The B Series logic gates are constructed with P and N channel
enhancement mode devices in a single monolithic structure
(Complementary MOS). Their primary use is where low power
dissipation and/or high noise immunity is desired.
• Supply Voltage Range = 3.0 Vdc to 18 Vdc
• All Outputs Buffered
• Capable of Driving T wo Low–power TTL Loads or One Low–power
Schottky TTL Load Over the Rated T emperature Range.
• Double Diode Protection on All Inputs
• Pin–for–Pin Replacements for Corresponding CD4000 Series B
Suffix Devices
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14
PDIP–14
P SUFFIX
CASE 646
MARKING
DIAGRAMS
MC14012BCP
AWLYYWW
1
MAXIMUM RATINGS (Voltages Referenced to V
Symbol
V
DD
Vin, V
Iin, I
P
T
T
stg
T
2. Maximum Ratings are those values beyond which damage to the device
may occur.
3. Temperature Derating:
Plastic “P and D/DW” Packages: – 7.0 mW/_C From 65_C To 125_C
This device contains protection circuitry to guard against damage due to high
static voltages or electric fields. However, precautions must be taken to avoid
applications of any voltage higher than maximum rated voltages to this
high–impedance circuit. For proper operation, V
to the range V
Unused inputs must always be tied to an appropriate logic voltage level (e.g.,
either V
DC Supply Voltage Range–0.5 to +18.0V
Input or Output Voltage Range
out
Input or Output Current
out
Power Dissipation,
D
Ambient Temperature Range–55 to +125°C
A
Storage Temperature Range–65 to +150°C
Lead Temperature
L
SS
or VDD). Unused outputs must be left open.
SS
ParameterValueUnit
(DC or Transient)
(DC or Transient) per Pin
per Package (Note 3.)
(8–Second Soldering)
v (Vin or V
) v VDD.
out
) (Note 2.)
SS
–0.5 to VDD + 0.5V
±10mA
500mW
260°C
and V
in
should be constrained
out
14
SOIC–14
D SUFFIX
CASE 751A
SOEIAJ–14
F SUFFIX
CASE 965
A= Assembly Location
WL or L = Wafer Lot
YY or Y = Year
WW or W = Work Week
, DRAIN–TO–SOURCE VOLTAGE (Vdc)VDS, DRAIN–TO–SOURCE VOLTAGE (Vdc)
V
DS
TA = – 55°C
– 40°C
+ 25°C
+ 85°C
+ 125°C
106.02.02016128.04.01814
– 100
DRAIN CURRENT (mA)
D
I ,
– 90
– 80
– 70
– 60
– 50
– 40
– 30
– 20
– 10
TA = – 55°C
– 40°C
+ 25°C
+ 85°C
+ 125°C
0
0
– 10– 6.0– 2.0– 20– 16– 12– 8.0– 4.0– 18– 14
Figure 6. VGS = 15 VdcFigure 7. VGS = – 15 Vdc
These typical curves are not guarantees, but are design aids.
Caution: The maximum rating for output current is 10 mA per pin.
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4
Page 5
MC14012B
1
TYPICAL B–SERIES GATE CHARACTERISTICS (cont’d)
VOLTAGE TRANSFER CHARACTERISTICS
5.0
4.0
3.0
OUTPUT VOLTAGE (Vdc)
2.0
out
V ,
1.0
OUTPUT VOLTAGE (Vdc)
out
V ,
8.0
6.0
4.0
2.0
SINGLE INPUT NAND, AND
MULTIPLE INPUT NOR, OR
SINGLE INPUT NOR, OR
MULTIPLE INPUT NAND, AND
0
1.03.05.04.02.00
V
, INPUT VOLTAGE (Vdc)
in
OUTPUT VOLTAGE (Vdc)
out
V ,
8.0
6.0
4.0
2.0
10
0
0
2.06.0108.04.0
SINGLE INPUT NAND, AND
MULTIPLE INPUT NOR, OR
SINGLE INPUT NOR, OR
MULTIPLE INPUT NAND, AND
, INPUT VOLTAGE (Vdc)
V
in
Figure 8. VDD = 5.0 VdcFigure 9. VDD = 10 Vdc
6
14
12
10
SINGLE INPUT NAND, AND
MULTIPLE INPUT NOR, OR
SINGLE INPUT NOR, OR
MULTIPLE INPUT NAND, AND
The DC noise margin is defined as the input voltage range
from an ideal “1” or “0” input level which does not produce
output state change(s). The typical and guaranteed limit
values of the input values V
DC NOISE MARGIN
and VIH for the output(s) to
IL
be at a fixed voltage VO are given in the Electrical
Characteristics table. VIL and VIH are presented graphically
in Figure 11.
Guaranteed minimum noise margins for both the “1” and
“0” levels =
1.0 V with a 5.0 V supply
0
0
2.06.0108.04.0
, INPUT VOLTAGE (Vdc)
V
in
Figure 10. VDD = 15 Vdc
2.0 V with a 10.0 V supply
2.5 V with a 15.0 V supply
V
V
out
DD
V
O
V
O
0
V
IL
V
V
DD
V
in
IH
VSS = 0 VOLTS DC
V
V
out
DD
V
O
V
O
V
DD
0
V
IL
V
V
in
IH
(a) Inverting Function(b) Non–Inverting Function
Figure 11. DC Noise Immunity
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5
Page 6
MC14012B
P ACKAGE DIMENSIONS
P SUFFIX
PLASTIC DIP PACKAGE
CASE 646–06
ISSUE M
148
B
17
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
–B–
P
7 PL
M
71
0.25 (0.010)B
C
R X 45
K
M
S
B
T
S
M
_
M
F
J
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS D AND E DO NOT INCLUDE
MOLD FLASH OR PROTRUSIONS AND ARE
Q
1
c
MEASURED AT THE PARTING LINE. MOLD FLASH
OR PROTRUSIONS SHALL NOT EXCEED 0.15
(0.006) PER SIDE.
4. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
5. THE LEAD WIDTH DIMENSION (b) DOES NOT
INCLUDE DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08 (0.003)
TOTAL IN EXCESS OF THE LEAD WIDTH
DIMENSION AT MAXIMUM MATERIAL CONDITION.
DAMBAR CANNOT BE LOCATED ON THE LOWER
RADIUS OR THE FOOT. MINIMUM SPACE
BETWEEN PROTRUSIONS AND ADJACENT LEAD
TO BE 0.46 ( 0.018).
MILLIMETERS
DIM MINMAXMINMAX
–––2.05––– 0.081
A
A
0.050.20 0.002 0.008
1
0.350.50 0.014 0.020
b
0.180.27 0.0070.011
c
9.90 10.50 0.390 0.413
D
5.105.45 0.201 0.215
E
1.27 BSC0.050 BSC
e
H
7.408.20 0.291 0.323
E
0.500.85 0.020 0.033
0.50
L
1.101.50 0.043 0.059
E
0
M
_
Q
0.700.90 0.028 0.035
1
–––1.42––– 0.056
Z
INCHES
10
_
10
0
_
_
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Page 8
MC14012B
ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes
without further notice to any products herein. SCILLC makes no warranty , representation or guarantee regarding the suitability of its products for any particular
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including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or
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MC14012B/D
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