Datasheet MC143456RDK, MC143455RDK Datasheet (Motorola)

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Page 1



SEMICONDUCTOR TECHNICAL DATA

REV 7

 Motorola, Inc. 1997

2/97

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High–Performance Silicon–Gate CMOS

The MC74HCT157A is identical in pinout to the LS157. This device may be used as a level converter for interfacing TTL or NMOS outputs to High Speed CMOS inputs.

This device routes 2 nibbles (A or B) to a single port (Y) as determined by the Select input. The data is presented at the outputs in noninverted form. A high level on the Output Enable input sets all four Y outputs to a low level.

The HCT157A is similar in function to the HC257 which has 3–state outputs.

• Output Drive Capability: 10 LSTTL Loads

• TTL NMOS Compatible Input Levels

• Outputs Directly Interface to CMOS, NMOS and TTL

• Operating Voltage Range: 4.5 to 5.5 V

• Low Input Current: 1.0 µA

• In Compliance with the Requirements Defined by JEDEC Standard

No. 7A

• Chip Complexity: 102 FETs or 25.5 Equivalent Gates

LOGIC DIAGRAM

5 11 14

6 10 13

4 7 9

A0 A1

A2 A3

B0 B1 B2 B3

Y0 Y1 Y2 Y3

SELECT

OUTPUT ENABLE

DATA OUTPUTS

NIBBLE

A INPUTS

NIBBLE

B INPUTS

PIN 16 = V

PIN 8 = GND

ОООООООООО

Design Criteria

ÎÎÎ

Value

ÎÎÎ

ÎÎ

Unit

ОООООООООО

Internal Gate Count*

ÎÎÎ

25.5

ÎÎÎ

ÎÎ

Internal Gate Propagation Delay

1.5

ÎÎÎ

Internal Gate Power Dissipation

0.005

ÎÎÎ

µW

Speed Power Product

0.0075

ÎÎÎ

*Equivalent to a two input NAND gate.



FUNCTION TABLE

PIN ASSIGNMENT

Inputs

Output Outputs Enable Select Y0 – Y3

X = don’t care A0 – A3, B0 – B3 = the levels of the respective Data–Word Inputs.

125

SELECT

GND

OUTPUT ENABLE

H L L

X L H

L A0–A3 B0–B3

D SUFFIX

SOIC PACKAGE

CASE 751B–05

N SUFFIX

PLASTIC PACKAGE

CASE 648–08

ORDERING INFORMATION

MC74HCTXXXAN MC74HCTXXXAD

Plastic SOIC

Page 2

MC74HCT157A

MOTOROLA High–Speed CMOS Logic Data

DL129 — Rev 6

MAXIMUM RATINGS*

Symbol

Parameter

Value

Unit

DC Supply Voltage (Referenced to GND)

– 0.5 to + 7.0

DC Input Voltage (Referenced to GND)

– 0.5 to VCC + 0.5

out

DC Output Voltage (Referenced to GND)

– 0.5 to VCC + 0.5

DC Input Current, per Pin

± 20

out

DC Output Current, per Pin

± 25

DC Supply Current, VCC and GND Pins

± 50

ОООООООООООО

Power Dissipation in Still Air Plastic DIP†

SOIC Package†

ÎÎÎÎ

750 500

stg

Storage Temperature

– 65 to + 150

ОООООООООООО

Lead Temperature, 1 mm from Case for 10 Seconds

(Plastic DIP or SOIC Package)

ÎÎÎÎ

260

*Maximum Ratings are those values beyond which damage to the device may occur.

Functional operation should be restricted to the Recommended Operating Conditions.

†Derating — Plastic DIP: – 10 mW/_C from 65_ to 125_C

SOIC Package: – 7 mW/_C from 65_ to 125_C

For high frequency or heavy load considerations, see Chapter 2 of the Motorola High–Speed CMOS Data Book (DL129/D).

RECOMMENDED OPERATING CONDITIONS

ÎÎ

Symbol

ОООООООООООО

Parameter

Min

Max

Unit

ÎÎ

ОООООООООООО

DC Supply Voltage (Referenced to GND)

4.5

5.5

ÎÎ

Vin, V

out

ОООООООООООО

DC Input Voltage, Output Voltage (Referenced to GND)

Operating Temperature, All Package Types

– 55

+ 125

tr, t

Input Rise and Fall Time (Figure 1)

500

DC ELECTRICAL CHARACTERISTICS (Voltages Referenced to GND)

Guaranteed Limit

Symbol

Parameter

Test Conditions

– 55 to

25_C

85_Cv 125_C

Unit

ÎÎ

ООООООО

Minimum High–Level Input Voltage

ООООООО

out

= 0.1 V or VCC – 0.1 V

out

| v 20 µA

ÎÎ

4.5

5.5

ÎÎ

2.0

ÎÎ

2.0

ÎÎ

2.0

ÎÎ

ООООООО

Maximum Low–Level Input Voltage

ООООООО

out

0.1 V or VCC – 0.1 V

out

| v 20 mA

ÎÎ

4.5

5.5

ÎÎ

0.8

ÎÎ

0.8

ÎÎ

0.8

ÎÎ

ООООООО

Minimum High–Level Output Voltage

ООООООО

Vin = VIH or V

out

| v 20 mA

ÎÎ

4.5

5.5

ÎÎ

4 4

5.4

ÎÎ

4.4

5.4

ÎÎ

4.4

5.4

ÎÎÎОООООООÎООООООО

Vin = VIH or V

out

| v 4.0 mA

ÎÎ

4.5

ÎÎ

3.98

ÎÎ

3.84

ÎÎ

3.7

ÎÎ

ООООООО

Maximum Low–Level Output Voltage

ООООООО

Vin = VIH or V

out

| v 20 µA

ÎÎ

4.5

5.5

ÎÎ

0.1

ÎÎ

0.1

ÎÎ

0.1

ÎÎÎОООООООÎООООООО

Vin = VIH or V

out

| v 4.0 mA

ÎÎ

4.5

ÎÎ

0.26

ÎÎ

0.33

ÎÎ

0.4

ÎÎ

ООООООО

Maximum Input Leakage Current

ООООООО

Vin = VCC or GND

ÎÎ

5.5

ÎÎ

± 0.1

ÎÎ

± 1.0

ÎÎ

± 1.0

µA

ÎÎ

ООООООО

Maximum Quiescent Supply Current (per Package)

ООООООО

Vin = VCC or GND I

out

= 0 µA

ÎÎ

5.5

ÎÎ

4.0

ÎÎ

160

µA

∆I

Additional Quiescent Supply

Vin = 2.4 V, Any One Input

≥ – 55_C

25_C to 125_C

Current

GND, Other Inputs

out

= 0 µA

5.5

2.9

2.4

NOTE:Information on typical parametric values can be found in Chapter 2 of the Motorola High–Speed CMOS Data Book (DL129/D).

This device contains protection circuitry to guard against damage due to high static voltages or electric fields. However, precautions must be taken to avoid applications of any voltage higher than maximum rated voltages to this high–impedance circuit. For proper operation, Vin and V

out

should be constrained to the

range GND v (Vin or V

out

) v VCC.

Unused inputs must always be tied to an appropriate logic voltage level (e.g., either GND or VCC). Unused outputs must be left open.

Page 3

MC74HCT157A

High–Speed CMOS Logic Data DL129 — Rev 6

3 MOTOROLA

AC ELECTRICAL CHARACTERISTICS (V

= 5.0 V ± 10%, CL = 50 pF, Input tr = tf = 6.0 ns)

Guaranteed Limit

ÎÎ

Symbol

ООООООООООООООООО

Parameter

ÎÎ

– 55 to

25_C

ÎÎ

85_C

ÎÎ

125_C

Unit

ÎÎ

PLH

PHL

ООООООООООООООООО

Maximum Propagation Delay, Input A or B to Output Y

(Figures 1 and 4)

ÎÎ

PLH

PHL

ООООООООООООООООО

Maximum Propagation Delay, Select to Output Y

(Figures 2 and 4)

ÎÎ

PLH

PHL

ООООООООООООООООО

Maximum Propagation Delay, Output Enable to Output Y

(Figures 3 and 4)

ÎÎ

TLH

THL

ООООООООООООООООО

Maximum Output Transition Time, Any Output

(Figures 1 and 4)

ÎÎ

tr, t

Maximum Input Rise and Fall Time

500

NOTE:For propagation delays with loads other than 50 pF , and information on typical parametric values, see Chapter 2 of the Motorola High–

Speed CMOS Data Book (DL129/D).

Typical @ 25°C, VCC = 5.0 V

Power Dissipation Capacitance (Per Transceiver Channel)*

*Used to determine the no–load dynamic power consumption: PD = CPD V

f + ICC VCC. For load considerations, see Chapter 2 of the

Motorola High–Speed CMOS Data Book (DL129/D).

PIN DESCRIPTIONS

INPUTS A0, A1, A2, A3 (Pins 2, 5, 11, 14)

Nibble A inputs. The data present on these pins is transferred to the outputs when the Select input is at a low level and the Output Enable input is at a low level. The data is presented to the outputs in noninverted form.

B0, B1, B2, B3 (Pins 3, 6, 10, 13)

Nibble B inputs. The data present on these pins is transferred to the outputs when the Select input is at a high level and the Output Enable input is at a low level. The data is presented to the outputs in noninverted form.

OUTPUTS Y0, Y1, Y2, Y3 (Pins 4, 7, 9, 12)

Data outputs. The selected input Nibble is presented at

these outputs when the Output Enable input is at a low level. The data is presented to the outputs in noninverted form. For the Output Enable input at a high level, the outputs are at a low level.

CONTROL INPUTS

Select (Pin 1)

Nibble select. This input determines the data word to be transferred to the outputs. A low level on this input selects the A inputs and a high level selects the B inputs.

Output Enable (Pin 15)

Output Enable input. A low level on this input allows the selected input data to be presented at the outputs. A high level on this input sets all outputs to a low level.

Page 4

MC74HCT157A

MOTOROLA High–Speed CMOS Logic Data

DL129 — Rev 6

INPUT A OR B

Figure 1. Figure 2.

OUTPUT ENABLE

PLH

PHL

GND

THL

TLH

10%

90%

Figure 3.

OUTPUT Y

SWITCHING W AVEFORMS

*Includes all probe and jig capacitance

CL*

TEST POINT

DEVICE UNDER

TEST

OUTPUT

Figure 4. Test Circuit

3 V

GND

OUTPUT Y

PHL

PLH

0.3 V

1.3 V

2.7 V

90%

TLH

THL

3 V

GND

SELECT

OUTPUT Y

PHL

PLH

TLH

THL

10%

90%

EXPANDED LOGIC DIAGRAM

OUTPUT ENABLE

SELECT

DATA OUTPUTS

NIBBLE

INPUTS

10%

1.3 V

0.3 V

1.3 V

2.7 V

1.3 V

0.3 V

1.3 V

2.7 V

1.3 V

Page 5

MC74HCT157A

High–Speed CMOS Logic Data DL129 — Rev 6

5 MOTOROLA

OUTLINE DIMENSIONS

N SUFFIX

PLASTIC PACKAGE

CASE 648–08

ISSUE R

MIN MINMAX MAX

INCHES MILLIMETERS

DIM

A B C D F G H J K L M S

18.80

6.35

3.69

0.39

1.02

0.21

2.80

7.50 0

0.51

19.55

6.85

4.44

0.53

1.77

0.38

3.30

7.74 10

1.01

0.740

0.250

0.145

0.015

0.040

0.008

0.110

0.295 0

0.020

0.770

0.270

0.175

0.021

0.070

0.015

0.130

0.305 10

0.040

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.

2. CONTROLLING DIMENSION: INCH.

3. DIMENSION L TO CENTER OF LEADS WHEN FORMED PARALLEL.

4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.

5. ROUNDED CORNERS OPTIONAL.

2.54 BSC

1.27 BSC

0.100 BSC

0.050 BSC

–A

–

916

16 PL

–T

–

SEATING PLANE

TA0.25 (0.010)

M M

0.25 (0.010) T B A

S S

MIN MINMAX MAX

MILLIMETERS INCHES

DIM

A B C D F G J K M P R

9.80

3.80

1.35

0.35

0.40

0.19

0.10 0

5.80

0.25

10.00

4.00

1.75

0.49

1.25

0.25

0.25 7

6.20

0.50

0.386

0.150

0.054

0.014

0.016

0.008

0.004 0

0.229

0.010

0.393

0.157

0.068

0.019

0.049

0.009

0.009 7

0.244

0.019

1.27 BSC 0.050 BSC

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.

2. CONTROLLING DIMENSION: MILLIMETER.

3. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION.

4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE.

5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION.

916

–A

–

–B

–

D 16 PL

–T

–

SEATING

PLANE

R X 45°

P 8 PL

0.25 (0.010) B

M M

D SUFFIX

PLASTIC SOIC PACKAGE

CASE 751B–05

ISSUE J

Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty , representation or guarantee regarding the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. “T ypical” parameters which may be provided in Motorola data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. Motorola does not convey any license under its patent rights nor the rights of others. Motorola products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the Motorola product could create a situation where personal injury or death may occur. Should Buyer purchase or use Motorola products for any such unintended or unauthorized application, Buyer shall indemnify and hold Motorola and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that Motorola was negligent regarding the design or manufacture of the part. Motorola and are registered trademarks of Motorola, Inc. Motorola, Inc. is an Equal Opportunity/Affirmative Action Employer.

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MC74HCT157A/D

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