Datasheet MC14194BCL, MC14194BCP, MC14194BD Datasheet (Motorola)

Page 1
MOTOROLA CMOS LOGIC DATAMC14194B
284
    
The MC14194B is a 4–bit static shift register capable of operating in the parallel l oad, serial shift left, serial s hift right, or hold mode. The asynchronous Reset input, when at a low level, overrides all other inputs, resets all stages, and forces all outputs low. When Reset
Synchronous Right/Left Serial Operation
Synchronous Parallel Load
Asynchronous Hold (Do Nothing) Mode
Functional Pin for Pin Equivalent of LS194
MAXIMUM RATINGS* (Voltages Referenced to V
SS
)
Symbol
Parameter
Value
Unit
V
DD
DC Supply Voltage
– 0.5 to + 18.0
V
Vin, V
out
Input or Output Voltage (DC or Transient)
– 0.5 to VDD + 0.5
V
Iin, I
out
Input or Output Current (DC or Transient), per Pin
± 10
mA
P
D
Power Dissipation, per Package†
500
mW
T
stg
Storage Temperature
– 65 to + 150
_
C
T
L
Lead Temperature (8–Second Soldering)
260
_
C
*Maximum Ratings are those values beyond which damage to the device may occur. †Temperature Derating:
Plastic “P and D/DW” Packages: – 7.0 mW/_C From 65_C To 125_C Ceramic “L” Packages: – 12 mW/_C From 100_C To 125_C
Q
LOGIC DIAGRAM
RESET
CLOCK
DSR
S0
S1
1
11
2
9
10
5
643
D
P1
D
P0
D
P2
D
P3
7
DSL
Q0 Q1 Q2 Q3
15 14 13 12
D
R
D Q D Q D Q
C C C C
R R R
VDD = PIN 16
VSS = PIN 8

SEMICONDUCTOR TECHNICAL DATA
Motorola, Inc. 1995
REV 3 1/94

L SUFFIX
CERAMIC CASE 620
ORDERING INFORMATION
MC14XXXBCP Plastic MC14XXXBCL Ceramic MC14XXXBD SOIC
TA = – 55° to 125°C for all packages.
P SUFFIX
PLASTIC
CASE 648
D SUFFIX
SOIC
CASE 751B
Page 2
MOTOROLA CMOS LOGIC DATA
285
MC14194B
ELECTRICAL CHARACTERISTICS (Voltages Referenced to V
SS
)
V
– 55_C
25_C
125_C
Characteristic
Symbol
V
DD
Vdc
Min
Max
Min
Typ #
Max
Min
ÎÎÎ
ÎÎÎ
ÎÎÎ
Max
Unit
“0” Level
Vin = VDD or 0
V
OL
5.0 10 15
— — —
0.05
0.05
0.05
— — —
0 0 0
0.05
0.05
0.05
— — —
ÎÎÎ
ÎÎÎ
ÎÎÎ
ÎÎÎ
0.05
0.05
0.05
Vdc
“1” Level
Vin = 0 or V
DD
V
OH
5.0 10 15
4.95
9.95
14.95
— — —
4.95
9.95
14.95
5.0 10 15
— — —
4.95
9.95
14.95
ÎÎÎ
ÎÎÎ
ÎÎÎ
ÎÎÎ
ÎÎÎ
— — —
Vdc
“0” Level (VO = 4.5 or 0.5 Vdc) (VO = 9.0 or 1.0 Vdc) (VO = 13.5 or 1.5 Vdc)
V
IL
5.0 10 15
— — —
1.5
3.0
4.0
— — —
2.25
4.50
6.75
1.5
3.0
4.0
— — —
ÎÎÎ
ÎÎÎ
ÎÎÎ
ÎÎÎ
ÎÎÎ
1.5
3.0
4.0
Vdc
“1” Level (VO = 0.5 or 4.5 Vdc) (VO = 1.0 or 9.0 Vdc) (VO = 1.5 or 13.5 Vdc)
V
IH
5.0 10 15
3.5
7.0 11
— — —
3.5
7.0 11
2.75
5.50
8.25
— — —
3.5
7.0 11
ÎÎÎ
ÎÎÎ
ÎÎÎ
ÎÎÎ
ÎÎÎ
— — —
Vdc
I
OH
5.0
5.0 10 15
– 3.0
– 0.64
– 1.6 – 4.2
— — — —
– 2.4
– 0.51
– 1.3 – 3.4
– 4.2 – 0.88 – 2.25
– 8.8
— — — —
– 1.7
– 0.36
– 0.9 – 2.4
ÎÎÎ
ÎÎÎ
ÎÎÎ
ÎÎÎ
ÎÎÎ
— — — —
mAdc
I
OL
5.0 10 15
0.64
1.6
4.2
— — —
0.51
1.3
3.4
0.88
2.25
8.8
— — —
0.36
0.9
2.4
ÎÎÎ
ÎÎÎ
ÎÎÎ
ÎÎÎ
ÎÎÎ
— — —
mAdc
Input Current
I
in
15
± 0.1
±0.00001
± 0.1
ÎÎÎ
ÎÎÎ
ÎÎÎ
± 1.0
µAdc
Input Capacitance
(Vin = 0)
C
in
5.0
7.5
ÎÎÎ
ÎÎÎ
ÎÎÎ
pF
Quiescent Current
(Per Package)
I
DD
5.0 10 15
— — —
5.0 10 20
— — —
0.005
0.010
0.015
5.0 10 20
— — —
ÎÎÎ
ÎÎÎ
ÎÎÎ
ÎÎÎ
ÎÎÎ
150 300 600
µAdc
Total Supply Current**†
(Dynamic plus Quiescent, Per Package) (CL = 50 pF on all outputs, all buffers switching)
I
T
5.0 10 15
IT = (0.95 µA/kHz) f + I
DD
IT = (1.90 µA/kHz) f + I
DD
IT = (2.90 µA/kHz) f + I
DD
µAdc
#Data labelled “Typ” is not to be used for design purposes but is intended as an indication of the IC’s potential performance. **The formulas given are for the typical characteristics only at 25_C. †To calculate total supply current at loads other than 50 pF:
IT(CL) = IT(50 pF) + (CL – 50) Vfk
where: IT is in µA (per package), CL in pF, V = (VDD – VSS) in volts, f in kHz is input frequency, and k = 0.002.
This device contains protection circuitry to guard against damage due to high static voltages or electric fields. However, precautions must be taken to avoid applications of any voltage higher than maximum rated voltages to this high-impedance circuit. For proper operation, Vin and V
out
should be constrained to the range VSS (Vin or V
out
) VDD.
Unused inputs must always be tied to an appropriate logic voltage level (e.g., either VSS or VDD). Unused outputs must be left open.
PIN ASSIGNMENT
13
14
15
16
9
10
11
125
4
3
2
1
8
7
6
Q3
Q2
Q1
V
DD
S0
S1
C
D
P1
D
P0
DSR
R
V
SS
DSL
D
P3
D
P2
Q0
Output Voltage
Input Voltage
Output Drive Current
(VOH = 2.5 Vdc) Source (VOH = 4.6 Vdc) (VOH = 9.5 Vdc) (VOH = 13.5 Vdc)
(VOL = 0.4 Vdc) Sink (VOL = 0.5 Vdc) (VOL = 1.5 Vdc)
Page 3
MOTOROLA CMOS LOGIC DATAMC14194B
286
TRUTH TABLE
Operating
Inputs
(Reset
= 1)
Outputs (@ t
n+1
)
Operating
Mode
S1 S0 DSR DSL D
P0–3
Q0 Q1 Q2 Q3
Hold 0 0 X X X Q0 Q1 Q2 Q3
1 0 X 0 X Q1 Q2 Q3 0
Shift Left
1 0 X 1 X Q1 Q2 Q3 1 0 1 0 X X 0 Q0 Q1 Q2
Shift Right
0 1 1 X X 1 Q0 Q1 Q2 1 1 X X 0 0 0 0 0
Parallel
1 1 X X 1 1 1 1 1
X = Don’t Care t
n+1
= State after the next positive–going transition of the clock.
SWITCHING CHARACTERISTICS* (C
L
= 50 pF, TA = 25_C)
Characteristic
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
Symbol
V
DD
Vdc
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
Min
Typ #
Max
Unit
Output Rise and Fall Time
t
TLH
, t
THL
= (1.35 ns/pF) CL + 32 ns
t
TLH
, t
THL
= (0.6 ns/pF) CL + 20 ns
t
TLH
, t
THL
= (0.4 ns/pF) CL + 20 ns
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
t
TLH
, t
THL
5.0 10 15
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
— — —
100
50 40
200 100
80
ns
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
t
PLH,tPHL
5.0 10 15
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
— — —
275
110
85
550 220 170
ns
to Q
t
PHL
= (0.9 ns/pF) CL + 305 ns
t
PHL
= (0.36 ns/pF) CL + 122 ns
t
PHL
= (0.26 ns/pF) CL + 97 ns
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
t
PHL
5.0 10 15
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
— — —
350 140
110
700 280 220
ns
Clock Pulse Width
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
t
WH
5.0 10 15
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
280 110
85
140
55 40
— — —
ns
Reset Pulse Width
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
t
WH
5.0 10 15
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
180
70 50
90 35 26
— — —
ns
Clock Pulse Frequency
(Shift Right or Left Mode)
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
f
cl
5.0 10 15
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
— — —
3.6
9.0 12
1.8
4.5
6.0
MHz
Clock Pulse Rise and Fall Time
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
t
TLH
, t
THL
5.0 10 15
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
— — —
— — —
15
5 4
µs
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
5.0 10 15
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
10 20 40
– 8.0
0
9.0
— — —
ns
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
5.0 10 15
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
200
75 55
100
36 27
— — —
ns
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
5.0 10 15
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
180
50 35
90 25 10
— — —
ns
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
5.0 10 15
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
0 0 0
– 40 – 27 – 20
— — —
ns
Reset Removal Time
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
t
rem
5.0 10 15
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
300 110
80
150
55 40
— — —
ns
*The formulas given are for the typical characteristics only at 25_C. #Data labelled “Typ” is not to be used for design purposes but is intended as an indication of the IC’s potential performance.
Propagation Delay Time
Clock to Q
Reset
t
, t
PLH
t
PLH
t
PLH
= (0.9 ns/pF) CL + 230 ns
PHL
, t
= (0.36 ns/pF) CL + 92 ns
PHL
, t
= (0.26 ns/pF) CL + 72 ns
PHL
Setup Time
Data to Clock
t
su
Mode Control (S) to Clock
Hold Time
Data to Clock
t
h
Mode Control (S) to Clock
Page 4
MOTOROLA CMOS LOGIC DATA
287
MC14194B
Figure 1. Switching Time Test Circuits and Waveforms
PULSE
GENERATOR
PULSE
GENERATOR
V
DD
V
DD
16 16
C
L
C
L
C
L
C
L
C
L
C
L
C
L
C
L
15
14
13
12
15
14
13
12
Q0
Q1
Q2
Q3
Q0
Q1
Q2
Q3
D
P0
D
P1
D
P2
D
P3
CLOCK DSR DSL S0 S1
3 4 5 6
11
2 7 9
10
1
8 V
SS
R
D
P0
D
P1
D
P2
D
P3
CLOCK DSR DSL S0 S1
R
8 V
SS
3 4 5 6
11
2 7 9
10
1
NOTE: Interchange DSR with DSL and S0 with
S1 for testing shift left.
20 ns 20 ns
90%
50%
10%
DPn
DSR
DSL
CLOCK
Q
n
RESET
t
h
t
su
t
su
t
h
50%
90%
50%
10%
t
TLH
t
THL
t
PLH
t
PHL
t
WH(cl)
1/f
cl
t
PHL
t
rem
t
WL
50%
V
DD
V
SS
V
DD
V
SS
V
OH
V
OL
V
DD
V
SS
Parallel Load Serial Load
Figure 2. Dynamic Power Dissipation Test Circuit and Waveforms
PULSE
GENERATOR
C
L
C
L
C
L
C
L
3 4 5 6
11
2 7 9
10
1
V
DD
16
D
P0
D
P1
D
P2
D
P3
CLOCK DSR DSL S0 S1
R
Q0
Q1
Q2
Q3
500
µ
FI
D
8 V
SS
15
14
13
12
20 ns 20 ns
50%
90%
DSR
CLOCK
Q
n
V
DD
V
SS
V
DD
V
SS
V
OH
V
OL
1/f
10%
Page 5
MOTOROLA CMOS LOGIC DATAMC14194B
288
OUTLINE DIMENSIONS
P SUFFIX
PLASTIC DIP PACKAGE
CASE 648–08
ISSUE R
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS WHEN FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
5. ROUNDED CORNERS OPTIONAL.
–A–
B
F
C
S
H
G
D
J
L
M
16 PL
SEATING
1 8
916
K
PLANE
–T–
M
A
M
0.25 (0.010) T
DIM MIN MAX MIN MAX
MILLIMETERSINCHES
A 0.740 0.770 18.80 19.55 B 0.250 0.270 6.35 6.85 C 0.145 0.175 3.69 4.44 D 0.015 0.021 0.39 0.53 F 0.040 0.70 1.02 1.77 G 0.100 BSC 2.54 BSC H 0.050 BSC 1.27 BSC J 0.008 0.015 0.21 0.38 K 0.110 0.130 2.80 3.30 L 0.295 0.305 7.50 7.74 M 0 10 0 10 S 0.020 0.040 0.51 1.01
____
L SUFFIX
CERAMIC DIP PACKAGE
CASE 620–10
ISSUE V
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN FORMED PARALLEL.
4. DIMENSION F MAY NARROW TO 0.76 (0.030) WHERE THE LEAD ENTERS THE CERAMIC BODY.
–A–
–B–
–T–
F
E
G
N
K
C
SEATING PLANE
16 PLD
S
A
M
0.25 (0.010) T
16 PLJ
S
B
M
0.25 (0.010) T
M
L
DIM MIN MAX MIN MAX
MILLIMETERSINCHES
A 0.750 0.785 19.05 19.93 B 0.240 0.295 6.10 7.49 C ––– 0.200 ––– 5.08 D 0.015 0.020 0.39 0.50 E 0.050 BSC 1.27 BSC F 0.055 0.065 1.40 1.65 G 0.100 BSC 2.54 BSC H 0.008 0.015 0.21 0.38 K 0.125 0.170 3.18 4.31 L 0.300 BSC 7.62 BSC M 0 15 0 15 N 0.020 0.040 0.51 1.01
_ _ _ _
16 9
1 8
Page 6
MOTOROLA CMOS LOGIC DATA
289
MC14194B
OUTLINE DIMENSIONS
D SUFFIX
PLASTIC SOIC PACKAGE
CASE 751B–05
ISSUE J
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION.
1 8
16 9
SEATING
PLANE
F
J
M
R
X 45
_
G
8 PLP
–B–
–A–
M
0.25 (0.010) B
S
–T–
D
K
C
16 PL
S
B
M
0.25 (0.010) A
S
T
DIM MIN MAX MIN MAX
INCHESMILLIMETERS
A 9.80 10.00 0.386 0.393 B 3.80 4.00 0.150 0.157 C 1.35 1.75 0.054 0.068 D 0.35 0.49 0.014 0.019 F 0.40 1.25 0.016 0.049
G 1.27 BSC 0.050 BSC
J 0.19 0.25 0.008 0.009 K 0.10 0.25 0.004 0.009
M 0 7 0 7
P 5.80 6.20 0.229 0.244 R 0.25 0.50 0.010 0.019
_ _ _ _
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MC14194B/D
*MC14194B/D*
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