Datasheet MC14532BD, MC14532BCL Datasheet (Motorola)

Page 1
MOTOROLA CMOS LOGIC DATA
1
MC14532B
  
The MC14532B is constructed with complementary MOS (CMOS) enhancement mode devices. The primary function of a priority encoder is to provide a binary address for the active input with the highest priority. Eight data inputs (D0 thru D7) and an enable input (E
are provided. Five outputs are available, three are address outputs (Q0 thru Q2), one group select (GS) and one enable output (E
out
).
Diode Protection on All Inputs
Supply Voltage Range = 3.0 Vdc to 18 Vdc
Capable of Driving Two Low–power TTL Loads or One Low–Power
Schottky TTL Load over the Rated Temperature Range
MAXIMUM RATINGS* (Voltages Referenced to V
SS
)
Symbol
Parameter Value Unit
V
DD
DC Supply Voltage – 0.5 to + 18.0 V
Vin, V
out
Input or Output Voltage (DC or Transient) – 0.5 to VDD + 0.5 V
Iin, I
out
Input or Output Current (DC or Transient), per Pin
± 10 mA
P
D
Power Dissipation, per Package† 500 mW
T
stg
Storage Temperature – 65 to + 150
_
C
T
L
Lead Temperature (8–Second Soldering) 260
_
C
*Maximum Ratings are those values beyond which damage to the device may occur. †Temperature Derating:
Plastic “P and D/DW” Packages: – 7.0 mW/_C From 65_C To 125_C Ceramic “L” Packages: – 12 mW/_C From 100_C To 125_C
TRUTH TABLE
Input Output
EinD7 D6 D5 D4 D3 D2 D1 D0 GS Q2 Q1 Q0 E
out
0 X X X X X X X X 0 0 0 0 0 1 0 0 0 0 0 0 0 0 0 0 0 0 1
1 1 X X X X X X X 1 1 1 1 0 1 0 1 X X X X X X 1 1 1 0 0 1 0 0 1 X X X X X 1 1 0 1 0 1 0 0 0 1 X X X X 1 1 0 0 0
1 0 0 0 0 1 X X X 1 0 1 1 0 1 0 0 0 0 0 1 X X 1 0 1 0 0 1 0 0 0 0 0 0 1 X 1 0 0 1 0 1 0 0 0 0 0 0 0 1 1 0 0 0 0
X = Don’t Care
This device contains protection circuitry to guard against damage due to high static voltages or electric fields. However, precautions must be taken to avoid applications of any voltage higher than maximum rated voltages to this high-impedance circuit. For proper operation, Vin and V
out
should be constrained to the range VSS (Vin or V
out
) VDD.
Unused inputs must always be tied to an appropriate logic voltage level (e.g., either VSS or VDD). Unused outputs must be left open.

SEMICONDUCTOR TECHNICAL DATA
Motorola, Inc. 1995
REV 3 1/94
L SUFFIX
CERAMIC CASE 620
ORDERING INFORMATION
MC14XXXBCP Plastic MC14XXXBCL Ceramic MC14XXXBD SOIC
TA = – 55° to 125°C for all packages.
P SUFFIX
PLASTIC
CASE 648
D SUFFIX
SOIC
CASE 751B
PIN ASSIGNMENT

13
14
15
16
9
10
11
125
4
3
2
1
8
7
6
D2
D3
GS
E
out
V
DD
Q0
D0
D1
D7
D6
D5
D4
V
SS
Q1
Q2
E
in
Page 2
MOTOROLA CMOS LOGIC DATAMC14532B
2
ELECTRICAL CHARACTERISTICS (Voltages Referenced to V
SS
)
V
– 55_C 25_C 125_C
Characteristic
Symbol
V
DD
Vdc
Min Max Min Typ # Max Min Max
Unit
“0” Level
Vin = VDD or 0
V
OL
5.0 10 15
— — —
0.05
0.05
0.05
— — —
0 0 0
0.05
0.05
0.05
— — —
0.05
0.05
0.05
Vdc
“1” Level
Vin = 0 or V
DD
V
OH
5.0 10 15
4.95
9.95
14.95
— — —
4.95
9.95
14.95
5.0 10 15
— — —
4.95
9.95
14.95
— — —
Vdc
“0” Level (VO = 4.5 or 0.5 Vdc) (VO = 9.0 or 1.0 Vdc) (VO = 13.5 or 1.5 Vdc)
V
IL
5.0 10 15
— — —
1.5
3.0
4.0
— — —
2.25
4.50
6.75
1.5
3.0
4.0
— — —
1.5
3.0
4.0
Vdc
“1” Level (VO = 0.5 or 4.5 Vdc) (VO = 1.0 or 9.0 Vdc) (VO = 1.5 or 13.5 Vdc)
V
IH
5.0 10 15
3.5
7.0 11
— — —
3.5
7.0 11
2.75
5.50
8.25
— — —
3.5
7.0 11
— — —
Vdc
I
OH
5.0
5.0 10 15
– 3.0
– 0.64
– 1.6 – 4.2
— — — —
– 2.4
– 0.51
– 1.3 – 3.4
– 4.2 – 0.88 – 2.25
– 8.8
— — — —
– 1.7
– 0.36
– 0.9 – 2.4
— — — —
mAdc
I
OL
5.0 10 15
0.64
1.6
4.2
— — —
0.51
1.3
3.4
0.88
2.25
8.8
— — —
0.36
0.9
2.4
— — —
mAdc
Input Current I
in
15 ± 0.1 ±0.00001 ± 0.1 ± 1.0 µAdc
Input Capacitance
(Vin = 0)
C
in
5.0 7.5 pF
Quiescent Current
(Per Package)
I
DD
5.0 10 15
— — —
5.0 10 20
— — —
0.005
0.010
0.015
5.0 10 20
— — —
150 300 600
µAdc
Total Supply Current**†
(Dynamic plus Quiescent, Per Package) (CL = 50 pF on all outputs, all buffers switching)
I
T
5.0 10 15
IT = (1.74 µA/kHz) f + I
DD
IT = (3.65 µA/kHz) f + I
DD
IT = (5.73 µA/kHz) f + I
DD
µAdc
#Data labelled “Typ” is not to be used for design purposes but is intended as an indication of the IC’s potential performance. **āThe formulas given are for the typical characteristics only at 25_C. †To calculate total supply current at loads other than 50 pF:
IT(CL) = IT(50 pF) + (CL – 50) Vfk
where: IT is in µA (per package), CL in pF, V = (VDD – VSS) in volts, f in kHz is input frequency, and k = 0.005.
Output Voltage
Input Voltage
Output Drive Current
(VOH = 2.5 Vdc) Source (VOH = 4.6 Vdc) (VOH = 9.5 Vdc) (VOH = 13.5 Vdc)
(VOL = 0.4 Vdc) Sink (VOL = 0.5 Vdc) (VOL = 1.5 Vdc)
Page 3
MOTOROLA CMOS LOGIC DATA
3
MC14532B
SWITCHING CHARACTERISTICS* (C
L
= 50 pF, TA = 25_C)
Characteristic
Symbol V
DD
Min Typ # Max Unit
Output Rise and Fall Time
t
TLH
, t
THL
= (1.5 ns/pF) CL + 25 ns
t
TLH
, t
THL
= (0.75 ns/pF) CL + 12.5 ns
t
TLH
, t
THL
= (0.55 ns/pF) CL + 9.5 ns
t
TLH
,
t
THL
5.0 10 15
— — —
100
50 40
200 100
80
ns
Propagation Delay Time — Ein to E
out
t
PLH
, t
PHL
= (1.7 ns/pF) CL + 120 ns
t
PLH
, t
PHL
= (0.66 ns/pF) CL + 77 ns
t
PLH
, t
PHL
= (0.5 ns/pF) CL + 55 ns
t
PLH
,
t
PHL
5.0 10 15
— — —
205 110
80
410 220 160
ns
Propagation Delay Time — Ein to GS
t
PLH
, t
PHL
= (1.7 ns/pF) CL + 90 ns
t
PLH
, t
PHL
= (0.66 ns/pF) CL 57 ns
t
PLH
, t
PHL
= (0.5 ns/pF) CL + 40 ns
t
PLH
,
t
PHL
5.0 10 15
— — —
175
90 65
350 180 130
ns
Propagation Delay Time — Ein to Q
n
t
PLH
, t
PHL
= (1.7 ns/pF) CL + 195 ns
t
PLH
, t
PHL
= (0.66 ns/pF) CL + 107 ns
t
PLH
, t
PHL
= (0.5 ns/pF) CL + 75 ns
t
PHL
,
t
PLH
5.0 10 15
— — —
280 140 100
560 280 200
ns
Propagation Delay Time — Dn to Q
n
t
PLH
, t
PHL
= (1.7 ns/pF) CL + 265 ns
t
PLH
, t
PHL
= (0.66 ns/pF) CL + 137 ns
t
PLH
, t
PHL
= (0.5 ns/pF) CL + 85 ns
t
PLH
,
t
PHL
5.0 10 15
— — —
300 170 110
600 340 220
ns
Propagation Delay Time — Dn to GS
t
PLH
, t
PHL
= (1.7 ns/pF) CL + 195 ns
t
PLH
, t
PHL
= (0.66 ns/pF) CL + 107 ns
t
PLH
, t
PHL
= (0.5 ns/pF) CL + 75 ns
t
PLH
,
t
PHL
5.0 10 15
— — —
280 140 100
560 280 200
ns
*The formulas given are for the typical characteristics only at 25_C. #Data labelled “Typ” is not to be used for design purposes but is intended as an indication of the IC’s potential performance.
Output
Under
VGS = V
DD
VDS = V
out
Sink Current
VGS = – V
DD
VDS = V
out
– V
DD
Source Current
Under
Test
D0 thru D7 EinD0 thru D6 D7 E
in
E
out
Q0XX00000111
Q2X001
1
GS
X0011
Figure 1. Typical Sink and Source
Current Characteristics
Figure 2. Typical Power Dissipation Test Circuit
SWITCH
MATRIX
EXTERNAL
POWER
SUPPLY
I
D
E
in D0 D1
D2 D3 D4 D5 D6 D7
GS
Q2
Q1
Q0
E
out
V
out
PULSE
GENERATOR
(fo)
E
in D0 D1
D2 D3 D4 D5 D6 D7
V
SS
V
DD
I
D
C
L
C
L
C
L
C
L
C
L
GS
Q2
Q1
Q0
E
out
0.01
µ
F
500
µ
F
E
Q1
0
0
X 0 0 0 1
X
1
1
Page 4
MOTOROLA CMOS LOGIC DATAMC14532B
4
Figure 3. AC Test Circuit and Waveforms
PROGRAMMABLE
PULSE
GENERATOR
E
in D0 D1
D2 D3 D4 D5 D6 D7
GS
Q2
Q1
Q0
E
out
V
DD
V
SS
C
L
C
L
C
L
C
L
C
L
NOTE: Input rise and fall times are 20 ns
50%
50%
50%
50%
50%
50%
50%
50%
90%
50%
10%
90%
50%
10%
90%
50%
10%
90%
50%
10%
t
PHL
t
PHL
t
PHL
t
PHL
t
PHL
t
THL
t
THL
t
THL
t
THL
t
PLH
t
PLH
t
PLH
t
PLH
t
PLH
t
PLH
t
PLH
t
TLH
t
TLH
t
TLH
t
TLH
t
TLH
t
PHL
t
PLH
t
THL
90%
50%
10%
t
PLH
t
PHL
t
PHL
t
PHL
D0
D1
D2
D3
D4
D5
D6
D7
E
in
E
out
GS
Q0
Q1
Q2
10
11
12
13
1
2
3
4
5
15
14
9
7
6
PIN NO.
50%
Page 5
MOTOROLA CMOS LOGIC DATA
5
MC14532B
LOGIC DIAGRAM
(Positive Logic)
LOGIC EQUATIONS
E
out
= Ein D0 D1 D2 D3 D4 D5 D6 D7
10
11
12
13
1
2
3
4
5
D0
D1
D2
D3
D4
D5
D6
D7
E
in
9
7
6
14
15
Q0
Q1
Q2
GS
E
out
Q0 = Ein (D1 D2 D4 D6 + D3 D4 D6 + D5 D6 + D7) Q1 = Ein (D2 D
4 D5 + D3 D4 D5 + D6 + D7) Q2 = Ein (D4 + D5 + D6 + D7) GS = Ein (D0 + D1 + D2 + D3 + D4 + 05 + D6 + D7)
Page 6
MOTOROLA CMOS LOGIC DATAMC14532B
6
Figure 4. Two MC14532B’s Cascaded for 4–Bit Output
D15 D14 D13 D12 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0
D7 D6 D5 D4 D3 D2 D1 D0 D7 D6 D5 D4 D3 D2 D1 D0
Q1 Q0Q2 Q1 Q0Q2
Q1 Q0Q2Q3
GS
3/4 MC14071B
V
DD
E
in
E
out
E
in
E
out
E
out
= “1”
WITH Din = “0”
[
0.03 µF). The analog 3.0 dB bandwidth would then be
dc to 1.0 kHz.
ANALOG TO DIGITAL CONVERSION
An analog signal is applied to the analog input of the MC1710. A digital eight–bit word known to represent a digi­tized level less than the analog input is applied to the MC14512 as in the D to A conversion. The word is increm­ented at rates sufficient to allow steady state to be reached between incrementations (i.e. 3.0 ms). The output of the MC1710 will change when the digital input represents the first digitized level above the analog input. This word is the digital representation of the analog word.
ANALOG OUTPUT
CLOCK
INPUT
ANALOG
INPUT
V
DD
X7 X6 X5 X4 X3 X2 X1 X0
MC14512
A B C
MC1710
R
C
Z
V
DD
V
SS
E
in
D0 D1 D2 D3 D4 D5 D6 D7
Q2 Q0Q1
STOP WORD INCREMENTATION
Q2 Q4Q3Q1 Q2 Q4Q3Q1
C E R C E R
1/2 MC14520B 1/2 MC14520B
DIGITAL INPUT/OUTPUT
8–BIT WORD
TO BE CONVERTED
DIGITAL TO ANALOG CONVERSION
The digital eight–bit word to be converted is applied to the inputs of the MC14512 with the most significant bit at X7 and the least significant bit at X0. A clock input of up to
2.5 MHz (at VDD = 10 V) is applied to the MC14520B. A compromise between I
for t he MC1710 and R
bias
between N and P–channel outputs gives a value of R of 33 k ohms. In order to filter out the switching frequencies, RC should be about 1.0 ms (if R = 33 k ohms, C
Figure 5. Digital to Analog and Analog to Digital Converter
Page 7
MOTOROLA CMOS LOGIC DATA
7
MC14532B
OUTLINE DIMENSIONS
P SUFFIX
PLASTIC DIP PACKAGE
CASE 648–08
ISSUE R
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS WHEN FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
5. ROUNDED CORNERS OPTIONAL.
–A–
B
F
C
S
H
G
D
J
L
M
16 PL
SEATING
1 8
916
K
PLANE
–T–
M
A
M
0.25 (0.010) T
DIM MIN MAX MIN MAX
MILLIMETERSINCHES
A 0.740 0.770 18.80 19.55 B 0.250 0.270 6.35 6.85 C 0.145 0.175 3.69 4.44 D 0.015 0.021 0.39 0.53 F 0.040 0.70 1.02 1.77 G 0.100 BSC 2.54 BSC H 0.050 BSC 1.27 BSC J 0.008 0.015 0.21 0.38 K 0.110 0.130 2.80 3.30 L 0.295 0.305 7.50 7.74 M 0 10 0 10 S 0.020 0.040 0.51 1.01
____
L SUFFIX
CERAMIC DIP PACKAGE
CASE 620–10
ISSUE V
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN FORMED PARALLEL.
4. DIMENSION F MAY NARROW TO 0.76 (0.030) WHERE THE LEAD ENTERS THE CERAMIC BODY.
–A–
–B–
–T–
F
E
G
N
K
C
SEATING PLANE
16 PLD
S
A
M
0.25 (0.010) T
16 PLJ
S
B
M
0.25 (0.010) T
M
L
DIM MIN MAX MIN MAX
MILLIMETERSINCHES
A 0.750 0.785 19.05 19.93 B 0.240 0.295 6.10 7.49 C ––– 0.200 ––– 5.08 D 0.015 0.020 0.39 0.50 E 0.050 BSC 1.27 BSC F 0.055 0.065 1.40 1.65 G 0.100 BSC 2.54 BSC H 0.008 0.015 0.21 0.38 K 0.125 0.170 3.18 4.31 L 0.300 BSC 7.62 BSC M 0 15 0 15 N 0.020 0.040 0.51 1.01
_ _ _ _
16 9
1 8
Page 8
MOTOROLA CMOS LOGIC DATAMC14532B
8
OUTLINE DIMENSIONS
D SUFFIX
PLASTIC SOIC PACKAGE
CASE 751B–05
ISSUE J
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION.
1 8
16 9
SEATING
PLANE
F
J
M
R
X 45
_
G
8 PLP
–B–
–A–
M
0.25 (0.010) B
S
–T–
D
K
C
16 PL
S
B
M
0.25 (0.010) A
S
T
DIM MIN MAX MIN MAX
INCHESMILLIMETERS
A 9.80 10.00 0.386 0.393 B 3.80 4.00 0.150 0.157 C 1.35 1.75 0.054 0.068 D 0.35 0.49 0.014 0.019 F 0.40 1.25 0.016 0.049
G 1.27 BSC 0.050 BSC
J 0.19 0.25 0.008 0.009 K 0.10 0.25 0.004 0.009
M 0 7 0 7
P 5.80 6.20 0.229 0.244 R 0.25 0.50 0.010 0.019
_ _ _ _
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MC14532B/D
*MC14532B/D*
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