Datasheet MC14042BCL, MC14042BCP, MC14042BD Datasheet (Motorola)

Page 1
MOTOROLA CMOS LOGIC DATAMC14042B
156
  
The MC14042B Quad Transparent L atch is constructed w ith MOS P–channel a nd N –channel e nhancement m ode devices i n a single monolithic s tructure. Each l atch has a separate d ata input, b ut all four latches share a common clock. The clock polarity (high or low) used to strobe data through the latches can be reversed using the polarity input. Information present at the data input is transferred to outputs Q and Q
during the clock level which is determined by the polarity input. When the polarity input is in the logic “0” state, data is transferred during the low clock level, and when the polarity input is in the logic “1” state the transfer occurs during the high clock level.
Buffered Data Inputs
Common Clock
Clock Polarity Control
Q and Q
Outputs
Double Diode Input Protection
Supply Voltage Range = 3.0 Vdc to 1 8 Vdc
Capable of Driving Two Low–power TTL Loads or One Low–power
Schottky TTL Load Over the Rated Temperature Range
MAXIMUM RATINGS* (Voltages Referenced to V
SS
)
Symbol
Parameter
Value
Unit
V
DD
DC Supply Voltage
– 0.5 to + 18.0
V
Vin, V
out
Input or Output Voltage (DC or Transient)
– 0.5 to VDD + 0.5
V
lin, l
out
Input or Output Current (DC or Transient), per Pin
± 10
mA
P
D
Power Dissipation, per Package†
500
mW
T
stg
Storage Temperature
– 65 to + 150
_
C
T
L
Lead Temperature (8–Second Soldering)
260
_
C
*Maximum Ratings are those values beyond which damage to the device may occur. †Temperature Derating:
Plastic “P and D/DW” Packages: – 7.0 mW/_C From 65_C To 125_C Ceramic “L” Packages: – 12 mW/_C From 100_C To 125_C
LOGIC DIAGRAM
CLOCK
POLARITY
VDD = PIN 16
VSS = PIN 8
5
6
4
7
13
14
D3
D2
D1
D0
LATCH
1
LATCH
2
LATCH
3
LATCH
4
Q
2
Q
3
Q3
Q2
Q
1
Q1
Q
0
Q0
12
2 3
10
9
11
1
15

SEMICONDUCTOR TECHNICAL DATA
Motorola, Inc. 1995
REV 3 1/94

L SUFFIX
CERAMIC CASE 620
ORDERING INFORMATION
MC14XXXBCP Plastic MC14XXXBCL Ceramic MC14XXXBD SOIC
TA = – 55° to 125°C for all packages.
P SUFFIX
PLASTIC
CASE 648
D SUFFIX
SOIC
CASE 751B
PIN ASSIGNMENT
TRUTH TABLE
13
14
15
16
9
10
11
125
4
3
2
1
8
7
6
Q
2
D2
D3
Q
3
V
DD
Q
1
Q1
Q2
D0
Q
0
Q0
Q3
V
SS
D1
POLARITY
CLOCK
Clock Polarity Q
0 0 Data 1 0 Latch 1 1 Data 0 1 Latch
Page 2
MOTOROLA CMOS LOGIC DATA
157
MC14042B
ELECTRICAL CHARACTERISTICS (Voltages Referenced to V
SS
)
V
– 55_C
25_C
125_C
Characteristic
Symbol
V
DD
Vdc
Min
Max
Min
Typ #
Max
Min
ÎÎÎ
ÎÎÎ
ÎÎÎ
Max
Unit
“0” Level
Vin = VDD or 0
V
OL
5.0 10 15
— — —
0.05
0.05
0.05
— — —
0 0 0
0.05
0.05
0.05
— — —
ÎÎÎ
ÎÎÎ
ÎÎÎ
ÎÎÎ
0.05
0.05
0.05
Vdc
“1” Level
Vin = 0 or V
DD
V
OH
5.0 10 15
4.95
9.95
14.95
— — —
4.95
9.95
14.95
5.0 10 15
— — —
4.95
9.95
14.95
ÎÎÎ
ÎÎÎ
ÎÎÎ
ÎÎÎ
ÎÎÎ
— — —
Vdc
“0” Level (VO = 4.5 or 0.5 Vdc) (VO = 9.0 or 1.0 Vdc) (VO = 13.5 or 1.5 Vdc)
V
IL
5.0 10 15
— — —
1.5
3.0
4.0
— — —
2.25
4.50
6.75
1.5
3.0
4.0
— — —
ÎÎÎ
ÎÎÎ
ÎÎÎ
ÎÎÎ
ÎÎÎ
1.5
3.0
4.0
Vdc
“1” Level (VO = 0.5 or 4.5 Vdc) (VO = 1.0 or 9.0 Vdc) (VO = 1.5 or 13.5 Vdc)
V
IH
5.0 10 15
3.5
7.0 11
— — —
3.5
7.0 11
2.75
5.50
8.25
— — —
3.5
7.0 11
ÎÎÎ
ÎÎÎ
ÎÎÎ
ÎÎÎ
ÎÎÎ
— — —
Vdc
I
OH
5.0
5.0 10 15
– 3.0
– 0.64
– 1.6 – 4.2
— — — —
– 2.4
– 0.51
– 1.3 – 3.4
– 4.2 – 0.88 – 2.25
– 8.8
— — — —
– 1.7
– 0.36
– 0.9 – 2.4
ÎÎÎ
ÎÎÎ
ÎÎÎ
ÎÎÎ
ÎÎÎ
— — — —
mAdc
I
OL
5.0 10 15
0.64
1.6
4.2
— — —
0.51
1.3
3.4
0.88
2.25
8.8
— — —
0.36
0.9
2.4
ÎÎÎ
ÎÎÎ
ÎÎÎ
ÎÎÎ
ÎÎÎ
— — —
mAdc
Input Current
I
in
15
± 0.1
±0.00001
± 0.1
ÎÎÎ
ÎÎÎ
ÎÎÎ
± 1.0
µAdc
Input Capacitance
(Vin = 0)
C
in
5.0
7.5
ÎÎÎ
ÎÎÎ
ÎÎÎ
pF
Quiescent Current
(Per Package)
I
DD
5.0 10 15
— — —
1.0
2.0
4.0
— — —
0.002
0.004
0.006
1.0
2.0
4.0
— — —
ÎÎÎ
ÎÎÎ
ÎÎÎ
ÎÎÎ
ÎÎÎ
30 60
120
µAdc
Total Supply Current**†
(Dynamic plus Quiescent, Per Package) (CL = 50 pF on all outputs all buffers switching)
I
T
5.0 10 15
IT = (1.0 µA/kHz) f + I
DD
IT = (2.0 µA/kHz) f + I
DD
IT = (3.0 µA/kHz) f + I
DD
µAdc
#Data labelled “Typ” is not to be used for design purposes but is intended as an indication of the IC’s potential performance. **The formulas given are for the typical characteristics only at 25_C. †To calculate total supply current at loads other than 50 pF:
IT(CL) = IT(50 pF) + (CL – 50) Vfk
where: IT is in µA (per package), CL in pF, V = (VDD – VSS) in volts, f in kHz is input frequency, and k = 0.004.
This device contains protection circuitry to guard against damage due to high static voltages or electric fields. However, precautions must be taken to avoid applications of any voltage higher than maximum rated voltages to this high-impedance circuit. For proper operation, Vin and V
out
should be constrained to the range VSS (Vin or V
out
) VDD.
Unused inputs must always be tied to an appropriate logic voltage level (e.g., either VSS or VDD). Unused outputs must be left open.
Output Voltage
Input Voltage
Output Drive Current
(VOH = 2.5 Vdc) Source (VOH = 4.6 Vdc) (VOH = 9.5 Vdc) (VOH = 13.5 Vdc)
(VOL = 0.4 Vdc) Sink (VOL = 0.5 Vdc) (VOL = 1.5 Vdc)
Page 3
MOTOROLA CMOS LOGIC DATAMC14042B
158
SWITCHING CHARACTERISTICS* (C
L
= 50 pF, TA = 25_C)
Characteristic
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
Symbol
V
DD
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
Min
Typ #
Max
Unit
Output Rise and Fall Time
t
TLH
, t
THL
= (1.5 ns/pF) CL + 25 ns
t
TLH
, t
THL
= (0.75 ns/pF) CL + 12.5 ns
t
TLH
, t
THL
= (0.55 ns/pF) CL + 9.5 ns
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
t
TLH
,
t
THL
5.0 10 15
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
— — —
100
50 40
200 100
80
ns
Propagation Delay Time, D to Q, Q
t
PLH
, t
PHL
= (1.7 ns/pF) CL + 135 ns
t
PLH
, t
PHL
= (0.66 ns/pF) CL + 57 ns
t
PLH
, t
PHL
= (0.5 ns/pF) CL + 35 ns
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
t
PLH
,
t
PHL
5.0 10 15
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
— — —
220
90 60
440 180 120
no
Propagation Delay Time, Clock to Q, Q
t
PLH
, t
PHL
= (1.7 ns/pF) CL + 135 ns
t
PLH
, t
PHL
= (0.66 ns/pF) CL + 57 ns
t
PLH
, t
PHL
= (0.5 ns/pF) CL + 35 ns
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
t
PLH
,
t
PHL
5.0 10 15
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
— — —
220
90 60
440 180 120
ns
Clock Pulse Width
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
t
WH
5.0 10 15
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
300 100
80
150
50 40
— — —
ns
Clock Pulse Rise and Fall Time
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
t
TLH
,
t
THL
5.0 10 15
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
— — —
— — —
15
5.0
4.0
µs
Hold Time
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
t
h
5.0 10 15
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
100
50 40
50 25 20
— — —
ns
Setup Time
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
t
su
5.0 10 15
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
50 30 25
0 0 0
— — —
ns
*The formulas given are for the typical characteristics only at 25_C. #Data labelled “Typ” is not to be used for design purposes but is intended as an indication of the IC’s potential performance.
Figure 1. AC and Power Dissipation Test Circuit and Timing Diagram
(Data to Output)
V
DD
V
SS
PULSE
GENERATOR 1
16
5 6 4
7 13 14
CLOCK POLARITY D0 D1 D2 D3 Q
3
Q3
Q
2
Q2
Q1
Q1
Q
0
Q0
15
1
12
11
9
10
3
2
8
For Power Dissipation test, each output is loaded with capacitance CL.
1
f
20 ns 20 ns
DATA INPUT
Q OUTPUT
Q
OUTPUT
t
PLH
t
PHL
t
TLH
t
THL
t
TLH
t
THL
90%
50%
10%
50%
90%
10%
90%
10%
50%
t
PHL
Page 4
MOTOROLA CMOS LOGIC DATA
159
MC14042B
Figure 2. AC Test Circuit and Timing Diagram
(Clock to Output)
NOTE: CL connected to output under test.
20* ns 20 ns
90%
10%
PULSE
GENERATOR 1
PULSE
GENERATOR 2
V
DD
16
5 6
4
7 13 14
CLOCK POLARITY
D0 D1 D2 D3 Q
3
Q3
Q
2
Q2
Q
1
Q1
Q
0
Q0
VSS8
15
1
12
11
9
10
3
2
50%
t
WH
20 ns
90%
50%
t
su
t
h
t
PLH
90%
50%
10%
CLOCK INPUT
P.G. 1
DATA INPUT
P.G. 2
Q OUTPUT
*Input clock rise time is 20 ns except for maximum rise time test.
Page 5
MOTOROLA CMOS LOGIC DATAMC14042B
160
OUTLINE DIMENSIONS
P SUFFIX
PLASTIC DIP PACKAGE
CASE 648–08
ISSUE R
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS WHEN FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
5. ROUNDED CORNERS OPTIONAL.
–A–
B
F
C
S
H
G
D
J
L
M
16 PL
SEATING
1 8
916
K
PLANE
–T–
M
A
M
0.25 (0.010) T
DIM MIN MAX MIN MAX
MILLIMETERSINCHES
A 0.740 0.770 18.80 19.55 B 0.250 0.270 6.35 6.85 C 0.145 0.175 3.69 4.44 D 0.015 0.021 0.39 0.53 F 0.040 0.70 1.02 1.77 G 0.100 BSC 2.54 BSC H 0.050 BSC 1.27 BSC J 0.008 0.015 0.21 0.38 K 0.110 0.130 2.80 3.30 L 0.295 0.305 7.50 7.74 M 0 10 0 10 S 0.020 0.040 0.51 1.01
____
L SUFFIX
CERAMIC DIP PACKAGE
CASE 620–10
ISSUE V
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN FORMED PARALLEL.
4. DIMENSION F MAY NARROW TO 0.76 (0.030) WHERE THE LEAD ENTERS THE CERAMIC BODY.
–A–
–B–
–T–
F
E
G
N
K
C
SEATING PLANE
16 PLD
S
A
M
0.25 (0.010) T
16 PLJ
S
B
M
0.25 (0.010) T
M
L
DIM MIN MAX MIN MAX
MILLIMETERSINCHES
A 0.750 0.785 19.05 19.93 B 0.240 0.295 6.10 7.49 C ––– 0.200 ––– 5.08 D 0.015 0.020 0.39 0.50 E 0.050 BSC 1.27 BSC F 0.055 0.065 1.40 1.65 G 0.100 BSC 2.54 BSC H 0.008 0.015 0.21 0.38 K 0.125 0.170 3.18 4.31 L 0.300 BSC 7.62 BSC M 0 15 0 15 N 0.020 0.040 0.51 1.01
_ _ _ _
16 9
1 8
Page 6
MOTOROLA CMOS LOGIC DATA
161
MC14042B
OUTLINE DIMENSIONS
D SUFFIX
PLASTIC SOIC PACKAGE
CASE 751B–05
ISSUE J
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION.
1 8
16 9
SEATING
PLANE
F
J
M
R
X 45
_
G
8 PLP
–B–
–A–
M
0.25 (0.010) B
S
–T–
D
K
C
16 PL
S
B
M
0.25 (0.010) A
S
T
DIM MIN MAX MIN MAX
INCHESMILLIMETERS
A 9.80 10.00 0.386 0.393 B 3.80 4.00 0.150 0.157 C 1.35 1.75 0.054 0.068 D 0.35 0.49 0.014 0.019 F 0.40 1.25 0.016 0.049
G 1.27 BSC 0.050 BSC
J 0.19 0.25 0.008 0.009 K 0.10 0.25 0.004 0.009
M 0 7 0 7
P 5.80 6.20 0.229 0.244 R 0.25 0.50 0.010 0.019
_ _ _ _
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MC14042B/D
*MC14042B/D*
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