Page 1
MOTOROLA CMOS LOGIC DATA
37
MC14008B
The MC14008B 4–bit full adder is constructed with MOS P–channel and
N–channel enhancement mode devices in a single monolithic structure. This
device consists of four full adders with fast internal look–ahead carry output.
It is useful in binary addition and other arithmetic applications. The fast
parallel carry output bit allows high–speed operation when used with other
adders in a system.
• Look–Ahead Carry Output
• Diode Protection on All Inputs
• All Outputs Buffered
• Supply Voltage Range = 3.0 Vdc to 18 Vdc
• Capable of Driving Two Low–power TTL Loads or One Low–power
Schottky TTL Load Over the Rated Temperature Range
• Pin–for–Pin Replacement for CD4008B
MAXIMUM RATINGS* (Voltages Referenced to V
SS
)
Symbol
Parameter
Value
Unit
V
DD
DC Supply Voltage
– 0.5 to + 18.0
V
Vin, V
out
Input or Output Voltage (DC or Transient)
– 0.5 to VDD + 0.5
V
lin, l
out
Input or Output Current (DC or Transient),
per Pin
± 10
mA
P
D
Power Dissipation, per Package†
500
mW
T
stg
Storage Temperature
– 65 to + 150
_
C
T
L
Lead Temperature (8–Second Soldering)
260
_
C
*Maximum Ratings are those values beyond which damage to the device may occur.
†Temperature Derating:
Plastic “P and D/DW” Packages: – 7.0 mW/_C From 65_C To 125_C
Ceramic “L” Packages: – 12 mW/_C From 100_C To 125_C
BLOCK DIAGRAM
HIGH–SPEED
PARALLEL CARRY
14 C
out
13 S4
12 S3
11 S2
10 S1
B4 15
A4 1
B3 2
A3 3
B2 4
A2 5
B1 6
A1 7
Cin9
ADDER
4
ADDER
3
ADDER
2
ADDER
1
C4
C3
C2
VDD = PIN 16
VSS = PIN 8
SEMICONDUCTOR TECHNICAL DATA
Motorola, Inc. 1995
REV 3
1/94
TRUTH TABLE
(One Stage)
L SUFFIX
CERAMIC
CASE 620
ORDERING INFORMATION
MC14XXXBCP Plastic
MC14XXXBCL Ceramic
MC14XXXBD SOIC
TA = – 55° to 125°C for all packages.
P SUFFIX
PLASTIC
CASE 648
D SUFFIX
SOIC
CASE 751B
13
14
15
16
9
10
11
125
4
3
2
1
8
7
6
S3
S4
C
out
B4
V
DD
C
in
S1
S2
B2
A3
B3
A4
V
SS
A1
B1
A2
PIN ASSIGNMENT
C
in
B A C
out
S
0 0 0 0 0
0 0 1 0 1
0 1 0 0 1
0 1 1 1 0
1 0 0 0 1
1 0 1 1 0
1 1 0 1 0
1 1 1 1 1
Page 2
MOTOROLA CMOS LOGIC DATAMC14008B
38
ELECTRICAL CHARACTERISTICS (Voltages Referenced to V
SS
)
V
– 55_C
25_C
125_C
Characteristic
Symbol
V
DD
Vdc
Min
Max
Min
Typ #
Max
Min
ÎÎÎ
ÎÎÎ
ÎÎÎ
Max
Unit
“0” Level
Vin = VDD or 0
V
OL
5.0
10
15
—
—
—
0.05
0.05
0.05
—
—
—
0
0
0
0.05
0.05
0.05
—
—
—
ÎÎÎ
ÎÎÎ
ÎÎÎ
ÎÎÎ
0.05
0.05
0.05
Vdc
“1” Level
V
OH
5.0
10
15
4.95
9.95
14.95
—
—
—
4.95
9.95
14.95
5.0
10
15
—
—
—
4.95
9.95
14.95
ÎÎÎ
ÎÎÎ
ÎÎÎ
ÎÎÎ
ÎÎÎ
—
—
—
Vdc
“0” Level
(VO = 4.5 or 0.5 Vdc)
(VO = 9.0 or 1.0 Vdc)
(VO = 13.5 or 1.5 Vdc)
V
IL
5.0
10
15
—
—
—
1.5
3.0
4.0
—
—
—
2.25
4.50
6.75
1.5
3.0
4.0
—
—
—
ÎÎÎ
ÎÎÎ
ÎÎÎ
ÎÎÎ
ÎÎÎ
1.5
3.0
4.0
Vdc
“1” Level
(VO = 1.0 or 9.0 Vdc)
(VO = 1.5 or 13.5 Vdc)
V
IH
5.0
10
15
3.5
7.0
11
—
—
—
3.5
7.0
11
2.75
5.50
8.25
—
—
—
3.5
7.0
11
ÎÎÎ
ÎÎÎ
ÎÎÎ
ÎÎÎ
—
—
—
Vdc
I
OH
5.0
5.0
10
15
– 3.0
– 0.64
– 1.6
– 4.2
—
—
—
—
– 2.4
– 0.51
– 1.3
– 3.4
– 4.2
– 0.88
– 2.25
– 8.8
—
—
—
—
– 1.7
– 0.36
– 0.9
– 2.4
ÎÎÎ
ÎÎÎ
ÎÎÎ
ÎÎÎ
ÎÎÎ
ÎÎÎ
—
—
—
—
mAdc
I
OL
5.0
10
15
0.64
1.6
4.2
—
—
—
0.51
1.3
3.4
0.88
2.25
8.8
—
—
—
0.36
0.9
2.4
ÎÎÎ
ÎÎÎ
ÎÎÎ
ÎÎÎ
—
—
—
mAdc
Input Current
I
in
15
—
± 0.1
—
±0.00001
± 0.1
—
ÎÎÎ
ÎÎÎ
ÎÎÎ
± 1.0
µAdc
Input Capacitance
(Vin = 0)
C
in
—
—
—
—
5.0
7.5
—
ÎÎÎ
ÎÎÎ
ÎÎÎ
ÎÎÎ
—
pF
Quiescent Current
(Per Package)
I
DD
5.0
10
15
—
—
—
5.0
10
20
—
—
—
0.005
0.010
0.015
5.0
10
20
—
—
—
ÎÎÎ
ÎÎÎ
ÎÎÎ
ÎÎÎ
150
300
600
µAdc
Total Supply Current**†
(Dynamic plus Quiescent,
Per Package)
(CL = 50 pF on all outputs, all
buffers switching)
I
T
5.0
10
15
IT = (1.7 µA/kHz) f + I
DD
IT = (3.4 µA/kHz) f + I
DD
IT = (5.0 µA/kHz) f + I
DD
µAdc
#Data labelled “Typ” is not to be used for design purposes but is intended as an indication of the IC’s potential performance.
**The formulas given are for the typical characteristics only at 25_C.
†To calculate total supply current at loads other than 50 pF:
IT(CL) = IT(50 pF) + (CL – 50) Vfk
where: IT is in µA (per package), CL in pF, V = (VDD – VSS) in volts, f in kHz is input frequency, and k = 0.005.
This device contains protection circuitry to guard against damage due to high static voltages or electric fields. However,
precautions must be taken to avoid applications of any voltage higher than maximum rated voltages to this high-impedance
circuit. For proper operation, Vin and V
out
should be constrained to the range VSS ≤ (Vin or V
out
) ≤ VDD.
Unused inputs must always be tied to an appropriate logic voltage level (e.g., either VSS or VDD). Unused outputs must
be left open.
Output Voltage
Vin = 0 or V
DD
Input Voltage
(VO = 0.5 or 4.5 Vdc)
Output Drive Current
(VOH = 2.5 Vdc) Source
(VOH = 4.6 Vdc)
(VOH = 9.5 Vdc)
(VOH = 13.5 Vdc)
(VOL = 0.4 Vdc) Sink
(VOL = 0.5 Vdc)
(VOL = 1.5 Vdc)
Page 3
MOTOROLA CMOS LOGIC DATA
39
MC14008B
SWITCHING CHARACTERISTICS* (C
L
= 50 pF, TA = 25_C)
Characteristic
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
Symbol
V
DD
Vdc
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
Min
Typ #
Max
Unit
Output Rise and Fall Time
t
TLH
, t
THL
= (1.5 ns/pF) CL + 25 ns
t
TLH
, t
THL
= (0.75 ns/pF) CL + 12.5 ns
t
TLH
, t
THL
= (0.55 ns/pF) CL + 9.5 ns
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
t
TLH
,
t
THL
5.0
10
15
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
—
—
—
100
50
40
200
100
80
ns
Propagation Delay Time
Sum in to Sum Out
t
PLH
, t
PHL
= (1.7 ns/pF) CL + 315 ns
t
PLH
, t
PHL
= (0.66 ns/pF) CL + 127 ns
t
PLH
, t
PHL
= (0.5 ns/pF) CL + 90 ns
Sum In to Carry Out
t
PLH
, t
PHL
= (1.7 ns/pF) CL + 220 ns
t
PLH
, t
PHL
= (0.66 ns/pF) CL + 112 ns
t
PLH
, t
PHL
= (0.5 ns/pF) CL + 85 ns
Carry In to Sum Out
t
PLH
, t
PHL
= (1.7 ns/pF) CL + 290 ns
t
PLH
, t
PHL
= (0.66 ns/pF) CL + 122 ns
t
PLH
, t
PHL
= (0.5 ns/pF) CL + 90 ns
Carry In to Carry Out
t
PLH
, t
PHL
= (1.7 ns/pF) CL + 85 ns
t
PLH
, t
PHL
= (0.66 ns/pF) CL + 42 ns
t
PLH
, t
PHL
= (0.5 ns/pF) CL + 30 ns
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
t
PLH
, t
PHL
5.0
10
15
5.0
10
15
5.0
10
15
5.0
10
15
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
—
—
—
—
—
—
—
—
—
—
—
—
400
160
115
305
145
110
375
155
115
170
75
55
800
320
230
610
290
220
750
310
230
340
150
110
ns
*The formulas given are for the typical characteristics only at 25_C.
#Data labelled “Typ” is not to be used for design purposes but is intended as an indication of the IC’s potential performance.
Figure 1. Typical Source Current
Characteristics Test Circuit
Figure 2. Typical Sink Current
Characteristics Test Circuit
VDD = –V
GS
V
out
16
B4
A4
B3
A3
B2
A2
B1
A1
C
in
S4
S3
S2
S1
C
out
I
OH
8 V
SS
EXTERNAL
POWER
SUPPLY
EXTERNAL
POWER
SUPPLY
I
OL
VDD = V
GS
V
out
16
B4
A4
B3
A3
B2
A2
B1
A1
C
in
S4
S3
S2
S1
C
out
8 V
SS
Page 4
MOTOROLA CMOS LOGIC DATAMC14008B
40
Figure 3. Dynamic Power Dissipation Test Circuit and Waveform
20 ns 20 ns
V
in
90%
10%
V
DD
V
SS
PULSE
GENERATOR
V
DD
16
B4
A4
B3
A3
B2
A2
B1
A1
C
in
S4
S3
S2
S1
C
out
I
DD
8 V
SS
C
L
C
L
C
L
C
L
C
L
500
µ
F
Figure 4. Switching Time Test Circuit and Waveforms
PULSE
GENERATOR
V
DD
16
B4
A4
B3
A3
B2
A2
B1
A1
C
in
S4
S3
S2
S1
C
out
I
DD
8 V
SS
C
L
C
L
C
L
C
L
C
L
20 ns 20 ns
C
in
S1– S4
C
out
V
DD
V
SS
V
OH
V
OL
V
OH
V
OL
t
PLH
t
PHL
t
THL
t
TLH
t
PLH
t
PHL
90%
50%
10%
90%
50%
10%
50%
Page 5
MOTOROLA CMOS LOGIC DATA
41
MC14008B
Figure 5. Logic Diagram
C
in
A1
B1
A2
B2
A3
B3
A4
B4
S1
S2
S3
S4
C
out
Page 6
MOTOROLA CMOS LOGIC DATAMC14008B
42
Figure 6. Using the MC14008B in a 16–Bit Adder Configuration
WORD A + B INPUTS
A1 B4 A1 B4 A1 B4 A1 B4
S1 S4 S1 S4 S1 S4 S1 S4
C
in
C
in
C
in
C
in
C
out
C
out
C
out
C
out
CHIP
1
CHIP
2
CHIP
3
CHIP
4
SUM OUTPUTS
Calculation of 16–bit adder speed:
tP total = tP (Sum to Carry) + tP (Carry to Sum) + 2 tP (Carry to Carry)
The guaranteed 16–bit adder speed at 10 V , 25°C, CL = 50 pF is:
tp total = 290 + 310 + 300 = 900 ns
TYPICAL APPLICATION
Page 7
MOTOROLA CMOS LOGIC DATA
43
MC14008B
OUTLINE DIMENSIONS
P SUFFIX
PLASTIC DIP PACKAGE
CASE 648–08
ISSUE R
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
5. ROUNDED CORNERS OPTIONAL.
–A–
B
F
C
S
H
G
D
J
L
M
16 PL
SEATING
1 8
916
K
PLANE
–T–
M
A
M
0.25 (0.010) T
DIM MIN MAX MIN MAX
MILLIMETERSINCHES
A 0.740 0.770 18.80 19.55
B 0.250 0.270 6.35 6.85
C 0.145 0.175 3.69 4.44
D 0.015 0.021 0.39 0.53
F 0.040 0.70 1.02 1.77
G 0.100 BSC 2.54 BSC
H 0.050 BSC 1.27 BSC
J 0.008 0.015 0.21 0.38
K 0.110 0.130 2.80 3.30
L 0.295 0.305 7.50 7.74
M 0 10 0 10
S 0.020 0.040 0.51 1.01
____
L SUFFIX
CERAMIC DIP PACKAGE
CASE 620–10
ISSUE V
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
4. DIMENSION F MAY NARROW TO 0.76 (0.030)
WHERE THE LEAD ENTERS THE CERAMIC
BODY.
–A–
–B–
–T–
F
E
G
N
K
C
SEATING
PLANE
16 PLD
S
A
M
0.25 (0.010) T
16 PLJ
S
B
M
0.25 (0.010) T
M
L
DIM MIN MAX MIN MAX
MILLIMETERSINCHES
A 0.750 0.785 19.05 19.93
B 0.240 0.295 6.10 7.49
C ––– 0.200 ––– 5.08
D 0.015 0.020 0.39 0.50
E 0.050 BSC 1.27 BSC
F 0.055 0.065 1.40 1.65
G 0.100 BSC 2.54 BSC
H 0.008 0.015 0.21 0.38
K 0.125 0.170 3.18 4.31
L 0.300 BSC 7.62 BSC
M 0 15 0 15
N 0.020 0.040 0.51 1.01
_ _ _ _
16 9
1 8
Page 8
MOTOROLA CMOS LOGIC DATAMC14008B
44
OUTLINE DIMENSIONS
D SUFFIX
PLASTIC SOIC PACKAGE
CASE 751B–05
ISSUE J
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
1 8
16 9
SEATING
PLANE
F
J
M
R
X 45
_
G
8 PLP
–B–
–A–
M
0.25 (0.010) B
S
–T–
D
K
C
16 PL
S
B
M
0.25 (0.010) A
S
T
DIM MIN MAX MIN MAX
INCHESMILLIMETERS
A 9.80 10.00 0.386 0.393
B 3.80 4.00 0.150 0.157
C 1.35 1.75 0.054 0.068
D 0.35 0.49 0.014 0.019
F 0.40 1.25 0.016 0.049
G 1.27 BSC 0.050 BSC
J 0.19 0.25 0.008 0.009
K 0.10 0.25 0.004 0.009
M 0 7 0 7
P 5.80 6.20 0.229 0.244
R 0.25 0.50 0.010 0.019
_ _ _ _
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the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit,
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MC14008B/D
*MC14008B/D*
◊
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