Datasheet MC14511BCP, MC14511BD, MC14511BDW, MC14511BCL Datasheet (Motorola)

Page 1
MOTOROLA CMOS LOGIC DATA
361
MC14511B
  
The MC14511B BCD–to–seven s egment latch/decoder/driver is constructed with complementary MOS (CMOS) enhancement mode devices and NPN bipolar output drivers in a single monolithic structure. The circuit provides the functions of a 4–bit storage latch, an 8421 BCD–to–seven segment decoder, and an output drive capability. Lamp test (LT
), blanking
(BI
), and latch enable (LE) inputs are used to test the display, to turn–off or pulse modulate the brightness of the display, and to store a BCD code, respectively. It can be used with seven–segment light–emitting diodes (LED), incandescent, fluorescent, gas discharge, or liquid crystal readouts either directly or indirectly.
Applications include instrument (e.g., counter, DVM, etc.) display driver, computer/calculator display driver, cockpit display driver, and various clock, watch, and timer uses.
Low Logic Circuit Power Dissipation
High–Current Sourcing Outputs (Up to 25 mA)
Latch Storage of Code
Blanking Input
Lamp Test Provision
Readout Blanking on all Illegal Input Combinations
Lamp Intensity Modulation Capability
Time Share (Multiplexing) Facility
Supply Voltage Range = 3.0 V to 18 V
Capable of Driving Two Low–power TTL Loads, One Low–power
Schottky TTL Load or Two HTL Loads Over the Rated Temperature Range
Chip Complexity: 216 FETs or 54 Equivalent Gates
Triple Diode Protection on all Inputs
MAXIMUM RATINGS* (Voltages Referenced to V
SS
)
Rating
Symbol Value Unit
DC Supply Voltage V
DD
– 0.5 to + 18 V
Input Voltage, All Inputs V
in
– 0.5 to VDD +0.5 V DC Current Drain per Input Pin I 10 mA Operating Temperature Range T
A
– 55 to + 125
_
C
Power Dissipation per Package† P
D
500 mW
Storage Temperature Range T
stg
– 65 to + 150
_
C
Maximum Output Drive Current
(Source) per Output
I
OHmax
25 mA
Maximum Continuous Output Power
(Source) per Output ‡
P
OHmax
50 mW
‡P
OHmax
= IOH (VDD – VOH) *Maximum Ratings are those values beyond which damage to the device may occur. †Temperature Derating:
Plastic “P and D/DW” Packages: – 7.0 mW/_C From 65_C To 125_C Ceramic “L” Packages: – 12 mW/_C From 100_C To 125_C

SEMICONDUCTOR TECHNICAL DATA
Motorola, Inc. 1995
REV 3 1/94

L SUFFIX
CERAMIC CASE 620
ORDERING INFORMATION
MC14XXXBCP Plastic MC14XXXBCL Ceramic MC14XXXBDW SOIC MC14XXXBD SOIC
TA = – 55° to 125°C for all packages.
P SUFFIX
PLASTIC
CASE 648
D SUFFIX
SOIC
CASE 751B
PIN ASSIGNMENT
DW SUFFIX
SOIC
CASE 751G
13
14
15
16
9
10
11
125
4
3
2
1
8
7
6
b
a
g
f
V
DD
e
d
c
BI
LT
C
B
V
SS
A
D
LE
0 1 2 3 4 5 6 7 8 9
DISPLAY
a
b
c
d
e
f g
ā
Depends upon the BCD code previously applied when LE = 0
TRUTH TABLE
LE BI LT D C B A a b c d e f g Display
X = Don’t Care *
Inputs Outputs
X X 0 X X X X 1 1 1 1 1 1 1 8 X 0 1 X X X X 0 0 0 0 0 0 0 Blank 0 1 1 0 0 0 0 1 1 1 1 1 1 0 0
0 1 1 0 0 0 1 0 1 1 0 0 0 0 1 0 1 1 0 0 1 1 1 1 1 1 0 0 1 2 0 1 1 0 0 1 1 1 1 1 1 0 0 1 3
0 1 1 0 1 0 0 0 1 1 0 0 1 1 4 0 1 1 0 1 0 1 1 0 1 1 0 1 1 5 0 1 1 0 1 1 0 0 0 1 1 1 1 1 6 0 1 1 0 1 1 1 1 1 1 0 0 0 0 7
0 1 1 1 0 0 0 1 1 1 1 1 1 1 8 0 1 1 1 0 0 1 1 1 1 0 0 1 1 9 0 1 1 1 0 1 0 0 0 0 0 0 0 0 Blank 0 1 1 1 0 1 1 0 0 0 0 0 0 0 Blank
0 1 1 1 1 0 0 0 0 0 0 0 0 0 Blank 0 1 1 1 1 0 1 0 0 0 0 0 0 0 Blank 0 1 1 1 1 1 0 0 0 0 0 0 0 0 Blank 0 1 1 1 1 1 1 0 0 0 0 0 0 0 Blank
1 1 1 X X X X * *
Page 2
MOTOROLA CMOS LOGIC DATAMC14511B
362
ELECTRICAL CHARACTERISTICS (Voltages Referenced to V
SS
)
V
– 55_C 25_C 125_C
Characteristic
Symbol
V
DD
Vdc
Min Max Min Typ # Max Min Max
Unit
“0” Level
Vin = VDD or 0
V
OL
5.0 10 15
— — —
0.05
0.05
0.05
— — —
0 0 0
0.05
0.05
0.05
— — —
0.05
0.05
0.05
Vdc
“1” Level
Vin = 0 or V
DD
V
OH
5.0 10 15
4.1
9.1
14.1
— — —
4.1
9.1
14.1
4.57
9.58
14.59
— — —
4.1
9.1
14.1
— — —
Vdc
“0” Level (VO = 3.8 or 0.5 Vdc) (VO = 8.8 or 1.0 Vdc) (VO = 13.8 or 1.5 Vdc)
V
IL
5.0 10 15
— — —
1.5
3.0
4.0
— — —
2.25
4.50
6.75
1.5
3.0
4.0
— — —
1.5
3.0
4.0
Vdc
“1” Level (VO = 0.5 or 3.8 Vdc) (VO = 1.0 or 8.8 Vdc) (VO = 1.5 or 13.8 Vdc)
V
IH
5.0 10 15
3.5
7.0 11
— — —
3.5
7.0 11
2.75
5.50
8.25
— — —
3.5
7.0 11
— — —
Vdc
5.0 4.1 —
3.9 —
3.4 —
— — — — — —
4.1 —
3.9 —
3.4 —
4.57
4.24
4.12
3.94
3.70
3.54
— — — — — —
4.1 —
3.5 —
3.0 —
— — — — — —
Vdc
10 9.1
9.0 —
8.6 —
— — — — — —
9.1 —
9.0 —
8.6 —
9.58
9.26
9.17
9.04
8.90
8.70
— — — — — —
9.1 —
8.6 —
8.2 —
— — — — — —
Vdc
15 14.1
— 14 —
13.6 —
— — — — — —
14.1 — 14 —
13.6 —
14.59
14.27
14.18
14.07
13.95
13.70
— — — — — —
14.1 —
13.6 —
13.2 —
— — — — — —
Vdc
Output Drive Current
(VOL = 0.4 V) Sink (VOL = 0.5 V) (VOL = 1.5 V)
I
OL
5.0 10 15
0.64
1.6
4.2
— — —
0.51
1.3
3.4
0.88
2.25
8.8
— — —
0.36
0.9
2.4
— — —
mAdc
Input Current I
in
15 ± 0.1 ±0.00001 ± 0.1 ± 1.0 µAdc
Input Capacitance C
in
5.0 7.5 pF
Quiescent Current
(Per Package) Vin = 0 or VDD, I
out
= 0 µA
I
DD
5.0 10 15
— — —
5.0 10 20
— — —
0.005
0.010
0.015
5.0 10 20
— — —
150 300 600
µAdc
Total Supply Current**†
(Dynamic plus Quiescent, Per Package) (CL = 50 pF on all outputs, all buffers switching)
I
T
5.0 10 15
IT = (1.9 µA/kHz) f + I
DD
IT = (3.8 µA/kHz) f + I
DD
IT = (5.7 µA/kHz) f + I
DD
µAdc
#Noise immunity specified for worst–case input combination.
Noise Margin for both “1” and “0” level =
1.0 Vdc min @ VDD = 5.0 Vdc
2.0 Vdc min @ VDD = 10 Vdc
2.5 Vdc min @ VDD = 15 Vdc **āThe formulas given are for the typical characteristics only at 25_C. †To calculate total supply current at loads other than 50 pF:
IT(CL) = IT(50 pF) + 3.5 x 10–3 (CL – 50) VDDf
where: IT is in µA (per package), CL in pF, VDD in Vdc, and f in kHz is input frequency.
Output Voltage
Input Voltage #
Output Drive Voltage
(IOH = 0 mA) Source (IOH = 5.0 mA) (IOH = 10 mA) (IOH = 15 mA) (IOH = 20 mA) (IOH = 25 mA)
(IOH = 0 mA) (IOH = 5.0 mA) (IOH = 10 mA) (IOH = 15 mA) (IOH = 20 mA) (IOH = 25 mA)
(IOH = 0 mA) (IOH = 5.0 mA) (IOH = 10 mA) (IOH = 15 mA) (IOH = 20 mA) (IOH = 25 mA)
V
OH
Page 3
MOTOROLA CMOS LOGIC DATA
363
MC14511B
SWITCHING CHARACTERISTICS* (C
L
= 50 pF, TA = 25_C)
Characteristic
Symbol
V
DD
Vdc
Min Typ Max Unit
Output Rise Time
t
TLH
= (0.40 ns/pF) CL + 20 ns
t
TLH
= (0.25 ns/pF) CL + 17.5 ns
t
TLH
= (0.20 ns/pF) CL + 15 ns
t
TLH
5.0 10 15
— — —
40 30 25
80 60 50
ns
Output Fall Time
t
THL
= (1.5 ns/pF) CL + 50 ns
t
THL
= (0.75 ns/pF) CL + 37.5 ns
t
THL
= (0.55 ns/pF) CL + 37.5 ns
t
THL
5.0 10 15
— — —
125
75 65
250 150 130
ns
t
PLH
5.0 10 15
— — —
640 250 175
1280
500 350
t
PHL
5.0 10 15
— — —
720 290 200
1440
580 400
t
PLH
5.0
I0
15
— — —
600 200 150
750 300 220
t
PHL
5.0 10 15
— — —
485 200 160
970 400 320
t
PLH
5.0 10 15
— — —
313 125
90
625 250 180
t
PHL
5.0 10 15
— — —
313 125
90
625 250 180
Setup Time t
su
5.0 10 15
100
40 30
— — —
— — —
ns
Hold Time t
h
5.0 10 15
60 40 30
— — —
— — —
ns
Latch Enable Pulse Width t
WL
5.0 10 15
520 220 130
260 110
65
— — —
ns
*The formulas given are for the typical characteristics only.
This device contains protection circuitry to protect the inputs against damage due to high static voltages or electric fields; how­ever, it is advised that normal precautions be taken to avoid application of any voltage higher than maximum rated voltages to this high-impedance circuit. A destructive high current mode may occur if Vin and V
out
are not constrained to the range VSS (Vin or
V
out
) VDD.
Due to the sourcing capability of this circuit, damage can occur to the device if VDD is applied, and the outputs are shorted to VSS and are at a logical 1 (See Maximum Ratings).
Unused inputs must always be tied to an appropriate logic voltage level (e.g., either VSS or VDD).
Data Propagation Delay Time
t
= (0.40 ns/pF) CL + 620 ns
PLH
t
= (0.25 ns/pF) CL + 237.5 ns
PLH
t
= (0.20 ns/pF) CL + 165 ns
PLH
t
= (1.3 ns/pF) CL + 655 ns
PHL
t
= (0.60 ns/pF) CL + 260 ns
PHL
t
= (0.35 ns/pF) CL + 182.5 ns
PHL
Blank Propagation Delay Time
t
= (0.30 ns/pF) CL + 585 ns
PLH
t
= (0.25 ns/pF) CL + 187.5 ns
PLH
t
= (0.15 ns/pF) CL + 142.5 ns
PLH
t
= (0.85 ns/pF) CL + 442.5 ns
PHL
t
= (0.45 ns/pF) CL + 177.5 ns
PHL
t
= (0.35 ns/pF) CL + 142.5 ns
PHL
Lamp Test Propagation Delay Time
t
= (0.45 ns/pF) CL + 290.5 ns
PLH
t
= (0.25 ns/pF) CL + 112.5 ns
PLH
t
= (0.20 ns/pF) CL + 80 ns
PLH
t
= (1.3 ns/pF) CL + 248 ns
PHL
t
= (0.45 ns/pF) CL + 102.5 ns
PHL
t
= (0.35 ns/pF) CL + 72.5 ns
PHL
ns
ns
ns
Page 4
MOTOROLA CMOS LOGIC DATAMC14511B
364
Figure 1. Dynamic Power Dissipation Signal Waveforms
Input LE low, and Inputs D, BI and LT high. f in respect to a system clock. All outputs connected to respective CL loads.
20 ns 20 ns
V
DD
V
SS
V
OH
V
OL
90%
50%
10%
50%
A, B, AND C
ANY OUTPUT
50% DUTY CYCLE
1
2f
Figure 2. Dynamic Signal Waveforms
20 ns 20 ns
V
DD
90%
INPUT C
(a) Inputs D and LE low, and Inputs A, B, BI and LT high.
V
SS
V
OH
V
OL
50% 10%
OUTPUT g
t
PLH
t
PHL
90%
10%
50%
t
TLH
t
THL
(b) Input D low, Inputs A, B, BI and LT high.
20 ns
10%
90%
50%
V
DD
V
SS
V
DD
V
SS
V
OH
V
OL
t
h
t
su
50%
INPUT C
OUTPUT g
LE
(c) Data DCBA strobed into latches.
20 ns
20 ns
V
DD
V
SS
LE
90%
50%
10%
t
WL
Page 5
MOTOROLA CMOS LOGIC DATA
365
MC14511B
CONNECTIONS TO VARIOUS DISPLAY READOUTS
COMMON
CATHODE LED
1.7 V
V
DD
V
SS
V
DD
COMMON
ANODE LED
V
SS
1.7 V
LIGHT EMITTING DIODE (LED) READOUT
INCANDESCENT READOUT FLUORESCENT READOUT
GAS DISCHARGE READOUT LIQUID CRYSTAL (LCD) READOUT
V
DD
V
DD
**
V
SS
V
DD
V
SS
FILAMENT SUPPLY
DIRECT (LOW BRIGHTNESS)
VSS OR APPROPRIATE VOLTAGE BELOW VSS.
(CAUTION: Maximum working voltage = 18.0 V)
V
DD
APPROPRIATE
VOLTAGE
V
SS
V
SS
V
DD
EXCITATION
(SQUARE WAVE,
VSS TO VDD)
1/4 OF MC14070B
**A filament pre–warm resistor is recommended to reduce filament
thermal shock and increase the effective cold resistance of the
filament.
Direct dc drive of LCD’s not recommended for life of LCD readouts.
Page 6
MOTOROLA CMOS LOGIC DATAMC14511B
366
LOGIC DIAGRAM
LE 5
D 6
C 2
B 1
A 7
VDD = PIN 16
VSS = PIN 8
BI
4
LT 3
14 g
15 f
9 e
10 d
11 c
12 b
13 a
Page 7
MOTOROLA CMOS LOGIC DATA
367
MC14511B
OUTLINE DIMENSIONS
P SUFFIX
PLASTIC DIP PACKAGE
CASE 648–08
ISSUE R
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS WHEN FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
5. ROUNDED CORNERS OPTIONAL.
–A–
B
F
C
S
H
G
D
J
L
M
16 PL
SEATING
1 8
916
K
PLANE
–T–
M
A
M
0.25 (0.010) T
DIM MIN MAX MIN MAX
MILLIMETERSINCHES
A 0.740 0.770 18.80 19.55 B 0.250 0.270 6.35 6.85 C 0.145 0.175 3.69 4.44 D 0.015 0.021 0.39 0.53
F 0.040 0.70 1.02 1.77 G 0.100 BSC 2.54 BSC H 0.050 BSC 1.27 BSC
J 0.008 0.015 0.21 0.38 K 0.110 0.130 2.80 3.30
L 0.295 0.305 7.50 7.74 M 0 10 0 10
S 0.020 0.040 0.51 1.01
____
L SUFFIX
CERAMIC DIP PACKAGE
CASE 620–10
ISSUE V
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN FORMED PARALLEL.
4. DIMENSION F MAY NARROW TO 0.76 (0.030) WHERE THE LEAD ENTERS THE CERAMIC BODY.
–A–
–B–
–T–
F
E
G
N
K
C
SEATING PLANE
16 PLD
S
A
M
0.25 (0.010) T
16 PLJ
S
B
M
0.25 (0.010) T
M
L
DIM MIN MAX MIN MAX
MILLIMETERSINCHES
A 0.750 0.785 19.05 19.93 B 0.240 0.295 6.10 7.49 C ––– 0.200 ––– 5.08 D 0.015 0.020 0.39 0.50 E 0.050 BSC 1.27 BSC F 0.055 0.065 1.40 1.65
G 0.100 BSC 2.54 BSC
H 0.008 0.015 0.21 0.38 K 0.125 0.170 3.18 4.31 L 0.300 BSC 7.62 BSC
M 0 15 0 15
N 0.020 0.040 0.51 1.01
_ _ _ _
16 9
1 8
Page 8
MOTOROLA CMOS LOGIC DATAMC14511B
368
OUTLINE DIMENSIONS
D SUFFIX
PLASTIC SOIC PACKAGE
CASE 751B–05
ISSUE J
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION.
1 8
16 9
SEATING
PLANE
F
J
M
R
X 45
_
G
8 PLP
–B–
–A–
M
0.25 (0.010) B
S
–T–
D
K
C
16 PL
S
B
M
0.25 (0.010) A
S
T
DIM MIN MAX MIN MAX
INCHESMILLIMETERS
A 9.80 10.00 0.386 0.393 B 3.80 4.00 0.150 0.157 C 1.35 1.75 0.054 0.068 D 0.35 0.49 0.014 0.019 F 0.40 1.25 0.016 0.049
G 1.27 BSC 0.050 BSC
J 0.19 0.25 0.008 0.009 K 0.10 0.25 0.004 0.009
M 0 7 0 7
P 5.80 6.20 0.229 0.244 R 0.25 0.50 0.010 0.019
_ _ _ _
DW SUFFIX
PLASTIC SOIC PACKAGE
CASE 751G–02
ISSUE A
DIM MIN MAX MIN MAX
INCHESMILLIMETERS
A 10.15 10.45 0.400 0.411 B 7.40 7.60 0.292 0.299 C 2.35 2.65 0.093 0.104 D 0.35 0.49 0.014 0.019 F 0.50 0.90 0.020 0.035 G 1.27 BSC 0.050 BSC J 0.25 0.32 0.010 0.012 K 0.10 0.25 0.004 0.009 M 0 7 0 7 P 10.05 10.55 0.395 0.415 R 0.25 0.75 0.010 0.029
M
B
M
0.010 (0.25)
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.13 (0.005) TOTAL IN EXCESS OF D DIMENSION AT MAXIMUM MATERIAL CONDITION.
–A–
–B– P8X
G14X
D16X
SEATING PLANE
–T–
S
A
M
0.010 (0.25) B
S
T
16 9
81
F
J
R
X 45
_
_ _ _ _
M
C
K
Page 9
MOTOROLA CMOS LOGIC DATA
369
MC14511B
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MC14511B/D
*MC14511B/D*
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