Datasheet MC14008BCP, MC14008BDR2, MC14008BF, MC14008BFR1 Datasheet (MOTOROLA)

 Semiconductor Components Industries, LLC, 2000

March, 2000 – Rev. 3

1 Publication Order Number:

MC14008B/D

MC14008B

4-Bit Full Adder

The MC14008B 4–bit full adder is constructed with MOS
P–channel and N–channel enhancement mode devices in a single
monolithic structure. This device consists of four full adders with fast
internal look–ahead carry output. It is useful in binary addition and
other arithmetic applications. The fast parallel carry output bit allows
high–speed operation when used with other adders in a system.

• Look–Ahead Carry Output

• Diode Protection on All Inputs

• All Outputs Buffered

• Supply Voltage Range = 3.0 Vdc to 18 Vdc

• Capable of Driving Two Low–power TTL Loads or One Low–power

Schottky TTL Load Over the Rated Temperature Range

• Pin–for–Pin Replacement for CD4008B

MAXIMUM RATINGS (Voltages Referenced to V

SS

) (Note 2.)

Symbol

Parameter Value Unit

V

DD

DC Supply Voltage Range –0.5 to +18.0 V

Vin, V

out

Input or Output Voltage Range

(DC or Transient)

–0.5 to VDD + 0.5 V

Iin, I

out

Input or Output Current

(DC or Transient) per Pin

±10 mA

P

D

Power Dissipation,

per Package (Note 3.)

500 mW

T

A

Ambient Temperature Range –55 to +125 °C

T

stg

Storage Temperature Range –65 to +150 °C

T

L

Lead Temperature

(8–Second Soldering)

260 °C

2. Maximum Ratings are those values beyond which damage to the device

may occur.

3. Temperature Derating:

Plastic “P and D/DW” Packages: – 7.0 mW/_C From 65_C T o 125_C

This device contains protection circuitry to guard against damage due to high
static voltages or electric fields. However, precautions must be taken to avoid
applications of any voltage higher than maximum rated voltages to this
high–impedance circuit. For proper operation, V

in

and V

out

should be constrained

to the range V

SS

v (Vin or V

out

) v VDD.

Unused inputs must always be tied to an appropriate logic voltage level (e.g.,
either V

SS

or VDD). Unused outputs must be left open.

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A = Assembly Location
WL or L = Wafer Lot
YY or Y = Year
WW or W = Work Week

Device Package Shipping

ORDERING INFORMATION

MC14008BCP PDIP–16 2000/Box
MC14008BDR2 SOIC–16 2500/Tape & Reel
MC14008BF SOEIAJ–16 See Note 1.

1. For ordering information on the EIAJ version of
the SOIC packages, please contact your local
ON Semiconductor representative.

MARKING

DIAGRAMS

1

16

PDIP–16

P SUFFIX

CASE 648

MC14008BCP

AWLYYWW

SOIC–16

D SUFFIX

CASE 751B

1

16

14008B

AWLYWW

SOEIAJ–16

F SUFFIX

CASE 966

1

16

MC14008B

AWLYWW

MC14008B

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2

BLOCK DIAGRAM

HIGH–SPEED

PARALLEL CARR Y

14 C

out

13 S4

12 S3

11 S2

10 S1

B4 15
A4 1

B3 2
A3 3

B2 4
A2 5

B1 6
A1 7

C

in

9

ADDER

4

ADDER

3

ADDER

2

ADDER

1

C4

C3

C2

V

DD

= PIN 16

V

SS

= PIN 8

TRUTH TABLE

(One Stage)

13

14

15

16

9

10

11

125

4

3

2

1

8

7

6

S3

S4

C

out

B4

V

DD

C

in

S1

S2

B2

A3

B3

A4

V

SS

A1

B1

A2

PIN ASSIGNMENT

C

in

BAC

out

S

00000
00101
01001
01110

10001
10110
11010
11111

MC14008B

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3

ELECTRICAL CHARACTERISTICS (Voltages Referenced to V

SS

)

V

– 55_C

25_C

125_C

Characteristic

Symbol

V

DD

Vdc

Min

Max

Min

Typ

(4.)

Max

Min

Max

Unit

ОООООООО

Î

Output Voltage “0” Level

V

in

= VDD or 0

ÎÎ

Î

V

OL

Î

Î

5.0
10
15

Î

Î

—
—
—

Î

Î

0.05

0.05

0.05

ÎÎ

Î

—
—
—

Î

Î

0
0
0

ÎÎ

Î

0.05

0.05

0.05

Î

Î

—
—
—

Î

Î

0.05

0.05

0.05

Î

Î

Vdc

ОООООООО

Î

Vin = 0 or V

DD

“1” Level

ÎÎ

Î

V

OH

Î

Î

5.0
10
15

Î

Î

4.95

9.95

14.95

Î

Î

—
—
—

ÎÎ

Î

4.95

9.95

14.95

Î

Î

5.0
10
15

ÎÎ

Î

—
—
—

Î

Î

4.95

9.95

14.95

Î

Î

—
—
—

Î

Î

Vdc

ОООООООО

Î

ОООООООО

Î

Input Voltage “0” Level

(V

O

= 4.5 or 0.5 Vdc)

(V

O

= 9.0 or 1.0 Vdc)

(V

O

= 13.5 or 1.5 Vdc)

ÎÎ

Î

ÎÎ

Î

V

IL

Î

Î

Î

Î

5.0
10
15

Î

Î

Î

Î

—
—
—

Î

Î

Î

Î

1.5

3.0

4.0

ÎÎ

Î

ÎÎ

Î

—
—
—

Î

Î

Î

Î

2.25

4.50

6.75

ÎÎ

Î

ÎÎ

Î

1.5

3.0

4.0

Î

Î

Î

Î

—
—
—

Î

Î

Î

Î

1.5

3.0

4.0

Î

Î

Î

Î

Vdc

ОООООООО

Î

ОООООООО

Î

(VO = 0.5 or 4.5 Vdc) “1” Level
(V

O

= 1.0 or 9.0 Vdc)

(V

O

= 1.5 or 13.5 Vdc)

ÎÎ

Î

ÎÎ

Î

V

IH

Î

Î

Î

Î

5.0
10
15

Î

Î

Î

Î

3.5

7.0
11

Î

Î

Î

Î

—
—
—

ÎÎ

Î

ÎÎ

Î

3.5

7.0
11

Î

Î

Î

Î

2.75

5.50

8.25

ÎÎ

Î

ÎÎ

Î

—
—
—

Î

Î

Î

Î

3.5

7.0
11

Î

Î

Î

Î

—
—
—

Î

Î

Î

Î

Vdc

ОООООООО

Î

ОООООООО

Î

Output Drive Current

(V

OH

= 2.5 Vdc) Source

(V

OH

= 4.6 Vdc)

(V

OH

= 9.5 Vdc)

(V

OH

= 13.5 Vdc)

ÎÎ

Î

ÎÎ

Î

I

OH

Î

Î

Î

Î

5.0

5.0
10
15

Î

Î

Î

Î

– 3.0

– 0.64

– 1.6
– 4.2

Î

Î

Î

Î

—
—
—
—

ÎÎ

Î

ÎÎ

Î

– 2.4

– 0.51

– 1.3
– 3.4

Î

Î

Î

Î

– 4.2
– 0.88
– 2.25

– 8.8

ÎÎ

Î

ÎÎ

Î

—
—
—
—

Î

Î

Î

Î

– 1.7

– 0.36

– 0.9
– 2.4

Î

Î

Î

Î

—
—
—
—

Î

Î

Î

Î

mAdc

ОООООООО

Î

ОООООООО

Î

(VOL = 0.4 Vdc) Sink
(V

OL

= 0.5 Vdc)

(V

OL

= 1.5 Vdc)

ÎÎ

Î

ÎÎ

Î

I

OL

Î

Î

Î

Î

5.0
10
15

Î

Î

Î

Î

0.64

1.6

4.2

Î

Î

Î

Î

—
—
—

ÎÎ

Î

ÎÎ

Î

0.51

1.3

3.4

Î

Î

Î

Î

0.88

2.25

8.8

ÎÎ

Î

ÎÎ

Î

—
—
—

Î

Î

Î

Î

0.36

0.9

2.4

Î

Î

Î

Î

—
—
—

Î

Î

Î

Î

mAdc

Input Current

I

in

15

—

± 0.1

—

±0.00001

± 0.1

—

± 1.0

µAdc

Input Capacitance

(V

in

= 0)

C

in

—

—

—

—

5.0

7.5

—

—

pF

ОООООООО

Î

ОООООООО

Î

Quiescent Current

(Per Package)

ÎÎ

Î

ÎÎ

Î

I

DD

Î

Î

Î

Î

5.0
10
15

Î

Î

Î

Î

—
—
—

Î

Î

Î

Î

5.0
10
20

ÎÎ

Î

ÎÎ

Î

—
—
—

Î

Î

Î

Î

0.005

0.010

0.015

ÎÎ

Î

ÎÎ

Î

5.0
10
20

Î

Î

Î

Î

—
—
—

Î

Î

Î

Î

150
300
600

Î

Î

Î

Î

µAdc

ОООООООО

Î

ОООООООО

Î

Total Supply Current

(5.) (6.)

(Dynamic plus Quiescent,
Per Package)
(C

L

= 50 pF on all outputs, all

buffers switching)

ÎÎ

Î

ÎÎ

Î

I

T

Î

Î

Î

Î

5.0
10
15

ООООООООООООООО

Î

ООООООООООООООО

Î

IT = (1.7 µA/kHz) f + I

DD

IT = (3.4 µA/kHz) f + I

DD

IT = (5.0 µA/kHz) f + I

DD

Î

Î

Î

Î

µAdc

4. Data labelled “Typ” is not to be used for design purposes but is intended as an indication of the IC’s potential performance.

5. The formulas given are for the typical characteristics only at 25_C.

6. To calculate total supply current at loads other than 50 pF:
I

T(CL

) = IT(50 pF) + (CL – 50) Vfk

where: I

T

is in µA (per package), CL in pF, V = (VDD – VSS) in volts, f in kHz is input frequency, and k = 0.005.

MC14008B

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4

SWITCHING CHARACTERISTICS

(7.)

(C

L

= 50 pF, T

A

= 25_C)

ООООООООООООО

Î

Characteristic

ÎÎÎ

Î

Symbol

ÎÎ

Î

V

DD

Vdc

ÎÎ

Î

Min

ÎÎ

Î

Typ

(8.)

ÎÎ

Î

Max

Î

Î

Unit

ООООООООООООО

Î

ООООООООООООО

Î

Output Rise and Fall Time

t

TLH

, t

THL

= (1.5 ns/pF) CL + 25 ns

t

TLH

, t

THL

= (0.75 ns/pF) CL + 12.5 ns

t

TLH

, t

THL

= (0.55 ns/pF) CL + 9.5 ns

ÎÎÎ

Î

ÎÎÎ

Î

t

TLH

,

t

THL

ÎÎ

Î

ÎÎ

Î

5.0
10
15

ÎÎ

Î

ÎÎ

Î

—
—
—

ÎÎ

Î

ÎÎ

Î

100

50
40

ÎÎ

Î

ÎÎ

Î

200
100

80

Î

Î

Î

Î

ns

ООООООООООООО

Î

ООООООООООООО

Î

ООООООООООООО

Î

ООООООООООООО

Î

ООООООООООООО

Î

ООООООООООООО

Î

ООООООООООООО

Î

ООООООООООООО

Î

ООООООООООООО

Î

ООООООООООООО

Î

ООООООООООООО

Î

Propagation Delay Time

Sum in to Sum Out

t

PLH

, t

PHL

= (1.7 ns/pF) CL + 315 ns

t

PLH

, t

PHL

= (0.66 ns/pF) CL + 127 ns

t

PLH

, t

PHL

= (0.5 ns/pF) CL + 90 ns

Sum In to Carry Out

t

PLH

, t

PHL

= (1.7 ns/pF) CL + 220 ns

t

PLH

, t

PHL

= (0.66 ns/pF) CL + 112 ns

t

PLH

, t

PHL

= (0.5 ns/pF) CL + 85 ns

Carry In to Sum Out

t

PLH

, t

PHL

= (1.7 ns/pF) CL + 290 ns

t

PLH

, t

PHL

= (0.66 ns/pF) CL + 122 ns

t

PLH

, t

PHL

= (0.5 ns/pF) CL + 90 ns

Carry In to Carry Out

t

PLH

, t

PHL

= (1.7 ns/pF) CL + 85 ns

t

PLH

, t

PHL

= (0.66 ns/pF) CL + 42 ns

t

PLH

, t

PHL

= (0.5 ns/pF) CL + 30 ns

ÎÎÎ

Î

ÎÎÎ

Î

ÎÎÎ

Î

ÎÎÎ

Î

ÎÎÎ

Î

ÎÎÎ

Î

ÎÎÎ

Î

ÎÎÎ

Î

ÎÎÎ

Î

ÎÎÎ

Î

ÎÎÎ

Î

t

PLH

, t

PHL

ÎÎ

Î

ÎÎ

Î

ÎÎ

Î

ÎÎ

Î

ÎÎ

Î

ÎÎ

Î

ÎÎ

Î

ÎÎ

Î

ÎÎ

Î

ÎÎ

Î

ÎÎ

Î

5.0
10
15

5.0
10
15

5.0
10
15

5.0
10
15

ÎÎ

Î

ÎÎ

Î

ÎÎ

Î

ÎÎ

Î

ÎÎ

Î

ÎÎ

Î

ÎÎ

Î

ÎÎ

Î

ÎÎ

Î

ÎÎ

Î

ÎÎ

Î

—
—
—

—
—
—

—
—
—

—
—
—

ÎÎ

Î

ÎÎ

Î

ÎÎ

Î

ÎÎ

Î

ÎÎ

Î

ÎÎ

Î

ÎÎ

Î

ÎÎ

Î

ÎÎ

Î

ÎÎ

Î

ÎÎ

Î

400
160
115

305
145
110

375
155
115

170

75
55

ÎÎ

Î

ÎÎ

Î

ÎÎ

Î

ÎÎ

Î

ÎÎ

Î

ÎÎ

Î

ÎÎ

Î

ÎÎ

Î

ÎÎ

Î

ÎÎ

Î

ÎÎ

Î

800
320
230

610
290
220

750
310
230

340
150
110

Î

Î

Î

Î

Î

Î

Î

Î

Î

Î

Î

Î

Î

Î

Î

Î

Î

Î

Î

Î

Î

Î

ns

7. The formulas given are for the typical characteristics only at 25_C.

8. Data labelled “Typ” is not to be used for design purposes but is intended as an indication of the IC’s potential performance.

Figure 1. Typical Source Current

Characteristics Test Circuit

Figure 2. Typical Sink Current

Characteristics Test Circuit

VDD = –V

GS

V

out

16

B4
A4
B3
A3
B2
A2
B1
A1

C

in

S4

S3

S2

S1

C

out

I

OH

8V

SS

EXTERNAL

POWER

SUPPLY

EXTERNAL

POWER

SUPPLY

I

OL

VDD = V

GS

V

out

16

B4
A4
B3
A3
B2
A2
B1
A1
C

in

S4

S3

S2

S1

C

out

8V

SS

MC14008B

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5

Figure 3. Dynamic Power Dissipation Test Circuit and Waveform

20 ns 20 ns

V

in

90%
10%

V

DD

V

SS

PULSE

GENERATOR

V

DD

16

B4
A4
B3
A3
B2
A2
B1
A1

C

in

S4

S3

S2

S1

C

out

I

DD

8V

SS

C

L

C

L

C

L

C

L

C

L

500 µF

Figure 4. Switching Time Test Circuit and Waveforms

PULSE

GENERATOR

V

DD

16

B4
A4
B3
A3
B2
A2
B1
A1
C

in

S4

S3

S2

S1

C

out

I

DD

8V

SS

C

L

C

L

C

L

C

L

C

L

20 ns 20 ns

C

in

S1–S4

C

out

V

DD

V

SS

V

OH

V

OL

V

OH

V

OL

t

PLH

t

PHL

t

THL

t

TLH

t

PLH

t

PHL

90%
50%
10%

90%
50%
10%

50%

MC14008B

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6

Figure 5. Logic Diagram

C

in

A1

B1

A2

B2

A3

B3

A4

B4

S1

S2

S3

S4

C

out

Figure 6. Using the MC14008B in a 16–Bit Adder Configuration

WORD A + B INPUTS

A1 B4 A1 B4 A1 B4 A1 B4

S1 S4 S1 S4 S1 S4 S1 S4

C

in

C

in

C

in

C

in

C

out

C

out

C

out

C

out

CHIP

1

CHIP

2

CHIP

3

CHIP

4

SUM OUTPUTS

Calculation of 16–bit adder speed:

t

P

total = tP (Sum to Carry) + tP (Carry to Sum) + 2 tP (Carry to Carry)

The guaranteed 16–bit adder speed at 10 V , 25°C, C

L

= 50 pF is:

t

p

total = 290 + 310 + 300 = 900 ns

TYPICAL APPLICATION

MC14008B

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7

P ACKAGE DIMENSIONS

PDIP–16

P SUFFIX

PLASTIC DIP PACKAGE

CASE 648–08

ISSUE R

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.

2. CONTROLLING DIMENSION: INCH.

3. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.

4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.

5. ROUNDED CORNERS OPTIONAL.

–A–

B

F

C

S

H

G

D

J

L

M

16 PL

SEATING

18

916

K

PLANE

–T–

M

A

M

0.25 (0.010) T

DIM MIN MAX MIN MAX

MILLIMETERSINCHES

A 0.740 0.770 18.80 19.55
B 0.250 0.270 6.35 6.85
C 0.145 0.175 3.69 4.44
D 0.015 0.021 0.39 0.53
F 0.040 0.70 1.02 1.77
G 0.100 BSC 2.54 BSC
H 0.050 BSC 1.27 BSC
J 0.008 0.015 0.21 0.38
K 0.110 0.130 2.80 3.30
L 0.295 0.305 7.50 7.74
M 0 10 0 10
S 0.020 0.040 0.51 1.01

____

SOIC–16

D SUFFIX

PLASTIC SOIC PACKAGE

CASE 751B–05

ISSUE J

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.

2. CONTROLLING DIMENSION: MILLIMETER.

3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.

4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.

5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.

18

16 9

SEATING

PLANE

F

J

M

R

X 45

_

G

8 PLP

–B–

–A–

M

0.25 (0.010) B

S

–T–

D

K

C

16 PL

S

B

M

0.25 (0.010) A

S

T

DIM MIN MAX MIN MAX

INCHESMILLIMETERS

A 9.80 10.00 0.386 0.393
B 3.80 4.00 0.150 0.157
C 1.35 1.75 0.054 0.068
D 0.35 0.49 0.014 0.019
F 0.40 1.25 0.016 0.049
G 1.27 BSC 0.050 BSC
J 0.19 0.25 0.008 0.009
K 0.10 0.25 0.004 0.009
M 0 7 0 7
P 5.80 6.20 0.229 0.244
R 0.25 0.50 0.010 0.019

____

MC14008B

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8

P ACKAGE DIMENSIONS

H

E

A

1

DIM MIN MAX MIN MAX

INCHES

––– 2.05 ––– 0.081

MILLIMETERS

0.05 0.20 0.002 0.008

0.35 0.50 0.014 0.020

0.18 0.27 0.007 0.011

9.90 10.50 0.390 0.413

5.10 5.45 0.201 0.215

1.27 BSC 0.050 BSC

7.40 8.20 0.291 0.323

0.50 0.85 0.020 0.033

1.10 1.50 0.043 0.059
0

0.70 0.90 0.028 0.035

––– 0.78 ––– 0.031

A

1

H

E

Q

1

L

E

_

10

_

0

_

10

_

L

E

Q

1

_

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.

2. CONTROLLING DIMENSION: MILLIMETER.

3. DIMENSIONS D AND E DO NOT INCLUDE
MOLD FLASH OR PROTRUSIONS AND ARE
MEASURED AT THE PARTING LINE. MOLD FLASH
OR PROTRUSIONS SHALL NOT EXCEED 0.15
(0.006) PER SIDE.

4. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.

5. THE LEAD WIDTH DIMENSION (b) DOES NOT
INCLUDE DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08 (0.003)
TOTAL IN EXCESS OF THE LEAD WIDTH
DIMENSION AT MAXIMUM MATERIAL CONDITION.
DAMBAR CANNOT BE LOCATED ON THE LOWER
RADIUS OR THE FOOT. MINIMUM SPACE
BETWEEN PROTRUSIONS AND ADJACENT LEAD
TO BE 0.46 ( 0.018).

M

L

DETAIL P

VIEW P

c

A

b

e

M

0.13 (0.005)

0.10 (0.004)

1

16 9

8

D

Z

E

A

b
c
D
E
e

L

M

Z

SOEIAJ–16

F SUFFIX

PLASTIC EIAJ SOIC PACKAGE

CASE 966–01

ISSUE O

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