Datasheet MC14076BD, MC14076BCP, MC14076BCL Datasheet (Motorola)

Page 1
MOTOROLA CMOS LOGIC DATA
1
MC14076B
 !    
The MC14076B 4–Bit Register consists of four D–type flip–flops operating synchronously from a common clock. OR gated output–disable inputs force the outputs into a high–impedance state for use in bus organized systems. OR gated data–disable inputs cause the Q outputs to be fed back to the D inputs of the flip–flops. Thus they are inhibited from changing state while the clocking process remains u ndisturbed. An asynchronous master root is provided to clear all four flip–flops simultaneously independent of the clock or disable inputs.
Three–State Outputs with Gated Control Lines
Fully Independent Clock Allows Unrestricted Operation for the Two
Modes: Parallel Load and Do Nothing
Asynchronous Master Reset
Four Bus Buffer Registers
Supply Voltage Range = 3.0 Vdc to 18 Vdc
Capable of Driving Two Low–Power TTL Loads or One Low–Power
Schottky TTL Load Over the Rated Temperature Range
MAXIMUM RATINGS* (Voltages Referenced to V
SS
)
Symbol
Parameter
Value
Unit
V
DD
DC Supply Voltage
– 0.5 to + 18.0
V
Vin, V
out
Input or Output Voltage (DC or Transient)
– 0.5 to VDD + 0.5
V
Iin, I
out
Input or Output Current (DC or Transient), per Pin
± 10
mA
P
D
Power Dissipation, per Package†
500
mW
T
stg
Storage Temperature
– 65 to + 150
_
C
T
L
Lead Temperature (8–Second Soldering)
260
_
C
*Maximum Ratings are those values beyond which damage to the device may occur. †Temperature Derating:
Plastic “P and D/DW” Packages: – 7.0 mW/_C From 65_C To 125_C Ceramic “L” Packages: – 12 mW/_C From 100_C To 125_C
FUNCTION TABLE
Inputs
Data Disable
Data
Output
Reset
Clock
A B
Data
D
Output
Q
1 X X X X 0 0 0 X X X Q
n
0 1 X X Q
n
0 X 1 X Q
n
0 0 0 0 0 0 0 0 1 1
When either output disable A or B (or both) is (are) high the output is disabled to the high–impedance state; however sequential operation of the flip–flops is not affected. X = Don’t Care.

SEMICONDUCTOR TECHNICAL DATA
Motorola, Inc. 1995
REV 3 1/94
    "   

L SUFFIX
CERAMIC
CASE 620
ORDERING INFORMATION
MC14XXXBCP Plastic MC14XXXBCL Ceramic MC14XXXBD SOIC
TA = – 55° to 125°C for all packages.
P SUFFIX
PLASTIC
CASE 648
D SUFFIX
SOIC
CASE 751B
BLOCK DIAGRAM
15 14 13 12 11 10
9 7 2 1
3
4
5
6
RESET D0 D1 D2 D3 B A CLOCK B A
DATA DISABLE
OUTPUT DISABLE
VDD = PIN 16
VSS = PIN 8
Q0
Q1
Q2
Q3
Page 2
MOTOROLA CMOS LOGIC DATAMC14076B
2
ELECTRICAL CHARACTERISTICS (Voltages Referenced to V
SS
)
V
– 55_C
25_C
125_C
Characteristic
Symbol
V
DD
Vdc
Min
Max
Min
Typ #
Max
Min
ÎÎÎ
ÎÎÎ
ÎÎÎ
Max
Unit
Output Voltage
“0” Level
Vin = VDD or 0
V
OL
5.0 10 15
— — —
0.05
0.05
0.05
— — —
0 0 0
0.05
0.05
0.05
— — —
ÎÎÎ
ÎÎÎ
ÎÎÎ
ÎÎÎ
0.05
0.05
0.05
Vdc
“1” Level
Vin = 0 or V
DD
V
OH
5.0 10 15
4.95
9.95
14.95
— — —
4.95
9.95
14.95
5.0 10 15
— — —
4.95
9.95
14.95
ÎÎÎ
ÎÎÎ
ÎÎÎ
ÎÎÎ
ÎÎÎ
— — —
Vdc
Input Voltage
“0” Level (VO = 4.5 or 0.5 Vdc) (VO = 9.0 or 1.0 Vdc) (VO = 13.5 or 1.5 Vdc)
V
IL
5.0 10 15
— — —
1.5
3.0
4.0
— — —
2.25
4.50
6.75
1.5
3.0
4.0
— — —
ÎÎÎ
ÎÎÎ
ÎÎÎ
ÎÎÎ
ÎÎÎ
1.5
3.0
4.0
Vdc
“1” Level (VO = 0.5 or 4.5 Vdc) (VO = 1.0 or 9.0 Vdc) (VO = 1.5 or 13.5 Vdc)
V
IH
5.0 10 15
3.5
7.0 11
— — —
3.5
7.0 11
2.75
5.50
8.25
— — —
3.5
7.0 11
ÎÎÎ
ÎÎÎ
ÎÎÎ
ÎÎÎ
ÎÎÎ
— — —
Vdc
Output Drive Current
(VOH = 2.5 Vdc) Source (VOH = 4.6 Vdc) (VOH = 9.5 Vdc) (VOH = 13.5 Vdc)
I
OH
5.0
5.0 10 15
– 3.0
– 0.64
– 1.6 – 4.2
— — — —
– 2.4
– 0.51
– 1.3 – 3.4
– 4.2 – 0.88 – 2.25
– 8.8
— — — —
– 1.7
– 0.36
– 0.9 – 2.4
ÎÎÎ
ÎÎÎ
ÎÎÎ
ÎÎÎ
ÎÎÎ
— — — —
mAdc
(VOL = 0.4 Vdc) Sink (VOL = 0.5 Vdc) (VOL = 1.5 Vdc)
I
OL
5.0 10 15
0.64
1.6
4.2
— — —
0.51
1.3
3.4
0.88
2.25
8.8
— — —
0.36
0.9
2.4
ÎÎÎ
ÎÎÎ
ÎÎÎ
ÎÎÎ
ÎÎÎ
— — —
mAdc
Input Current
I
in
15
± 0.1
±0.00001
± 0.1
ÎÎÎ
ÎÎÎ
ÎÎÎ
± 1.0
µAdc
Input Capacitance
(Vin = 0)
C
in
5.0
7.5
ÎÎÎ
ÎÎÎ
ÎÎÎ
pF
Quiescent Current
(Per Package)
I
DD
5.0 10 15
— — —
5.0 10 20
— — —
0.005
0.010
0.015
5.0 10 20
— — —
ÎÎÎ
ÎÎÎ
ÎÎÎ
ÎÎÎ
ÎÎÎ
150 300 600
µAdc
Total Supply Current**†
(Dynamic plus Quiescent, Per Package) (CL = 50 pF on all outputs, all buffers switching)
I
T
5.0 10 15
IT = (0.75 µA/kHz) f + I
DD
IT = (1.50 µA/kHz) f + I
DD
IT = (2.25 µA/kHz) f + I
DD
µAdc
Three–State Leakage Current
I
TL
15
± 0.1
± 0.0001
± 0.1
ÎÎÎ
ÎÎÎ
ÎÎÎ
± 3.0
µAdc
#Data labelled “Typ” is not to be used for design purposes but is intended as an indication of the IC’s potential performance. **The formulas given are for the typical characteristics only at 25_C. †To calculate total supply current at loads other than 50 pF:
IT(CL) = IT(50 pF) + (CL – 50) Vfk
where: IT is in µA (per package), CL in pF, V = (VDD – VSS) in volts, f in kHz is input frequency, and k = 0.002.
Page 3
MOTOROLA CMOS LOGIC DATA
3
MC14076B
SWITCHING CHARACTERISTICS* (C
L
= 50 pF, TA = 25_C)
Characteristic
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
Symbol
V
DD
Vdc
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
Min
Typ #
Max
Unit
Output Rise and Fall Time
t
TLH
, t
THL
= (1.5 ns/pF) CL + 25 ns
t
TLH
, t
THL
= (0.75 ns/pF) CL + 12.5 ns
t
TLH
, t
THL
= (0.55 ns/pF) CL + 9.5 ns
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
t
TLH
, t
THL
5.0 10 15
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
— — —
100
50 40
200 100
80
ns
Propagation Delay Time
Clock to Q
t
PLH
, t
PHL
= (1.7 ns/pF) CL + 215 ns
t
PLH
, t
PHL
= (0.66 ns/pF) CL + 92 ns
t
PLH
, t
PHL
= (0.5 ns/pF) CL + 65 ns
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
t
PLH
, t
PHL
5.0 10 15
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
— — —
300 125
90
600 250 180
ns
Reset to Q
t
PLH
, t
PHL
= (1.7 ns/pF) CL + 215 ns
t
PLH
, t
PHL
= (0.66 ns/pF) CL + 92 ns
t
PLH
, t
PHL
= (0.5 ns/pF) CL + 65 ns
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
5.0 10 15
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
— — —
300 125
90
600 250 180
3–State Propagation Delay, Output “1” or “0”
to High Impedance
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
t
PHZ
, t
PLZ
5.0 10 15
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
— — —
150
60 45
300 120
90
ns
3–State Propagation Delay, High Impedance
to “1” or “0” Level
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
t
PZH
, t
PZL
5.0 10 15
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
— — —
200
80 60
400 160 120
ns
Clock Pulse Width
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
t
WH
5.0 10 15
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
260 110
80
130
55 40
— — —
ns
Reset Pulse Width
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
t
WH
5.0 10 15
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
370 150 110
185
75 55
— — —
ns
Data Setup Time
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
t
su
5.0 10 15
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
30 10
4
15
5 2
— — —
ns
Data Hold Time
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
t
h
5.0 10 15
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
130
60 50
65 30 25
— — —
ns
Data Disable Setup Time
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
t
su
5.0 10 15
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
220
80 50
110
40 25
— — —
ns
Clock Pulse Rise and Fall Time
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
t
TLH
, t
THL
5.0 10 15
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
— — —
— — —
15
5 4
µs
Clock Pulse Frequency
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
f
cl
5.0 10 15
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
— — —
3.6
9.0 12
1.8
4.5
6.0
MHz
*The formulas given are for the typical characteristics only at 25_C. #Data labelled “Typ” is not to be used for design purposes but is intended as an indication of the IC’s potential performance.
This device contains protection circuitry to guard against damage due to high static voltages or electric fields. However, precautions must be taken to avoid applications of any voltage higher than maximum rated voltages to this high-impedance circuit. For proper operation, Vin and V
out
should be constrained to the range VSS (Vin or V
out
) VDD.
Unused inputs must always be tied to an appropriate logic voltage level (e.g., either VSS or VDD). Unused outputs must be left open.
Page 4
MOTOROLA CMOS LOGIC DATAMC14076B
4
Figure 1. Timing Diagram
INPUT RISE AND FALL 20 ns
D
INPUT
INFORMATION
V
DD
V
SS
V
SS
V
OH
V
OL
V
DD
Q OUTPUT
90%
50%
10%
t
su
t
h
t
su
t
h
20 ns
90%
10%
50%
90%
10%
t
TLH
t
PHL
t
THL
50%
t
WH
t
WL
f
cl
RESET = 0 DATA DISABLE A AND B = 0 OUTPUT DISABLE A AND B = 0
Figure 2. Three–State Propagation Delay
Waveshape and Circuit
MC14076B
OTHER INPUTS
OUTPUT
DISABLE
A OR B
ANY Q
OUTPUT
RL = 1 k
C
L
VDD FOR t
PLZ
AND t
PZL
VSS FOR t
PHZ
AND t
PZH
OUTPUT DISABLE
A OR B
ANY Q
OUTPUT
ANY Q
OUTPUT
20 ns 20 ns
V
DD
V
SS
V
OH
90%
50%
50%
10%
t
PLZ
t
PZL
90%
t
PZH
t
PHZ
90%
10%
10%
2.5 V @ VDD = 5 V, 10 V, AND 15 V
2 V @ VDD = 5 V
6 V @ VDD = 10 V
10 V @ VDD = 15 V
V
OL
OUTPUTS
CONNECTED
OUTPUTS
DISCONNECTED
OUTPUTS
CONNECTED
t
PLH
EQUIVALENT
FUNCTIONAL BLOCK DIAGRAM
OUTPUT DISABLE A OUTPUT DISABLE B
D0
1 2
14
DATA DISABLE A DATA DISABLE B910
D1 13
CLOCK 7
D2 12
D3 11
RESET 15
6 Q3
5 Q2
4 Q1
3 Q0
D Q
R
C
Q
D Q
R
C
Q
D Q
R
C
Q
D Q
R
C
Q
PIN ASSIGNMENT
13
14
15
16
9
10
11
125
4
3
2
1
8
7
6
D2
D1
D0
R
V
DD
A
B
D3
Q1
B
A
V
SS
C
Q3
Q2
Q0
OUTPUT
DISABLE
DATA DISABLE
{
}
Page 5
MOTOROLA CMOS LOGIC DATA
5
MC14076B
OUTLINE DIMENSIONS
P SUFFIX
PLASTIC DIP PACKAGE
CASE 648–08
ISSUE R
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS WHEN FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
5. ROUNDED CORNERS OPTIONAL.
–A–
B
F
C
S
H
G
D
J
L
M
16 PL
SEATING
1 8
916
K
PLANE
–T–
M
A
M
0.25 (0.010) T
DIM MIN MAX MIN MAX
MILLIMETERSINCHES
A 0.740 0.770 18.80 19.55 B 0.250 0.270 6.35 6.85 C 0.145 0.175 3.69 4.44 D 0.015 0.021 0.39 0.53
F 0.040 0.70 1.02 1.77 G 0.100 BSC 2.54 BSC H 0.050 BSC 1.27 BSC J 0.008 0.015 0.21 0.38 K 0.110 0.130 2.80 3.30 L 0.295 0.305 7.50 7.74 M 0 10 0 10 S 0.020 0.040 0.51 1.01
____
L SUFFIX
CERAMIC DIP PACKAGE
CASE 620–10
ISSUE V
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN FORMED PARALLEL.
4. DIMENSION F MAY NARROW TO 0.76 (0.030) WHERE THE LEAD ENTERS THE CERAMIC BODY.
–A–
–B–
–T–
F
E
G
N
K
C
SEATING PLANE
16 PLD
S
A
M
0.25 (0.010) T
16 PLJ
S
B
M
0.25 (0.010) T
M
L
DIM MIN MAX MIN MAX
MILLIMETERSINCHES
A 0.750 0.785 19.05 19.93 B 0.240 0.295 6.10 7.49 C ––– 0.200 ––– 5.08 D 0.015 0.020 0.39 0.50 E 0.050 BSC 1.27 BSC F 0.055 0.065 1.40 1.65 G 0.100 BSC 2.54 BSC H 0.008 0.015 0.21 0.38 K 0.125 0.170 3.18 4.31 L 0.300 BSC 7.62 BSC M 0 15 0 15 N 0.020 0.040 0.51 1.01
_ _ _ _
16 9
1 8
Page 6
MOTOROLA CMOS LOGIC DATAMC14076B
6
OUTLINE DIMENSIONS
D SUFFIX
PLASTIC SOIC PACKAGE
CASE 751B–05
ISSUE J
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION.
1 8
16 9
SEATING
PLANE
F
J
M
R
X 45
_
G
8 PLP
–B–
–A–
M
0.25 (0.010) B
S
–T–
D
K
C
16 PL
S
B
M
0.25 (0.010) A
S
T
DIM MIN MAX MIN MAX
INCHESMILLIMETERS
A 9.80 10.00 0.386 0.393 B 3.80 4.00 0.150 0.157 C 1.35 1.75 0.054 0.068 D 0.35 0.49 0.014 0.019
F 0.40 1.25 0.016 0.049
G 1.27 BSC 0.050 BSC
J 0.19 0.25 0.008 0.009 K 0.10 0.25 0.004 0.009 M 0 7 0 7
P 5.80 6.20 0.229 0.244 R 0.25 0.50 0.010 0.019
_ _ _ _
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MC14076B/D
*MC14076B/D*
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