Datasheet MC14069UBFEL, MC14069UBFL1, MC14069UBFL2, MC14069UBFR1, MC14069UBD Datasheet (MOTOROLA)

...
Page 1
Semiconductor Components Industries, LLC, 2000
March, 2000 – Rev. 3
1 Publication Order Number:
MC14069UB/D
MC14069UB
Hex Inverter
The MC14069UB hex inverter is constructed with MOS P–channel and N–channel enhancement mode devices in a single monolithic structure. These inverters find primary use where low power dissipation and/or high noise immunity is desired. Each of the six inverters is a single stage to minimize propagation delays.
Supply Voltage Range = 3.0 Vdc to 18 Vdc
Capable of Driving Two Low–Power TTL Loads or One Low–Power
Schottky TTL Load Over the Rated Temperature Range
Triple Diode Protection on All Inputs
Pin–for–Pin Replacement for CD4069UB
Meets JEDEC UB Specifications
MAXIMUM RATINGS (Voltages Referenced to V
SS
) (Note 2.)
Symbol
Parameter Value Unit
V
DD
DC Supply Voltage Range –0.5 to +18.0 V
Vin, V
out
Input or Output Voltage Range
(DC or Transient)
–0.5 to VDD + 0.5 V
Iin, I
out
Input or Output Current
(DC or Transient) per Pin
±10 mA
P
D
Power Dissipation,
per Package (Note 3.)
500 mW
T
A
Ambient Temperature Range –55 to +125 °C
T
stg
Storage Temperature Range –65 to +150 °C
T
L
Lead Temperature
(8–Second Soldering)
260 °C
2. Maximum Ratings are those values beyond which damage to the device
may occur.
3. Temperature Derating:
Plastic “P and D/DW” Packages: – 7.0 mW/_C From 65_C T o 125_C
This device contains protection circuitry to guard against damage due to high static voltages or electric fields. However, precautions must be taken to avoid applications of any voltage higher than maximum rated voltages to this high–impedance circuit. For proper operation, Vin and V
out
should be constrained
to the range V
SS
v (Vin or V
out
) v VDD.
Unused inputs must always be tied to an appropriate logic voltage level (e.g., either V
SS
or VDD). Unused outputs must be left open.
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A = Assembly Location WL or L = Wafer Lot YY or Y = Year WW or W = Work Week
Device Package Shipping
ORDERING INFORMATION
MC14069UBCP PDIP–14 2000/Box MC14069UBD SOIC–14
2750/Box MC14069UBDR2 SOIC–14 2500/Tape & Reel MC14069UBDT TSSOP–14
MC14069UBF SOEIAJ–14
96/Rail
See Note 1.
MARKING
DIAGRAMS
1
14
PDIP–14
P SUFFIX
CASE 646
MC14069UBCP
AWLYYWW
SOIC–14
D SUFFIX
CASE 751A
TSSOP–14 DT SUFFIX
CASE 948G
1
14
14069U
AWLYWW
14
069U
ALYW
1
14
SOEIAJ–14
F SUFFIX
CASE 965
1
14
MC14069U
AWLYWW
MC14069UBFEL SOEIAJ–14 See Note 1.
1. For ordering information on the EIAJ version of
the SOIC packages, please contact your local ON Semiconductor representative.
MC14069UBDTR2 TSSOP–14 2500/Tape & Reel
MC14069UBDTEL TSSOP–14 2000/Tape & Reel
Page 2
MC14069UB
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2
PIN ASSIGNMENT
11
12
13
14
8
9
105
4
3
2
1
7
6
OUT 5
IN 5
OUT 6
IN 6
V
DD
OUT 4
IN 4
OUT 2
IN 2
OUT 1
IN 1
V
SS
OUT 3
IN 3
CIRCUIT SCHEMATIC
(1/6 OF CIRCUIT SHOWN)
LOGIC DIAGRAM
13
11
9
5
3
1
12
10
8
6
4
2
V
DD
= PIN 14
V
SS
= PIN 7
V
DD
V
SS
OUTPUTINPUT*
*Double diode protection on all
inputs not shown.
Figure 1. Switching Time Test Circuit and Waveforms
PULSE
GENERATOR
V
DD
VSS7
INPUT
OUTPUT
C
L
14
20 ns 20 ns
V
DD
V
SS
V
OH
V
OL
t
THL
t
TLH
OUTPUT
INPUT
t
PHL
t
PLH
90% 50% 10%
90% 50% 10%
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3
ELECTRICAL CHARACTERISTICS (Voltages Referenced to V
SS
)
Symbo
V
– 55_C
25_C
125_C
Characteristic
Symbo
l
V
DD
Vdc
Min
Max
Min
Typ
(4.)
Max
Min
Max
Unit
ООООООООО
Î
Output Voltage “0” Level
V
in
= V
DD
Î
Î
V
OL
Î
Î
5.0 10 15
Î
Î
— — —
Î
Î
0.05
0.05
0.05
ÎÎ
Î
— — —
Î
Î
0 0 0
ÎÎ
Î
0.05
0.05
0.05
Î
Î
— — —
Î
Î
0.05
0.05
0.05
Î
Î
Vdc
ООООООООО
Î
Vin = 0 “1” Level
Î
Î
V
OH
Î
Î
5.0 10 15
Î
Î
4.95
9.95
14.95
Î
Î
— — —
ÎÎ
Î
4.95
9.95
14.95
Î
Î
5.0 10 15
ÎÎ
Î
— — —
Î
Î
4.95
9.95
14.95
Î
Î
— — —
Î
Î
Vdc
ООООООООО
Î
ООООООООО
Î
Input Voltage “0” Level
(V
O
= 4.5 Vdc)
(V
O
= 9.0 Vdc)
(V
O
= 13.5 Vdc)
Î
Î
Î
Î
V
IL
Î
Î
Î
Î
5.0 10 15
Î
Î
Î
Î
— — —
Î
Î
Î
Î
1.0
2.0
2.5
ÎÎ
Î
ÎÎ
Î
— — —
Î
Î
Î
Î
2.25
4.50
6.75
ÎÎ
Î
ÎÎ
Î
1.0
2.0
2.5
Î
Î
Î
Î
— — —
Î
Î
Î
Î
1.0
2.0
2.5
Î
Î
Î
Î
Vdc
ООООООООО
Î
ООООООООО
Î
“1” Level
(V
O
= 0.5 Vdc)
(V
O
= 1.0 Vdc)
(V
O
= 1.5 Vdc)
Î
Î
Î
Î
V
IH
Î
Î
Î
Î
5.0 10 15
Î
Î
Î
Î
4.0
8.0
12.5
Î
Î
Î
Î
— — —
ÎÎ
Î
ÎÎ
Î
4.0
8.0
12.5
Î
Î
Î
Î
2.75
5.50
8.25
ÎÎ
Î
ÎÎ
Î
— — —
Î
Î
Î
Î
4.0
8.0
12.5
Î
Î
Î
Î
— — —
Î
Î
Î
Î
Vdc
ООООООООО
Î
ООООООООО
Î
ООООООООО
Î
Output Drive Current
(V
OH
= 2.5 Vdc) Source
(V
OH
= 4.6 Vdc)
(V
OH
= 9.5 Vdc)
(V
OH
= 13.5 Vdc)
Î
Î
Î
Î
Î
Î
I
OH
Î
Î
Î
Î
Î
Î
5.0
5.0 10 15
Î
Î
Î
Î
Î
Î
– 3.0
– 0.64
– 1.6 – 4.2
Î
Î
Î
Î
Î
Î
— — — —
ÎÎ
Î
ÎÎ
Î
ÎÎ
Î
– 2.4
– 0.51
– 1.3 – 3.4
Î
Î
Î
Î
Î
Î
– 4.2 – 0.88 – 2.25
– 8.8
ÎÎ
Î
ÎÎ
Î
ÎÎ
Î
— — — —
Î
Î
Î
Î
Î
Î
– 1.7
– 0.36
– 0.9 – 2.4
Î
Î
Î
Î
Î
Î
— — — —
Î
Î
Î
Î
Î
Î
mAdc
ООООООООО
Î
(VOL = 0.4 Vdc) Sink (V
OL
= 0.5 Vdc)
(V
OL
= 1.5 Vdc)
Î
Î
I
OL
Î
Î
5.0 10 15
Î
Î
0.64
1.6
4.2
Î
Î
— — —
ÎÎ
Î
0.51
1.3
3.4
Î
Î
0.88
2.25
8.8
ÎÎ
Î
— — —
Î
Î
0.36
0.9
2.4
Î
Î
— — —
Î
Î
mAdc
Input Current
I
in
15
± 0.1
±0.00001
± 0.1
± 1.0
µAdc
ООООООООО
Î
Input Capacitance
(V
in
= 0)
Î
Î
C
in
Î
Î
Î
Î
Î
Î
ÎÎ
Î
Î
Î
5.0
ÎÎ
Î
7.5
Î
Î
Î
Î
Î
Î
pF
ООООООООО
Î
Quiescent Current
(Per Package)
Î
Î
I
DD
Î
Î
5.0 10 15
Î
Î
— — —
Î
Î
0.25
0.5
1.0
ÎÎ
Î
— — —
Î
Î
0.0005
0.0010
0.0015
ÎÎ
Î
0.25
0.5
1.0
Î
Î
— — —
Î
Î
7.5 15 30
Î
Î
µAdc
ООООООООО
Î
ООООООООО
Î
Total Supply Current
(5.) (6.)
(Dynamic plus Quiescent, Per Gate) (C
L
= 50 pF)
Î
Î
Î
Î
I
T
Î
Î
Î
Î
5.0 10 15
ООООООООООООООО
Î
ООООООООООООООО
Î
IT = (0.3 µA/kHz) f + IDD/6 I
T
= (0.6 µA/kHz) f + IDD/6
I
T
= (0.9 µA/kHz) f + IDD/6
Î
Î
Î
Î
µAdc
ООООООООО
Î
ООООООООО
Î
Output Rise and Fall Times
(5.)
(CL = 50 pF)
t
TLH
, t
THL
= (1.35 ns/pF) C
L
+ 33 ns
t
TLH
, t
THL
= (0.60 ns/pF) C
L
+ 20 ns
t
TLH
, t
THL
= (0.40 ns/pF) C
L
+ 20 ns
Î
Î
Î
Î
t
TLH
,
t
THL
Î
Î
Î
Î
5.0 10 15
Î
Î
Î
Î
— — —
Î
Î
Î
Î
— — —
ÎÎ
Î
ÎÎ
Î
— — —
Î
Î
Î
Î
100
50 40
ÎÎ
Î
ÎÎ
Î
200 100
80
Î
Î
Î
Î
— — —
Î
Î
Î
Î
— — —
Î
Î
Î
Î
ns
ООООООООО
Î
ООООООООО
Î
ООООООООО
Î
Propagation Delay Times
(5.)
(CL = 50 pF)
t
PLH
, t
PHL
= (0.90 ns/pF) CL + 20 ns
t
PLH
, t
PHL
= (0.36 ns/pF) CL + 22 ns
t
PLH
, t
PHL
= (0.26 ns/pF) CL + 17 ns
Î
Î
Î
Î
Î
Î
t
PLH
,
t
PHL
Î
Î
Î
Î
Î
Î
5.0 10 15
Î
Î
Î
Î
Î
Î
— — —
Î
Î
Î
Î
Î
Î
— — —
ÎÎ
Î
ÎÎ
Î
ÎÎ
Î
— — —
Î
Î
Î
Î
Î
Î
65 40 30
ÎÎ
Î
ÎÎ
Î
ÎÎ
Î
125
75 55
Î
Î
Î
Î
Î
Î
— — —
Î
Î
Î
Î
Î
Î
— — —
Î
Î
Î
Î
Î
Î
ns
4. Data labelled “Typ” is not to be used for design purposes but is intended as an indication of the IC’s potential performance.
5. The formulas given are for the typical characteristics only at 25_C.
6. To calculate total supply current at loads other than 50 pF: I
T(CL
) = IT(50 pF) + (CL – 50) Vfk
where: I
T
is in µA (per package), CL in pF, V = (VDD – VSS) in volts, f in kHz is input frequency, and k = 0.002.
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MC14069UB
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4
P ACKAGE DIMENSIONS
P SUFFIX
PLASTIC DIP PACKAGE
CASE 646–06
ISSUE M
17
14 8
B
A
DIM MIN MAX MIN MAX
MILLIMETERSINCHES
A 0.715 0.770 18.16 18.80 B 0.240 0.260 6.10 6.60 C 0.145 0.185 3.69 4.69 D 0.015 0.021 0.38 0.53 F 0.040 0.070 1.02 1.78 G 0.100 BSC 2.54 BSC H 0.052 0.095 1.32 2.41 J 0.008 0.015 0.20 0.38 K 0.115 0.135 2.92 3.43 L M ––– 10 ––– 10 N 0.015 0.039 0.38 1.01
__
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS WHEN FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
5. ROUNDED CORNERS OPTIONAL.
F
HG
D
K
C
SEATING PLANE
N
–T–
14 PL
M
0.13 (0.005)
L
M
J
0.290 0.310 7.37 7.87
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MC14069UB
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5
P ACKAGE DIMENSIONS
D SUFFIX
PLASTIC SOIC PACKAGE
CASE 751A–03
ISSUE F
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION.
–A–
–B–
G
P
7 PL
14 8
71
M
0.25 (0.010) B
M
S
B
M
0.25 (0.010) A
S
T
–T–
F
R
X 45
SEATING PLANE
D 14 PL
K
C
J
M
_
DIM MIN MAX MIN MAX
INCHESMILLIMETERS
A 8.55 8.75 0.337 0.344 B 3.80 4.00 0.150 0.157 C 1.35 1.75 0.054 0.068 D 0.35 0.49 0.014 0.019
F 0.40 1.25 0.016 0.049
G 1.27 BSC 0.050 BSC
J 0.19 0.25 0.008 0.009 K 0.10 0.25 0.004 0.009 M 0 7 0 7
P 5.80 6.20 0.228 0.244 R 0.25 0.50 0.010 0.019
____
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6
P ACKAGE DIMENSIONS
DT SUFFIX
PLASTIC TSSOP PACKAGE
CASE 948G–01
ISSUE O
DIM MIN MAX MIN MAX
INCHESMILLIMETERS
A 4.90 5.10 0.193 0.200 B 4.30 4.50 0.169 0.177 C ––– 1.20 ––– 0.047 D 0.05 0.15 0.002 0.006
F 0.50 0.75 0.020 0.030 G 0.65 BSC 0.026 BSC H 0.50 0.60 0.020 0.024
J 0.09 0.20 0.004 0.008 J1 0.09 0.16 0.004 0.006 K 0.19 0.30 0.007 0.012
K1 0.19 0.25 0.007 0.010
L 6.40 BSC 0.252 BSC M 0 8 0 8
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. MOLD FLASH OR GATE BURRS SHALL NOT EXCEED
0.15 (0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED
0.25 (0.010) PER SIDE.
5. DIMENSION K DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE K DIMENSION AT MAXIMUM MATERIAL CONDITION.
6. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY.
7. DIMENSION A AND B ARE TO BE DETERMINED AT DATUM PLANE –W–.
____
S
U0.15 (0.006) T
2X L/2
S
U
M
0.10 (0.004) V
S
T
L
–U–
SEATING PLANE
0.10 (0.004)
–T–
SECTION N–N
DETAIL E
J
J1
K
K1
DETAIL E
F
M
–W–
0.25 (0.010)
8
14
7
1
PIN 1 IDENT.
H
G
A
D
C
B
S
U0.15 (0.006) T
–V–
14X REFK
N
N
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7
P ACKAGE DIMENSIONS
F SUFFIX
PLASTIC EIAJ SOIC PACKAGE
CASE 965–01
ISSUE O
H
E
A
1
DIM MIN MAX MIN MAX
INCHES
––– 2.05 ––– 0.081
MILLIMETERS
0.05 0.20 0.002 0.008
0.35 0.50 0.014 0.020
0.18 0.27 0.007 0.011
9.90 10.50 0.390 0.413
5.10 5.45 0.201 0.215
1.27 BSC 0.050 BSC
7.40 8.20 0.291 0.323
0.50 0.85 0.020 0.033
1.10 1.50 0.043 0.059 0
0.70 0.90 0.028 0.035
––– 1.42 ––– 0.056
A
1
H
E
Q
1
L
E
_
10
_
0
_
10
_
L
E
Q
1
_
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS AND ARE MEASURED AT THE PARTING LINE. MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.15 (0.006) PER SIDE.
4. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY.
5. THE LEAD WIDTH DIMENSION (b) DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE LEAD WIDTH DIMENSION AT MAXIMUM MATERIAL CONDITION. DAMBAR CANNOT BE LOCATED ON THE LOWER RADIUS OR THE FOOT. MINIMUM SPACE BETWEEN PROTRUSIONS AND ADJACENT LEAD TO BE 0.46 ( 0.018).
0.13 (0.005)
M
0.10 (0.004)
D
Z
E
1
14 8
7
e
A
b
VIEW P
c
L DETAIL P
M
A
b c D E e
0.50
M
Z
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MC14069UB
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8
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without further notice to any products herein. SCILLC makes no warranty , representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability , including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly , any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer .
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