Datasheet MC145200EVK, MC145201EVK, MC145191EVK, MC145190EVK Datasheet (Motorola)

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Page 1

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SEMICONDUCTOR TECHNICAL DATA

3–1

REV 1

 Motorola, Inc. 1995

10/95

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High–Performance Silicon–Gate CMOS

The MC74HCT541A is identical in pinout to the LS541. This device may be used as a level converter for interfacing TTL or NMOS outputs to high speed CMOS inputs.

The HCT541A is an octal non–inverting buffer/line driver/line receiver designed to be used with 3–state memory address drivers, clock drivers, and other bus–oriented systems. This device features inputs and outputs on opposite sides of the package and two ANDed active–low output enables.

• Output Drive Capability: 15 LSTTL Loads

• TTL/NMOS–Compatible Input Levels

• Outputs Directly Interface to CMOS, NMOS and TTL

• Operating Voltage Range: 4.5 to 5.5V

• Low Input Current: 1µA

• In Compliance With the JEDEC Standard No. 7A Requirements

• Chip Complexity: 134 FETs or 33.5 Equivalent Gates

OE1 OE2

Output

Enables

Data

Inputs

Non–Inverting Outputs

PIN 20 = V

PIN 10 = GND

LOGIC DIAGRAM

Pinout: 20–Lead Packages (Top View)

1920 18 17 16 15 14

21 3 4 5 6 7

OE2 Y1 Y2 Y3 Y4 Y5 Y6 Y7 Y8

OE1 A1 A2 A3 A4 A5 A6 A7 A8 GND

L L H X

L L X H

L H X X



FUNCTION TABLE

Inputs

Output Y

OE1 OE2 A

L H Z Z

Z = High Impedance X = Don’t Care

DW SUFFIX

SOIC PACKAGE

CASE 751D–04

N SUFFIX

PLASTIC PACKAGE

CASE 738–03

ORDERING INFORMATION

MC74HCTXXXAN MC74HCTXXXADW

Plastic SOIC

Page 2

MC74HCT541A

MOTOROLA High–Speed CMOS Logic Data

DL129 — Rev 6

3–2

MAXIMUM RATINGS*

Symbol

Parameter

Value

Unit

DC Supply Voltage (Referenced to GND)

– 0.5 to + 7.0

DC Input Voltage (Referenced to GND)

– 0.5 to VCC + 0.5

out

DC Output Voltage (Referenced to GND)

– 0.5 to VCC + 0.5

DC Input Current, per Pin

± 20

out

DC Output Current, per Pin

± 35

DC Supply Current, VCC and GND Pins

± 75

Power Dissipation in Still Air Plastic DIP†

SOIC Package†

750 500

stg

Storage Temperature Range

– 65 to + 150

Lead Temperature, 1 mm from Case for 10 Seconds

Plastic DIP or SOIC Package

260

*Maximum Ratings are those values beyond which damage to the device may occur.

Functional operation should be restricted to the Recommended Operating Conditions.

†Derating — Plastic DIP: – 10 mW/_C from 65_ to 125_C

SOIC Package: – 7 mW/_C from 65_ to 125_C

For high frequency or heavy load considerations, see Chapter 2 of the Motorola High–Speed CMOS Data Book (DL129/D).

RECOMMENDED OPERATING CONDITIONS

Symbol

Parameter

Min

Max

Unit

DC Supply Voltage (Referenced to GND)

4.5

5.5

Vin, V

out

DC Input Voltage, Output Voltage (Referenced to GND)

Operating Temperature Range, All Package Types

– 55

+ 125

tr, t

Input Rise/Fall Time (Figure 1)

500

DC CHARACTERISTICS (Voltages Referenced to GND)

Guaranteed Limit

Symbol Parameter Condition

CC V

–55 to 25°C ≤85°C ≤125°C Unit

Minimum High–Level Input Voltage V

out

= 0.1V or VCC – 0.1V

out

| ≤ 20µA

4.5

5.5

2.0

Maximum Low–Level Input Voltage V

out

= 0.1V or VCC – 0.1V

out

| ≤ 20µA

4.5

5.5

0.8

Minimum High–Level Output Voltage

Vin = VIH or V

out

| ≤ 20µA

4.5

5.5

4.4

5.4

4.4

5.4

4.4

5.4

Vin = VIH or V

IL|Iout

| ≤ 6.0mA 4.5 3.98 3.84 3.70

Maximum Low–Level Output Voltage

Vin = VIH or V

out

| ≤ 20µA

4.5

5.5

0.1

Vin = VIH or V

IL|Iout

| ≤ 6.0mA 4.5 0.26 0.33 0.40

Maximum Input Leakage Current Vin = VCC or GND 5.5 ±0.1 ±1.0 ±1.0 µA

Maximum Three–State Leakage Current

Output in High Impedance State Vin = VIL or V

out

= VCC or GND

5.5 ±0.5 ±5.0 ±10.0 µA

Maximum Quiescent Supply Current (per Package)

Vin = VCC or GND I

out

= 0µA

5.5 4 40 160 µA

∆ICCAdditional Quiescent Supply Current

Vin = 2.4V, Any One Input

≥ –55°C 25 to 125°C

Vin = VCC or GND, Other Inputs I

out

= 0µA

5.5

2.9 2.4

1. Information on typical parametric values can be found in Chapter 2 of the Motorola High–Speed CMOS Data Book (DL129/D).

2. Total Supply Current = ICC + Σ∆ICC.

This device contains protection circuitry to guard against damage due to high static voltages or electric fields. However, precautions must be taken to avoid applications of any voltage higher than maximum rated voltages to this high–impedance circuit. For proper operation, Vin and V

out

should be constrained to the

range GND v (Vin or V

out

) v VCC.

Unused inputs must always be tied to an appropriate logic voltage level (e.g., either GND or VCC). Unused outputs must be left open.

Page 3

MC74HCT541A

High–Speed CMOS Logic Data DL129 — Rev 6

3–3 MOTOROLA

AC CHARACTERISTICS (V

= 5.0V, CL = 50 pF, Input tr = tf = 6 ns)

Guaranteed Limit

Symbol Parameter –55 to 25°C ≤85°C ≤125°C Unit

PLH

PHL

Maximum Propagation Delay, Input A to Output Y (Figures 1 and 3)

23 28 32 ns

PLZ

PHZ

Maximum Propagation Delay, Output Enable to Output Y (Figures 2 and 4)

30 34 38 ns

PZL

PZH

Maximum Propagation Delay, Output Enable to Output Y (Figures 2 and 4)

30 34 38 ns

TLH

THL

Maximum Output Transition Time, Any Output (Figures 1 and 3)

12 15 18 ns

Maximum Input Capacitance 10 10 10 pF

out

Maximum Three–State Output Capacitance (Output in High Impedance State)

15 15 15 pF

NOTE: For propagation delays with loads other than 50 pF, and information on typical parametric values, see Chapter 2 of the Motorola High–

Speed CMOS Data Book (DL129/D).

Typical @ 25°C, VCC = 5.0 V

Power Dissipation Capacitance (Per Buffer)*

*Used to determine the no–load dynamic power consumption: PD = CPD V

f + ICC VCC. For load considerations, see Chapter 2 of the

Motorola High–Speed CMOS Data Book (DL129/D).

Figure 1.

CL*

*Includes all probe and jig capacitance

TEST

POINT

OE1 or OE2

1.3V

3.0V

GND

OUTPUT Y

PZL

OUTPUT Y

PZH

HIGH IMPEDANCE

10%

90%

PLZ

PHZ

1.3V

Figure 2.

SWITCHING WAVEFORMS

DEVICE UNDER

TEST

OUTPUT

TEST CIRCUITS

Figure 3. Figure 4.

CL*

*Includes all probe and jig capacitance

TEST

POINT

DEVICE

UNDER

TEST

OUTPUT

Ω

CONNECT TO VCC WHEN TESTING t

PLZ

AND t

PZL

. CONNECT TO GND WHEN TESTING t

PHZ

and t

PZH

3.0V

GND

INPUT A

OUTPUT Y

PLH

PHL

90%

1.3V

10%

TLH

THL

90%

1.3V

10%

1.3V

Page 4

MC74HCT541A

MOTOROLA High–Speed CMOS Logic Data

DL129 — Rev 6

3–4

PIN DESCRIPTIONS

INPUTS

A1, A2, A3, A4, A5, A6, A7, A8 (PINS 2, 3, 4, 5, 6, 7, 8,

9) — Data input pins. Data on these pins appear in non–in-

verted form on the corresponding Y outputs, when the outputs are enabled.

CONTROLS

OE1, OE2 (PINS 1, 19) — Output enables (active–low).

When a low voltage is applied to both of these pins, the out-

puts are enabled and the device functions as a non–inverting buffer. When a high voltage is applied to either input, the outputs assume the high impedance state.

OUTPUTS

Y1, Y2, Y3, Y4, Y5, Y6, Y7, Y8 (PINS 18, 17, 16, 15, 14,

13, 12, 11) — Device outputs. Depending upon the state of

the output enable pins, these outputs are either non–inverting outputs or high–impedance outputs.

LOGIC DETAIL

To 7 Other

Buffers

One of Eight

Buffers

INPUT A

OE1

OE2

OUTPUT Y

Page 5

MC74HCT541A

High–Speed CMOS Logic Data DL129 — Rev 6

3–5 MOTOROLA

OUTLINE DIMENSIONS

N SUFFIX

PLASTIC PACKAGE

CASE 738–03

ISSUE E

DW SUFFIX

PLASTIC SOIC PACKAGE

CASE 751D–04

ISSUE E

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.

2. CONTROLLING DIMENSION: INCH.

3. DIMENSION L TO CENTER OF LEAD WHEN FORMED PARALLEL.

4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.

20 PL

0.25 (0.010) T

DIM MIN MAX MIN MAX

MILLIMETERSINCHES

A 25.66 27.171.010 1.070 B 6.10 6.600.240 0.260 C 3.81 4.570.150 0.180 D 0.39 0.550.015 0.022

G 2.54 BSC0.100 BSC

J 0.21 0.380.008 0.015

K 2.80 3.550.110 0.140

L 7.62 BSC0.300 BSC M 0 15 0 15 N 0.51 1.010.020 0.040

_ __ _

1.27 1.770.050 0.070

–A–

SEATING PLANE

20 PL

–T–

0.25 (0.010) T

1.27 BSC0.050 BSC

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.

2. CONTROLLING DIMENSION: MILLIMETER.

3. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION.

4. MAXIMUM MOLD PROTRUSION 0.150 (0.006) PER SIDE.

5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.13 (0.005) TOTAL IN EXCESS OF D DIMENSION AT MAXIMUM MATERIAL CONDITION.

–A–

–B–

0.010 (0.25) B

D20X

0.010 (0.25)

P10X

18X

–T–

SEATING PLANE

X 45

DIM MIN MAX MIN MAX

INCHESMILLIMETERS

A 12.65 12.95 0.499 0.510 B 7.40 7.60 0.292 0.299 C 2.35 2.65 0.093 0.104 D 0.35 0.49 0.014 0.019

F 0.50 0.90 0.020 0.035

G 1.27 BSC 0.050 BSC

J 0.25 0.32 0.010 0.012 K 0.10 0.25 0.004 0.009 M 0 7 0 7 P 10.05 10.55 0.395 0.415 R 0.25 0.75 0.010 0.029

_ _

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P.O. Box 20912; Phoenix, Arizona 85036. 1–800–441–2447 6F Seibu–Butsuryu–Center, 3–14–2 Tatsumi Koto–Ku, Tokyo 135, Japan. 03–3521–8315

MFAX: [email protected] –TOUCHTONE (602) 244–6609 HONG KONG: Motorola Semiconductors H.K. Ltd.; 8B Tai Ping Industrial Park, INTERNET: http://Design–NET.com 51 Ting Kok Road, Tai Po, N.T., Hong Kong. 852–26629298

Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty , representation or guarantee regarding the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. “T ypical” parameters can and do vary in different applications. All operating parameters, including “T ypicals” must be validated for each customer application by customer’s technical experts. Motorola does not convey any license under its patent rights nor the rights of others. Motorola products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the Motorola product could create a situation where personal injury or death may occur. Should Buyer purchase or use Motorola products for any such unintended or unauthorized application, Buyer shall indemnify and hold Motorola and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that Motorola was negligent regarding the design or manufacture of the part. Motorola and are registered trademarks of Motorola, Inc. Motorola, Inc. is an Equal Opportunity/Affirmative Action Employer.

MC74HCT541A/D

*MC74HCT541A/D*

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