Datasheet MC14067BDW, MC14067BCL, MC14067BCP Datasheet (Motorola)

Page 1
MOTOROLA CMOS LOGIC DATA
1
MC14067B MC14097B
Analog Multiplexers/Demultiplexers
The MC14067 and MC14097 multiplexers/demultiplexers are digitally controlled analog switches f eaturing low ON r esistance and very low leakage current. These devices can be used in either digital or analog applications.
The MC14067 is a 16–channel multiplexer/demultiplexer with an inhibit and four binary control inputs A, B, C, and D. These control inputs select 1–of–16 channels by turning O N the appropriate analog switch (see MC14067 truth table.)
The MC14097 is a differential 8–channel multiplexer/demultiplexer with an inhibit and three binary control inputs A, B, and C. These control inputs select 1 of 8 pairs of channels by turning ON the appropriate analog switches (see MC14097 truth table).
Low OFF Leakage Current
Matched Channel Resistance
Low Quiescent Power Consumption
Low Crosstalk Between Channels
Wide Operating Voltage Range: 3 to 18 V
Low Noise
Pin for Pin Replacement for CD4067B and CD4097B
MC14067B
16–Channel Analog
Multiplexer/Demultiplexer
MC14097B
Dual 8–Channel Analog
Multiplexer/Demultiplexer
CONTROLS
SWITCHES
IN/OUT
COMMON
OUT/IN
16
17
18
19
21
22
23
2
3
4
5
6
7
9
13
8
14
11
10
15
20
1
INHIBIT A B C D X0 X1 X2 X3 X4 X5 X6 X7 X8 X9 X10 X11 X12 X13 X14 X15
X
CONTROLS
SWITCHES
IN/OUT
COMMONS
OUT/IN
1
17
15
16
18
19
21
22
23
2
3
4
5
6
7
9 8
14
11
10
1320INHIBIT
A B C
X0 X1 X2 X3 X4 X5 X6 X7 Y0 Y1 Y2 Y3 Y4 Y5 Y6 Y7
X
Y
VDD = PIN 24 VSS = PIN 12
MOTOROLA
SEMICONDUCTOR TECHNICAL DATA
Motorola, Inc. 1995
REV 3 1/94
MC14067B MC14097B
L SUFFIX
CERAMIC
CASE 623
ORDERING INFORMATION
MC14XXXBCP Plastic MC14XXXBCL Ceramic MC14XXXBDW SOIC
TA = – 55° to 125°C for all packages.
P SUFFIX
PLASTIC
CASE 709
DW SUFFIX
SOIC
CASE 751E
Page 2
MOTOROLA CMOS LOGIC DATAMC14067B MC14097B
2
MAXIMUM RATINGS* (Voltages Referenced to V
SS
)
Symbol
Parameter
Value
Unit
V
DD
DC Supply Voltage
– 0.5 to + 18.0
V
Vin, V
out
Input or Output Voltage (DC or Transient)
– 0.5 to VDD + 0.5
V
I
in
Input Current (DC or Transient), per Control Pin
± 10
mA
I
sw
Switch Through Current
± 25
mA
P
D
Power Dissipation, per Package†
500
mW
T
stg
Storage Temperature
– 65 to + 150
_
C
T
L
Lead Temperature (8–Second Soldering)
260
_
C
*Maximum Ratings are those values beyond which damage to the device may occur. †Temperature Derating:
Plastic “P and D/DW” Packages: – 7.0 mW/_C From 65_C To 125_C Ceramic “L” Packages: – 12 mW/_C From 100_C To 125_C
MC14067 TRUTH TABLE
Control Inputs
Selected
A B C D Inh
Selected Channel
X X X X 1 None 0 0 0 0 0 X0 1 0 0 0 0 X1 0 1 0 0 0 X2
1 1 0 0 0 X3 0 0 1 0 0 X4 1 0 1 0 0 X5 0 1 1 0 0 X6
1 1 1 0 0 X7 0 0 0 1 0 X8 1 0 0 1 0 X9 0 1 0 1 0 X10
1 1 0 1 0 X11 0 0 1 1 0 X12 1 0 1 1 0 X13 0 1 1 1 0 X14 1 1 1 1 0 X15
MC14097 TRUTH TABLE
Control Inputs
Selected
A B C Inh
Selected
Channels
X X X 1 None 0 0 0 0 X0 Y0 1 0 0 0 X1 Y1 0 1 0 0 X2 Y2
1 1 0 0 X3 Y3 0 0 1 0 X4 Y4 1 0 1 0 X5 Y5 0 1 1 0 X6 Y6 1 1 1 0 X7 Y7
X = Don’t Care
MC14067 FUNCTIONAL DIAGRAM MC14097 FUNCTIONAL DIAGRAM
1–OF–16 DECODER
INHIBIT
A B C D
X15
X14
X13
X12
X11
X10
X9
X8
X7
X6
X5
X4
X3
X2
X1
X0
CONTROL
INPUTS
X
IN/OUT
X
OUT/IN
INHIBIT
A B
C
CONTROL
INPUTS
1–OF–8 DECODER
X7
X6
X5
X4
X3
X2
X1
X0
Y7
Y6
Y5
Y4
Y3
Y2
Y1
Y0
X
OUT/IN
Y
OUT/IN
X
IN/OUT
Y
IN/OUT
This device contains protection circuitry to guard against damage due to high static voltages or electric fields. However, pre­cautions must be taken to avoid applications of any voltage higher than maximum rated volt­ages to this high–impedance circuit. For proper operation, Vin and V
out
should be constrained
to the range VSS v (Vin or V
out
) v VDD.
Unused inputs must always be tied to an appropriate logic voltage level (e.g., either V
SS
or VDD). Unused outputs must be left open.
Page 3
MOTOROLA CMOS LOGIC DATA
3
MC14067B MC14097B
ELECTRICAL CHARACTERISTICS
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
– 55°C
25_C
125_C
Characteristic
Symbol
VDDTest Conditions
ÎÎ
ÎÎ
ÎÎ
Min
Max
Min
Typ #
Max
Min
Max
Unit
SUPPLY REQUIREMENTS (Voltages Referenced to VSS)
Power Supply Voltage
Range
V
DD
3.0
18
3.0
18
3.0
18
V
Quiescent Current Per
Package
I
DD
5.0 10 15
Control Inputs: Vin
=
VSS or VDD,
Switch I/O: VSS v V
I/O
v
VDD, and
V
switch
v
500 mV**
— — —
5.0 10 20
— — —
0.005
0.010
0.015
5.0 10 20
— — —
150 300 600
µA
Total Supply Current
(Dynamic Plus Quiescent, Per Package
I
D(AV)
5.0 10 15
TA = 25_C only (The
channel component, (Vin – V
out
)/Ron, is
not included.)
(0.07 µA/kHz) f + I
DD
Typical (0.20 µA/kHz) f + I
DD
(0.36 µA/kHz) f + I
DD
µA
CONTROL INPUTS — INHIBIT, A, B, C, D (Voltages Referenced to VSS)
Low–Level Input Voltage
V
IL
5.0 10 15
Ron = per spec, I
off
= per spec
— — —
1.5
3.0
4.0
— — —
2.25
4.50
6.75
1.5
3.0
4.0
— — —
1.5
3.0
4.0
V
High–Level Input Voltage
V
IH
5.0 10 15
Ron = per spec, I
off
= per spec
3.5
7.0 11
— — —
3.5
7.0 11
2.75
5.50
8.25
— — —
3.5
7.0 11
— — —
V
Input Leakage Current
I
in
15
Vin = 0 or V
DD
± 0.1
±0.00001
± 0.1
1.0
µA
Input Capacitance
C
in
5.0
7.5
pF
SWITCHES IN/OUT AND COMMONS OUT/IN — X, Y (Voltages Referenced to VSS)
Recommended Peak–to–
Peak Voltage Into or Out of the Switch
V
I/O
Channel On or Off
0
V
DD
0
V
DD
0
V
DDVp–p
Recommended Static or
Dynamic Voltage Across the Switch’* (Figure 1)
V
switch
Channel On
0
600
0
600
0
300
mV
Output Offset Voltage
V
OO
Vin = 0 V, No Load
10
µV
ON Resistance
R
on
5.0 10 15
V
switch
v 500 mV**,
Vin = VIL or V
IH
(Control), and V
in
0 to VDD (Switch)
— — —
800 400 220
— — —
250 120
80
1050
500 280
— — —
1300
550 320
ON Resistance Between
Any Two Channels in the Same Package
R
on
5.0 10 15
— — —
70 50 45
— — —
25 10 10
70 50 45
— — —
135
95 65
Off–Channel Leakage
Current (Figure 2)
I
off
15
Vin = VIL or V
IH
(Control) Channel to Channel or Any One Channel
± 100
± 0.05
± 100
±1000
nA
Capacitance, Switch I/O
C
I/O
Inhibit = V
DD
10
pF
Capacitance, Common O/I
C
O/I
Inhibit = V
DD
(MC14067B) (MC14097B)
———
— —
100
60
— —
———
pF
Capacitance, Feedthrough
(Channel Off)
C
I/O
——Pins Not Adjacent
Pins Adjacent
0.47
pF
Data labeled “Typ” is not to be used for design purposes, but is intended as an indication of the IC’s potential performance.
**For voltage drops across the switch (V
switch
) > 600 mV ( > 300 mV at high temperature), excessive VDD current may be drawn; i.e.
the current out of the switch may contain both VDD and switch input components. The reliability of the device will be unaffected unless the
Maximum Ratings are exceeded. (See first page of this data sheet.)
Page 4
MOTOROLA CMOS LOGIC DATAMC14067B MC14097B
4
ELECTRICAL CHARACTERISTICS (C
L
= 50 pF, TA = 25_C)
Characteristic
Symbol
VDD – V
SS
Vdc
Typ #
Max
Unit
Propagation Delay Times
Channel Input–to–Channel Output (RL = 200 k)
MC14067B
t
PLH,tPHL (Figure 3)
5.0 10 15
35 15 12
90 40 30
ns
MC14097B
5.0 10 15
25 10
7
65 25 18
ns
Control Input–to–Channel Output Channel Turn–On Time (RL = 10 k)
MC14067B/097B
t
PZH
, t
PZL
(Figure 4)
5.0 10 15
240 115
75
600 290 190
ns
Channel Turn–Off Time (RL = 300 k)
MC14067B/097B
t
PHZ,tPLZ (Figure 4)
5.0 10 15
250 120
75
625 300 190
ns
Any Pair of Address Inputs to Output
MC14067B
t
PLH
, t
PHL
5.0 10 15
280 115
85
700 290 215
ns
MC14097B
(Figure 10)
5.0 10 15
250 100
75
625 250 190
ns
Second Harmonic Distortion
(RL = 10 k, f = 1 kHz, Vin = 5 V
p–p
)
10
0.3
%
ON Channel Bandwidth
[RL = 1 k, Vin = 1/2 (VDD – VSS)
p–p
(sine–wave)]
20 Log10 (V
out/Vin
) = – 3 dB MC14067B
MC14097B
BW
(Figure 5)
10 10
15 25
— —
MHz
Off Channel Feedthrough Attenuation
[RL = 1 k, Vin = 1/2 (VDD–VSS)
p–p
(sine–wave)]
fin = 20 MHz – MC14067B fin = 12 MHz – MC14097B
(Figure 5)
10
– 40
dB
Channel Separation
[RL = 1 k, Vin = 1/2 (VDD–VSS)
p–p
(sine–wave)]
fin = 20 MHz—(Figure 6)
10
– 40
dB
Crosstalk, Control Inputs–to–Common O/I
(R1 = 1 k, RL = 10 k, Control tr = tf = 20 ns, Inhibit = VSS)
(Figure 7)
10
30
mV
#Data labelled “Typ” is not to be used for design purposes but is intended as an indication of the IC’s potential performance.
Page 5
MOTOROLA CMOS LOGIC DATA
5
MC14067B MC14097B
Figure 1. V Across Switch Figure 2. Off Channel Leakage
CONTROL
SECTION
OF IC
SOURCE
V
LOAD
ON SWITCH
CONTROL
SECTION
OF IC
OFF CHANNEL UNDER TEST
OTHER CHANNEL(S)
V
DD
V
SS
V
SS
V
DD
V
SS
V
DD
A
X3
X5
X6
X7
X
X1
X2
X4 X11
X10
X9
X8
V
DD
INHIBIT
X15
X14
5
4
3
2
1
10
9
8
7
6
14
15
16
17
18
19
20
13
11 12
21
22
23
24
D
C
X13
X12
B
V
SS
A
X0
MC14067B
PIN ASSIGNMENT
MC14097B
PIN ASSIGNMENT
X3
X5
X6
X7
X
X1
X2
X4 Y3
Y2
Y1
Y0
V
DD
Y7
Y6
Y
5
4
3
2
1
10
9
8
7
6
14
15
16
17
18
19
20
13
11 12
21
22
23
24
INHIBIT
C
Y5
Y4
B
V
SS
A
X0
Page 6
MOTOROLA CMOS LOGIC DATAMC14067B MC14097B
6
Figure 3. Propagation Delay Test Circuit
and Waveforms Vin to V
out
Figure 4. Turn–On and Delay Turn–Off
Test Circuit and Waveforms
V
DD
V
out
CL = 50 pF
R
L
V
in
A B C D
INH
V
in
V
out
20 ns
20 ns
V
DD
V
SS
50%
10%
t
PLH
t
PHL
90%
50%
PULSE
GENERATOR
V
C
A B C D
INH
R
L
CL = 50 pF
V
out
V
in
VDDVSSVSSV
DD
V
X
20 ns 20 ns
90% 50%
10%
90%
10%
V
out
V
out
V
C
50%
50%
t
PZH
, t
PZL
t
PHZ
, t
PLZ
Vin = V
DD
VX = V
SS
Vin = V
SS
VX = V
DD
Figure 5. Bandwidth and Off–Channel
Feedthrough Attenuation
Figure 6. Channel Separation
(Adjacent Channels Used for Setup)
A, B, and C inputs used to turn ON or OFF the switch under test.
A B C D
INH
V
in
R
L
CL = 50 pF
V
out
V
DD
R
L
V
out
CL = 50 pF
R
L
V
in
A B C D
INH
OFF
ON
Figure 7. Crosstalk, Control to Common O/I
V
C
A B C D
INH
R
L
CL = 50 pF
V
out
R1
Page 7
MOTOROLA CMOS LOGIC DATA
7
MC14067B MC14097B
Figure 8. Channel Resistance (RON) Test Circuit
V
DD
V
SS
10 k
KEITHLEY 160
DIGITAL
MULTIMETER
X–Y
PLOTTER
1 k
RANGE
V
DD
V
A
V
B
A B C D
INH
C
L
V
DD
V
out
V
out
V
B
V
A
50%
50%
t
PHL
t
PLH
50%
Figure 9. Propagation Delay, Any Pair of
Address Inputs to Output
TYPICAL RESISTANCE CHARACTERISTICS
Figure 10. VDD = 7.5 V, VSS = – 7.5 V Figure 11. VDD = 5.0 V, VSS = – 5.0 V
R
ON
, “ON” RESISTANCE (OHMS)
350 300
250
200
150
100
0
50
–8.0–10 –6.0 – 4.0 –2.0 0 0.2 4.0 6.0 8.0 10
Vin, INPUT VOLTAGE (VOLTS)
TA = 125°C
25°C
–55°C
R
ON
, “ON” RESISTANCE (OHMS)
350 300
250
200
150
100
0
50
–8.0–10 –6.0 – 4.0 –2.0 0 0.2 4.0 6.0 8.0 10
Vin, INPUT VOLTAGE (VOLTS)
TA = 125°C
25°C
–55°C
Figure 12. VDD = 2.5 V, VSS = – 2.5 V
R
ON
, “ON” RESISTANCE (OHMS)
700 600
500
400
300
200
0
100
–8.0–10 –6.0 – 4.0 –2.0 0 0.2 4.0 6.0 8.0 10
Vin, INPUT VOLTAGE (VOLTS)
TA = 125°C
25°C –55°C
Figure 13. Comparison at 25°C, VDD = –V
SS
R
ON
, “ON” RESISTANCE (OHMS)
350 300
250
200
150
100
0
50
–8.0–10 –6.0 – 4.0 –2.0 0 0.2 4.0 6.0 8.0 10
Vin, INPUT VOLTAGE (VOLTS)
TA = 25°C
VDD = 2.5 V
5.0 V
7.5 V
Page 8
MOTOROLA CMOS LOGIC DATAMC14067B MC14097B
8
APPLICATIONS INFORMATION
Figure A illustrates use of the Analog Multiplexer/Demulti­plexer. The 0–to–5 volt Digital Control signal is used to directly control a 5 V
p–p
analog signal.
The digital control logic levels are determined by VDD and VSS. The VDD voltage is the logic high voltage; the VSS volt­age is logic low. For the example. VDD = + 5 V = logic high at the control inputs; VSS = GND = 0 V = logic low.
The maximum analog signal level is determined by V
DD
and VSS. The analog voltage must swing neither higher than VDD nor lower than VSS. The example shows a 5 V
p–p
signal
which allows no margin at either peak. If voltage transients above VDD and/or below VSS are anticipated on the analog channels, external diodes (Dx) are recommended as shown in Figure B. These diodes should be small signal types able to absorb the maximum anticipated current surges during clipping.
The absolute maximum potential difference between V
DD
and VSS is 18.0 volts. Most parameters are specified up to 15 V w hich i s the recommended m aximum d ifference between VDD and VSS.
Figure A. Application Example
+5 V
V
DD
V
SS
5 V
p–p
ANALOG SIGNAL
0–TO–5 V DIGITAL
CONTROL SIGNALS
SWITCH
I/O
MC14067B MC14097B
COMMON
O/I
5 V
p–p
ANALOG SIGNAL
+5.0 V
+
2.5 V
GND
+5 V
EXTERNAL
CMOS
DIGITAL
CIRCUITRY
Figure B. External Germanium or Schottky Clipping Diodes
V
DD
V
DD
V
SS
V
SS
D
X
D
X
D
X
D
X
SWITCH
I/O
COMMON
O/I
Page 9
MOTOROLA CMOS LOGIC DATA
9
MC14067B MC14097B
OUTLINE DIMENSIONS
P SUFFIX
PLASTIC DIP PACKAGE
CASE 709–02
ISSUE C
L SUFFIX
CERAMIC DIP PACKAGE
CASE 623–05
ISSUE M
NOTES:
1. POSITIONAL TOLERANCE OF LEADS (D), SHALL BE WITHIN 0.25 (0.010) AT MAXIMUM MATERIAL CONDITION, IN RELATION TO SEATING PLANE AND EACH OTHER.
2. DIMENSION L TO CENTER OF LEADS WHEN FORMED PARALLEL.
3. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
DIM MIN MAX MIN MAX
INCHESMILLIMETERS
A 31.37 32.13 1.235 1.265 B 13.72 14.22 0.540 0.560 C 3.94 5.08 0.155 0.200 D 0.36 0.56 0.014 0.022 F 1.02 1.52 0.040 0.060 G 2.54 BSC 0.100 BSC H 1.65 2.03 0.065 0.080 J 0.20 0.38 0.008 0.015 K 2.92 3.43 0.115 0.135 L 15.24 BSC 0.600 BSC M 0 15 0 15 N 0.51 1.02 0.020 0.040
_ _ _ _
1 12
1324
B
H
A
F
D
G
K
SEATING PLANE
N
C
M
J
L
NOTES:
1. DIMENSION L TO CENTER OF LEADS WHEN FORMED PARALLEL.
2. LEADS WITHIN 0.13 (0.005) RADIUS OF TRUE POSITION AT SEATING PLANE AT MAXIMUM MATERIAL CONDITION (WHEN FORMED PARALLEL).
1 12
24 13
B
A
SEATING PLANE
F
D
G
K
N
C
M
J
L
DIM MIN MAX MIN MAX
INCHESMILLIMETERS
A 31.24 32.77 1.230 1.290 B 12.70 15.49 0.500 0.610 C 4.06 5.59 0.160 0.220 D 0.41 0.51 0.016 0.020 F 1.27 1.52 0.050 0.060 G 2.54 BSC 0.100 BSC J 0.20 0.30 0.008 0.012 K 3.18 4.06 0.125 0.160 L 15.24 BSC 0.600 BSC M 0 15 0 15 N 0.51 1.27 0.020 0.050
_ _ _ _
Page 10
MOTOROLA CMOS LOGIC DATAMC14067B MC14097B
10
OUTLINE DIMENSIONS
DW SUFFIX
PLASTIC SOIC PACKAGE
CASE 751E–04
ISSUE E
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.13 (0.005) TOTAL IN EXCESS OF D DIMENSION AT MAXIMUM MATERIAL CONDITION.
–A–
–B– P12X
D24X
12
1324
1
M
0.010 (0.25) B
M
S
A
M
0.010 (0.25) B
S
T
–T–
G
22X
SEATING PLANE
K
C
R
X 45
_
M
F
J
DIM MIN MAX MIN MAX
INCHESMILLIMETERS
A 15.25 15.54 0.601 0.612 B 7.40 7.60 0.292 0.299 C 2.35 2.65 0.093 0.104 D 0.35 0.49 0.014 0.019 F 0.41 0.90 0.016 0.035
G 1.27 BSC 0.050 BSC
J 0.23 0.32 0.009 0.013 K 0.13 0.29 0.005 0.011
M 0 8 0 8
P 10.05 10.55 0.395 0.415 R 0.25 0.75 0.010 0.029
____
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MC14067B/D
*MC14067B/D*
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