Datasheet MC144111P, MC144110DW, MC144110P, MC144111DW Datasheet (Motorola)

Page 1
MC144110MC144111MOTOROLA
1
    
CMOS LSI
The MC144110 and MC144111 are low–cost 6–bit D/A converters with serial interface ports to provide communication with CMOS microprocessors and microcomputers. The MC144110 contains six static D/A converters; the MC144111 contains four converters.
Due to a unique feature of these DACs, the user is permitted easy scaling of the analog outputs of a system. Over a 5 to 15 V supply range, these DACs may be directly interfaced to CMOS MPUs operating at 5 V.
Direct R–2R Network Outputs
Buffered Emitter–Follower Outputs
Serial Data Input
Digital Data Output Facilitates Cascading
Direct Interface to CMOS µP
Wide Operating Voltage Range: 4.5 to 15 V
Wide Operating Temperature Range: 0 to 85°C
Software Information is Contained in Document M68HC11RM/AD
BLOCK DIAGRAM
*Transparent Latch
D
in
CLK
ENB
D C Q
*
C D
6–BIT SHIFT REGISTER
HEX LATCH
HEX BUFFER (INVERTING)
D
out
Qn
OUTRnOUT
R R R R R
2R 2R 2R 2R 2R 2R
R1 OUT
V
DD
Q1 OUT
2R
C
Order this document
by MC144110/D

SEMICONDUCTOR TECHNICAL DATA

P SUFFIX
PLASTIC DIP
CASE 707
DW SUFFIX
SOG PACKAGE
CASE 751D

ORDERING INFORMATION
MC144110P Plastic DIP MC144110DW SOG Package
P SUFFIX
PLASTIC DIP
CASE 646
DW SUFFIX
SOG PACKAGE
CASE 751G
MC144110
MC144111
MC144111P Plastic DIP MC144111DW SOG Package
18
1
20
1
14
1
16
1
Motorola, Inc. 1995
REV 1 8/95
Page 2
MC144110MC144111 MOTOROLA 2
PIN ASSIGNMENTS
MC144110P
R2 Out
R1 Out
Q1 Out
D
in
V
SS
ENB
R3 Out
Q3 Out
Q2 Out Q6 Out
R6 Out
D
out
V
DD
CLK
Q4 Out
R4 Out
Q5 Out
R5 Out
14
15
16
17
18
10
11
12
13
5
4
3
2
1
9
8
7
6
11
12
13
14
8
9
105
4
3
2
1
7
6
13
14
15
16
9
10
11
125
4
3
2
1
8
7
6
NC
5
4
3
2
1
10
9
8
7
6
14
15
16
17
18
19
20
11
12
13
MC144110DW
MC144111P MC144111DW
NC
R2 Out
R1 Out
Q1 Out
D
in
V
SS
ENB
R3 Out
Q3 Out
Q2 Out
Q6 Out
R6 Out
D
out
V
DD
CLK
Q4 Out
R4 Out
Q5 Out
R5 Out
R2 Out
R1 Out
Q1 Out
D
in
V
SS
ENB
Q2 Out
Q4 Out
R4 Out
D
out
V
DD
CLK
Q3 Out
R3 Out
NC
R2 Out
R1 Out
Q1 Out
D
in
V
SS
ENB
Q2 Out
Q4 Out
R4 Out
D
out
V
DD
CLK
Q3 Out
R3 Out
NC
NC = NO CONNECTION
Page 3
MC144110MC144111MOTOROLA
3
MAXIMUM RATINGS* (Voltages referenced to V
SS
)
Parameter
Symbol
Value
Unit
DC Supply Voltage
V
DD
– 0.5 to + 18
V
Input Voltage, All Inputs
V
in
– 0.5 to VDD + 0.5
V
DC Input Current, per Pin
I
± 10
mA
Power Dissipation (Per Output)
TA = 70°C, MC144110
MC144111
TA = 85°C, MC144110
MC144111
P
OH
30 50 10 20
mW
Power Dissipation (Per Package)
TA = 70°C, MC144110
MC144111
TA = 85°C, MC144110
MC144111
P
D
100 150
25 50
mW
Storage Temperature Range
T
stg
– 65 to + 150
°C
*Maximum Ratings are those values beyond which damage to the device may occur.
ELECTRICAL CHARACTERISTICS (Voltages referenced to V
SS
, TA = 0 to 85°C unless otherwise indicated)
Symbol
Parameter Test Conditions V
DD
Min Max Unit
V
IH
High–Level Input Voltage (Din, ENB, CLK) 5
10 15
3.0
3.5 4
— — —
V
V
IL
Low–Level Input Voltage (Din, ENB, CLK) 5
10 15
— — —
0.8
0.8
0.8
V
I
OH
High–Level Output Current (D
out
) V
out
= VDD – 0.5 V 5 – 200 µA
I
OL
Low–Level Output Current (D
out
) V
out
= 0.5 V 5 200 µA
I
DD
Quiescent Supply Current MC144110
MC144111
I
out
= 0 µA 15
15
— —
12
8
mA
I
in
Input Leakage Current (Din, ENB, CLK) Vin = VDD or 0 V 15 ± 1 µA
V
nonl
Nonlinearity Voltage (Rn Out) See Figure 1 5
10 15
— — —
100 200 300
mV
V
step
Step Size (Rn Out) See Figure 2 5
10 15
19 39 58
137 274 411
mV
V
offset
Offset Voltage from V
SS
Din = $00, See Figure 1 1 LSB
I
E
Emitter Leakage Current VRn
Out
= 0 V 15 10 µA
h
FE
DC Current Gain IE = 0.1 to 10.0 mA
TA = 25°C
40
V
BE
Base–to–Emitter Voltage Drop IE = 1.0 mA 0.4 0.7 V
This device contains protection circuitry to guard against damage due to high static voltages or electric fields; however, it is ad­vised that precautions be taken to avoid application of voltage higher than maximum rated voltages to this high–impedance circuit. For proper operation it is recommended that Vin and V
out
be constrained to the range VSS
(Vin or V
out
) VDD.
Unused inputs must always be tied to an appropriate logic voltage level (e.g., either V
SS
or VDD).
Page 4
MC144110MC144111 MOTOROLA 4
SWITCHING CHARACTERISTICS
(Voltages referenced to VSS, TA = 0 to 85°C, CL = 50 pF, Input tr = tf = 20 ns unless otherwise indicated)
Symbol
Parameter V
DD
Min Max Unit
t
wH
Positive Pule Width, CLK (Figures 3 and 4) 5
10 15
2
1.5 1
— — —
µs
t
wL
Negative Pulse Width, CLK (Figure 3 and 4) 5
10 15
5
3.5 2
— — —
µs
t
su
Setup Time, ENB to CLK (Figures 3 and 4) 5
10 15
5
3.5 2
— — —
µs
t
su
Setup Time, Din to CLK (Figures 3 and 4) 5
10 15
1000
750 500
— — —
ns
t
h
Hold Time, CLK to ENB (Figures 3 and 4) 5
10 15
5
3.5 2
— — —
µs
t
h
Hold Time, CLK to Din (Figures 3 and 4) 5
10 15
5
3.5 2
— — —
µs
tr, t
f
Input Rise and Fall Times 5 – 15 2 µs
C
in
Input Capacitance 5 – 15 7.5 pF
LINEARITY ERROR (integral linearity). A measure of how straight a device’s transfer function is, it indicates the worst–case deviation of linearity of the actual transfer function from the best– fit straight line. It is normally specified in parts of an LSB.
Figure 1. D/A Transfer Function
100
75
50
25
0
0
$00
15
$0F
31
$1F
47
$2F
63
$3F
V
nonl
PROGRAM STEP
OUTPUT VOLTAGE @ Rn Out, % (V
DD
– V
SS
)
V
offset
ACTUAL
IDEAL
Page 5
MC144110MC144111MOTOROLA
5
Figure 2. Definition of Step Size
VRn
OUT
STEP
SIZE
DIGITAL NUMBER
Step Size =
± 0.75
V
DD
64
V
DD
64
(For any adjacent pair of digital numbers)
Figure 3. Serial Input, Positive Clock
D
in
D
1
D
2
D
N
C
2
C
1
C
N
ENB
CLK
t
su
t
wH
t
wL
t
h
t
h
t
su
50%
50%
Figure 4. Serial Input, Negative Clock
D
in
D
1
D
2
D
N
C
2
C
1
C
N
ENB
CLK
t
su
t
wL
t
wH
t
h
t
h
t
su
Page 6
MC144110MC144111 MOTOROLA 6
PIN DESCRIPTIONS INPUTS D
in
Data Input
Six–bit words are entered serially, MSB first, into digital data input, Din. Six words are loaded into the MC144110 during each D/A c ycle; four w ords a re loaded into the MC144111.
The last 6–bit word shifted in determines the output level of pins Q1 Out and R1 Out. The next–to–last 6–bit word affects pins Q2 Out and R2 Out, etc.
ENB Negative Logic Enable
The ENB pin must be low (active) during the serial load. On the low–to–high transition of ENB
, data contained in the
shift register is loaded into the latch.
CLK Shift Register Clock
Data is shifted into the register on the high–to–low transi­tion of CLK. CLK is fed into the D–input of a transparent latch, which is used for inhibiting the clocking of the shift reg­ister when ENB
is high.
The number of clock cycles required for the MC144110 is usually 36. The MC144111 usually uses 24 cycles. See Table 1 for additional information.
OUTPUTS D
out
Data Output
The digital data output is primarily used for cascading the
DACs and may be fed into Din of the next stage.
R1 Out through Rn Out Resistor Network Outputs
These are the R–2R resistor network outputs. These out­puts may be fed to high–impedance input FET op amps to bypass the on–chip bipolar transistors. The R value of the re­sistor network ranges from 7 to 15 k.
Q1 Out through Qn Out NPN Transistor Outputs
Buffered DAC outputs utilize an emitter–follower configu­ration for current–gain, thereby allowing interface to low–im­pedance circuits.
SUPPLY PINS V
SS
Negative Supply Voltage
This pin is usually ground.
V
DD
Positive Supply Voltage
The voltage applied to this pin is used to scale the analog output swing from 4.5 to 15 V p–p.
Table 1. Number of Channels vs Clocks Required
Number of
Channels Required
Number of
Clock Cycles
Outputs Used on MC144110 Outputs Used on MC144111
1 6 Q1/R1 Q1/R1 2 12 Q1/R1, Q2/R2 Q1/R1, Q2/R2 3 18 Q1/R1, Q2/R2, Q3/R3 Q1/R1, Q2/R2, Q3/R3 4 24 Q1/R1, Q2/R2, Q3/R3, Q4/R4 Q1/R1, Q2/R2, Q3/R3, Q4/R4 5 30 Q1/R1, Q2/R2, Q3/R3, Q4/R4, Q5/R5 Not Applicable 6 36 Q1/R1, Q2/R2, Q3/R3, Q4/R4, Q5/R5, Q6/R6 Not Applicable
Page 7
MC144110MC144111MOTOROLA
7
PACKAGE DIMENSIONS
P SUFFIX PLASTIC DIP CASE 707–02
MIN MINMAX MAX
MILLIMETERS INCHES
DIM
22.22
6.10
3.56
0.36
1.27
1.02
0.20
2.92
23.24
6.60
4.57
0.56
1.78
1.52
0.30
3.43
0
°
0.51
0.875
0.240
0.140
0.014
0.050
0.040
0.008
0.115
0.915
0.260
0.180
0.022
0.070
0.060
0.012
0.135
15
°
1.02
2.54 BSC
7.62 BSC
0.100 BSC
0.300 BSC 0
°
0.020
15
°
0.040
A B C D F G H J K L M N
NOTES:
1. POSITIONAL TOLERANCE OF LEADS (D), SHALL BE WITHIN 0.25 (0.010) AT MAXIMUM MATERIAL CONDITION, IN RELATION TO SEATING PLANE AND EACH OTHER.
2. DIMENSION L TO CENTER OF LEADS WHEN FORMED PARALLEL.
3. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
1 9
1018
B
A
H
F
G
D
SEATING PLANE
N
K
M
J
L
C
DW SUFFIX
SOG PACKAGE
CASE 751D–04
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.150 (0.006) PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.13 (0.005) TOTAL IN EXCESS OF D DIMENSION AT MAXIMUM MATERIAL CONDITION.
–A–
–B–
20
1
11
10
S
A
M
0.010 (0.25) B
S
T
D20X
M
B
M
0.010 (0.25)
P10X
J
F
G
18X
K
C
–T–
SEATING PLANE
M
R
X 45
_
DIM MIN MAX MIN MAX
INCHESMILLIMETERS
A 12.65 12.95 0.499 0.510 B 7.40 7.60 0.292 0.299 C 2.35 2.65 0.093 0.104 D 0.35 0.49 0.014 0.019 F 0.50 0.90 0.020 0.035 G 1.27 BSC 0.050 BSC J 0.25 0.32 0.010 0.012 K 0.10 0.25 0.004 0.009 M 0 7 0 7 P 10.05 10.55 0.395 0.415 R 0.25 0.75 0.010 0.029
_ _
_ _
Page 8
MC144110MC144111 MOTOROLA 8
P SUFFIX PLASTIC DIP CASE 646–06
NOTES:
1. LEADS WITHIN 0.13 (0.005) RADIUS OF TRUE POSITION AT SEATING PLANE AT MAXIMUM MATERIAL CONDITION.
2. DIMENSION L TO CENTER OF LEADS WHEN FORMED PARALLEL.
3. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
4. ROUNDED CORNERS OPTIONAL.
1 7
14 8
B
A
F
H G D
K
C
N
L
J
M
SEATING PLANE
DIM MIN MAX MIN MAX
MILLIMETERSINCHES
A 0.715 0.770 18.16 19.56 B 0.240 0.260 6.10 6.60 C 0.145 0.185 3.69 4.69 D 0.015 0.021 0.38 0.53 F 0.040 0.070 1.02 1.78
G 0.100 BSC 2.54 BSC
H 0.052 0.095 1.32 2.41 J 0.008 0.015 0.20 0.38 K 0.115 0.135 2.92 3.43 L 0.300 BSC 7.62 BSC
M 0 10 0 10
N 0.015 0.039 0.39 1.01
_ _ _ _
DW SUFFIX
SOG PACKAGE
CASE 751G–02
DIM MIN MAX MIN MAX
INCHESMILLIMETERS
A 10.15 10.45 0.400 0.411 B 7.40 7.60 0.292 0.299 C 2.35 2.65 0.093 0.104 D 0.35 0.49 0.014 0.019 F 0.50 0.90 0.020 0.035 G 1.27 BSC 0.050 BSC J 0.25 0.32 0.010 0.012 K 0.10 0.25 0.004 0.009 M 0 7 0 7 P 10.05 10.55 0.395 0.415 R 0.25 0.75 0.010 0.029
M
B
M
0.010 (0.25)
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.13 (0.005) TOTAL IN EXCESS OF D DIMENSION AT MAXIMUM MATERIAL CONDITION.
–A–
–B– P8X
G14X
D16X
SEATING PLANE
–T–
S
A
M
0.010 (0.25) B
S
T
16 9
81
F
J
R
X 45
_
_ _ _ _
M
C
K
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MC144110/D
*MC144110/D*
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