retrigger is initiated , the voltage at CX/RX will a gain drop t o V
ref 1
before progressing along the RC charging curve toward VDD. The Q output will remain high until time T, after the last valid retrig­ger.
RESET OPERATION
The MC14538B may be reset during the generation of the output pulse. In the reset mode of operation, an input pulse on Reset
sets the reset latch and causes the capacitor to be fast charged to VDD by turning on transistor P1 . When the voltage on the capacitor reaches V
ref 2
, the reset latch will clear, and will then be ready to accept another pulse. It the Reset
input is held low, any trigger inputs that occur will be
inhibited and the Q and Q
outputs of the output latch will not
change. Since the Q output is reset when an input low level is detected on the Reset
input, the output pulse T can be made significantly shorter than the minimum pulse width specifi­cation.
POWER–DOWN CONSIDERATIONS
Large capacitance values can cause problems due to the large amount of energy stored. When a system containing the MC14538B is powered down, the capacitor voltage may discharge from VDD through the standard protection diodes at pin 2 or 14. Current through the protection diodes should be limited to 10 mA and therefore the discharge time of the VDD supply must not be faster than (VDD). (C)/(10 mA). For example, if VDD = 10 V and CX = 10 µF, the VDD supply should discharge no faster than (10 V) x (10 µF)/(10 mA) = 10 ms. This is normally not a problem since power supplies are heavily filtered and cannot discharge at this rate.
When a more rapid decrease of VDD to zero volts occurs, the MC14538B can sustain damage. To avoid this possibility use an external clamping diode, DX, connected as shown in Fig. 11.
Figure 11. Use of a Diode to Limit
Power Down Current Surge
PIN ASSIGNMENT
13
14
15
16
9
10
11
125
4
3
2
1
8
7
6
A
B
RESET
B
CX/RXB
V
SS
V
DD
Q
B
Q
B
B
B
A
A
RESET
A
CX/RXA
V
SS
V
SS
Q
A
Q
A
B
A
V
SS
D
x
V
DD
V
DD
R
x
C
x
Q
Q
RESET
Page 8
MOTOROLA CMOS LOGIC DATAMC14538B
8
TYPICAL APPLICATIONS
Figure 12. Retriggerable
Monostables Circuitry
Figure 13. Non–Retriggerable
Monostables Circuitry
C
X
R
X
V
DD
Q
Q
RESET = V
DD
B = V
DD
A B
RISING–EDGE
TRIGGER
C
X
R
X
V
DD
Q
Q
RESET = V
DD
B
A = V
SS
FALLING–EDGE
TRIGGER
C
X
R
X
V
DD
Q
Q
A B
RESET = V
DD
C
X
R
X
V
DD
Q
Q
RESET = V
DD
A B
FALLING–EDGE
TRIGGER
RISING–EDGE
TRIGGER
NC
NC NC
V
DD
V
DD
A B
Figure 14. Connection of Unused Sections
Q Q
C
D
Page 9
MOTOROLA CMOS LOGIC DATA
9
MC14538B
OUTLINE DIMENSIONS
P SUFFIX
PLASTIC DIP PACKAGE
CASE 648–08
ISSUE R
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS WHEN FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
5. ROUNDED CORNERS OPTIONAL.
–A–
B
F
C
S
H
G
D
J
L
M
16 PL
SEATING
1 8
916
K
PLANE
–T–
M
A
M
0.25 (0.010) T
DIM MIN MAX MIN MAX
MILLIMETERSINCHES
A 0.740 0.770 18.80 19.55 B 0.250 0.270 6.35 6.85 C 0.145 0.175 3.69 4.44 D 0.015 0.021 0.39 0.53 F 0.040 0.70 1.02 1.77 G 0.100 BSC 2.54 BSC H 0.050 BSC 1.27 BSC
J 0.008 0.015 0.21 0.38 K 0.110 0.130 2.80 3.30 L 0.295 0.305 7.50 7.74 M 0 10 0 10 S 0.020 0.040 0.51 1.01
____
L SUFFIX
CERAMIC DIP PACKAGE
CASE 620–10
ISSUE V
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN FORMED PARALLEL.
4. DIMENSION F MAY NARROW TO 0.76 (0.030) WHERE THE LEAD ENTERS THE CERAMIC BODY.
–A–
–B–
–T–
F
E
G
N
K
C
SEATING PLANE
16 PLD
S
A
M
0.25 (0.010) T
16 PLJ
S
B
M
0.25 (0.010) T
M
L
DIM MIN MAX MIN MAX
MILLIMETERSINCHES
A 0.750 0.785 19.05 19.93 B 0.240 0.295 6.10 7.49 C ––– 0.200 ––– 5.08 D 0.015 0.020 0.39 0.50
E 0.050 BSC 1.27 BSC
F 0.055 0.065 1.40 1.65 G 0.100 BSC 2.54 BSC H 0.008 0.015 0.21 0.38 K 0.125 0.170 3.18 4.31
L 0.300 BSC 7.62 BSC M 0 15 0 15 N 0.020 0.040 0.51 1.01
_ _ _ _
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MOTOROLA CMOS LOGIC DATAMC14538B
10
OUTLINE DIMENSIONS
DW SUFFIX
PLASTIC SOIC PACKAGE
CASE 751G–02
ISSUE A
DIM MIN MAX MIN MAX
INCHESMILLIMETERS
A 10.15 10.45 0.400 0.411 B 7.40 7.60 0.292 0.299 C 2.35 2.65 0.093 0.104 D 0.35 0.49 0.014 0.019 F 0.50 0.90 0.020 0.035
G 1.27 BSC 0.050 BSC
J 0.25 0.32 0.010 0.012 K 0.10 0.25 0.004 0.009
M 0 7 0 7
P 10.05 10.55 0.395 0.415 R 0.25 0.75 0.010 0.029
M
B
M
0.010 (0.25)
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.13 (0.005) TOTAL IN EXCESS OF D DIMENSION AT MAXIMUM MATERIAL CONDITION.
–A–
–B– P8X
G14X
D16X
SEATING PLANE
–T–
S
A
M
0.010 (0.25) B
S
T
16 9
81
F
J
R
X 45
_
_ _ _ _
M
C
K
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MC14538B/D
*MC14538B/D*
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