Datasheet MC14515BCP, MC14515BCL, MC14514BCP, MC14514BDW, MC14515BDW Datasheet (Motorola)

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Page 1
MOTOROLA CMOS LOGIC DATA
385
MC14514B MC14515B
    
The MC14514B and MC14515B are two output options of a 4 to 16 line decoder with latched inputs. The MC14514B (output active high option) presents a logical “1” at the selected output, whereas the MC14515B (output active low option) presents a logical “0” at the selected output. The latches are R–S type flip–flops which hold the last input data presented prior to the strobe transition from “1” to “0”. These high and low options of a 4–bit latch/4 to 1 6 line decoder a re constructed with N–channel and P –channel enhancement mode devices in a single monolithic structure. The latches are R–S type flip–flops and data is admitted upon a signal incident at the strobe input, decoded, and presented at the output.
These complementary circuits find primary use in decoding applications where low power dissipation and/or high noise immunity is desired.
Supply Voltage Range = 3.0 Vdc to 18 Vdc
Capable of Driving Two Low–power TTL Loads or One Low–power
Schottky TTL Load Over the Rated Temperature Range
MAXIMUM RATINGS* (Voltages Referenced to V
SS
)
Symbol
Parameter Value Unit
V
DD
DC Supply Voltage – 0.5 to + 18.0 V
Vin, V
out
Input or Output Voltage (DC or Transient) 0.5 to VDD + 0.5 V
Iin, I
out
Input or Output Current (DC or Transient), per Pin
± 10 mA
P
D
Power Dissipation, per Package† 500 mW
T
stg
Storage Temperature – 65 to + 150
_
C
T
L
Lead Temperature (8–Second Soldering) 260
_
C
*Maximum Ratings are those values beyond which damage to the device may occur. †Temperature Derating:
Plastic “P and D/DW” Packages: – 7.0 mW/_C From 65_C To 125_C Ceramic “L” Packages: – 12 mW/_C From 100_C To 125_C
BLOCK DIAGRAM
VDD = PIN 24 VSS = PIN 12
4 TO 16
DECODER
TRANSPARENT
LATCH
STROBE
INHIBIT
2 3
1
21 22
23
DATA 1 DATA 2 DATA 3 DATA 4
A B C D 20
17
18
4
5
6
7
8
10
9
11
19
16
13
14
15
A
B C D A B C D A B C D A B C D A B C D A B C D A B C D A B C D A B C D A B
C D
A
B C D A B C
D A B C D A B
C D A B C D A B C DS15
S14
S13
S12
S11
S10
S9
S8
S7
S6
S5
S4
S3
S2
S1
S0
Data Inputs
Selected Output
MC14514 = Logic “1”
Inhibit D C B A MC14515 = Logic “0”
0 0 0 0 0 S0 0 0 0 0 1 S1 0 0 0 1 0 S2 0 0 0 1 1 S3
0 0 1 0 0 S4 0 0 1 0 1 S5 0 0 1 1 0 S6 0 0 1 1 1 S7
0 1 0 0 0 S8 0 1 0 0 1 S9 0 1 0 1 0 S10 0 1 0 1 1 S11
0 1 1 0 0 S12 0 1 1 0 1 S13 0 1 1 1 0 S14 0 1 1 1 1 S15
1 X X X X All Outputs = 0, MC14514
All Outputs = 1, MC14515
DECODE TRUTH TABLE (Strobe = 1)*
X = Don’t Care *Strobe = 0, Data is latched

SEMICONDUCTOR TECHNICAL DATA
Motorola, Inc. 1995
REV 3 1/94
 
L SUFFIX
CERAMIC
CASE 623
ORDERING INFORMATION
MC14XXXBCP Plastic MC14XXXBCL Ceramic MC14XXXBDW SOIC
TA = – 55° to 125°C for all packages.
P SUFFIX
PLASTIC
CASE 709
DW SUFFIX
SOIC
CASE 751E
Page 2
MOTOROLA CMOS LOGIC DATAMC14514B MC14515B
386
ELECTRICAL CHARACTERISTICS (Voltages Referenced to V
SS
)
V
– 55_C 25_C 125_C
Characteristic
Symbol
V
DD
Vdc
Min Max Min Typ # Max Min Max
Unit
Output Voltage
“0” Level
Vin = VDD or 0
V
OL
5.0 10 15
— — —
0.05
0.05
0.05
— — —
0 0 0
0.05
0.05
0.05
— — —
0.05
0.05
0.05
Vdc
“1” Level
Vin = 0 or V
DD
V
OH
5.0 10 15
4.95
9.95
14.95
— — —
4.95
9.95
14.95
5.0 10 15
— — —
4.95
9.95
14.95
— — —
Vdc
Input Voltage
“0” Level (VO = 4.5 or 0.5 Vdc) (VO = 9.0 or 1.0 Vdc) (VO = 13.5 or 1.5 Vdc)
V
IL
5.0 10 15
— — —
1.5
3.0
4.0
— — —
2.25
4.50
6.75
1.5
3.0
4.0
— — —
1.5
3.0
4.0
Vdc
“1” Level (VO = 0.5 or 4.5 Vdc) (VO = 1.0 or 9.0 Vdc) (VO = 1.5 or 13.5 Vdc)
V
IH
5.0 10 15
3.5
7.0 11
— — —
3.5
7.0 11
2.75
5.50
8.25
— — —
3.5
7.0 11
— — —
Vdc
Output Drive Current
(VOH = 2.5 Vdc) Source (VOH = 4.6 Vdc) (VOH = 9.5 Vdc) (VOH = 13.5 Vdc)
I
OH
5.0
5.0 10 15
– 1.2 – 0.25 – 0.62
– 1.8
— — — —
– 1.0 – 0.2 – 0.5 – 1.5
– 1.7
– 0.36
– 0.9 – 3.5
— — — —
– 0.7 – 0.14 – 0.35
– 1.1
— — — —
mAdc
(VOL = 0.4 Vdc) Sink (VOL = 0.5 Vdc) (VOL = 1.5 Vdc)
I
OL
5.0 10 15
0.64
1.6
4.2
— — —
0.51
1.3
3.4
0.88
2.25
8.8
— — —
0.36
0.9
2.4
— — —
mAdc
Input Current I
in
15 ± 0.1 ±0.00001 ± 0.1 ± 1.0 µAdc
Input Capacitance
(Vin = 0)
C
in
5.0 7.5 pF
Quiescent Current
(Per Package)
I
DD
5.0 10 15
— — —
5.0 10 20
— — —
0.005
0.010
0.015
5.0 10 20
— — —
150 300 600
µAdc
Total Supply Current**†
(Dynamic plus Quiescent, Per Package) (CL = 50 pF on all outputs, all buffers switching)
I
TL
5.0 10 15
IT = (1.35 µA/kHz) f + I
DD
IT = (2.70 µA/kHz) f + I
DD
IT = (4.05 µA/kHz) f + I
DD
µAdc
#Data labelled “Typ” is not to be used for design purposes but is intended as an indication of the IC’s potential performance. **āThe formulas given are for the typical characteristics only at 25_C. †To calculate total supply current at loads other than 50 pF:
IT(CL) = IT(50 pF) + (CL – 50) Vfk
where: IT is in µA (per package), CL in pF, V = (VDD – VSS) in volts, f in kHz is input frequency, and k = 0.002.
This device contains protection circuitry to guard against damage due to high static voltages or electric fields. However, precautions must be taken to avoid applications of any voltage higher than maximum rated voltages to this high-impedance circuit. For proper operation, Vin and V
out
should be constrained to the range VSS (Vin or V
out
) VDD.
Unused inputs must always be tied to an appropriate logic voltage level (e.g., either VSS or VDD). Unused outputs must be left open.
Page 3
MOTOROLA CMOS LOGIC DATA
387
MC14514B MC14515B
SWITCHING CHARACTERISTICS* (C
L
= 50 pF, TA = 25_C)
All Types
Characteristic
Symbol
V
DD
Min Typ # Max
Unit
Output Rise Time
t
TLH
= (3.0 ns/pF) CL + 30 ns
t
TLH
= (1.5 ns/pF) CL + 15 ns
t
TLH
= (1.1 ns/pF) CL + 10 ns
t
TLH
5.0 10 15
— — —
180
90 65
360 180 130
ns
Output Fall Time
t
THL
= (1.5 ns/pF) CL + 25 ns
t
THL
= (0.75 ns/pF) CL + 12.5 ns
t
THL
= (0.55 ns/pF) CL + 9.5 ns
t
THL
5.0 10 15
— — —
100
50 40
200 100
80
ns
Propagation Delay Time; Data, Strobe to S
t
PLH
, t
PHL
= (1.7 ns/pF) CL + 465 ns
t
PLH
, t
PHL
= (0.86 ns/pF) CL + 192 ns
t
PLH
, t
PHL
= (0.5 ns/pF) CL + 125 ns
t
PLH
,
t
PHL
5.0 10 15
— — —
550 225 150
1100
450 300
ns
Inhibit Propagation Delay Times
t
PLH
, t
PHL
= (1.7 ns/pF) CL + 315 ns
t
PLH
, t
PHL
= (0.66 ns/pF) CL + 117 ns
t
PLH
, t
PHL
= (0.5 ns/pF) CL + 75 ns
t
PLH
,
t
PHL
5.0 10 15
— — —
400 150 100
800 300 200
ns
Setup Time
Data to Strobe
t
su
5.0 10 15
250 100
75
125
50 38
— — —
ns
Hold Time
Strobe to Data
t
h
5.0 10 15
– 20
0
10
– 100
– 40 – 30
— — —
ns
Strobe Pulse Width t
WH
5.0 10 15
350 100
75
175
50 38
— — —
ns
*The formulas given are for the typical characteristics only at 25_C. #Data labelled “Typ” is not to be used for design purposes but is intended as an indication of the IC’s potential performance.
Figure 1. Drain Characteristics Test Circuit
EXTERNAL
POWER SUPPLY
V
SS
STROBE
INHIBIT
D1
D2
D3
D4
V
DD
V
DS
I
D
For MC14515B
1. For P–channel: Inhibit = V
DD
2. For N–channel: Inhibit = V
SS
2. and D1–D4 constitute binary
2. code for “output under test.”
For MC14514B
1. For P–channel: Inhibit = V
SS
1. and D1–D4 constitute
1. binary code for “output
1. under test.”
2. For N–channel: Inhibit = V
DD
S15
S14
S13
S12
S11
S10
S9
S8
S7
S6
S5
S4
S3
S2
S1
S0
Page 4
MOTOROLA CMOS LOGIC DATAMC14514B MC14515B
388
Figure 2. Dynamic Power Dissipation Test Circuit and Waveform
PULSE
GENERATOR
C
L
C
L
V
DD
V
DD
V
SS
S0
S15
12
24
I
D
0.01
µ
F
CERAMIC
500
µ
F
V
DD
V
SS
V
in
20 ns
20 ns
90%
10%
STROBE
D1 D2
D3 D4
INHIBIT
Figure 3. Switching Time Test Circuit and Waveforms
PROGRAMMABLE
PULSE
GENERATOR
V
DD
STROBE
INHIBIT
D1
D2
D3
D4
C
L
V
DD
V
SS
V
DD
V
SS
S0 S1
S15
V
SS
C
L
C
L
INPUT
OUTPUT
t
TLH
t
TLH
t
THL
t
THL
t
PHL
t
PLH
20 ns
OUTPUT S0 OUTPUT S1
OUTPUT S15
90% 50% 10%
90% 50%
10%
S5
S7
D2
D1
ST
S3
S4
S6 S10
D3
D4
INH
V
DD
S15
S14
S9
5
4
3
2
1
10
9
8
7
6
14
15
16
17
18
19
20
13
11 12
21
22
23
24
S13
S12
S8
S11
S0
V
SS
S2
S1
PIN ASSIGNMENT
Page 5
MOTOROLA CMOS LOGIC DATA
389
MC14514B MC14515B
LOGIC DIAGRAM
DATA 1 2
DATA 2 3
DATA 3 21
DATA 4 22
STROBE 1
INHIBIT 23
Q
QR
S
Q
QRSQ
QRSQ
QR
S
A
B
C
D
IN MC14515B ONLY
A
B C D
11 S0
9 S1
10 S2
8 S3
7 S4
6 S5
5 S6
4 S7
18 S8
17 S9
20 S10
19 S11
14 S12
13 S13
16 S14
15 S15
A B C D
A B C D
A B C D
A B C D
A B C D
A B C D
A B C D
A B C D
A B
C D
A
B C D
A B CDA
B C D
A B
C D
A B C D
A B C D
Page 6
MOTOROLA CMOS LOGIC DATAMC14514B MC14515B
390
COMPLEX DATA ROUTING
Two MC14512 eight–channel data selectors are used here with the MC14514B four–bit latch/decoder to effect a com­plex data routing system. A total of 16 inputs from data regis­ters are selected and transferred via a 3–state data bus to a data distributor for rearrangement and entry into 16 output registers. In this way sequential data can be re–routed or intermixed according to patterns determined by data select and distribution inputs.
Data is placed into the routing scheme via the eight inputs on both MC14512 data selectors. One register is assigned to each input. The signals on A0, A1, and A2 choose one of eight inputs for transfer out to the 3–state data bus. A fourth signal, labelled Dis, disables one of the MC14512 selectors, assuring transfer of data from only one register.
In addition to a choice of input registers, 1 thru 16, the rate of transfer of the sequential information can also be varied. That is, if the MC14512 were addressed at a rate that is eight
times faster then the shift frequency of the input registers, the most significant bit (MSB) from each register could be se­lected for transfer to the data bus. Therefore, all of the most significant bits from all of the registers can be transferred to the data bus before the next most significant bit is presented for transfer by the input registers.
Information from the 3–state bus is redistributed by the MC14514B four–bit latch/decoder. Using the four–bit ad­dress, D1 thru D4, the information on the inhibit line can be transferred to the addressed output line to the desired output registers, A thru P. This distribution of data bits to the output registers can be made in many complex patterns. For exam­ple, all of the most significant bits from the input registers can be routed into output register A, all of the next most signifi­cant bits into register B, etc. In this way horizontal, vertical, or other methods of data slicing can be implemented.
DATA ROUTING SYSTEM
INPUT
REGISTERS
DATA
TRANSFER
DATA
DISTRIBUTION
OUTPUT
REGISTERS
3–STATE
DATA BUS
REGISTER A
REGISTER P
REGISTER 1
REGISTER 8
REGISTER 9
REGISTER 16
DATA
SELECT
STROBE
INHIBIT
DIS
DIS
Q
Q
D1 D2 D3 D4
A0 A1 A2
A0 A1 A2
MC14514B
MC14512MC14512
D0 D1 D2 D3
D4 D5 D6 D7
D0 D1 D2 D3 D4
D5 D6 D7
S15
S14
S13
S12
S11
S10
S9
S8
S7
S6
S5
S4
S3
S2
S1
S0
Page 7
MOTOROLA CMOS LOGIC DATA
391
MC14514B MC14515B
OUTLINE DIMENSIONS
P SUFFIX
PLASTIC DIP PACKAGE
CASE 709–02
ISSUE C
L SUFFIX
CERAMIC DIP PACKAGE
CASE 623–05
ISSUE M
NOTES:
1. POSITIONAL TOLERANCE OF LEADS (D), SHALL BE WITHIN 0.25 (0.010) AT MAXIMUM MATERIAL CONDITION, IN RELATION TO SEATING PLANE AND EACH OTHER.
2. DIMENSION L TO CENTER OF LEADS WHEN FORMED PARALLEL.
3. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
DIM MIN MAX MIN MAX
INCHESMILLIMETERS
A 31.37 32.13 1.235 1.265 B 13.72 14.22 0.540 0.560 C 3.94 5.08 0.155 0.200 D 0.36 0.56 0.014 0.022 F 1.02 1.52 0.040 0.060 G 2.54 BSC 0.100 BSC H 1.65 2.03 0.065 0.080 J 0.20 0.38 0.008 0.015 K 2.92 3.43 0.115 0.135 L 15.24 BSC 0.600 BSC M 0 15 0 15 N 0.51 1.02 0.020 0.040
_ _ _ _
1 12
1324
B
H
A
F
D
G
K
SEATING PLANE
N
C
M
J
L
NOTES:
1. DIMENSION L TO CENTER OF LEADS WHEN FORMED PARALLEL.
2. LEADS WITHIN 0.13 (0.005) RADIUS OF TRUE POSITION AT SEATING PLANE AT MAXIMUM MATERIAL CONDITION (WHEN FORMED PARALLEL).
1 12
24 13
B
A
SEATING PLANE
F
D
G
K
N
C
M
J
L
DIM MIN MAX MIN MAX
INCHESMILLIMETERS
A 31.24 32.77 1.230 1.290 B 12.70 15.49 0.500 0.610 C 4.06 5.59 0.160 0.220 D 0.41 0.51 0.016 0.020
F 1.27 1.52 0.050 0.060
G 2.54 BSC 0.100 BSC
J 0.20 0.30 0.008 0.012
K 3.18 4.06 0.125 0.160
L 15.24 BSC 0.600 BSC M 0 15 0 15 N 0.51 1.27 0.020 0.050
_ _ _ _
Page 8
MOTOROLA CMOS LOGIC DATAMC14514B MC14515B
392
OUTLINE DIMENSIONS
DW SUFFIX
PLASTIC SOIC PACKAGE
CASE 751E–04
ISSUE E
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.13 (0.005) TOTAL IN EXCESS OF D DIMENSION AT MAXIMUM MATERIAL CONDITION.
–A–
–B– P12X
D24X
12
1324
1
M
0.010 (0.25) B
M
S
A
M
0.010 (0.25) B
S
T
–T–
G
22X
SEATING PLANE
K
C
R
X 45
_
M
F
J
DIM MIN MAX MIN MAX
INCHESMILLIMETERS
A 15.25 15.54 0.601 0.612 B 7.40 7.60 0.292 0.299 C 2.35 2.65 0.093 0.104 D 0.35 0.49 0.014 0.019
F 0.41 0.90 0.016 0.035
G 1.27 BSC 0.050 BSC
J 0.23 0.32 0.009 0.013 K 0.13 0.29 0.005 0.011 M 0 8 0 8 P 10.05 10.55 0.395 0.415 R 0.25 0.75 0.010 0.029
____
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MC14514B/D
*MC14514B/D*
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